Transcript
To our customers,
Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com
April 1st, 2010 Renesas Electronics Corporation
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Notice 1.
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”:
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DATA SHEET
MOS FIELD EFFECT TRANSISTOR
2SK2411, 2SK2411-Z SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
DESCRIPTION PACKAGE DIMENSIONS
The 2SK2411 is N-Channel MOS Field Effect Transistor designed
(in millimeter) 3.0 ±0.3
for high speed switching applications. 10.6 MAX.
5.9 MIN.
RDS(on)1 = 40 mΩ MAX. (@ VGS = 10 V, ID = 15 A) 4
1 2 3 6.0 MAX.
• Low Ciss Ciss = 1500 pF TYP. • Built-in G-S Gate Protection Diodes • High Avalanche Capability Ratings
1.3 ±0.2
10.0
• Low On-Resistance RDS(on)2 = 60 mΩ MAX. (@ VGS = 4 V, ID = 15 A)
4.8 MAX.
3.6 ±0.2
1.3 ±0.2
12.7 MIN. 15.5 MAX.
FEATURES
0.5 ±0.2 2.8 ±0.2
0.75 ±0.1 2.54
2.54 1. Gate 2. Drain 3. Source 4. Fin (Drain) JEDEC: TO-220AB
QUALITY GRADE Standard Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applica-
MP-25 (TO-220) 4.8 MAX.
(10.0)
tions.
1.3 ±0.2
V
Gate to Source Voltage
VGSS
±20
V
Drain Current (DC)
ID(DC)
±30
A
Drain Current (pulse)*
ID(pulse)
±120
A
Total Power Dissipation (Tc = 25 ˚C)
PT1
75
W
Total Power Dissipation (TA = 25 ˚C)
PT2
1.5
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
–55 to +150 °C
Single Avalanche Current**
IAS
30
A
Single Avalanche Energy**
EAS
90
mJ
*
1.4 ±0.2
1.0 ±0.3 (2.54) (2.54) 1 2 3
8.5 ±0.2
60
1.1 ±0.4 3.0 ±0.5
VDSS
R) .5 ) (0 .8R (0
0.5 ±0.2
2.8 ±0.2
Drain to Source Voltage
1.5 MAX.
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)
1.0 ±0.5
4
MP-25Z(SURFACE MOUNT TYPE) Drain
PW ≤ 10 µs, Duty Cycle ≤ 1 %
** Starting Tch = 25 ˚C, RG = 25 Ω, VGS = 20 V → 0
Gate
Body Diode
Gate Protection Diode Source
The information in this document is subject to change without notice. Document No. D13398EJ1V0DS00 (1st edition) (Previous No. TC-2492) Date Published March 1998 N CP(K) Printed in Japan
©
1994
2SK2411, 2SK2411-Z ELECTRICAL CHARACTERISTICS (TA = 25 °C) TYP.
MAX.
UNIT
Drain to Source On-Resistance
CHARACTERISTIC
SYMBOL RDS(on)1
MIN.
31
40
mΩ
VGS = 10 V, ID = 15 A
Drain to Source On-Resistance
RDS(on)2
40
60
mΩ
VGS = 4 V, ID = 15 A
2.0
V
VDS = 10 V, ID = 1 mA
S
VDS = 10 V, ID = 15 A
10
µA
VDS = 60 V, VGS = 0
±10
µA
VGS = ±20 V, VDS = 0
Gate to Source Cutoff Voltage
VGS(off)
1.0
1.5
Forward Transfer Admittance
| yfs |
15
27
Drain Leakage Current
IDSS
TEST CONDITIONS
Gate to Source Leakage Current
IGSS
Input Capacitance
Ciss
1500
pF
VDS = 10 V
Output Capacitance
Coss
720
pF
VGS = 0
Reverse Transfer Capacitance
Crss
190
pF
f = 1 MHz
Turn-On Delay Time
td(on)
20
ns
ID = 15 A
Rise Time
tr
260
ns
VGS(on) = 10 V
Turn-Off Delay Time
td(off)
130
ns
VDD = 30 V
Fall Time
tf
150
ns
RG = 10 Ω
Total Gate Charge
QG
50
nC
ID = 30 A
Gate to Source Charge
QGS
5.0
nC
VDD = 48 V
Gate to Drain Charge
QGD
15
nC
VGS = 10 V
Body Diode Forward Voltage
VF(S-D)
1.1
V
Reverse Recovery Time
trr
110
ns
IF = 30 A, VGS = 0
Reverse Recovery Charge
Qrr
320
nC
di/dt = 100 A/µs
Test Circuit 1 Avalanche Capability
Test Circuit 2 Switching Time D.U.T.
D.U.T. RG = 25 Ω PG
IF = 30 A, VGS = 0
RL
L PG.
50 Ω
VDD
RG RG = 10 Ω
VGS Wave Form
VDD
VGS 0
BVDSS
ID
VDS
VDD
ID Wave Form
VGS (on)
10 % 0
90 %
90 %
ID
VGS = 20 V → 0 IAS
VGS
90 %
ID
10 % 0
10 %
td (on)
tr
td (off)
tf
t t = 1 µs Duty Cycle ≤ 1 %
ton
toff
Starting Tch
Test Circuit 3 Gate Charge
D.U.T. IG = 2 mA PG.
50 Ω
RL
VDD
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.
