Transcript
AMD Radeon TM HD7970M MXM 3.0 Type B Module Specification
CONTENTS 1.
2.
Overview ....................................................................................................................................... 3 1.1. General Description ........................................................................................................ 3 1.2. Features ............................................................................................................................ 3 Module Diagrams ........................................................................................................................ 7 2.1. Module Block Diagram ................................................................................................... 7
4.
2.2. Module Mechanical Parameters ................................................................................... 8 Display Configuration ................................................................................................................. 9 3.1. Default Display Settings ................................................................................................. 9 3.2. Optional Display Setting ................................................................................................. 9 Mechanical and Environmental Specifications ..................................................................... 10
5.
4.1. Electromechanical Specification ................................................................................. 10 4.2. Thermo-mechanical Specification .............................................................................. 10 4.3. Environmental Specifications and Conditions .......................................................... 10 Electrical Specifications ........................................................................................................... 11
3.
6.
7.
5.1 PCI Express® Support ................................................................................................. 11 5.2 Electrical Connector ...................................................................................................... 11 Electrical Exceptions................................................................................................................. 16 6.1. VGA ................................................................................................................................. 16 6.2. LVDS ............................................................................................................................... 16 Power .......................................................................................................................................... 17 7.1. Power Tree ..................................................................................................................... 17 7.2. Power Consumption ..................................................................................................... 18 7.3. Power Sequencing ........................................................................................................ 18
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1. Overview 1.1. General Description The AMD Radeon™ HD 7970M MXM 3.0 Type B module from AMD’s Embedded Solutions is designed to reap the benefits of PCI Express® 3.0, and achieve fast time-to-market with cutting edge, innovative solutions. The module features an AMD Radeon HD 7970 GPU at 850MHz with 2GB of GDDR5 on-module graphics memory at 1200MHz. The module consists of a standard single 285-pin edge connector that all input/outputs are routed through and is based on the MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/).
1.2. Features •
Graphics Core Next (GCN) Architecture:
• • • • • • •
9th generation programmable hardware tessellation unit 20 Compute units (1280 Stream processors) 80 Texture units 128 Z/Stencil ROP units 32 Color ROP units 512KB L2 read/write cache 256-bit GDDR5 memory interface
Image Quality Enhancement Technology: • • • • • •
Up to 24x multi-sample and super-sample anti-aliasing Adaptive anti-aliasing Enhanced Quality Anti-Aliasing (EQAA) Morphological Anti-Aliasing (MLAA) 16x angle invariant anisotropic texture filtering 128-bit floating point HDR rendering
AMD Eyefinity Multi-Display Technology: • • • REV 0.1
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• • • •
DirectCompute 11, and Microsoft® C++ AMP
Video Codec Engine (VCE): •
Accelerated H.264 HD video encoding, transcoding, and up-scaling
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Unified Video Decoder (UVD)
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H.264
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VC-1
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MPEG-2 (SD & HD)
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MVC (Blu-ray 3D)
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MPEG-4 Part 2 (DivX® /Xvid)
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Adobe® Flash
Enhanced Video Quality: •
Advanced post-processing and scaling
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Deblocking
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Denoising
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Automatic deinterlacing
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Mosquito noise reduction
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Edge enhancement
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3:2 pulldown detection
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Advanced video color correction
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Brighter whites processing (Blue Stretch)
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Independent video gamma control
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Flesh tone correction
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Color vibrance control
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Dynamic contrast
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Dynamic video range control
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DXVA 1.0 & 2.0 support
AMD HD3D Technology: •
Stereoscopic 3D display/glasses support
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Blu-ray 3D support
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Stereoscopic 3D gaming
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•
3rd party Stereoscopic 3D middleware software support
AMD CrossFire™ multi-GPU Technology: •
Supports dual GPU performance scaling
Cutting-edge Integrated Display Support: •
•
DisplayPort 1.2 Max resolution: 2560x1600 per display
Multi-Stream Transport
21.6 Gbps bandwidth
High bit-rate audio
HDMI™ (with 3D, 4k, Deep Color, x.v.Color) Max resolution: 4096x3112
1080p60 Stereoscopic 3D
Quad HD/4k video support
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Dual-link DVI with HDCP Max resolution: 2560x1600
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VGA Max resolution: 2048x1536
Integrated HD Audio Controller: •
Output protected high bit rate 7.1 channel surround sound over HDMI with no additional cables required
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Supports AC-3, AAC, Dolby TrueHD and DTS Master Audio formats
AMD PowerPlay™ Power Management Technology: •
Automatic power management with low power idle states
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AMD PowerTune technology
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Intelligent TDP management technology
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Dynamic clock speed/performance enhancement for games
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AMD ZeroCore Power technology
Additional Interfaces: •
153.6 GB/s memory bandwidth
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2176 GFLOPs Single Precision compute power
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136 GFLOPs Double Precision compute power
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PCI Express 3.1 x16 bus interface
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DirectX® 11 graphics
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OpenGL 4.2 support
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Partially Resident Texture (PRT) support
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2. Module Diagrams This section provides a block diagram and the mechanical parameters of the module.
2.1. Module Block Diagram
Module Block Diagram Note: The Module Block Diagram shows what the HD 7970M is capable of displaying and does not reflect the actual default video BIOS settings.
