Transcript
블루투스 시스템 개발 기술
서울대학교 Bluetooth Lab. 팀장 이한욱
목차(Contents) 1.블루투스 2.블루투스 3.블루투스 4.블루투스 5.프로토콜 6.블루투스
개요 개발 관련 기술의 종류 칩셋 모듈 스택 인증
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1.블루투스 개요
What is Bluetooth (1) z
Harald Blaatand “Bluetooth”
King of Denmark 940-981 AC
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Ericsson Mobile Communication의 사내 프로젝트로 시 작,1994
z
Universal radio interface in the ISM band that enables portable electronic devices to connect and communicate wirelessly via short-range, ad hoc networks
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What is Bluetooth (2) z
Bluetooth SIG (Special Interest Group)
Members 9 Promoters : Ericsson, Nokia, IBM, Toshiba, Intel, Microsoft, Motorola , 3Com, Lucent Technologies 9 Associate 9 Adopter
z
Website : www.bluetooth.com , www.bluetooth.org
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Bluetooth Concept (1) z
Low Cost, Low Power, Short Range
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Low Cost : $5 per Chip Low Power : 0.3~30mA (휴대용 기기에 적합) Short Range : 10m~100m
Replace All Signal Cable
“Less Wire, More Life” - Nokia “Making Bluetooth Dreams Come True” – Ericsson “A Wireless Specification that Goes Where You Do” – Bluetooth SIG
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Bluetooth Concept (2)
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Bluetooth Concept (3)
Cable Replacement
Data/Voice Access Points
Personal Ad-hoc Networks
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Specification Overview Wireless Technology for Cable Replacement z Low Cost, Low Power, Short Range z 2.4GHz ISM Band z FHSS (Frequency Hopping Spread Spectrum) z
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CH, 1MHz/CH Hopping Rate : 1600Hz Pseudo Random Pattern z
Maximum Rate : 1Mbps Actual
Maximum Rate : 723.2 Kbps
Transfer Range : 10~100m z Networks Support z
Piconet
(Master 1 : Slave 7) Scatternet (Inter-Piconet) 9
2.블루투스 개발 관련 기술의 종류
블루투스 개발 관련 기술 z
블루투스 칩셋 하드웨어(Hardware)
z
블루투스 모듈
z
프로토콜 스택 및 프로파일
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어플리케이션 개발
z
인증(Qualification)
- 소프트웨어(Software)
- 하드웨어+소프트웨어 - 테스트(Test)
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Bluetooth System Overview
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관련 기술의 형태 칩셋 개발
Upper Layer
프로토콜 스택/ 프로파일 개발 모듈 개발
어플리케이션 개발
인증(Qualification)
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3.블루투스 칩셋
블루투스 하드웨어의 구조
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RF Design(1) : Receiver Antenna Filter
LNA
RF Mixer
Selectivity Filter&Gain
Demodulator
VCO Digital Data
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RF Design(2) : Transmitter Antenna Filter
PA
RF Mixer
Modulator
VCO Digital Data
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Silicon Technology for RF
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Baseband Processor z
Baseband
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Link Manager
DSP Processor
USB UART
z
z
RF Interface Digital Interface
RF Interface
μ-Processor (16bit/32bit)
IO
RAM
PIO PCM
Flash Rom (Lower Stack Firmware)
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Baseband/Link Controller z
Baseband : Provide Reliable RF Link Physical
RF Channel / Logical Channel Support ACL/SCO Link Guaranteed Delivery/Throughput : ARQ, FEC z
Link Manager Baseband
Connection Management Piconet Management : Hold, Sniff, Park Authentication/Encryption z
Firmware in Flash Rom Lower
Layer Stack : BB+LM+HCI
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RF Interface z
SPI 8-Pad
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Bi-directional Serial
JTAG 14-Pad
Uni-directional Serial
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Industrial Standard Interface
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Vendor Specific Interface
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칩 솔루션의 형태 RF RF IC IC
Baseband Baseband IC IC
RF Baseband RF Baseband IC IC IC IC
Two Chip Solution
One Chip Solution 22
One Chip Solution z
RF+μP+DSP+RAM = 1Chip
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CMOS Process
z
Advantage
z
Easy to Use Small, Compact
Disadvantage
Not Flexible RF Performance (CMOS) μP (16bit)
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Two Chip Solution z
RF IC (BiCMOS/CMOS)
z
Baseband IC
μP+DSP+RAM
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CMOS/BiCMOS Process
z
Advantage
Flexible, Scalable Design 9 Baseband IP (SoC)
