Transcript
http://www.fujielectric.com/products/semiconductor/
7MBR50VM120-50
IGBT Modules
IGBT MODULE (V series) 1200V / 50A / PIM Features Low VCE(sat) Compact Package P.C.Board Mount Module Converter Diode Bridge Dynamic Brake Circuit RoHS compliant product
Applications Inverter for Motor Drive AC and DC Servo Drive Amplifier Uninterruptible Power Supply
Maximum Ratings and Characteristics Absolute Maximum Ratings (at Tc=25°C unless otherwise specified) Items
Symbols
Inverter
Collector-Emitter voltage Gate-Emitter voltage Collector current
Converter
Brake
Collector power dissipation Collector-Emitter voltage Gate-Emitter voltage Collector current Collector power dissipation Repetitive peak reverse voltage (Diode) Repetitive peak reverse voltage Average output current Surge current (Non-Repetitive) I2t (Non-Repetitive)
Conditions
VCES VGES Ic Icp -Ic -Ic pulse Pc VCES VGES IC ICP PC VRRM VRRM IO IFSM I2 t
Junction temperature
Tj
Operating junciton temperature (under switching conditions)
Tjop
Case temperature Storage temperature
Tc Tstg
Continuous 1ms
Tc=100°C Tc=80°C
1ms 1 device
Continuous 1ms 1 device
Tc=80°C Tc=80°C
50Hz/60Hz, sine wave 10ms, Tj=150°C half sine wave Inverter, Brake Converter Inverter, Brake Converter
Isolation voltage
between terminal and copper base (*1) Viso between thermistor and others (*2)
AC : 1min.
Screw torque
Mounting (*3)
M5
-
Maximum ratings 1200 ±20 50 100 50 100 280 1200 ±20 35 70 210 1200 1600 50 360 648 175 150 150 150 125 -40 to +125
Units V V A W V V A W V V A A A2 s
°C
2500
VAC
3.5
Nm
Note *1: All terminals should be connected together during the test. Note *2: Two thermistor terminals should be connected together, other terminals should be connected together and shorted to base plate during the test. Note *3: Recommendable value : 2.5-3.5 Nm (M5)
1
1257c MARCH 2014
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Electrical characteristics (at Tj= 25°C unless otherwise specified) Items Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage
Symbols
Conditions
ICES IGES VGE (th)
VGE = 0V, VCE = 1200V VGE = 0V, VGE = ±20V VCE = 20V, IC = 50mA
VCE (sat) (terminal)
VGE = 15V IC = 50A
VCE (sat) (chip)
VGE = 15V IC = 50A
Rg(int) Cies ton tr tr (i) toff tf
VCE = 10V, VGE = 0V, f = 1MHz
Inverter
Collector-Emitter saturation voltage
Internal gate resistance Input capacitance Turn-on time Turn-off time
VF (terminal)
VCC = 600V IC = 50A VGE = +15 / -15V RG = 15Ω Tj=25°C Tj=125°C Tj=150°C Tj=25°C Tj=125°C Tj=150°C
IF = 50A
Forward on voltage
Brake
Units mA nA V
V
Ω nF
µs
V
VF (chip)
IF = 50A
trr
IF = 50A
Zero gate voltage collector current
ICES
VGE = 0V VCE = 1200V
-
-
1.0
mA
Gate-Emitter leakage current
IGES
VCE = 0V VGE = +20 / -20V
-
-
200
nA
VCE (sat) (terminal)
VGE = 15V IC = 35A
465 3305
2.10 2.45 2.50 1.85 2.20 2.25 0 0.39 0.09 0.53 0.06 1.70 1.35 5000 495 3375
2.55 2.30 1.20 0.60 1.00 0.30 1.00 2.15 1.0 520 3450
Reverse recovery time
Collector-Emitter saturation voltage
Internal gate resistance Turn-on time Turn-off time Reverse current Thermistor Converter
Tj=25°C Tj=125°C Tj=150°C Tj=25°C Tj=125°C Tj=150°C
Characteristics min. typ. max. 1.0 200 6.0 6.5 7.0 2.20 2.65 2.55 2.60 1.85 2.30 2.20 2.25 4 4.2 0.39 1.20 0.09 0.60 0.03 0.53 1.00 0.06 0.30 2.25 2.70 2.50 2.45 1.90 2.35 2.15 2.10 0.35
VCE (sat) (chip)
VGE = 15V IC = 35A
Rg(int) ton tr toff tf IRRM
-
Tj=25°C Tj=125°C Tj=150°C Tj=25°C Tj=125°C Tj=150°C
VCE = 600V IC = 35A VGE = +15 / -15V RG = 27Ω VR = 1200V terminal chip
Forward on voltage
VFM (chip)
Reverse current
IRRM
Resistance
R
B value
B
VR = 1600V T = 25°C T = 100°C T = 25 / 50°C
Symbols
Conditions
IF = 50A
µs
V
Ω µs mA V mA Ω K
Thermal resistance characteristics Items
Thermal resistance (1device)
Rth(j-c)
Contact thermal resistance (1device) (*4)
Rth(c-f)
Inverter IGBT Inverter FWD Brake IGBT Converter Diode with Thermal Compound
Note *4: This is the value which is defined mounting on the additional cooling fin with thermal compound.
