Transcript
UNISONIC TECHNOLOGIES CO., LTD 4N60
Power MOSFET
4 Amps, 600 Volts N-CHANNEL POWER MOSFET 1
DESCRIPTION
TO-220
The UTC 4N60 is a high voltage MOSFET and is designed to have better characteristics, such as fast switching time, low gate charge, low on-state resistance and have a high rugged avalanche characteristics. This power MOSFET is usually used at high speed switching applications in power supplies, PWM motor controls, high efficient DC to DC converters and bridge circuits.
1
TO-220F
FEATURES * RDS(ON) = 2.5Ω @VGS = 10 V * Ultra low gate charge ( typical 15 nC ) * Low reverse transfer Capacitance ( CRSS = typical 8.0 pF ) * Fast switching capability * Avalanche energy Specified * Improved dv/dt capability, high ruggedness
*Pb-free plating product number: 4N60L
SYMBOL 2.Drain
1.Gate
3.Source
ORDERING INFORMATION Normal 4N60-TA3-T 4N60-TF3-T
Order Number Lead Free Plating 4N60L-TA3-T 4N60L-TF3-T
Package TO-220 TO-220F
Pin Assignment 1 2 3 G D S G D S
Packing Tube Tube
4N60L-TA3-T (1)Packing Type
(1) T: Tube, R: Tape Reel
(2)Package Type
(2) TA3: TO-220, TF3: TO-220F
(3)Lead Plating
(3) L: Lead Free Plating, Blank: Pb/Sn
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4N60
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25℃, unless otherwise specified) PARAMETER Drain-Source Voltage Gate-Source Voltage Avalanche Current - (Note 1)
SYMBOL VDSS VGSS IAR
RATINGS UNIT 600 V ±30 V 4.4 A TC = 25°C 4.0 A ID Continuous Drain Current TC = 100°C 2.8 A Pulsed Drain Current, TP Limited by TJMAX - (Note 1) IDM 16 A Avalanche Energy, Single Pulsed (Note 2) EAS 260 mJ Avalanche Energy, Repetitive, Limited by TJMAX EAR 10.6 mJ Peak Diode Recovery dv/dt (Note 3) dv/dt 4.5 V/ns Power Dissipation (TC = 25°C) PD 106 W Junction Temperature TJ +150 ℃ Storage Temperature TSTG -55 ~ +150 ℃ Note Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.
THERMAL DATA PARAMETER
SYMBOL θJA θJC θCS
Junction-to-Ambient Junction-to-Case Case-to-Sink
MIN
TYP
MAX 62.5 3
0.5
UNIT °C/W °C/W °C/W
ELECTRICAL CHARACTERISTICS (TC =25℃, unless otherwise specified) PARAMETER Off Characteristics Drain-Source Breakdown Voltage
SYMBOL BVDSS
Drain-Source Leakage Current Gate-Source Leakage Current
IDSS Forward Reverse
Breakdown Voltage Temperature Coefficient On Characteristics Gate Threshold Voltage Drain-Source On-State Resistance Forward Transconductance Dynamic Characteristics Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
IGSS
VGS = 0 V, ID = 250 µA VDS = 600 V, VGS = 0 V VDS = 480 V, TC = 125°C VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V
MIN TYP MAX UNIT 600 10 100 100 -100
△BVDSS/△TJ ID = 250 µA, Referenced to 25°C VGS(TH) RDS(ON) gFS CISS COSS CRSS tD(ON) tR tD(OFF) tF QG QGS QDD
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TEST CONDITIONS
VDS = VGS, ID = 250 µA VGS = 10 V, ID = 2.2 A VDS = 50 V, ID = 2.2 A (Note 4)
VDS = 25 V, VGS = 0 V, f = 1MHz
VDD = 300V, ID = 4.0 A, RG = 25Ω (Note 4, 5)
VDS= 480V,ID= 4.0A, VGS= 10 V (Note 4, 5)
0.6 2.0
V µA µA nA nA V/℃
4.0 2.5
V Ω S
520 70 8
670 90 11
pF pF pF
13 45 25 35 15 3.4 7.1
35 100 60 80 20
ns ns ns ns nC nC nC
4.0
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Power MOSFET
ELECTRICAL CHARACTERISTICS(Cont.) PARAMETER SYMBOL TEST CONDITIONS Source- Drain Diode Ratings and Characteristics Drain-Source Diode Forward Voltage VSD VGS = 0 V, IS = 4.4 A Maximum Continuous Drain-Source IS Diode Forward Current Maximum Pulsed Drain-Source Diode ISM Forward Current Reverse Recovery Time tRR VGS = 0 V, IS = 4.4 A, dIF/dt = 100 A/µs (Note 4) Reverse Recovery Charge QRR Notes: 1. Repetitive Rating : Pulse width limited by TJ 2. L = 25mH, IAS = 4.4A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 4.4A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300µs, Duty cycle ≤ 2% 5. Essentially independent of operating temperature
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MIN
TYP MAX UNIT
250 1.5
1.4
V
4.4
A
17.6
A ns µC
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Power MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS + -
L
RG Driver * dv/dt controlled by RG * I SD controlled by pulse period * D.U.T.-Device Under Test
Same Type as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS (Driver)
P.W.