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RF Performance (BiCMOS) μP (32bit:ARM7TDMI) Small Off-Chip Requirements
Disadvantage
Complexity 24
Chip Maker(1) : CSR z
BlueCore2-External
Single Chip (RF+Baseband) CMOS External Flash Rom 25
Chip Maker(1) : CSR z
BlueCore2-Flash/ROM Internal Flash/Rom HCI Stack/Upper Layer Stack (L2CAP, RFCOMM)
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Chip Maker(1) : CSR z
BlueCore2-Audio/Multimedia
Internal Audio Codec for Headset DSP for High Quality Audio Application
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Chip Maker(2) : Ericsson z
Radio Core : K-E1
No Module Approach No External RF Sensitive Components Smallest Off-Chip Requirements Small Size, Thin Thickness
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Chip Maker(2) : Ericsson z
Baseband IP : Q-D1
Low Power SoC IP(Intellectual Property) Target : Mobile Phone Low CPU Load : Below 1.9MIPS ASCI Design Flow for ARM7TDMI PPEC(Pitch Periodic Error Concealment) : Enhance Voice Quality
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Chip Maker(2) : Ericsson z
Baseband IP : Q-D2
Small, Inexpensive, Power Saving Solution Target : PDA Utilizing Existing System Resource Low CPU Load : Below 1.9MIPS SoC Design for ARM Family(ARM9) Low Power Solution
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Chip Maker(3) : Silicon Wave z
Radio Core : SiW170X
SiW1701 : Generic Radio Modem SiW1702 : for CDMA Phone SiW1703 : for GSM Phone
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Chip Maker(3) : Silicon Wave z
Baseband : SiW170X
SiW1750 : External Flash Memory SiW1760 : 256KB Internal Rom SiW1770 : 256KB Internal Flash Memory
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Chip Maker(3) : Silicon Wave z
Baseband IP
Target Host : Mobile Phone, PDA, Printer, Digital Camera, HID, AP Source RTL Code, Code Description, Synthesis, DFT Insertion Script,…
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Chip Maker(4) : Broadcom z
Radio Core : BCM2002
Compatible with Qualcomm Chip : MSM3300, MSM5100 CMOS Process
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Chip Maker(4) : Broadcom z
Single Chip : BCM2033
Single Chip (RF+Baseband) CMOS Process
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Chip Maker(5) : GCT z
Baseband : GDM1202
Hybrid Processor (32bit RISC+24bit DSP) Portable MP3 Player Wireless Short Range Audio Streaming Wireless High Quality Digital Speaker
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Chip Maker(6) : Brightcom z
Baseband : IntelliBlue BIC2301
Contain Fast Ethernet MAC Controller LAN Access Point, Remote Access Server, Hub, DSL Gateway
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Other Chip Makers Single Chip
RF
Baseband
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4.블루투스 모듈
What is Bluetooth Module? z
RF IC + Baseband IC + OffChip RF Components + Flash = Mini PCB
RF Baseband IC IC Off-Chip Flash RF Comp Rom
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Why Bluetooth Module? z
Difficulty in Making 2.4GHz RF Circuits
z
Saving Developing Time
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Noise, Design Parameter, Matching Need Know-How, High Cost
Easy to Use for Hardware Developer Shorten Qualification Test Process
Cost Down
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Bluetooth Module Architecture Xtal USB
LNA BPF
RF Switch
RF IC
UART
Baseband IC
Balun VCO
PIO PCM
Flash
PLL
SPI
Regulator 1~3 Chip, 30~50 Discrete Components 42
Off-Chip RF Components z
Balun
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PCB Pattern/Surface Mount
PLL/VCO
R/C
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PCB Layout
4~6 Layer Minimum Size : 10×10mm (or Below)
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PCB Components
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Bluetooth Module Roadmap
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Bluetooth Module Maker(1) Model : ROK101 007, ROK104 001 Chip : Ericsson Size : 10.5×15.5mm
Model : UGXZ Series Chip : CSR Size : 10×10mm
Model : EYSF Series Chip : Silicon Wave 47
Bluetooth Module Maker(2)
Model : LMX9814 Chip : National Semiconductor Size : 10.1×14mm
Model : BlueSEM Chip : CSR, Infineon Size : 14×18mm
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5.블루투스 프로토콜 스택
Protocol Stack Overview
Not Included in Chip (Firmware)
Included in Chip (Firmware)
Must Be Implemented According to Your Host
Just Buy Chip/Module
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What is Protocol Stack? z
Upper Layer Protocol Software Operated in Host
