Transcript
AMU-9401 / AMU-9411 Megapixel IP camera module package
Electrical Mechanical Design Guide Version 2.2
Revision History
Revision Number
Change
2.2
Add Hardware reset in Important design notes
2.1
Supported video resolutions correction in spec section
2.0
J4 (RS232) of the compression module is N/A for use
1.0
AMU-9401 / AMU-9411 introduction
Table of Contents
1. Product definition 2. Module Connector Interface 3. Mechanical Requirements
Date Feb 11 2010 Mar 22 2009 June 25 2008 Nov 22 2007
4. Environmental Standards 5. Important design notes – MUST READ
1.0. Product definition Model number Intended application
Mechanical IR cut filter
Lens holder
Lens
AMU-9401
Fixed dome Bullet camera
Yes
Yes
Yes, attached
AMU-9411
Box camera
Yes
No
No
Block diagram:
2.0.
Module Connector Interface 2.1.
Connector Pin Assignments Table 1 lists the signals for each pin of the connectors from the IP module to the system electronics.
Table 2 lists the signal for each pin of the connectors from the PoE+DC12V module to the system electronics.
Table 3 lists the signal for each pin of the connectors from the sensor module to the system electronics.
Please note that when handling the connectors, please use proper tools and handling. If you pull or insert cables with excessive force from the connectors, the connector’s solder pad may be damaged.
Remark : When connecting cables to the IP MODULE, you should align the pin 1 of the cable with the pin 1 indicator of the connector on the module (Indicated with white arrow).
IP module connector pin definitions Connector Pins Purpose Pin Description no. # J1 3 Power Input 1 GND 2 GND 3 DC 12V J2 10 Network 1 TX2 TX+ 3 RX+ 4 RX5 LANACT_LED+ 6 GND 7 LANLINK_LED+ 8 GND 9 LAN 48V in 10 LAN 48V in + J3 4 Audio 1 Audio input 2 GND 3 Audio output 4 GND 1 GND 2 Data 7 3 Data 6 4 Data 5 ITU-R BT.656 5 Data 4 (CCIR656) 6 GND J5 12 (8 bit) 7 Data 3 Follow 8 Data 2 standard specs 9 Data 1 10 Data 0 11 GND 12 PCLK
Connector Remark type Wafer Pitch: 1.0mm Spec: +/- 10% Wafer Pitch: 1.0mm Ethernet Active LED Ethernet Link LED
Wafer Pitch: 1.0mm
PoE detection use PoE detection use 1.0 Vrms (1.4Vpp) 1.0 Vrms (1.4Vpp)
Wafer Pitch: 1.0mm
Clock rate is 27MHz
J6
4
J7
4
JP5
JP3
5
2
1 2 I2C bus 3 4 Power LED 1 2 Reset 3 Button 4
I2C Data I2C CLK GND NC Power LED+ GND Reset GND
Power output
NC GND DC12V output NC NC
IR detect
1 2 3 4 5
1 2
IR detect Ground
Wafer Pitch: 1.0mm Wafer Pitch: 1.0mm
Wafer Pitch: 1.0mm
Wafer Pitch: 1.0 mm
Active/Power Factory reset to default (refer to section 5.5 Hardware reset) CVBS is not used in this IP MODULE, as the default video interface is ITU-R BT.656 (CCIR656). Only this connector’s DC12V output is required. DC12V output supply for CCD/CMOS camera module Only used with the original supplier’s megapixel sensor module
Table 1
PoE+DC12V power module connector pin definitions Connector Pins Purpose Pin # no. J1 3 DC12V output to 1 IP module 2 3 1 DC12V input 2 J2 3 from external source 3 J3 10 Network and PoE 1 data output 2 interface to IP 3 module 4 5 6 7 8 9 10 J4 10 Network to 1 external RJ45 2 cable interface 3 4
Description
Connector Remark type Wafer Pitch: 1.0mm Range: +/- 10%
GND GND DC12V output GND Wafer GND Pitch: 1.0mm DC12V input TXWafer Pitch: TX+ 1.0mm RX+ RXLANACT_LED+ GND LANLINK_LED+ GND LAN 48V in LAN 48V in + TXWafer Pitch: TX+ 1.0mm RX+ RX-
Range: +/- 10%
Ethernet Active LED Ethernet Link LED PoE detection use PoE detection use
5 6 7 8 9 10
LANACT_LED+ GND LANLINK_LED+ GND LAN 48V in LAN 48V in +
Ethernet Active LED Ethernet Link LED PoE detection use PoE detection use
Table 2
Megapixel sensor module connector pin definitions Connector Pins Purpose no.