2
Characteristics min. typ. max. 0.54 0.91 0.72 0.54 0.05 -
Units
°C/W
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Characteristics (Representative) [ Inverter ] Collector current vs. Collector-Emitter voltage (typ.)
[ Inverter ] Collector current vs. Collector-Emitter voltage (typ.) Tj= 25oC / chip
Tj= 150oC / chip 100
100 15V
VGE=20V
12V
75
50
10V
25
15V 12V
Collector current: IC [A]
Collector current: IC [A]
VGE=20V
75
50
10V
25 8V
8V 0
0 0
1
2
3
4
5
0
3
4
5
Collector-Emitter voltage: VCE[V]
[ Inverter ] Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip
[ Inverter ] Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj= 25oC / chip Collector - Emitter voltage: VCE [V]
8 Tj=25°C
Collector current: IC [A]
2
Collector-Emitter voltage: VCE[V]
100 Tj=150°C
75 Tj=125°C 50
25
0
6
4
Ic=100A Ic=50A Ic=25A
2
0 0
1
2
3
4
5
5
10
Collector current: IC [A]
Collector - Emitter voltage: VCE [200V/div] Gate - Emitter voltage: VGE [5V/div]
10.0 Cies
1.0 Cres Coes
0.0 0
10
20
20
25
[ Inverter ] Dynamic gate charge (typ.) Vcc=600V, Ic=50A, Tj= 25°C
VGE=0V, f= 1MHz, Tj= 25oC
0.1
15
Gate - Emitter voltage: VGE [V]
[ Inverter ] Capacitance vs. Collector-Emitter voltage (typ.)
Capacitance: Cies, Coes, Cres [nF]
1
30
VCE VGE 0
-600
Collector - Emitter voltage: VCE [V]
0
Gate charge: Qg [nC]
3
600
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Inverter ] Switching time vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=15Ω, Tj=150°C
10000
1000
Switching time : ton, tr, toff, tf [ nsec ]
Switching time : ton, tr, toff, tf [ nsec ]
[ Inverter ] Switching time vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=15Ω, Tj=125°C
toff ton tr
100
tf
10 0
25
50
75
100
10000
1000
ton
tf
10
125
0
Switching loss : Eon, Eoff, Err [mJ/pulse ]
Switching time : ton, tr, toff, tf [ nsec ]
[ Inverter ] Switching time vs. gate resistance (typ.) Vcc=600V, Ic=50A, VGE=±15V, Tj=125°C 10000
toff ton tr
100 tf
10 10
100
25
50
75
100
Collector current: IC [A]
15
10
Eon(150°C) Eon(125°C) Eoff(150°C) Eoff(125°C)
5
Err(150°C) Err(125°C)
0 0
25
50
75
100
125
[ Inverter ] Reverse bias safe operating area (max.) +VGE=15V, -VGE <= 15V, Rg >=15Ω, Tj = 150°C
10
125
Collector current: IC [A]
Eon(150°C) Eon(125°C)
6
Eoff(150°C) Eoff(125°C)
4 Err(150°C) Err(125°C)
2
100 75 RBSOA (Repetitive pulse)
50 25 0
0 10
150
Collector current: IC [A]
[ Inverter ] Switching loss vs. gate resistance (typ.) Vcc=600V, Ic=50A, VGE=±15V
8
125
[ Inverter ] a Switching loss vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=15Ω
Gate resistance : Rg [Ω]
Switching loss : Eon, Eoff, Err [mJ/pulse ]
tr
100
Collector current: IC [A]
1000
toff
0
100
400
800
1200
Collector-Emitter voltage : VCE[V] (Main terminals)
Gate resistance : Rg [Ω]
4
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Inverter ] Reverse recovery characteristics (typ.) Vcc=600V, VGE=±15V, Rg=15Ω
[ Inverter ] Forward current vs. forward on voltage (typ.) chip
80 Tj=25°C 60 40
Tj=150°C Tj=125°C
20 0 0
1
2
1000
Reverse recovery current : Irr [ A ] Reverse recovery time : trr [ nsec ]
Forward current : IF [A]
100
3
trr(150°C) trr(125°C)
100
Irr(150°C) Irr(125°C)
10
4
0
25
Forward on voltage : VF [V]
50
75
100
125
150
Forward current : IF [A]
[ Converter ] Forward current vs. forward on voltage (typ.) chip
Forward current : IF [A]
100
Tj=125°C C
Tj=25°C
75
50
25
0 0
1
2
3
4
Forward on voltage : VFM [V] [ Thermistor ] Temperature characteristic (typ.)