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Provide Source Code/Library
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API/Library for Windows/WinCE ANSI C code for Embedded System
Provide Qualification Product
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HCI, L2CAP, RFCOMM, SDP, TCS
Shorten Qualification Process for End Products
Technical Support
Porting into Developer’s Platform Making Application using Profile
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Key Factors in Protocol Stack z
Supported Profile
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Supported O/S
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How Many/Which Profile? Current 25 Profiles (include v0.95)
Windows, WinCE, RTOS
Qualification List
For Protocol For Profile
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Host Types for Protocol Stack Porting Protocol Stack into Your Developing System according to Hardware, OS, Resource
PC Based System
Protocol Stack PDA Based System
Embedded System
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PC Based System
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Windows XP Bluetooth Architecture z
Microsoft Windows XP Bluetooth Architecture RAS TAPI UNIMODEM.TSP MODEM.SYS HID
PAN HCRP
BTHMODEM.SYS RFCOMM.SYS BTHPORT.SYS
USB
UART
PCI
3COM
CSR
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MS Windows XP for Bluetooth (1) z
Top Scenario Scenario
#1 : Always Connected
9 DUN, PAN Scenario
#2 : Wireless Desktop
9Keyboard 9Mouse 9Printer 9PDA z
Profile Support HCRP DUN HID PAN
(IPv6 Only) ESDP (IPv6 Only) 56
MS Windows XP for Bluetooth (2) z
Support IP for Bluetooth Bluetooth
Device Can Talk to Other Bluetooth Device Over IP Bluetooth Device Can Talk to Other General Device Over IP z
Support IPv6 Easy
to Configure Address Assignment Simple Standard Protocol Currently mandated for 3G cellular systems Better Mobility Support zBTH
Port
HCI,
L2CAP, SDP Not Supported SCO Link 57
MS Windows XP for Bluetooth (3) z
Support IPv6
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MS Windows XP for Bluetooth (4) z
API Set Winsock
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IPv6 namespace and ESDP Defined in the system SDK Enables application portability Enables applications to extend beyond Bluetooth Propagates wireless advancements made in Windows XP
Windows Logo WHQL
(Windows Hardware Quality Lab) Test
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PDA Based System z
Microsoft Windows CE Stack
Extensible : Upper Layer API Level 9 WinSock API 9 OBEX
Extensive Hardware Support Broad Applications 9 Pocket PC 9 Web TV 9 Automotive
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Embedded System z
Embedded System
Limited Resource 9 Code Size, Memory, MIPS
Hardware Dependence OS Dependence Source Level Approach Stack Distribution for System Type
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RAM Usage for Protocol Stack
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OS/Hardware Dependence Operating System API z Timers z Debugging IO z Multitasking Control z
Semaphore Scheduling
Structure Packing z Big/Little Endian z Bus Access on Illegal Address z
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Stack Makers
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6. 블루투스 프로토콜 인증
Qualification & Type Approval Bluetooth Enabled Product
Complies with the specification ?
Follows the regulations ? Regulatory Type Approval
Bluetooth Qualification
& Bluetooth license
License to sell
The Global Market
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Qualification Test
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Test Suite Category
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Organization for BT Qualification z
BQRB : Bluetooth Qualification Review Board
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BQB : Bluetooth Qualification Body
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BQTF : Bluetooth Qualification Test Facility
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Individual
Category A Test RF Conformance Testing Protocol/Profile Conformance Testing
BTA : Bluetooth Technical Assessor
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Qualification Process
BQTF
BQB
Application, Declarations
Test Sample (product)
Qualified Product Database
Test Report
Manufacturer => Manufacturer Adopter Test Report Adopters Agreement
Get from WEB
Qualification Program Documents
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