Preview only show first 10 pages with watermark. For full document please download

Afbr-57r6apz - Foxconn Interconnect Technology

   EMBED


Share

Transcript

AFBR-57R6APZ Digital Diagnostic SFP, 850 nm, 4.25/2.125/1.0625 and 1.25 GBd Ethernet, RoHS Compliant Optical Transceiver with Rate Select 6APZ -57RSER PROD S1 LA AFBR 0nm CLAS Data Sheet 2-DI -410 PPOC 85 0446 F(J) 21CR APORE CD1C SING: AJ0446 SN n2 Description Features Avago’s AFBR-57R6APZ optical transceiver supports high-speed serial links over multimode optical fiber at signaling rates up to 4.25 Gb/s. Compliant with Small Form Pluggable (SFP) Multi Source Agreement (MSA) mechanical and electrical specifications for LC Duplex transceivers, ANSI Fibre Channel FC-PI, FC-PI-2 and compliant with IEEE 802.3 for gigabit applications. The part is electrically interoperable with SFP conformant devices. •  Fully RoHS compliant • Diagnostic features per SFF-8472 “Diagnostic Monitoring Interface for Optical Transceivers” • Real time monitoring of: –  Transmitted optical power –  Received optical power –  Laser bias current – Temperature –  Supply voltage • Rate select functionality per SFF 8079 (revision 1.7) •  Wide temperature and supply voltage operation (-10°C to 85°C) (3.3 V ± 10%) • Transceiver specifications per SFP (SFF-8074i) MultiSource Agreement and SFF-8472 (revision 9.3) –  4.25 GBd Fibre Channel operation for FC-PI 400-M5-SN-I and 400-M6-SN-I –  2.125 GBd Fibre Channel operation for FC-PI 200-M5-SN-I and 200-M6-SN-I –  1.0625 GBd Fibre Channel operation for FC-PI 100-M5-SN-I and 100-M6-SN-I –  1.25 GBd operation for IEEE 802.3 Gigabit Ethernet 1000Base-SX • Link lengths at 4.25 GBd: –  150 m with 50 µm MMF, 70 m with 62.5 µm MMF • Link lengths at 2.125 GBd: –  300 m with 50 µm MMF, 150 m with 62.5 µm MMF • Link lengths at 1.0625 GBd: –  500 m with 50 µm MMF, 300 m with 62.5 µm MMF • Link lengths at 1.25 GBd: –  2 to 550 m with 50 µm MMF, 2 to 275 m with 62.5 µm MMF • LC Duplex optical connector interface conforming to ANSI TIA/EIA604-10 (FOCIS 10A) • 850 nm Vertical Cavity Surface Emitting Laser (VCSEL) source technology • IEC 60825-1 Class 1/CDRH Class 1 laser eye safe • Compliant with Gigabit Ethernet As an enhancement to the conventional SFP interface defined in SFF-8074i, the AFBR-57R6APZ is compliant to SFF-8472 (digital diagnostic interface for optical transceivers). Using the 2-wire serial interface defined in the SFF-8472 MSA, the AFBR-57R6APZ provides real time temperature, supply voltage, laser bias current, laser average output power and received input power. This information is in addition to conventional SFP base data. The digital diagnostic interface also adds the ability to disable the transmitter (TX_DISABLE), monitor for Transmitter Faults (TX_FAULT), and monitor for Receiver Loss of Signal (RX_LOS). Installation The AFBR-57R6APZ can be installed in any SFF-8074i compliant Small Form Pluggable (SFP) port regardless of host equipment operating status. The AFBR-57R6APZ is hot-pluggable, allowing the module to be installed while the host system is operating and on-line. Upon insertion, the transceiver housing makes initial contact with the host board SFP cage, mitigating potential damage due to Electro-Static Discharge (ESD). Related Products • AFBR-59R5LZ: 850 nm +3.3 V LC SFF 2x7 for 4.25/2.125/1.0625 GBd Fibre Channel Patent - www.avagotech.com/patents Digital Diagnostic Interface and Serial Identification Fault Isolation The 2-wire serial interface is based on ATMEL AT24C01A series EEPROM protocol and signaling detail. Conventional EEPROM memory, bytes 0-255 at memory address 0xA0, is organized in compliance with SFF-8074i. New digital diag­nostic information, bytes 0-255 at memory address 0xA2, is compliant to SFF-8472. The new diagnostic information provides the opportunity for Predictive Failure Identification, Com­pliance Prediction, Fault Isolation and Component Monitoring. The fault isolation feature allows a host to quickly pinpoint the location of a link failure, minimizing downtime. For optical links, the ability to identify a fault at a local device, remote device or cable plant is crucial to speeding service of an installation. AFBR-57R6APZ real-time monitors of Tx_Bias, Tx_Power, Vcc, Temperature and Rx_Power can be used to assess local transceiver current operating conditions. In addition, status flags Tx_Disable and Rx Loss of Signal (LOS) are mirrored in memory and available via the two-wire serial interface. The I2C accessible memory page address 0xB0 is used internally by SFP for the test and diagnostic purposes and it is reserved. Predictive Failure Identification The AFBR-57R6APZ predictive failure feature allows a host to identify potential link problems before system performance is impacted. Prior identification of link problems enables a host to service an application via “fail over” to a redundant link or replace a suspect device, maintaining system uptime in the process. For applications where ultra-high system uptime is required, a digital SFP provides a means to monitor two real-time laser metrics asso­ciated with observing laser degradation and predicting failure: average laser bias current (Tx_Bias) and average laser optical power (Tx_Power). Compliance Prediction Compliance prediction is the ability to determine if an optical transceiver is operating within its operating and environmental requirements. AFBR-57R6APZ devices provide real-time access to transceiver internal supply voltage and temperature, allowing a host to identify potential component compliance issues. Received optical power is also available to assess compliance of a cable plant and remote transmitter. When operating out of requirements, the link cannot guarantee error free transmission. 