Transcript
2SK2647-01MR
N-channel MOS-FET
FAP-IIS Series
800V
> Features -
4Ω
4A
40W
> Outline Drawing
High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated
> Applications -
Switching Regulators UPS DC-DC converters General Purpose Power Amplifier
> Maximum Ratings and Characteristics
> Equivalent Circuit
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified Item Drain-Source-Voltage Continous Drain Current Pulsed Drain Current Gate-Source-Voltage Repetitive or Non-Repetitive (Tch ≤ 150°C) Avalanche Energy Max. Power Dissipation Operating and Storage Temperature Range
Symbol V DS ID I D(puls) V GS I AR E AS PD T ch T stg
Rating 800 4 16 ±30 4 109 40 150 -55 ~ +150
Unit V A A V A mJ W °C °C
- Electrical Characteristics (TC=25°C), unless otherwise specified Item Drain-Source Breakdown-Voltage Gate Threshhold Voltage Zero Gate Voltage Drain Current
Symbol V (BR)DSS V GS(th) I DSS
Gate Source Leakage Current Drain Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On-Time ton (ton=td(on)+tr)
I R g C C C t t t t I V t Q
Turn-Off-Time toff (ton=td(off)+tf) Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge
- Thermal Characteristics Item Thermal Resistance
GSS DS(on) fs iss oss rss d(on) r d(off) f AV SD rr rr
Symbol R th(ch-a) R th(ch-c)
Test conditions ID=1mA VGS=0V ID=1mA VDS=VGS VDS=800V Tch=25°C VGS=0V Tch=125°C VGS=±30V VDS=0V ID=2A VGS=10V ID=2A VDS=25V VDS=25V VGS=0V f=1MHz VCC=600V ID=4A VGS=10V RGS=10 Ω Tch=25°C L = 100µH IF=2xIDR VGS=0V Tch=25°C IF=IDR VGS=0V -dIF/dt=100A/µs Tch=25°C
Min. 800 3,5
Test conditions channel to air channel to case
Min.
Typ. 4,0 10 0,2 10 3,19 2 450 75 40 20 40 50 25
Max. 4,5 500 1,0 100 4,0
3 1,0 450 3,0
FUJI ELECTRIC GmbH; Lyoner Straße 26; D-60528 Frankfurt; Tel: 069-66 90 29-0; Fax: 069-66 90 29-56
Typ.
Max. 62,5 3,125
Unit V V µA mA nA Ω S pF pF pF ns ns ns ns A V ns µC
Unit °C/W °C/W
2SK2647-01MR
N-channel MOS-FET 800V
4Ω
4A
FAP-IIS Series
40W
> Characteristics Typical Output Characteristics
Drain-Source-On-State Resistance vs. Tch
ID=f(VDS); 80µs pulse test; TC=25°C
ID [A]
2
→
Tch [°C]
→
VGS [V]
→
Typical Forward Transconductance vs. ID
Gate Threshold Voltage vs. Tch
RDS(on)=f(ID); 80µs pulse test; TC=25°C
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
VGS(th)=f(Tch); ID=1mA; VDS=VGS
↑ 5
→
ID [A]
Typical Capacitances vs. VDS
VGS(th) [V]
↑ 4
ID [A]
Tch [°C]
IF=f(VSD); 80µs pulse test; VGS=0V
VDS [V]
→
8
Starting Tch [°C]
Allowable Power Dissipation vs. TC
IF [A]
↑
Eas [mJ]
↑ 7
9
→
VSD [V]
↑ Zth(ch-c) [K/W]
ID=f(VDS): D=0,01, Tc=25°C
↑
Transient Thermal impedance Zthch=f(t) parameter:D=t/T
12
ID [A]
PD [W]
Tc [°C]
→
→
Safe operation area
PD=f(Tc)
10
→
Forward Characteristics of Reverse Diode
Eas=f(starting Tch); VCC=80V; IAV=4A
↑
6
→
Avalanche Energy Derating
C=f(VDS); VGS=0V; f=1MHz
↑
3
Typical Drain-Source-On-State-Resistance vs. ID
gfs [S]
RDS(ON) [Ω]
↑
RDS(ON) [Ω]
1
↑
C [F]
ID=f(VGS); 80µs pulse test;VDS=25V; Tch=25°C
↑
ID [A]
↑
VDS [V]
Typical Transfer Characteristics
RDS(on) = f(Tch); ID=2A; VGS=10V
VDS [V]
→
This specification is subject to change without notice!
t [s]
→