Transient thermal resistance (max.) 100
1.00
Resistance : R [kΩ]
Thermal resistanse : Rth(j-c) [ °C/W ]
10.00
FWD[Inverter]
IGBT[Brake]
IGBT[Inverter] Conv. Diode
0.10
0.01 0.001
n τn rn [°C/W]
[sec] IGBT FWD B-IGBT Conv
0.010
1 0.0023 0.05792 0.09761 0.07723 0.05792
2 0.0301 0.14685 0.24747 0.19580 0.14685
3 0.0598 0.20746 0.34960 0.27661 0.20746
0.100
4 0.0708 0.12777 0.21532 0.17036 0.12777
10
1
0.1
1.000
-60
-40
-20
0
20
40
60
80
100 120 140 160 180
Temperature [°C ]
Pulse width : Pw [sec]
5
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Brake ] Collector current vs. Collector-Emitter voltage (typ.)
[ Brake ] Collector current vs. Collector-Emitter voltage (typ.) Tj= 25oC / chip
70
VGE=20V
15V
Collector current: IC [A]
60
12V
50 40 10V
30 20 10
VGE=20V
50
12V
40 10V
30 20
8V
10
8V
0
0 0
1
2
3
4
5
0
[ Brake ] Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip
3
4
5
Tj= 25oC / chip 8
Tj=25°C
Tj=150°C
60
Collector current: IC [A]
2
[ Brake ] Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
Collector - Emitter voltage: VCE [V]
70
1
Collector-Emitter voltage: VCE[V]
Collector-Emitter voltage: VCE[V]
50
Tj=125°C
40 30 20 10 0
6
4
Ic=70A Ic=35A Ic=18A
2
0 0
1
2
3
4
5
5
10
Collector-Emitter voltage: VCE[V]
Collector - Emitter voltage: VCE [200V/div] Gate - Emitter voltage: VGE [5V/div]
10.0 Cies
1.0 Cres Coes
0.0 0
10
20
20
25
[ Brake ] Dynamic gate charge (typ.) Vcc=600V, Ic=35A, Tj= 25°C
VGE=0V, f= 1MHz, Tj= 25oC
0.1
15
Gate - Emitter voltage: VGE [V]
[ Brake ] Capacitance vs. Collector-Emitter voltage (typ.)
Capacitance: Cies, Coes, Cres [nF]
15V
60
Collector current: IC [A]
70
Tj= 150oC / chip
30
VCE VGE 0
-300
Collector - Emitter voltage: VCE [V]
0
Gate charge: Qg [nC]
6
300
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Outline Drawing (Unit:mm)
(
shows theoretical dimension. ) shows reference dimension.
Section A-A Weight: 200g(typ.)
Equivalent Circuit [ Converter ]
[ Brake]
[ Inverter ]
7
[ Thermistor ]
7MBR50VM120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
WARNING 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of March 2014. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sure to obtain the latest specifications. 2. A ll applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. A lthough Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 4. T he products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. • Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment • Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. • Transportation equipment (mounted on cars and ships) • Trunk communications equipment • Traffic-signal control equipment • Gas leakage detectors with an auto-shut-off feature • Emergency equipment for responding to disasters and anti-burglary devices • Safety devices • Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). • Space equipment • Aeronautic equipment • Nuclear control equipment • Submarine repeater equipment 7. Copyright ©1996-2014 by Fuji Electric Device Technology Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Device Technology Co., Ltd. 8. If you have any question about any portion in this Catalog, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.
8
Technical Information
IGBT Modules
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