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2.2. Module Mechanical Parameters
Module Mechanical Parameters Note: Board photos are not to scale and measurement are in mm. Note: Refer to the MXM 3.1 Type B specification for board dimensions and fan holes location.
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3. Display Configuration The MXM module, using the AMD Radeon HD 7970 GPU, provides flexibility for display configurations briefly explained here. If you do not use the default display settings, you will need a custom video BIOS. Contact Supplier technical support channel first for changes to the display settings.
3.1. Default Display Settings •
Dual-Link DVI-D (GPU display controllers DP E + DP F) Only 2 legacy displays are active at the same time
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Single-Link DVI-I (GPU display controllers DP A + CRT) Only 2 legacy displays are active at the same time
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HDMI (GPU display controller DP C) Only 2 legacy displays are active at the same time
• DisplayPort v1.2 (GPU display controller DP D) Note: Legacy displays are CRT, DVI or HDMI displays.
3.2. Optional Display Setting The MXM module can be configured with LVDS_U* and LVDS_L* (DP E + DP F) as single or dual-link LVDS, up to two single or one dual-link DVI, one HDMI or up to two DisplayPort v1.1 outputs. The MXM module description of DP_A, DP_B, DP_C, and DP_D (corresponding DP A, DP C, DP B, DP D respectively for GPU descriptions) can be configured as single-link DVI, HDMI or DisplayPort v1.2. Only a maximum of two legacy displays (CRT, DVI or HDMI) can be displayed at the same time. Only one HDMI will be output (one audio codec only). Examples of possible configurations in addition to the default settings: 1. Single-link LVDS + single-link DVI-I + 4 DisplayPorts 2. Single-link LVDS + HDMI + 4 DisplayPorts 3. Single-link LVDS + 5 DisplayPorts 4. Dual-Link LVDS + 4 DisplayPorts 5. 6 DisplayPorts 6. Dual-link DVI-D + single DVI-I + 3 DisplayPorts Note: Legacy displays are CRT, DVI or HDMI displays. REV 0.1
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4. Mechanical and Environmental Specifications 4.1. Electromechanical Specification Refer to the MXM 3.1 Type B mechanical specifications outlined in the MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/). The AMD Radeon HD 7970M MXM 3.0 Type B module is based upon that specification
4.2. Thermo-mechanical Specification Feature
Max. Configuration
Temperature Sensor Support
Internal and External
External Temperature Sensor Mechanism
ADM1032ARMZ
Fan Control Circuit
Adjustable 2-wire fan circuit
Thermal Solution Type
Active cooler
Passive Heatsink Type
Fansink
Thermal Protection
Critical Temperature Shutdown (CTF)
4.3. Environmental Specifications and Conditions Parameter
Value
Operating Temperature
0°C to 55°C
Storage Temperature
All function shall be normal after 500hrs at -40°C to 75°C at normal humidity with a 24-hour recovery period at room temperature.
Operating Humidity
5% to 90% RH
Storage Humidity
5% to 95% RH
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5. Electrical Specifications Refer to the MXM electrical specifications outlined in the publicly available MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/). Some pins are different than in the specification. Refer to the pin descriptions.
5.1
PCI Express® Support
The module supports up to 16 bidirectional PCI Express differential signaling lanes (x1, x2, x4, x8, and x16). It is compliant with PCI Express Base Specification 3.1, except for power delivery and power management. Embedded system power requirements supersede PCI Express power specifications. Hot plug insertion is not supported.
5.2
Electrical Connector
Provides the connector pin assignment for the module. Note that some pins are different compared to the MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1, Revision 1.0 (http://www.mxm-sig.org/).
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AMD Radeon ™ HD 7970M MXM Pin Assignment
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6. Electrical Exceptions 6.1. VGA When driving stereoscopic 3D displays AMD designs make use of the stereo-sync (generic a/b) signal to differentiate between the left and right scene. This is implemented on OEM2 (MXM pin 40).
6.2. LVDS
LVDS Implementation in AMD Designs The HD 7970M MXM differs from MXM 3.1 spec in the implementation of LVDS, specifically on the pull-ups on the DDC lines and the MXM connector pin used for hot plug detect. AMD recommends that the 4.7K PU to 3.3V on LVDS DDC lines be placed on the motherboard side allowing the channel to be used for eDP/DP or LVDS. This adds flexibility and simplifies display qualification. To have more control over the display configuration, AMD designs make use of OEM3 (MXM pin 41) for DDCDATA_AUX7N (DPF) and OEM5 (MXM pin 43) for DDCCLK_AUX7P (DPF). REV 0.1
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7. Power 7.1. Power Tree
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7.2. Power Consumption
7.3. Power Sequencing The power sequencing for this board requires that the 5VRUN (+5V) and the PWR_SRC (+20V) come up before or at the same time as 3V3RUN (3.3V). Voltage tolerances are +/-5%.Layout Guidelines Refer to the MXM Graphics Module, MXM Version 3.1 System Design Guide (http://www.mxm-sig.org/) for detailed layout requirements on the system board.
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Change log or update history Rev. 0.1
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Date 2013/9/4
History 1st Draft
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