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2mbi225vx-170-50

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2MBI225VX-170-50 IGBT Modules Power Module (V series) 1700V / 225A / 2-in-1 package ■ Features Low VCE(sat) Low Inductance Module structure Solderless press-fit terminals ■ Applications Inverter for Motor Drives, AC and DC Servo Drives Uninterruptible Power Supply Systems, Wind Turbines, PV Power Conditioning Systems ■ Outline drawing ( Unit : mm ) Weight: 350g (typ.) ■ Equivalent Circuit [ Inverter ] C P [ Thermistor ] T1 T2 G1 E1 OUT G2 E2 N 1 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules ■ Absolute Maximum Ratings (at TC= 25°C unless otherwise specified) Items Collector-Emitter voltage Gate-Emitter voltage Symbols VCES VGES IC Collector current Conditions IC pulse -IC -IC pulse PC Tj Continuous 1ms TC=25oC TC=100oC Maximum Ratings 1700 ±20 300 225 450 225 450 1500 175 Units V V A 1ms Collector power dissipation 1 device W Junction temperature Operating junction temperature Tjop 150 o (under switching conditions) C Tc Case temperature 125 Tstg Storage temperature -40 ~ 125 Isolation between terminal and copper base (*1) Viso AC: 1min. 3400 VAC between thermistor and others (*2) voltage 3.5 Mounting (*3) Screw Nm Torque 4.5 Terminals (*4) (*1) All terminals should be connected together during the test. (*2) Two thermistor terminals should be connected together, other terminals should be connected together and shorted to base plate during the test. (*3) Recommendable Value : 2.5-3.5 Nm (M5) (*4) Recommendable Value : 3.5-4.5 Nm (M6) 2 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules ■ Electrical characteristics (at Tj= 25°C unless otherwise specified) Items Zero gate voltage Collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Symbols Characteristics min. typ. max. Conditions ICES VGE=0V, VCE=1700V - - 3.0 mA IGES VCE=0V, VGE=±20V - - 600 nA 6.0 6.5 7.0 V Tj=25 C - 2.35 2.80 o Tj=125 C - 2.80 - Tj=150oC - 2.85 - Tj=25 C - 2.00 2.45 Tj=125oC - 2.45 - Tj=150oC Tj=25oC - 2.50 3.33 23 900 450 100 1050 80 2.15 2.60 Tj=125oC - 2.35 - VGE = 0V Tj=150oC - 2.35 - IF= 225A Tj=25oC - 1.80 2.25 Tj=125oC - 2.05 - Tj=150oC 465 3305 2.00 200 5000 495 3375 520 3450 VGE(th) VCE=20V, IC=225mA o VCE(sat) (terminal) Collector-Emitter saturation voltage VCE(sat) (chip) Internal gate resistance Input capacitance Turn-on time Turn-off time Units RG(int) Cies ton tr tr(i) toff tf VF (terminal) Forward on voltage VF (chip) Reverse recovery time trr Thermistor Resistance R Thermistor B value B VGE = 15V IC=225A o VCE=10V, VGE=0V, f=1MHz VCC= 900V VGE= ±15V Ls= 80nH IC= 225A RG= 6.8Ω IF=225A T=25oC T=100oC T=25/50oC V Ω nF nsec V nsec Ω K 5. Thermal resistance characteristics Items Symbols Thermal resistance (1device) Rth(j-c) Contact thermal resistance (1device) (*1) Rth(c-f) Conditions Characteristics min. typ. max. IGBT FWD - - 0.12 0.20 with thermal compound - 0.0167 - Units o C/W (*1) This is the value which is defined mounting on the additional cooling fin with thermal compound. 3 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules Collector current vs. Collector-Emitter voltage Tj = 25oC / chip Collector current vs. Collector-Emitter voltage (typ.) Tj = 150oC / chip 500 500 VGE=20V 15V 15V 400 12V Collector current: IC [A] 400 Collector current: IC [A] VGE= 20V 12V 300 300 10V 10V 200 200 100 100 8V 8V 0 0 0 1 2 3 4 0 5 Collector-Emitter voltage: VCE [V] 2 4 5 Collector-Emitter voltage vs. Gate-Emitter voltage Tj = 25oC / chip 500 10 125oC Tj=25oC Collector-Emitter Voltage: VCE [V] 150oC 400 300 200 100 0 8 6 4 IC=450A IC=225A IC=113A 2 0 1 2 3 4 5 5 10 Collector-Emitter Voltage: VCE [V] 15 20 Gate-Emitter Voltage: VGE [V] Dynamic Gate Charge (typ.) Vcc=900V, Ic=225A, Tj= 25°C Capacitance vs. Collector-Emitter Voltage VGE= 0V, f= 1MHz, Tj= 25oC 1000 20 Gate-Emitter voltage: VGE [V] 15 100 Cies 10 Cres 1 Coes 0.1 0 10 20 25 Collector-Emitter voltage: VCE [V] VCE 750 10 500 5 250 0 0 -5 -10 -250 VGE -500 -15 -20 -4000 30 1000 -750 -2000 0 2000 Gate charge: QG [nC] 4 Collector-Emitter