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Sensing your life! Motion and environmental Sensing Solutions based on MEMS technologies МЭМС-датчики движения и контроля окружающей среды Москва, 28 мая 2013г. 2 ПЕРЕМЕЩЕНИЕ АУДИО •Акселерометр •Компас •Гироскоп •МЭМС+MCU •Микрофон •Динамик ОКРУЖАЮЩАЯ СРЕДА •Давление •Температура •Влажность •Хим. Состав •Инфракр. изл. •Расход газа Presentation Title АКТУАТОР •Электростат. •Пьезоэлектр. •Термический 03/06/2013 Where ST MEMS are used? Sport & Healthcare Industrial Home appliances Portable Automotive 3 ST MEMS ICs consist of… Three key elements of a MEMS Sensor: • Micron-sized Sensor Element (+ Cap) realized through a specific process (THELMA or VenSen or variants of them) • An Advanced Mixed Signal Chip with embedded smart functionalities • Dedicated Package and Calibration features ASIC @ 130/160 nm THELMA @ 1 um 3 Axis Gyroscope + = 4 Stacked Dice ASIC Sensor Cap Sensor LIS2DH sensor; shown without 2x2mm2 package (Resin) 5 Motion MEMS for 3D orientation • The accelerometer senses linear acceleration • In static conditions, the projection of gravity on the three axes allows tilt angles to be computed • The magnetometer senses the magnetic field • In static conditions, the projection of the geomagnetic field on the three axes allows the heading angle to be computed • The gyroscope measures the angular rate applied to the device • In dynamic conditions, by integration of the 3-axis angular rate, the 3D orientations can be computed Sensor fusion and AHRS* algorithm for 3D space orientation *Altitude heading reference system 6 Motion MEMS - Accelerometer – LIS3DH • 3-Axis Digital SPI/I2C Accelerometer • 4 selectable Full Scales: ±2, 4, 8 and 16g • Up to 12 bit resolution • Very low power consumption: • 2µA in Low power mode (1Hz), • 11µA in Normal mode (50Hz) • 0.5µA in Power down mode • High number of features for a Higher Flexibility • Small size package 3x3x1 (in mm) В наличии на складе КОМПЭЛ 7 Motion MEMS – tiny Accelerometers - LIS2DH LIS2DH: up to 12 bit resolution 2 Interrupt generators 2x2x0.9 LGA-14      Activity / Inactivity Full-scale ranges of ±2g/±4g/±8g/±16g Temperature sensor FIFO memory block 4D/6D orientation detection Programmable interrupt signals that enable immediate notification of motion detection, click/double-click events, and other conditions  Small size & Low power targeted applications 8 Motion MEMS – low noise Accelerometer - LIS3DSH • 3-Axis Digital SPI/I2C Accelerometer • 5 selectable Full Scales: ±2, 4, 6, 8, 16g • 2 programmable embedded finite-state machines (up to 16 states) for interrupt generation • Very High Resolution (up to 14 bit) and low noise (150µg/vHz) • Low power consumption: 11µA in Active mode (3.1Hz) and 2µA in Power down mode • High Flexibility • P2Pcompatible with LIS3DH Поступление на склад КОМПЭЛ: Июль 2013 9 Motion MEMS - LIS3DSH - state machine? • The State Machine (SM) a allows a dynamic and customized motion sequence detection • INPUTS: Acceleration data from x, y & z, Vector Amplitudes, Timers, Thresholds, Peak Detection • OPERATION: Event Detections are configured by the customer through the register setting • OUTPUTS: Interrupt/Wake-up requests for uController • The State Machine is autonomous and generate Interrupts when event is detected • State Machined sensors reduce system power consumption as movement detection is managed by LIS3DSH and no more by MCU • Comprehensive Tools available 10 Motion MEMS – LIS3DSH - use cases • Examples of State Machine utilization: • Basic movements detection: • Free Fall, • Peak measurement, • From 1 click/tap to several click detections