2 Component Monitoring Component evaluation is a more casual use of the AFBR57R6APZ real-time monitors of Tx_Bias, Tx_Power, Vcc, Temperature and Rx_Power. Potential uses are as debugging aids for system installation and design, and transceiver parametric evaluation for factory or field qualification. For example, temperature per module can be observed in high density applications to facilitate thermal evaluation of blades, PCI cards and systems. OPTICAL INTERFACE ELECTRICAL INTERFACE RECEIVER LIGHT FROM FIBER RATE SELECT AMPLIFICATION & QUANTIZATION PHOTO-DETECTOR RD+ (RECEIVE DATA) RD– (RECEIVE DATA) Rx LOSS OF SIGNAL MOD-DEF2 (SDA) CONTROLLER & MEMORY MOD-DEF1 (SCL) MOD-DEF0 TRANSMITTER LIGHT TO FIBER VCSEL TX_DISABLE LASER DRIVER & SAFETY CIRCUITRY TD+ (TRANSMIT DATA) TD– (TRANSMIT DATA) TX_FAULT Figure 1. Transceiver functional diagram. Transmitter Section Transmit Fault (Tx_Fault) The transmitter section includes the Transmitter Optical SubAssembly (TOSA) and laser driver circuitry. The TOSA, containing an 850 nm VCSEL (Vertical Cavity Surface Emitting Laser) light source, is located at the optical interface and mates with the LC optical connector. The TOSA is driven by a custom IC which uses the incoming differential high speed logic signal to modulate the laser diode driver current. This Tx laser driver circuit regulates the optical power at a constant level provided the incoming data pattern is dc balanced (8B/10B code, for example). A catastrophic laser fault will activate the transmitter signal, TX_FAULT, and disable the laser. This signal is an open collector output (pull-up required on the host board). A low signal indicates normal laser operation and a high signal indicates a fault. The TX_FAULT will be latched high when a laser fault occurs and is cleared by toggling the TX_DISABLE input or power cycling the transceiver. The transmitter fault condition can also be monitored via the two-wire serial interface (address A2, byte 110, bit 2). Transmit Disable (Tx_Disable) The AFBR-57R6APZ provides Class 1 (single fault tolerant) eye safety by design and has been tested for compliance with the requirements listed in Table 1. The eye safety circuit continuously monitors the optical output power level and will disable the transmitter upon detecting an unsafe condition beyond the scope of Class 1 certification. Such unsafe conditions can be due to inputs from the host board (Vcc fluctuation, unbalanced code) or a fault within the transceiver. The AFBR-57R6APZ accepts a TTL and CMOS compatible transmit disable control signal input (pin 3) which shuts down the transmitter optical output. A high signal implements this function while a low signal allows normal transceiver operation. In the event of a fault (e.g. eye safety circuit activated), cycling this control signal resets the module as depicted in Figure 4. An internal pull up resistor disables the transceiver transmitter until the host pulls the input low. Host systems should allow a 10 ms interval between successive assertions of this control signal. Tx_Disable can also be asserted via the two-wire serial interface (address A2h, byte 110, bit 6) and monitored (address A2h, byte 110, bit 7). The contents of A2h, byte 110, bit 6 are logic OR’d with hardware Tx_Disable (pin 3) to control transmitter operation. 3 Eye Safety Circuit Receiver Section The receiver section includes the Receiver Optical SubAssembly (ROSA) and the amplification/quantization circuitry. The ROSA, containing a PIN photodiode and custom transimpedance amplifier, is located at the optical interface and mates with the LC optical connector. The ROSA output is fed to a custom IC that provides postamplification and quantization. Fibre Channel Rate Select (Rate_Select) The AFBR-57R6APZ transceiver contains a parametric optimiza-tion circuit to insure compliant performance for 1.0625 Gb/s, 2.125 Gb/s and 4.25 Gb/s data rates. When Rate_Select (pin 7) is asserted, the transceiver receiver bandwidth is optimized for 4.25G/2.125G performance as defined in document SFF-8079 Section 5.1 (currently on Draft 1.7) and ANSI FC-PI-2. When deasserted (or open), performance is optimized for 2.125G/1.065G performance per SFF-8074i and SFF-8079. Rate_Select can also be asserted via the two-wire serial interface (address A2h, byte 110, bit 3) and monitored (address A2h, byte 110, bit 4). The contents of A2h, byte 110, bit 3 are logic OR’d with hardware Rate_Select (pin 7) to control transmitter operation. Receiver Loss of Signal (Rx_LOS) The post-amplification IC also includes transition detection circuitry which monitors the ac level of incoming optical signals and provides a TTL/CMOS compatible status signal to the host (pin 8). An adequate optical input results in a low Rx_LOS output while a high Rx_LOS output indicates an unusable optical input. The Rx_LOS thresholds are factory set so that a high output indicates a definite optical fault has occurred. Rx_LOS can also be monitored via the two-wire serial interface (address A2h, byte 110, bit 1). Functional Data I/O The AFBR-57R6APZ interfaces with the host circuit board through twenty I/O pins (SFP electrical connector) identified by function in Table 2. The board layout for this interface is depicted in Figure 6. The AFBR-57R6APZ high speed transmit and receive interfaces require SFP MSA compliant signal lines on the host board. To simplify board requirements, biasing resistors and ac coupling capacitors are incorporated into the SFP transceiver module (per SFF-8074i) and hence are not required on the host board. The Tx_Disable, Tx_ Fault, Rx_LOS, and Rate_Select lines require TTL lines on the host board (per SFF-8074i) if used. If an application chooses not to take advantage of the functionality of these pins, care must be taken to ground Tx_Disable (for normal operation). 4 Figure 2 depicts the recom­mended interface circuit to link the AFBR-57R6APZ to supporting physical layer ICs. Timing for MSA compliant control signals implemented in the transceiver are listed in Figure 4. Application Support An Evaluation Kit and Reference Designs are available to assist in evaluation of the AFBR-57R6APZ. Please contact your local Field Sales representative for availability and ordering details. Caution There are no user serviceable parts nor maintenance requirements for the AFBR-57R6APZ. All mechanical adjustments are made at the factory prior to shipment. Tampering with, modifying, misusing or improperly handling the AFBR-57R6APZ will void the product warranty. It may also result in improper operation and possibly overstress the laser source. Performance degrada­tion or device failure may result. Connection of the AFBR57R6APZ to a light source not compliant with ANSI FC-PI or IEEE 802.3 specifications, operating above maximum operating conditions or in a manner inconsistent with it’s design and function may result in exposure to hazardous light radiation and may constitute an act of modifying or manufacturing a laser product. Persons performing such an act are required by law to re-certify and re-identify the laser product under the provisions of U.S. 21 CFR (Subchapter J) and TUV. Ordering Information Please contact your local field sales engineer or one of Avago Technologies franchised distributors for ordering information. For technical information, please visit Avago Technologies’ WEB page at www.Avago.com or contact Avago Technologies Semicon-ductor Products Customer Response Center at 1-800-235-0312. For information related to SFF Committee documentation visit www.sffcommittee.org. Regulatory Compliance The AFBR-57R6APZ complies with all applicable laws and regulations as detailed in Table 1. Certification level is dependent on the overall configuration of the host equipment. The transceiver performance is offered as a figure of merit to assist the designer. Electrostatic Discharge (ESD) Electromagnetic Interference (EMI) The AFBR-57R6APZ is compatible with ESD levels found in typical manufacturing and operating environments as described in Table 1. In the normal handling and operation of optical transceivers, ESD is of concern in two circumstances. Equipment incorporating gigabit transceivers is typically subject to regulation by the FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. The AFBR-57R6APZ’s compliance to these standards is detailed in Table 1. The metal housing and shielded design of the AFBR-57R6APZ minimizes the EMI challenge facing the equipment designer. The first case is during handling of the transceiver prior to insertion into an SFP compliant cage. To protect the device, it’s important to use normal ESD handling precautions. These include use of grounded wrist straps, work-benches and floor wherever a transceiver is handled. The second case to consider is static discharges to the exterior of the host equipment chassis after installation. If the optical interface is exposed to the exterior of host equipment cabinet, the transceiver may be subject to system level ESD requirements. EMI Immunity (Susceptibility) Due to its shielded design, the EMI immunity of the AFBR-57R6APZ exceeds typical industry standards. Flammability The AFBR-57R6APZ optical transceiver is made of metal and high strength, heat resistant, chemical resistant and UL 94V-0 flame retardant plastic. Table 1. Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pins MIL-STD-883C Method 3015.4 Class 1 (> 2000 Volts) Electrostatic Discharge (ESD) Variation of IEC 61000-4-2 to the Duplex LC Receptacle Typically, no damage occurs with 25 kV when the duplex LC connector receptacle is contacted by a Human Body Model probe. GR1089 10 contacts of 8 kV on the electrical faceplate with device inserted into a panel. Electrostatic Discharge (ESD) Variation of IEC 801-2 to the Optical Connector Air discharge of 15 kV (min.) contact to connector without damage. Electromagnetic Interference (EMI) FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1 System margins are dependent on customer board and chassis design. Immunity Variation of IEC 61000-4-3 Typically shows no measurable effect from a 10 V/m field swept from 10 MHz to 1 GHz. Laser Eye Safety and US FDA CDRH AEL Class 1 Equipment Type Testing US21 CFR, Subchapter J per Paragraphs 1002.10 BAUART   and 1002.12 CDRH certification # 9720151-48 TUV file # R72042669 ¨ GEPRUFT (IEC) EN60825-1: 1994 + A11 + A2 ¨ TUV TYPE Rheinland Product (IEC) EN60825-2: 1994 + A1 APPROVED Safety (IEC) EN60950: 1992 + A1 + A2 +   A3 + A4 + A11 Component Recognition Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment including Electrical Business Equipment RoHS Compliance 5 UL File # E173874 Less than 1000 ppm of cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers. VCC,T GND,T 6.8 kΩ Tx DIS Tx_DISABLE Tx FAULT Tx_FAULT TD+ 0.01 µF 100 Ω TD– 0.01 µF LASER DRIVER 4.7 k to 10 kΩ 1 µH VCC,T 0.1 µF 3.3 V SERDES IC PROTOCOL IC 10 µF 0.1 µF 1 µH VCC,R 10 µF VCC,R VCC,R 0.1 µF 50 Ω 4.7 k to 10 kΩ RD+ 50 Ω 0.01 µF 100 Ω RD– 0.01 µF Rx LOS LOSS OF SIGNAL RATE SELECT 40 kΩ 3.3 V 4.7 k to 10 kΩ GND,R MOD_DEF0 4.7 k to 10 kΩ MODULE DETECT SCL SDA Figure 2. Typical application configuration. 1 µH VCCT 0.1 µF 1 µH VCCR 0.1 µF SFP MODULE 10 µF 3.3 V 0.1 µF 10 µF HOST BOARD NOTE: INDUCTORS MUST HAVE LESS THAN 1 Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE. Figure 3. Recommended power supply filter. 6 POST AMPLIFIER 4.7 k to 10 kΩ MOD_DEF1 MOD_DEF2 Table 2. Pin Description Pin Name Function/Description Notes 1 VeeT Transmitter Ground 2 TX_FAULT Transmitter Fault Indication – High indicates a fault condition Note 1 3 TX_DISABLE Transmitter Disable – Module electrical input disables on high or open Note 2 4 MOD-DEF2 Module Definition 2 – Two wire serial ID interface data line (SDA) Note 3 5 MOD-DEF1 Module Definition 1 – Two wire serial ID interface clock line (SCL) Note 3 6 MOD-DEF0 Module Definition 0 – Grounded in module (module present indicator) Note 3 7 Rate Select Bit Rate Parametric Optimization Note 4 8 RX_LOS Loss of Signal – High indicates loss of received optical signal Note 5 9 VeeR Receiver Ground 10 VeeR Receiver Ground 11 VeeR Receiver Ground 12 RD- Inverse Received Data Out Note 6 13 RD+ Received Data Out Note 6 14 VeeR Receiver Ground 15 VccR Receiver Power + 3.3 V Note 7 16 VccT Transmitter Power + 3.3 V Note 7 17 VeeT Transmitter Ground 18 TD+ Transmitter Data In Note 8 19 TD- Inverse Transmitter Data In Note 8 20 VeeT Transmitter Ground Notes: 1.  TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high, this output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V. 2.  TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8 kΩ resistor. Low (0 – 0.8 V ): Transmitter on Between (0.8 V and 2.0 V ): Undefined High (2.0 – Vcc max) or OPEN: Transmitter Disabled 3.  The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. Mod-Def 0 is grounded by the module to indicate the module is present Mod-Def 1 is serial clock line (SCL) of two wire serial interface Mod-Def 2 is serial data line (SDA) of two wire serial interface 4.  RATE_SELECT is an input used to control transceiver compatiility for multiple rates. It is internally pulled down with a >30 kΩ resistor. Low (0 - 0.8 V) or OPEN: Low Bit Rate Compatibility per SFF-8074i (1.0625 Gb/s and 2.125 Gb/s per SFF-8079) Between (0.8 V and 2.0 V) Undefined per SFF-8074i High (2.0 – Vcc max): High Bit Rate Compatibility per SFF-8074i (2.125 Gb/s and 4.25 Gb/s per SFF-8079) 5.  RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high, this output indicates the received optical power is below the worst case receiver sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V. 6.  RD-/+ designate the differential receiver outputs. They are AC coupled 100 Ω differential lines which should be terminated with 100 Ω differential at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will be between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated. 7.  VccR and VccT are the receiver and transmitter power supplies. They are defined at the SFP connector pin. The maximum supply current is 300 mA and the associated in-rush current will typically be no more than 30 mA above steady state after 2 microseconds. 8.  TD-/+ designate the differential transmitter inputs. They are AC coupled differential lines with 100 Ω differential termination inside the module. The AC coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400 mV (200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended) be used for best EMI performance. 7 Table 3. Absolute Maximum Ratings Parameter Symbol Minimum Maximum Unit Notes Storage Temperature TS -40 100 C Note 1, 2 Case Operating Temperature TC -40 100 C Note 1, 2 Relative Humidity RH 5 95 % Note 1 Supply Voltage VccT, R -0.5 3.8 V Note 1, 2, 3 Low Speed Input Voltage VIN -0.5 Vcc+0.5 V Note 1 Notes; 1.  Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short period of time. See Reliability Data Sheet for specific reliability performance. 2.  Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3.  The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur. Table 4. Recommended Operating Conditions Parameter Symbol Minimum Maximum Unit Notes Case Operating Temperature TC -10 85 °C Note 1, 2 Supply Voltage VccT, R 2.97 3.63 V Note 2 1.0625 4.25 Gb/s Note 2 Data Rate Notes: 1.  The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system thermal design. 2.  Recommended Operating Conditions are those values for which functional performance and device reliability is implied. Table 5. Transceiver Electrical Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%) Parameter Symbol Minimum Typical Maximum PSNR 100 Unit  Notes AC Electrical Characteristics Power Supply Noise Rejection (peak-peak) mV Note 1 DC Electrical Characteristics Module Supply Current ICC 210 mA Power Dissipation PDISS 765 mW Low Speed Outputs: Transmit Fault (TX_FAULT), Loss of Signal   (RX_LOS), MOD-DEF 2   VOH 2.0 VccT,R+0.3 V VOL 0.8 V Low Speed Inputs: VIH Transmit Disable (TX_DIS), MOD-DEF 1,   VIL MOD-DEF2, Rate Select (RATE_SELECT)   2.0 Vcc V 0 0.8 V Notes: 1.  Filter per SFP specification is required on host board to remove 10 Hz to 2 MHz content. 2.  Pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V. 3.  Mod-Def1, Mod-Def2 and RATE_SELECT must be pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V. 8 Note 2 Note 3 Table 6. Transmitter and Receiver Electrical Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%) Parameter Symbol Minimum Typical Maximum Unit Notes High Speed Data Input:   Transmitter Differential Input Voltage (TD +/-) VI 400 High Speed Data Output:   Receiver Differential Output Voltage (RD +/-) Vo 600 2400 mV Note 1 1600 mV Note 2 Receiver Contributed Total Jitter TJ 0.26 UI (4.25 Gb/s)   62 ps Note 3 Receiver Contributed Total Jitter TJ 0.26 UI (2.125 Gb/s)   124 ps Note 3 Receiver Contributed Total Jitter TJ 0.22 UI (1.0625 Gb/s)   205 ps Note 3 Receiver Contributed Total Jitter TJ 0.332 UI (1.25 Gb/s)   266 ps Note 3 Receiver Electrical Output Rise & Fall Times  (20-80%) Note 4 tr, tf 50 150 ps Notes: 1.  Internally AC coupled and terminated (100 Ohm differential). 2.  Internally AC coupled but requires an external load termination (100 Ohm differential). 3.  Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the worst case specified component jitter input. 4.  20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern. 9 Table 7. Transmitter Optical Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3V ±10%) Parameter Symbol Minimum Typical Maximum Unit Notes Modulated Optical Output Power (OMA)   (Peak-to-Peak) 4.25 Gb/s Tx,OMA 247 µW Note 1 Modulated Optical Output Power (OMA)   (Peak-to-Peak) 2.125 Gb/s Tx,OMA 196 µW Note 2 Modulated Optical Output Power (OMA)   (Peak-to-Peak) 1.0625 Gb/s Tx,OMA 156 µW Note 3 Optical Extinction Ratio ER 9 dB Note 4 Average Optical Output Power Pout -9.0 dBm Note 5, 6 Center Wavelength lC 830 860 nm Spectral Width – rms s,rms 0.85 nm Optical Rise/Fall Time (4.25 Gb/s) tr, tf 90 ps RIN 12 (OMA) RIN -118 dB/Hz Transmitter Contributed Total Jitter (4.25 Gb/s) TJ 0.25 UI 60 ps Transmitter Contributed Total Jitter (2.125 Gb/s) 0.25 UI 120 ps Transmitter Contributed Total Jitter (1.0625 Gb/s) 0.27 UI 252 ps Transmitter Contributed Total Jitter (1.25 Gb/s) 0.284 UI TJ TJ TJ 20% - 80% Note 7 Note 7 Note 7 227 ps Pout TX_DISABLE Asserted Notes: POFF -35 dBm 1.  An OMA of 247 µW is approximately equal to an average power of –8 dBm, avg assuming an Extinction Ratio of 9 dB. 2.  An OMA of 196 µW is approximately equal to an average power of –9 dBm, avg assuming an Extinction Ratio of 9 dB. 3.  An OMA of 156 µW is approximately equal to an average power of –10 dBm, avg assuming an Extinction Ratio of 9 dB. 4. Extinction ratio of 9 dB valid when RATE_SELECT signal is driven low. 5.  Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power, max. 6.  Into 50/125 µm (0.2 NA) multi-mode optical fiber. 7.  Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the worst case specified component jitter input. 10 Table 8. Receiver Optical Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%) Parameter Symbol Min. Typ. Max. Unit Input Optical Power [Overdrive] PIN 0 dBm, avg Input Optical Modulation Amplitude   (Peak-to-Peak) 4.25 Gb/s [Sensitivity] OMA 61 µW, OMA Notes 1, 2 Input Optical Modulation Amplitude   (Peak-to-Peak) 2.125 Gb/s [Sensitivity] OMA 49 µW, OMA Notes 1, 3 Input Optical Modulation Amplitude   (Peak-to-Peak) 1.0625 Gb/s [Sensitivity] OMA 31 µW, OMA Notes 1, 4 Receiver Sensitivity (Optical Input Power) PRMIN -17 dBm 138 µW, OMA 50/125 µm fiber, Note 5 148 µW, OMA 62.5/125 µm fiber, Note 5 96 µW, OMA 50/125 µm fiber, Note 6 109 µW, OMA 62.5/125 µm fiber, Note 6 Stressed Receiver Sensitivity   (OMA) 4.25 Gb/s Stressed Receiver Sensitivity   (OMA) 2.125 Gb/s Notes Stressed Receiver Sensitivity   (OMA) 1.0625 Gb/s 55 µW, OMA 50/125 µm fiber, Note 7 67 µW, OMA 62.5/125 µm fiber, Note 7 Stressed Receiver Sensitivity 1.25 Gb/s -13.5 dBm 50/125 µm fiber   -12.5 dBm 62.5/125 µm fiber Return Loss 12 dB Loss of Signal – Assert PA 27.5 µW, OMA -30 Loss of Signal - De-Assert 31 µW, OMA -17.0 dBm, avg Loss of Signal Hysteresis 0.5 dB PD PD - PA -17.5 dBm, avg Note 8 Note 8 Notes: 1.  Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input. 2.  An OMA of 61 µW is approximately equal to an average power of –14 dBm, avg with an Extinction Ratio of 9 dB. 3.  An OMA of 49 µW is approximately equal to an average power of –15 dBm, avg with an Extinction Ratio of 9 dB. 4.  An OMA of 31 µW is approximately equal to an average power of –17 dBm, avg with an Extinction Ratio of 9 dB. 5.  4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.67 dB for 50 µm fiber and 2.14 dB for 62.5 µm fiber. Stressed receiver DCD component min. (at TX) is 20 ps. 6.  2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver DCD component min. (at TX) is 40 ps. 7.  1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver DCD component min. (at TX) is 80 ps. 8.  These average power values are specified with an Extinction Ratio of 9 dB. The loss of signal circuitry responds to valid 8B/10B encoded peak to peak input optical power, not average power. 11 Table 9. Transceiver SOFT DIAGNOSTIC Timing Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%) Parameter Symbol Minimum Maximum Unit Notes Hardware TX_DISABLE Assert Time t_off 10 µs Note 1 Hardware TX_DISABLE Negate Time t_on 1 ms Note 2 Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3 Hardware TX_FAULT Assert Time t_fault 100 µs Note 4 Hardware TX_DISABLE to Reset t_reset µs Note 5 Hardware RX_LOS Deassert Time t_loss_on 100 µs Note 6 Hardware RX_LOS Assert Time t_loss_off 100 µs Note 7 Hardware RATE_SELECT Assert Time t_rate_high 10 ms Note 8 Hardware RATE_SELECT Deassert Time t_rate_low 10 ms Note 8 Software TX_DISABLE Assert Time t_off_soft 100 ms Note 9 Software TX_DISABLE Negate Time t_on_soft 100 ms Note 10 Software Tx_FAULT Assert Time t_fault_soft 100 ms Note 11 Software Rx_LOS Assert Time t_loss_on_soft 100 ms Note 12 Software Rx_LOS Deassert Time t_loss_off_soft 100 ms Note 13 Analog parameter data ready t_data 1000 ms Note 14 Serial bus hardware ready t_serial 300 ms Note 15 Write Cycle Time t_write 10 ms Note 16 Serial ID Clock Rate f_serial_clock 400 kHz 10 Notes:   1.  Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.   2.  Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.   3.  Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.   4.  From power on or negation of TX_FAULT using TX_DISABLE.   5.  Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.   6.  Time from loss of optical signal to Rx_LOS Assertion.   7.  Time from valid optical signal to Rx_LOS De-Assertion.   8.  Time from rising or falling edge of Rate_Select input until transceiver is in conformance with appropriate specification.   9.  Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured from falling clock edge after stop bit of write transaction. 10.  Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal. 11.  Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted. 12.  Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal. 13.  Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal. 14.  From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional. 15.  Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h). 16.  Time from stop bit to completion of a 1-8 byte write command. 12 Table 10. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics (TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%) Parameter Symbol Min. Units Notes Transceiver Internal Temperature TINT ±3.0 °C Accuracy Temperature is measured internal to the transceiver. Valid from = -10°C to 85°C case temperature. Transceiver Internal Supply VINT ±0.1 V Voltage Accuracy Supply voltage is measured internal to the transceiver and can, with less accuracy, be correlated to voltage at the SFP Vcc pin. Valid over 3.3 V ± 10%. Transmitter Laser DC Bias Current Accuracy IINT ±10 % IINT is better than ±10% of the nominal value. Transmitted Average Optical PT ±3.0 dB Output Power Accuracy Coupled into 50/125 µm multi-mode fiber. Valid from 100 µW to 500 µW, avg. Received Average Optical Input PR ±3.0 dB Power Accuracy Coupled from 50/125 µm multi-mode fiber. Valid from 31 µW to 500 µW, avg. VCCT,R > 2.97 V VCCT,R > 2.97 V TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_init t_init t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED VCCT,R > 2.97 V TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_off t_init t_on INSERTION t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED OCCURANCE OF FAULT OCCURANCE OF FAULT TX_FAULT TX_FAULT TX_DISABLE TX_DISABLE TRANSMITTED SIGNAL TRANSMITTED SIGNAL t_fault t_reset * SFP SHALL CLEAR TX_FAULT IN < t_init IF THE FAILURE IS TRANSIENT t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t_init* t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED OCCURANCE OF FAULT TX_FAULT LOS TRANSMITTED SIGNAL t_fault * SFP SHALL CLEAR TX_FAULT IN < t_init IF THE FAILURE IS TRANSIENT t_loss_on t_reset t_init* t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED Figure 4. Transceiver timing diagrams (module installed except where noted). 