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2SK2411, 2SK2411-Z TYPICAL CHARACTERISTICS (TA = 25 °C) TOTAL POWER DISSIPATION vs. CASE TEMPERATURE
DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 100
PT - Total Power Dissipation - W
dT - Percentage of Rated Power - %
100
80
60
40
20
0
20
40
60
80
100 120
140
80
60
40
20
0
160
40
60
80
100 120
Tc - Case Temperature - °C
FORWARD BIAS SAFE OPERATING AREA
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 100
PW
=
ID (pulse)
10
0
Di
m
s
10
ss
m DC s
ip
at
io
n
Pulsed
VGS = 10 V
80 VGS = 6 V
70 60 50
VGS = 4 V
40 30
10
ite
d
1
160
20
Li
m
Tc = 25 °C Single Pulse
1 0.1
s
µ 1 er
10
s
µ
d ite ) m 0V i L 1 n) ID (DC) (o S = G DS Po V R t w (a
10
ID - Drain Current - A
90
100
140
Tc - Case Temperature - °C
1000
ID - Drain Current - A
20
10
100
VDS - Drain to Source Voltage - V
0
2
4
6
8
10
12
VDS - Drain to Source Voltage - V
FORWARD TRANSFER CHARACTERISTICS
ID - Drain Current - A
1000
Pulsed VDS = 10 V
100
TA = –25 °C 25 °C 125 °C
10
1 0
5
10
VGS - Gate to Source Voltage - V
3
2SK2411, 2SK2411-Z TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
rth (t) - Transient Thermal Resistance - °C/W
1000
100 Rth (ch-a) = 83.3 °C/W 10
Rth (ch-c) = 1.67 °C/W
1
0.1
0.01 10 µ
100 µ
1m
10 m
100 m
1
Single Pulse 100 1000
10
1000 TA = –25 °C 25 °C 75 °C 125 °C
100
10
1 1
RDS (on) - Drain to Source On-State Resistance - mΩ
VDS = 10 V Pulsed
10
100
Pulsed 50 40 30
ID = 15 A
20 10 0 0
5
10
15
20
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
GATE TO SOURCE CUTOFF VOLTAGE vs. CHANNEL TEMPERATURE
Pulsed
50 40
VGS = 4 V
30
VGS = 10 V
20 10
1
10 ID - Drain Current - A
4
60
VGS - Gate to Source Voltage - V
60
0
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
ID - Drain Current - A
100
VGS (off) - Gate to Source Cutoff Voltage - V
|yfs| - Forward Transfer Admittance - S
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
RDS (on) - Drain to Source On-State Resistance - mΩ
PW - Pulse Width - s
2.0
VDS = 10 V ID = 1 mA
1.5
1.0
0.5
0 –50
0
50
100
Tch - Channel Temperature - °C
150
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE
SOURCE TO DRAIN DIODE FORWARD VOLTAGE 1000
80 ISD - Diode Forward Current - A
70 60 VGS = 4 V
50 40
VGS = 10 V
30 20 10 0 –50 –25
ID = 15 A 0
25
50
75
Pulsed
100 10 V VGS = 0 10
1
100 125 150
0
1.0
Tch - Channel Temperature - °C
Ciss 1000 Coss
Crss 100
10 10
1000 td (on), tr, td (off), tf - Switching Time - ns
Ciss, Coss, Crss - Capacitance - pF
SWITCHING CHARACTERISTICS
VGS = 0 f = 1 MHz
1
td (off) 100 tf tr 10
td (on) VDD = 30 V VGS = 10 V RG = 10 Ω
1.0
100
0.1
1.0
VDS - Drain to Source Voltage - V
80
di/dt = 50 A/µ s VGS = 0
VDS - Drain to Source Voltage - V
trr - Reverse Recovery Diode - ns
100
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
100
10 0.1
10
ID - Drain Current - A
REVERSE RECOVERY TIME vs. DRAIN CURRENT 1000
3.0
VSD - Source to Drain Voltage - V
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 10000
2.0
16 ID = 30 A
70 VDD = 48 V
60
14 12
50
10 VGS
40
8 VDS
30
6
20
4
10
2
VGS - Gate to Source Voltage - V
RDS (on) - Drain to Source On-State Resistance - mΩ
2SK2411, 2SK2411-Z
0 1.0
10
ID - Drain Current - A
100
0
10
20
30
40
50
60
70
80
Qg - Gate Charge - nC
5
2SK2411, 2SK2411-Z SINGLE AVALANCHE ENERGY vs. INDUCTIVE LOAD
SINGLE AVALANCHE ENERGY DERATING FACTOR 100
IAS = 30 A EA
S
=9
0m
10
J
VDD = 30 V VGS = 20 V → 0 RG = 25 Ω
1.0 10 µ
100 µ
1m
L - Inductive Load - H
6
dt - Energy Derating Factor - %
IAS - Single Avalanche Energy - mJ
100
10 m
VDD = 30 V RG = 25 Ω VGS = 20 V → 0 IAS ≤ 30 A
80
60
40
20 0 25
50
75
100
125
150
Starting Tch - Starting Channel Temperature - °C
2SK2411, 2SK2411-Z REFERENCE Document Name
Document No.
NEC semiconductor device reliability/quality control system.
C11745E
Quality grade on NEC semiconductor devices.
C11531E
Semiconductor device mounting technology manual.
C10535E
IC package manual.
C10943X
Guide to quality assurance for semiconductor devices.
MEI-1202
Semiconductor selection guide.
X10679E
Power MOS FET features and application switching power supply.
D12971E
Application circuits using Power MOS FET.
D12972E
Safe operating area of Power MOS FET.
D13085E
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device is actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
7
2SK2411, 2SK2411-Z [MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5