such as double/triple tap detection • Sophisticated movements detection: • Combination of basic movements detection, free fall then peak amplitude measurement • Activity & Object tracking: number of steps, movement, …. More on the State machine: AN3393 LIS3DSH 11 Motion MEMS - 3-Axis Gyroscopes - L3GD20 12 L3GD20 Features • Selectable Full Scale from ±250 up to ±2000 dps • 16 Bit data output, ODR from 95 to 760 Hz • Rate Noise Density: 0.03 dps/√Hz • Digital Interfaces I2C/SPI • Programmable interrupts • Embedded Power-down and sleep modes • Embedded FIFO • integrated low- and high-pass Filters with userselectable Bandwidth • Temperature sensor • Supply voltage 2.4 to 3.6V • LGA -16 Package 4x4x1mm В наличии на складе КОМПЭЛ Motion MEMS - Digital Compass - LSM303D 13 • MEMS Accelerometer + Magnetic sensor • 3A (12bit): from 2 to 16g dynamically selectable full-scale • Embedded temperature sensor (12 bit output) • FIFO • Self-test • 3M (16bit): from 2 to 12gauss dynamically selectable full-scale • Resolution selectable • I²C/SPI interfaces • LGA-16, 3 x 3 x 1 mm³, P2P compatible with LIS3DH / LIS3DSH 2.5 mgauss typical resolution @ 12 gauss full scale В наличии на складе КОМПЭЛ: LSM303DLHCTR и LSM303DLM Motion MEMS - 3-axis Magnetometer - LIS3MDL* • LIS3MDL is a 3-axis standalone digital magnetometer: • FS ±4/±8/±12/±16gauss • Typical resolution ῀3mgauss RMS • ODR on single mode operation from .625 to 80Hz • I2C/SPI • Vdd from 1.9 V to 3.6 V with 1.8V IOs compatible • Self-test • Power consumption (@ODR=20Hz): • 270µA in High resolution • 40µA in Low power • 1µA in Power down • 2x2x0.7 mm 12L-LGA * Available in Q3 2013 for MM 14 Why 9-DoF and Sensor Fusion are needed Gyroscopes tracks heading, pitch and roll on an instantaneous and short term basis + Not influenced by lateral acceleration, vibration, or changing magnetic fields - Does not have absolute reference and has an intrinsic drifts over time Accelerometer tracks the direction of gravity + has absolute long-term reference (gravity) - susceptible to acceleration, vibration Magnetometer tracks the direction of Earth’s magnetic field + has absolute long-term reference (Earth’s magnetic field) - susceptible to magnetic interference Data from multiple sensors are combined through digital filtering algorithms (Kalman filter) so measurement distortions, inaccuracies and interferences of the individual sensors are compensated obtaining an accurate and responsive dynamic attitude information (pitch/roll/heading or quaternions). Resulting Heading / Orientation is immune to environmental magnetic disturbance and to the drift of the gyroscope 15 Motion MEMS - iNEMO - Inertial Movement Unit • 6-axis Digital IMU, Accelerometer + Gyroscope • When application needs 3-axis Accelerometer and 3-axis Gyroscope • More compact solution than separated devices • 1 device to be soldered instead of 2 LSM330DLC • LSM330DLC (12bit accel + 16bit gyroscope) in a 4x5 package MEMS IMU • LSM330D (12bit accel + 16bit gyroscope) in a 3x5.5 package • LSM6DS* (14bit accel + 16bit gyroscope) in a 3x3 package *Available for MM in Q1 2014 (tbc) В наличии на складе КОМПЭЛ: LSM330DLС и LSM330D 16 Motion MEMS – iNEMO Inertial Module LSM330DLC: • MEMS Accelerometer (LIS3DH) + Gyroscope sensor (L3GD20) • 3-axis accelerometer, ±2 ±4 ±8 ±16g Full Scale • 3-axis gyroscope, ±250 ±500 ±2000 dps Full Scale • SPI/I²C digital interface • Power-down mode • 4x Interrupt lines (2x gyro and 2x accel) • 2x Embedded FIFOs and Temperature sensor • Small 4x5 package LSM330DLC MEMS IMU 17 Motion MEMS - iNEMO-M1: Overview LSM303DLHC6-Axis eCompass STM32F103 32-bit Microcontroller • The