13 OCCURANCE OF LOSS OPTICAL SIGNAL TX_DISABLE t-loss-on & t-loss-off t_loss_off Table 12. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h) Byte # Data Decimal Hex Notes Byte # Data Decimal Hex Notes 0 03 SFP physical device 37 00 Hex Byte of Vendor OUI[4] 1 04 SFP function defined by serial ID only 38 17 Hex Byte of Vendor OUI[4] 2 07 LC optical connector 39 6A Hex Byte of Vendor OUI[4] 3 00 40 41 “A” - Vendor Part Number ASCII character 4 00 41 46 “F” - Vendor Part Number ASCII character 5 00 42 42 “B” - Vendor Part Number ASCII character 6 01 1000Base-SX 43 52 “R” - Vendor Part Number ASCII character 7 20 Intermediate distance (per FC-PI) 44 2D “-” - Vendor Part Number ASCII character 8 40 Shortwave laser without OFC (open fiber control) 45 35 “5” - Vendor Part Number ASCII character 9 0C Multi-mode 50 µm and 62.5 µm optical media 46 37 “7” - Vendor Part Number ASCII character 10 15 100, 200 & 400 Mbytes/sec FC-PI speed[1] 47 52 “R” - Vendor Part Number ASCII character 11 01 Compatible with 8B/10B encoded data 48 36 “6” - Vendor Part Number ASCII character 12 2B 4300 MBit/sec nominal bit rate (4.25 Gbit/s) 49 41 “A” - Vendor Part Number ASCII character 13 00 50 50 “P” - Vendor Part Number ASCII character 14 00 51 5A “Z” - Vendor Part Number ASCII character 15 00 52 20 “ ” - Vendor Part Number ASCII character 16 0F 150 m of 50/125 µm fiber @ 4.25GBit/sec[2] 53 20 “ ” - Vendor Part Number ASCII character 17 07 70 m of 62.5/125 µm fiber @ 4.25GBit/sec[3] 54 20 “ ” - Vendor Part Number ASCII character 18 00 55 20 “ ” - Vendor Part Number ASCII character 19 00 56 20 “ ” - Vendor Part Number ASCII character 20 41 “A” - Vendor Name ASCII character 57 20 “ ” - Vendor Part Number ASCII character 21 56 “V” - Vendor Name ASCII character 58 20 “ ” - Vendor Part Number ASCII character 22 41 “A” - Vendor Name ASCII character 59 20 “ ” - Vendor Part Number ASCII character 23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength[5] 24 4F “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength[5] 25 20 “ ” - Vendor Name ASCII character 62 00 26 20 “ ” - Vendor Name ASCII character 63 27 20 “ ” - Vendor Name ASCII character 64 Checksum for Bytes 0-62[6] 00 28 20 “ ” - Vendor Name ASCII character 65 3A Hardware SFP TX_DISABLE, TX_FAULT, & RX_LOS, RATE_SELECT 29 20 “ ” - Vendor Name ASCII character 66 00 30 20 “ ” - Vendor Name ASCII character 67 00 31 20 “ ” - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters[7] 32 20 “ ” - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters[8] 33 20 “ ” - Vendor Name ASCII character 92 Digital Diagnostics, Internal Cal, Rx Pwr Avg 68 34 20 “ ” - Vendor Name ASCII character 93 F8 A/W, Soft SFP TX_DISABLE, TX_FAULT, & RX_LOS, RATE_SELECT 35 20 SFF-8472 Compliance to revision 9.3 36 00 “ ” - Vendor Name ASCII character 94 01 95 96 - 255 Checksum for Bytes 64-94[6] 00 Notes: 1.  FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial bit rate of 4.25 GBit/sec. 2. Link distance with 50/125 µm cable at 1.0625 GBit/sec is 500 m. Link distance at 2.125 GBit/sec is 300 m. 3. Link distance with 62.5/125 µm cable at 1.0625 GBit/sec is 300 m. Link distance with 62.5/125 µm cable at 2.125 GBit/sec is 150 m. 4.  The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-30-D3 (3 bytes of hex). 5.  Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352. 6.  Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074) and stored prior to product shipment. 7.  Addresses 68-83 specify the AFBR-57R6APZ ASCII serial number and will vary on a per unit basis. 8.  Addresses 84-91 specify the AFBR-57R6APZ ASCII date code and will vary on a per date code basis. 14 Table 13: EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h) Byte # Decimal Notes Byte # Decimal Notes Byte # Decimal Notes 0 Temp H Alarm MSB[1] 26 Tx Pwr L Alarm MSB[4] 104 Real Time Rx Pwr MSB[5] 1 Temp H Alarm LSB[1] 27 Tx Pwr L Alarm LSB[4] 105 2 Temp L Alarm MSB[1] 28 Tx Pwr H Warning MSB[4] 106 Reserved 3 Temp L Alarm LSB[1] 29 Tx Pwr H Warning LSB[4] 107 Reserved 4 Temp H Warning MSB[1] 30 Tx Pwr L Warning MSB[4] 108 Reserved 5 Temp H Warning LSB[1] 31 Tx Pwr L Warning LSB[4] 109 Reserved Temp L Warning MSB[1] Real Time Rx Pwr LSB[5] Rx Pwr H Alarm MSB[5] 6 32 110 Status/Control - See Table 14 7 Temp L Warning LSB[1] 33 Rx Pwr H Alarm LSB[5] 8 Vcc H Alarm MSB[2] 111 Reserved 34 Rx Pwr L Alarm MSB[5] 9 Vcc H Alarm LSB[2] 112 Flag Bits - See Table 15 35 Rx Pwr L Alarm LSB[5] 10 Vcc L Alarm MSB[2] 113 Flag Bits - See Table 15 36 Rx Pwr H Warning MSB[5] 11 Vcc L Alarm LSB[2] 114 Reserved 37 Rx Pwr H Warning LSB[5] 12 Vcc H Warning MSB[2] 115 Reserved 38 Rx Pwr L Warning MSB[5] 13 Vcc H Warning LSB[2] 116 Flag Bits - See Table 15 39 Rx Pwr L Warning LSB[5] 14 Vcc L Warning MSB[2] 117 Flag Bits - See Table 15 15 Vcc L Warning LSB[2] 40-55 Reserved 118-127 Reserved 56-94 External Calibration Constants[6] 16 Tx Bias H Alarm MSB[3] 128-247 Customer Writeable 95 Checksum for Bytes 0-94[7] 17 Tx Bias H Alarm LSB[3] 248-255 Vendor Specific 96 Real Time Temperature MSB[1] 18 Tx Bias L Alarm MSB[3] 97 Real Time Temperature LSB[1] 19 Tx Bias L Alarm LSB[3] 98 Real Time Vcc MSB[2] 20 Tx Bias H Warning MSB[3] 99 Real Time Vcc LS[2] 21 Tx Bias H Warning LSB[3] 100 Real Time Tx Bias MSB[3] 22 Tx Bias L Warning MSB[3] 101 Real Time Tx Bias LSB[3] 23 Tx Bias L Warning LSB[3] 102 Real Time Tx Power MSB[4] 24 Tx Pwr H Alarm MSB[4] 103 Real Time Tx Power LSB[4] 25 Tx Pwr H Alarm LSB[4] Notes: 1.  Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C. 2.  Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV. 3.  Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA. 4.  Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW. 5.  Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW. 6.  Bytes 56-94 are not intended for use with AFBR-57R5APZ, but have been set to default values per SFF-8472. 7.  Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment. 15 Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110) Status/ Bit # Control Name Description Notes 7 TX_ DISABLE State Digital state of SFP TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) Note 1 6 Soft TX_ DISABLE Read/write bit for changing digital state of TX_DISABLE function Note 1, 2 5 Reserved 4 Rate Select State Digital state of SFP Rate Select Input Pin (1 = RATE_SELECT asserted) Note 1, 3 3 Soft Rate_Select Read/write bit for changing digital state of RATE_SELECT function Note 1, 3 2 TX_FAULT State Digital state of the SFP TX_FAULT Output Pin (1 = TX_FAULT asserted) Note 1 1 RX_LOS State Digital state of the SFP RX_LOS Output Pin (1 = RX_LOS asserted) Note 1 0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) Note 3 Notes: 1.  The response time for soft commands of the AFBR-57R6APZ is 100 msec as specified by the MSA SFF-8472. 2.  Bit 6 is logic OR’d with the SFP TX_DISABLE input pin 3 ... either asserted will disable the SFP transmitter. 3. AFBR-57R6APZ optimizes for 4.25 G & 2.125 Gb/s performance when asserted and 2.125 G & 1.0625 Gb/s performance when deasserted. Bit 3 is logic OR’d with the SFP RATE_SELECT input pin 7 . . . either asserted will set the SFP transceiver to high bit rate parametric performance. Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117) Byte Bit Flag Bit Name Description 112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold 6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold 5 Vcc High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold 4 Vcc Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold 3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold 2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold 1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold 0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold 113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold 6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold 0-5 Reserved 116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold 6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold 5 Vcc High Warning Set when transceiver internal supply voltage exceeds high warning threshold 4 Vcc Low Warning Set when transceiver internal supply voltage exceeds low warning threshold 3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold 2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold 1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold 0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold 117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold 6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold 0-5 Reserved 16 55.3 ± 0.2 AFBR-57R6APZ 850nm LASER PROD 21CRF(J) CLASS1 SINGAPORE 0446 PPOC-4102-DIn2 SN: AJ0446CD1C 13.6 APZ OD 7R6 PR R-5 ASERASS1 AFB 50nmRLF(J) C0L44545CD1C DEVICE SHOWN WITH DUST CAP AND BAIL DELATCH 13.4 ± 0.1 1.91 8 21C INA 04 CHSN: A3 2 -Din 02 -44 G PPO 1.39 UNCOMPRESSED 12.4 ± 0.2 8.5 ± 0.1 0.55 UNCOMPRESSED 6.25 ± 0.05 + 0.2 13.6 0 TX RX 14.9 UNCOMPRESSED Figure 5. Module drawing. 17 X Y 34.5 10 3x 7.1 8.58 ∅ 0.85 ± 0.05 ∅ 0.1 S X Y A 1 2.5 1 2.5 B PCB EDGE 11.08 16.25 REF. 14.25 7.2 10x ∅1.05 ± 0.01 ∅ 0.1 L X A S 16.25 MIN. PITCH 3.68 5.68 20 PIN 1 2x 1.7 8.48 9.6 4.8 11 10 11.93 SEE DETAIL 1 2.0 11x 11x 2.0 9x 0.95 ± 0.05 ∅ 0.1 L X A S 5 26.8 10 3x 3 2 41.3 42.3 3.2 5 0.9 PIN 1 10.53 0.8 TYP. 11.93 1. PADS AND VIAS ARE CHASSIS GROUND 2. THROUGH HOLES, PLATING OPTIONAL 10 11 3. HATCHED AREA DENOTES COMPONENT AND TRACE KEEPOUT (EXCEPT CHASSIS GROUND) 4 2x 1.55 ± 0.05 ∅ 0.1 L A S B S 2 ± 0.005 TYP. 0.06 L A S B S DETAIL 1 Figure 6. SFP host board mechanical layout. 18 LEGEND 20 10.93 9.6 20x 0.5 ± 0.03 0.06 L A S B S 4. AREA DENOTES COMPONENT KEEPOUT (TRACES ALLOWED) DIMENSIONS ARE IN MILLIMETERS 1.7 ± 0.9 3.5 ± 0.3 41.78 ± 0.5 Tcase REFERENCE POINT CAGE ASSEMBLY 15 MAX. 11.73 REF 15.25 ± 0.1 9.8 MAX. 10 REF (to PCB) 10.4 ± 0.1 PCB 0.4 ± 0.1 (below PCB) 16.25 ± 0.1 MIN. PITCH DIMENSIONS ARE IN MILLIMETERS Figure 7. SFP Assembly drawing. Customer Manufacturing Processes This module is pluggable and is not designed for aqueous wash, IR reflow, or wave soldering processes. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0075EN AV02-3803EN - January 23, 2013