Period
D=
P. W. Period
VGS= 10V
I FM, Body Diode Forward Current ISD (D.U.T.)
di/dt IRM Body Diode Reverse Current
Body Diode Recovery dv/dt VDS (D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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4N60
Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS RG
VGS
D.U.T.
10V
10% t D(ON )
Pulse Width ≤ 1μs
tD (OFF) tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type as D.U.T.
50kΩ 12V
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF VDS
QGS
QGD
VGS DUT VG
3mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L VDS BVDSS
RD
10V
VDD D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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Breakdown Voltage Variation vs. Temperature 1.2 1.1 1.0 Note: 1. VGS=0V 2. ID=250µA
0.9
0.8 -100 -50 0 50 100 150 200 Junction Temperature, TJ (℃)
On-Resistance Junction Temperature
Drain-Source On-Resistance, RDS(ON) (Normalized)
Drain-Source Breakdown Voltage, BVDSS (Normalized)
TYPICAL CHARACTERISTICS
3.0 2.5 2.0 1.5
Note: 1. VGS=10V 2. ID=4A
1.0 0.5 0.0 -100 -50
Maximum Drain Current vs. Case Temperature 5 Drain Current, I D (A)
Drain Current, ID (A)
Operation in This Area is Limited by R DS(on ) 100 µs 1ms 10ms
1
0.1 1
Notes: 1. T J=25 ℃ 2. TJ=150℃ 3. Single Pulse
10
DC
100
4 3 2 1 0
1000
25
Drain-Source Voltage, VDS (V)
On-State Characteristics
1
0.1
10
5.0V
Notes: 1. 250µs Pulse Test 2. TC=25℃
0.1 1 10 Drain-to-Source Voltage, VDS (V)
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50 75 100 125 Case Temperature, TC (℃)
Transfer Characteristics Drain Current, I D (A)
Drain Current, ID (A)
10
V GS Top : 10V 9V 8V 7V 6V 5.5V 5V Bottorm :5.0V
50 100 150 200
Junction Temperature, TJ (℃)
Maximum Safe Operating Area
10
0
25℃ 1
0.1
150℃
Notes: 1. VDS =50V 2. 250 µs Pulse Test
4 6 8 10 2 Gate-Source Voltage, VGS (V)
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On-Resistance Variation vs. Drain Current and Gate Voltage 6 5 VGS =20V
4
VGS=10V
3 2 1 0
Note: TJ=25℃
0
6 8 10 12 2 4 Drain Current, I D (A)
On State Current vs. Allowable Case Temperature
Reverse Drain Current, IDR (A)
Drain-Source On-Resistance, RDS(ON) (ohm)
TYPICAL CHARACTERISTICS(Cont.)
10 150℃ 25℃ 1 Notes: 1. VGS=0V 2. 250µs Test 0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Source-Drain Voltage, VSD (V)
Capacitance Characteristics (Non-Repetitive)
Capacitance (pF)
1000
12
Ciss=Cgs +Cgd (Cds=shorted ) Coss=Cds +Cgd Crs s=Cgd
Ciss
800 600
Coss
Notes: 1. V GS =0V 2. f = 1MHz
400 200 0 0.1
Crss
Gate-Source Voltage, VGS (V)
1200
Gate Charge Characteristics
10 8
VDS=120V
6 4 2
Note: I D=4A
0 1
0
10
5
10
15
20
25
Total Gate Charge, QG (nC)
Drain-SourceVoltage, VDS (V)
Transient Thermal Response Curve
Power Dissipation 120
1
100 80 PD (w)
Thermal Response, θJC (t)
VDS=300V VDS=480V
0.1
40
Notes : 1. θJ C (t) = 1.18℃/ W Max. 2. Duty Factor , D=t 1/t2 3. TJ M-TC=P DM×θJC (t)
20
0.01 1E-5
1E-4 1E-3 0.01 0.1
1
10
Square Wave Pulse Duration, t1 (sec)
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60
0
0 20 40 60 80 100 120 140 160 T C (°C)
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4N60
Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all UTC products described or contained herein. UTC products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice.
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