iNEMO-M1 a tiny sensor fusion system on board (SoB). • It consists of multiple ST`s sensors: • 3 axis accelerometer, • 3 axis gyroscope, • 3 axis magnetometer and a powerful L3GD20 3-Axis Digital Gyroscope • 32-bit computational core. • Is targetted for: • augmented reality, • navigation, • human machine interfaces, • robotics • industrial automated systems and • body motion reconstruction. just 13x13x2 mm2 • Several communication interfaces & small size (13x13x2 mm) make the iNEMO-M1 a flexible solution for orientation estimation applications. 18 Motion MEMS - iNemo-A + Brain STMicroelectronics Unveils Ultra-Compact 3-Axis Accelerometer with Embedded Microcontroller for Advanced Motion-Recognition Capabilities and Sensor Hub Smart sensor packs motion sensing and intelligence into 9 mm3 Geneva, January 22, 2013 - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world’s top manufacturer of MEMS (MicroElectro-Mechanical Systems) 1, today announced details of a miniature smart sensor that combines a 3-axis accelerometer with an embedded microcontroller together in an ultra-compact 3x3x1mm LGA package for advanced custom motion-recognition capabilities. LIS331EB Accelerometer + ARM0 = “Brain” LIS3MDL L3GD20H 19 Motion MEMS - Smart sensor - LIS331EB* LIS3DSH: - Low-power mode down to 10 μA - ±2g/±4g/ ±6g /±8g / ±16g full-scale - Data rate: 3Hz to 1.6kHz - 16 bit data output - Low noise 150µg/vHz - Embedded FIFO and State Machine - 10000 g high shock survivability Accelerometer BRAIN: - Cortex-M0 core - 72MIPS@80Mhz - 80 MHz / 32 KHz RC / External crystal oscillator - 64KB Flash Memory - 128KB RAM memory - 2x I2C (1 Master, 1 Slave) - SPI Master/Slave - JTAG/SWD - 7 Programmable GPIOs - Embedded WDG (32Khz) - Embedded Timers/Event Counters - Low power features *Available for MM in Q2 2014 MCU – M0 20 Environmental Sensors - personal weather forecast Humidity, Pressure and Temperature sensors Re-engineering the personal barometric station 21 22 Environmental SENSORS 03/06/2013 Environmental Sensor - LPS331AP Key Features Barometric Sensor Key Features Dimension 3x3x1mm Pressure range 260-1260 mbar Overpressure / Shock > 20 bar / 10,000G ADC resolution 24 bits Supply Voltage 1.71 to 3.6 V Power consumption Less than 1 µA (stby) 5.5uA (low res) @ 1Hz ODR 30 µA (high res.) @ 1Hz ODR Pressure noise 0.060 mbar rms (0.5 meter) Relative Accuracy over temperature (0÷80°C) • • • • Pressure and Temperature inputs Analog to Digital Conversion (ADC) Embedded Filtering & Compensation I2C or SPI Digital output Factory calibrated System on a Chip! 23 Other features Quadratic : ± 1 mbar Linear embedded : ± 2 mbar Auto zero One Shot mode ODR selectable up to 25Hz Digital features Compensation Linear Embedded Quadratic external SW Offset management Embedded temperature and Embedded 3 point calibration В наличии на складе КОМПЭЛ 24 AUDIO& SOUND • MEMS Microphones: • Technology, Product Description & Features - • Audio Processor : • Multiple Microphones Application 03/06/2013 ST MEMS Microphone everywhere 26 DSC Laptop & Ultrabook Tablet and Smartphone Skype TV Smart Accessory Industrial 26 Overview DUAL DIE ARCHITECTURE THE MEMS SENSOR (FROM THE PRESSURE SOUND WAVE TO CHANGE OF CAPACITANCE) THE ASIC (FROM A CAPACITANCE CHANGE TO INTO A DIGITAL OR ANALOG OUTPUT) TOP AND BOTTOM PORT DEPENDING ON THE POSITIONINGG OF THE SOUND INLET 27 Sensitivity Vs. Temperature ECM – MEMS Microphone 28 MP34DT01 – digital microphone ECM parts 5 4 Relativesensitivity [dBr] 3 2 1 0 -1 -2 -3 -4 -5 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature [DegC] ECM AUDIO PERFORMANCES ARE HIGHLY IMPACTED BY TEMPERATURE