voltage: VCE [V] 0 Gate Capacitance: Cies, Coes, Cres [nF] 3 Collector-Emitter voltage: VCE [V] Collector current vs. Collector-Emitter voltage VGE = 15V / chip Collector Current: IC [A] 1 -1000 4000 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules Switching time vs. Collector current (typ.) Vcc=900V, VGE=±15V, Rg=6.8Ω, Tj=25°C 10000 Switching time: ton, tr, toff, tf [nsec] Switching time: ton, tr, toff, tf [nsec] 10000 Switching time vs. Collector current (typ.) Vcc=900V, VGE=±15V, Rg=6.8Ω, Tj=125°C, 150°C toff 1000 Tj=125oC Tj=150oC toff 1000 ton tr tf 100 ton tr 100 10 tf 10 0 100 200 300 400 500 0 100 200 Collector current: IC [A] 500 Switching loss vs. Collector current (typ.) Vcc=900V, VGE=±15V, Rg=6.8Ω, Tj=125°C, 150°C 10000 250 Tj=125oC Tj=150oC 1000 toff ton tr 100 tf 10 1 Tj=125oC Tj=150oC Switching loss: Eon, Eoff, Err [mJ/pulse] Switching time: ton, tr, toff, tf [nsec] 400 Collector current: IC [A] Switching time vs. Gate resistance (typ.) Vcc=900V, Ic=225A, VGE=±15V, Tj=125°C, 150°C 10 200 Eon 150 Eoff 100 Err 50 0 100 0 100 Gate resistance: RG [Ω] 200 300 400 500 Collector current: IC [A] Switching loss vs. Gate resistance (typ.) Vcc=900V, Ic=225A, VGE=±15V, Tj=125°C, 150°C Reverse bias safe operating area (max.) +VGE=15V, -VGE=15V, Rg=6.8Ω, Tj=150°C 300 600 Tj=125oC Tj=150oC Eon 500 Collector current: IC [A] Switching loss: Eon, Eoff, Err [mJ/pulse] 300 200 400 Notice) Switching characteristics of VCE is defined between Sense C and Sense E1 for Upper arm and Sense E1 and Sense E2 for Lower arm. 300 Eoff 200 100 100 Err 0 0 1 10 0 100 500 1000 1500 2000 Collector-Emitter voltage: VCE [V] Gate resistance: RG [Ω] 5 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules Reverse recovery characteristics (typ.) Vcc=900V, VGE=±15V, Rg=6.8Ω, Tj=25°C Forward current vs. Forward vltage (typ.) chip 500 10000 Reverse recovery current: Irr [A] Reverse recovery time: trr [nsec] Tj=25oC Forward current: IF [A] 400 1000 300 200 125oC 100 150oC Irr trr 100 0 10 0 1 2 3 4 0 100 Forward on voltage: VF [V] 300 400 500 Forward current: IF [A] Reverse Recovery Characteristics (typ.) Vcc=900V, VGE=±15V, Rg=6.8Ω, Tj=125℃,150℃ Transient Thermal Resistance (max.) 1 Irr trr 100 Tj=125oC Tj=150oC 10 0 100 200 300 400 Thermal resistance: Rth(j-c) [oC/W] *** 1000 Reverse recovery current: Irr [A] Reverse recovery time: trr [nsec] 200 FWD 0.1 IGBT 0.01 τ [sec] 0.0023 0.0301 0.0598 0.0708 Rth IGBT 0.01287 0.03263 0.04610 0.02839 [°C/W] FWD 0.02145 0.05439 0.07684 0.04732 0.001 0.001 500 0.01 Forward current: IF [A] 0.1 1 Pulse Width : PW [sec] [THERMISTOR] Temperature characteristic (typ.) FWD safe operating area (max.) Tj=150°C 500 100 Reverse recovery current: Irr [A] Resistance : R [kΩ] 400 10 1 0.1 -60 -40 -20 0 20 40 60 Pmax=281kW 300 200 Notice) Switching characteristics of VCE is defined between Sense C and Sense E1 for Upper arm and Sense E1 100 0 0 80 100 120 140 160 Temperature [oC] 500 1000 1500 Collector-Emitter voltage: VCE [V] 6 2000 FM5F8403 2014/12 2MBI225VX-170-50 IGBT Modules Warnings 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of 12/2014. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sure to obtain the latest specifications. 2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ・Computers ・OA equipment ・Communications equipment (terminal devices) ・Measurement equipment ・Machine tools ・Audiovisual equipment ・Electrical home appliances ・Personal equipment ・Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. ・Transportation equipment (mounted on cars and ships) ・Trunk communications equipment ・Traffic-signal control equipment ・Gas leakage detectors with an auto-shut-off feature ・Emergency equipment for responding to disasters and anti-burglary devices ・Safety devices ・Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). ・Space equipment ・Aeronautic equipment ・Nuclear control equipment ・Submarine repeater equipment 7. Copyright (c)1996-2014 by Fuji Electric Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd. 8. If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein. 7 FM5F8403 2014/12