Transcript
Digital Scale and DRO Systems
2D Image Correlation Encoder
MICSYS
Bulletin No. 2029
Making small, non-contact, 2D-displacement measurements at the nanometer level
Two-dimensional micro-displacement measurement achieved with high resolution and high accuracy. FEATURES High accuracy non-contact 2D encoder using image correlation. Simultaneous X-Y position measurements. Nanometer resolution. Easy alignment. Allows minute strain and deflection measurements.
Measuring principle When the rough surface of an object is irradiated by a laser beam, the beam is scattered into multiple reflected beams that, due to the coherent nature of laser radiation, interfere with each other to form a particular kind of reflection called a speckle pattern. Now, if the object is moved, the speckle pattern image is also moved in proportion, and this effect can be used to track the 2D displacement of the object at the nanometer resolution level by comparing the speckle images obtained before and after the movement (image correlation). Incident laser beam
Image Sensor
MICSYS
Reflected laser beams Speckle Pattern
Surface
Direction of movement (X-Y Plane)
2D displacement measurements in the X-Y plane
System Configuration Standard configuration: Detector, I/F unit, Head cable, Sample software for data correlation, Standard target
Head cable (Length: 1m)
RS-232C cable*1 Personal computer*1
Detector
Standard target*2
I/F unit
Sample software for data correlation (CD-ROM)
Mounting distance 10±0.2mm
Measured object
*1:PC and RS-232C cable (Dsub-9 pin (female) straight) are excluded. *2:For stable measurements, we recommend the installation of a standard target provided.
1
Specification MICSYS-SA1 549-701A Laser speckle image correlation 1nm 5nm (σ) +/-100nm; Linearity: 80nm ± 100μm (2D) RS-232C 20Hz 100 650nm (Visible) Class 2 80 Detector: 15-25ºC, I/F unit: 0-40ºC, 20-80%RH (Non-condensing) 60 -10-50ºC / ~85%RH (Non-condensing) 40 AC100-240V 45W 50/60Hz 20 0 (on CD-ROM) Standard target, Sample software for data correlation -20 * : Measurement is performed within the X-Y plane from the origin point with the standard target. -40 -60 -80 -100 0 20
Indication accuracy
nm
Model No. Order No. Detection method Resolution Repeatability (20Cº) Accuracy (20Cº) Effective range Interface Data update period Laser wavelength Operating temperature and humidity range Storage temperature and humidity range Power supply Standard accessories
Measurement accuracy relative to position
Effect of temperature change on 60 80 dimensional output40
µm * : The following results are typical but are not guaranteed for any particular unit. * : Measurement is performed within the X-Y plane from the origin point with the standard target.
-200
20
-200 21:00
100
20
5:00
7:00
17 .59”(15)
.59”(15)
2-M4x0.7, depth 6
Measuring surface
Standard target
Mass: 3.75lb (1700g)
8.5”(216)
2.83”(72)
8.03”(204)
3.05”(77.6)
7.87”(200)
2
.06”(1.6)
.39”(10)±0.2
.39” (10 ±0.2)
39”(1000)
2-ø3.4, through hole ø6.5Countersunk,depth3
.39”(10) .35”(9)
.62”(16)
1.82”(46.3)
I/F unit
9:00
Mass: .02lb (10g)
1.10”(28)
1.18”(30)
h
Standard target
18
.54”(39)
.23” (ø5.8)
1.62”(41.2)
Time
h
0.1
.79”(20) ±0.2
.39”(10)
1.89”(48)
21
.59”(15)
9:00
24 23
1.61”(41)
7:00
25
19
3:00
5:00
.19”(5)
Changes in output value
1:00
3:00
.15”(4) .24”(6.1)
Unit: Inch (mm)
22
23:00
1:00
Time
Mass: .66lb (300g)
Temperature changes
23:00
µm
18
.06”(1.6)
80
19
Temperature changes
17
ºC
nm
Output 60
.31”(8) .55”(4) ±0.1
40
.63”(16)
nm
Output
21
ºC
Detector
-200 21:00
22
Temperature
20
Dimensions
-100
23
0 -100
Measurement position
0
24
Changes in output value
-100
0
-100
25
Temperature
100 80 60 40 20 0 -20 -40 -60 -80 -100
Indication accuracy
nm
* : The following results are typical but are not guaranteed for any particular unit. * : Measurement is performed within the X-Y plane from the origin point with the standard target.
-200
100
Measurement position
Applications 1. Evaluation stage system for various types of manufacturing and inspection equipment
Temperature, humidity, voltage changes caused by displacement measurements
Actuator Stage
X-Y stage a) Evaluation of positional repeatability
b) Evaluation of static stability and drift
2. High-precision positioning for various types of workpiece (device) Installation, removal Actuator X-Y stage
3. Determination of a small displacement Load
Measurement of displacement due to changes in temperature/humidity. Measurement of displacement occurring due to the process of bonding objects together.
Structure (Beam)
a) Determination of small structural displacements
b) Determination of small workpiece displacements
One Number to Serve You Better
1-888-MITUTOYO (1-888-648-8869) Aurora, Illinois (Corporate Headquarters) Note: All information regarding our products, and in particular the illustrations, drawings, dimensional and performance data contained in this printed matter as well as other technical data are to be regarded as approximate average values. We therefore reserve the right to make changes to the corresponding designs. The stated standards, similar technical regulations, descriptions and illustrations of the products were valid at the time of printing. In addition, the latest applicable version of our General Trading Conditions will apply. Only quotations submitted by ourselves may be regarded as definitive. Mitutoyo products are subject to US Export Administration Regulations (EAR). Re-export or relocation of our products may require prior approval by an appropriate governing authority. Trademarks and Registrations Designations used by companies to distinguish their products are often claimed as trademarks. In all instances where Mitutoyo America Corporation is aware of a claim, the product names appear in initial capital or all capital letters. The appropriate companies should be contacted for more complete trademark and registration information.
© 2013 Mitutoyo America Corporation, Aurora IL
100
0211-12 Printed in USA, July 2013
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