VARIATIONS 90 Lab tests shows operation in the -40  85°C range MEMS AUDIO PERFORMANCES ARE IMMUNE TO TEMPERATURE VARIATIONS. Frequency response comparison #1 COMPETITOR ST MEMS MICROPHONES COMPETITORS PERFORMANCES ARE GUARANTEE AN HIGH FIDELITY NOT UNIFORM AND DEPEND ON SENSING IN THE WHOLE ABW THE FREQUENCY ST MEMS Microphone are ideal for Noise cancellation thanks to Frequency Flatness 29 Ultra-flat frequency response State-of-the-art membrane Current Design Others ANSYS Simulating Vibrating membrane 4 point support Sensitivity Good Conventional style Supporting all round structure Fair OUR 4 ANCHOR POINT MEMBRANE DESIGN ALLOW US TO GET HIGH SENSITIVITY WITH MINIMAL CHIP AREA AT ANY FREQUENCY 30 ST MEMS Microphone: Nomenclature MP34DB01 MP: microphone 34: package size D: digital (otherwise A for analog) B: bottom port (otherwise T for top) EXAMPLE MP45DT02 : MEMS microphone, 4x5 wide, digital, top port, revision 02 01: device revision 31 Digital MEMS Microphone MP34DB01 / MP34DT01 • • Omni-directional sensitivity Digital PDM output interface • • Acoustic overload point: 120dBSPL SNR(A-weighted @ 1KHz, 1Pa): • • 62.6dB (Bottom) 63dB (Top) • • • Sensitivity: -26dBFS PSRR: -70dBFS (217Hz sq.wave, 100mVpp) THD+N: <1% @ 100dBSPL • • Supply voltage: 1.64V / 3.6V Current consumption: • • Normal mode: 600μA Power-down mode: 20μA RHLGA 3 x 4 HCLGA 3 x 4 (thickness: 1mm) (thickness: 1mm) Available NOW FREQUENCY RESPONSE 32 • Omni-directional sensitivity • Analog output interface Analog MEMS Microphone MP33AB01 /MP33AB01H 3.76x2.95x1.00 • Acoustic overload point: 125dBSPL Available NOW • SNR: 63dBV (MP33AB01) • SNR: 66dBV (MP33AB01H) ST Freq Response • Sensitivity: -38dBV • THD+N: <1% @ 94dBSPL <2% @ 115dBSPL • Supply voltage: 1.5V / 3.6V • Current consumption: 130 typ @ 2V • Temperature range: -30ºC / +70ºC #1 competitor 33 Multiple Microphones Applications STA321MP Microphone Array Processor Multiple microphones applications ACTUAL TREND IS TO EMBED INTO A SINGLE APPLICATION MULTIPLE MICROPHONES TO OFFER FEATURES LIKE BEAM-FORMING ADAPTIVE NOISE CANCELLING SOUND SOURCE LOCALIZATION DIGITAL MEMS MICROPHONES REPRESENT THE PROPER SOLUTION FOR ARRAY • DIGITAL OUTPUT • SMALL SIZE • PERFORMANCE PERFECT MATCH A COMPANION CHIP IS NEEDED TO SUPPORT PROCESSING ACTIVITIES ON MICROPHONES SIGNAL OFFLOADING THE APPLICATION MCU/CPU 36 ST MEMS & SENSORS Conclusion • Continuous performance improvement • Superior performances and reliability • Manufacturing capabilities • ST has delivered 3 Billions MEMS units • Since 2012, ST Manufacturing capacity 4Mu per day (2 manuf sources) • Sophisticated processing engine • iNemo Fusion IP • System in package (SiP) technology • Bringing more values into smaller spaces 37 38 9 axis IMU - production 39 ANALOG FULL SET of ANALOG & SENSORS around STM32 40 Standard Analog Enhance The Signal Chain Key of features Wide Range Commodities     N°2 World Wide on LM3xx 1.5 B Units / Year Tiny DFN/QFN optional High Reliability   0.1ppm Automotive Grade <1ppm Industrial Grade Tiny packages Precision Micro-power Key features New CMOS Technology  Reduced consumption (nano-power <1µA)  Industrial & Automotive Voltages 16V CMOS (36V in 2014)  Tiny DFN/QFN Packages  Improved Precision (ie Zero Drift) >30 New Root Part Numbers /yr ! WHAT’S NEW ? M41T62LC* M41TC8025 42 TS881 TSV7, TSU1 MP34DT MP33AB Nano Consumption & precision op-amps & comparators Tiny & Temperature Compensated RTC with embedded crystal MEMS Microphone ultra-flat response TSX56x* TSX63x 16V CMOS OpAmps Motion MEMS & iNemo SW LPS331AP* MEMS Pressure Sensor SPIRIT1** STBLC01, BlueNRG Sub-Giga & BTLE ultra-low power RF Transceivers * В наличии на складе/**в пути TS881 in our Portfolio TS881 220nA / 2us Best Consumption! Best Speed/ Consumption tradeoff ! 43 TS881 Industry’s Lowest Consumption Comparator Features Benefits • Ultra Low Current Consumption: Typ 210nA Long battery lifetime • Operating Voltage Down to 1.1V up to 5.5V Suitable for Rechargeable battery • Push Pull output Save the pull-up resistor • Response time 2µs • -40 to 125°C • ESD Tolerance 8 KV HBM • SC70-5 Fast enough for most applications Robust Space saving 44 Comparators Roadmap LMV331/393/339 Micro power 100uA 200ns TSX393 / TSX3702 TS331 /332/334 16V CMOS 5uA 1.5us ESD 4KV 20uA 200ns High speed TS3021 TS3011 TS3012 100uA 50ns 470uA 8ns 470uA 8ns Production Development Available in H1.2013 Low power TS882 210nA 2us High speed TS881 210nA 2us Nano power 45 Operational Amplifiers Roadmap Micro power 16V CMOS op-amp TSV52x 45µA 1.15Mhz TSV62x 29µA 420kHz TSX56x 235µA 850khz TSV63x 60µA 880kHz Micropower 16V CMOS op-amp Micropower 16V CMOS op-amp TSX632/TSX634 TSU1x 650nA 8kHz Nano power Nanopower 5V CMOS op-amp TSV71x Vio<200µV 10µA Precision TSX631 45µA 200khz TS507 Bip Vio < 100µV 200kHz Micropower 5V CMOS op-amp TSX7 Vio 200µV; 800µA 2.5Mhz 16V CMOS Precison op-amp TSV73x Vio<200µV 60µA 1.2MHz Micropower 5V CMOS op-amp Zero-drift Low power TSV61x 10µA 120kHz TSX921 3mA 10Mhz TSZ121 Vio<20µV 50nV/ºC Micropower Zero-drift op-amp Production Development Available in H1.2013 TSZ122 / TSZ124 Precision Low power LMV82x 300µA 5.5MHz TSV85x 180µA 1.3MHz 46 Summary Op Amps Series Main Features TSV5 – TSV6 TSV8 – TSV9   TSV7 – TSZ121 Comparators TSX5 – TSX6 TSX9 TS881 TS3011   Ideal for Micropower 5V CMOS Low voltage   Sensor Signal conditioning Battery operated devices   High Precision Micropower 5V CMOS    Sensor Signal conditioning Medical instrumentation Handheld equipment   Micropower 16V CMOS Excellent Power/Bandwidth ratio   Power Applications (12V ,15V, +/- 5V) AFE for High Voltage sensors   Nano power Very low voltage   Gaz, CO detectors Battery operated Security System   Optical modules High frequency system Nano Second response time High efficiency Visit us on www.st.com/opamps 47 M41TC8025 Low Power Real time Clock with Temperature Compensation High accuracy RTC with embedded crystal and temperature drift compensation Standalone vs Embedded RTC in MCU? STANDALONE Vcc Vbat DC/DC RTC Xtal • Lower consumption • Higher accuracy EMBEDDED Xtal MCU Vcc DC/DC Vbat MCU RTC LDO • Perceived as more integrated (but needs external Xtal) • Lower system cost but basic performance 49 Real Time Clock Accuracy Identified factors PPM Impact ST Solution Matching of Load capacitance with Xtal 20 to 60 Intrinsic property +/- 30 (at 25°C) Embedded Crystal & Analog Calibration In ST factory Ambient Temperature 130 (25 to 85°C) Aging of the Quartz Xtal +/- 5 (per year) Total PPM impact up to 230 Min/ Month Automatic Temperature Compensation M41TC8025 : less than 5 PPM PPM s/ Month Min/ Year 2 5 1 min 10 26 5 min 12s 50 129 2 min 09s 25 min 48s 100 259 4 min 19s 51 min 48s 150 388 6 min 28s 1h 17min 36s 50 M41TC8025 Features & Benefits Features Embedded calibrated Xtal & high accuracy over temperature • ±5.0 ppm max (-40 to 85 °C) • ±3.8 ppm max (0 to 50 °C) Benefits No Xtal to select No capacitor to match No CPU for temperature compensation When accuracy matters ! • Very Low Consumption 800nA typ Suitable for battery powered applications Supply voltage from 1.6V (retention) 1.8V (I2C operating) 2.2V (compensation) Longer battery lifetime More simple , power saving & accurate than MCU embedded RTC 51 STC3115 Adaptive Gas Gauge Release To Market Introduction to Gas Gauge Monitors For systems with batteries, one challenge is to precisely predict the remaining time before recharge or battery change. • State of charge can be estimated with MCU accuracy is low and consumption higher • A battery monitoring device : • measures voltage, current and temperature of the battery even when MCU is in standby. Low Consumption (<100 µA) • keeps track of the battery charge & discharge with High accuracy (<1%) Battery indicator Poor battery indicator without dedicated gas gauge support. Battery data Current Battery State-of-Charge Remaining Percentage 0.32 A 80 % Voltage 3.71 V Remaining Time 2:06 Temperature 27 °C Reliable and accurate battery state-of-charge measurement preserves battery life time! 53 2 ways of estimating State-of-Charge 1. Voltage Mode : Integration of Battery voltage variations over time Voltage Measurement + Model Curve ▬▬▬▬▬▬▬▬▬▬ = State of Charge (%) • No need for resistor • Low power/ Low accuracy Voltage mode is best : • for initial estimation • during system standby 2. Batteries Model Curves OCV : Open Cell Voltage (V) SOC : State of Charge (%) Coulomb Counter : Current flowing into the battery is accumulated (calculation) over time. Current measurement through resistor: High accuracy but higher consumption. Coulomb Counter is best : • for high accuracy estimation during system run 54 4 Strengths of STC3115 1 Embedded adaptive algorithm : dynamically adjusts the initial battery model curve. • Temperature compensation • Aging compensation Power management Micro Controller Main Reset ctrl IRQ Charger RSTIO Alarm Control Thermal protection I2C STC3115 + - Battery pack 2 3 New battery detect : to reset the battery monitoring. 4 Automatic mode selection : Voltage Mode or Coulomb Counter according to system status. Charge inhibit during voltage measurement for better accuracy. 55 57 RF Communication LOW POWER DESIGN Cuts power budget by 50% over competing devices Every mA counts: • RX : 9mA • TX: 21mA [@ +11dBm] • Shutdown: 2.5 nA Excellent Sensitivity: -118 dBm 58 Bluetooth® SMART Roadmap STBLC01 Bluetooth Low Energy Controller BlueNRG Bluetooth Low Energy Wireless Network Processor  BLE radio  Embedded full BLE stack  Interfaces with an host MCU  BLE radio  BLE lower stack  HCI interface to host MCU 2012 MP=NOW 2013 ES=Feb 2013 Eval Kit=April 13 MP=July 2013 Bluetooth® SMART 59 BlueNRG Application schematic 60 Component High performance Mode Standard Mode C9 0.8pF 0.7pF C10 0.7pF 0.7pF C11 51pF 51pF C14 1pF 1pF C15 1.2pF 0.8pF C16 51pF 51pF L2 1.2nH 1.4nH L3 2.7nH 3.7nH L4 1nH 1nH High Performance or Standard Mode selectable through BOM • High Performance : TX output power up to +8dBm • Standard Mode : TX output power up to +5dBm Bluetooth® SMART BlueNRG: a fully qualified Bluetooth® SMART solution 61 February 19, 2013 RF, LL, HCI and Host stack qualification Bluetooth® SMART BlueNRG main performance Parameter Symbol Off Mode Ioff Sleep Mode Isleep Reset Idle Mode Stand-by TX @0dBm Sleep RX 32 kHz XO 32 kHz RO Iidle Typ. Value Typ. value DCDC not active 1 Typ. Value Unit DCDC active 3 5 1.5 Itx Irx 2 3 150 13.5 14.5 Unit Current Consumption [Vin=3.3V] µA µA 5 1.5 µA mA nA µA 2 3 mA µA Active (CPU) 2.3 2 mA TX @+5dBm 21 11 mA 14.3 7.3 mA RX Reference Design Configuration Minimum Output Power Maximum Output Power Unit High Performance Mode -15 +8 dBm Standard Mode -21 +5 dBm TX performance Bluetooth® SMART 62 Focus on RF SPIRIT1 • Advanced Features • Basic Packet • Stack Packet • Automatic packet filtering • Automatic acknowledgment • Receiver quality indicators (Rx Timeout management) • Antenna diversity • PA options 63