J2
3
Power in
J3
13
ITU-R BT656 interface
J4
J5
5
2
I2C
Light sensor
Pin # Description 1
DC12V
2
Ground
3 1 2 3 4
NC NC NC Ground PCLK
5 6 7 8 9 10 11 12 13 1
Ground Data 0 Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Ground
2
IR detect
3
I2C CLK
4
I2C Data
5
Ground
1 2
Lux detect Ground
Connector Remark type Range: +/- 10% Connect to JP5 of IP Wafer module Pitch: Ground – connect to JP5 1.25 mm of IP module NC Wafer Pitch: 1.25 mm Clock rate is 27MHz – connect to J5 of IP module Connect to J5 of IP module
Wafer Pitch: 1.25 mm
Wafer Pitch: 1.00 mm
Connect to JP3 of IP module Connect to JP3 of IP module Connect to J6 of IP module Connect to J6 of IP module Connect of J6 of IP module Light sensor and cable included
Table 3
Please note that when handling the connectors, please use proper tools and
handling. If you pull or insert cables with excessive force from the connectors, the connector’s solder pad may be damaged.
Ethernet cabling and connector EXAMPLE:
2.2.
Functional Specification
Table 4 summarizes the specifications of the module Product Specification Compression Picture Resolution Video Compression
MPEG-4 SP OR MJPEG SXGA (1280 * 1024) HD720 (1280 * 720) VGA (640 * 480)
MPEG4: 28K ~ 3M bps MJPEG: Up to 10Mbps 8 fps at 1280*1024 resolution Image Frame Rate 10 fps at 1280 * 720 resolution 25 / 30fps at VGA resolution Bit Rate
Video interface
Digital ITU-R ITU-R BT.656 (CCIR656) input, 8 bits, clock rate is BT.656 (CCIR656) 27MHz input
Lux rating
Minimum lux
0.1 Lux at F1.8
Color / D/N mode support
Color mode operation
Color -> B/W mode switching occurs at 7 Lux B/W -> Color mode switching occurs at 10 Lux
AMU-9401
f 4.3mm, F1.8 / 75Deg (Horizontal)
AMU-9411
No lens included. Please refer to recommended CS mount megapixel lens guide
Lens spec
Audio Input Audio Output External I/O Network
Software
Power
Physical
Compression Audio Line Input Compression Audio Line output Reset Key LED Ethernet Port Protocol Web Browser SDK Security
8kHz, Mono, PCM Unbalanced, 1.4Vp-p, (1Vrms) 8kHz, Mono, PCM Unbalanced, 1.4Vp-p, (1Vrms) Factory Default Power Status Ethernet(10/100 Base-T) TCP, UDP, IP, HTTP, DHCP, PPPoE, RTP, RTSP Microsoft Internet Explorer 6.0 or above ActiveX control, C SDK Password Protection: Configured by the Administrator DC12V±10% PoE (IEEE802.3af compliant) Auto sensing / Auto detection. Example: if both DC12V Power Requirement and PoE are provided to the unit, then if PoE cuts off, the IP module will disconnect and then automatically reconnect after 20 seconds with just the DC12V power. Power 4W, with PoE on. Consumption 3W, DC12V All board sizes 38*38mm, details refer to mechanical Dimensions drawing section of this guide Table 4
2.3.
Connector Spec
For this megapixel module package, connectors of pin pitch with 1.00mm and 1.25mm are used. Module IP
Pin pitch 1.00 mm
PoE
1.00 mm
Comment
Connector type Wafer Wafer
Sensor
1.25 mm 1.00 mm
Majority of connectors here use 1.00mm pitch, except for the included light sensor, whose connector has 1.00mm pitch
Wafer
1.0mm Pin pitch connector diagram example:
Cable supplier (Taiwan) For foreign clients that require contact to this supplier, please contact the module supplier Name: RF connectors Contact person: Ms. Tinny Hsu Email:
[email protected] TEL: +886 2 27893499 Fax: +886 2 27893398
Digikey catalog (USA) www.digikey.com Digikey has both 1.00mm and 1.25mm connectors available.
Please note that when handling the connectors, please use proper tools and handling. If you pull or insert cables with excessive force from the connectors, the connector’s solder pad may be damaged.
3.0.
Mechanical Requirements 3.1.
Module Dimensions The figure below shows the dimensions and the connector orientation for the IP camera module, PoE module and megapixel sensor module. It is strongly recommended that the system OEM utilize the mounting holes to ensure the long term mechanical reliability of the system.
3.1.1 IP module board dimensions
Note: All units are in mm
3.1.2 PoE module board dimensions
Note: all units are in mm.
3.1.3 AMU-9401 Megapixel sensor board dimensions (Lens holder + lens attached version)
Light sensor cable:
Note: all units are in mm.
3.1.4 AMU-9411 Megapixel sensor board dimensions (Lens holder + lens NOT attached version)
Light sensor cable:
Note: all units are in mm.
4.0.
Environmental Standards
Parameter Temperature
Humidity
Condition Non-Operating (environment) Operating (environment)
Junction temperature of IP module Unbiased
ROHS: Ready, self declaration
Specifications - 40 to 85 ℃ - 10 to 50 ℃ (Module placed within a sealed housing, and this housing placed in an environment running at operating temperature) - 10 to 120 ℃ (Surface temperature spec of module) 10%~85% RGH. 85% relative Humidity @ 55 ℃
5.0.
Important design notes
Please note that the company supplying the module has no liabilities or responsibilities to the design and manufacturing of the I/O connector board, thermal solution and cable design.
5.1 I/O connector board circuitry The I/O connector board is the board with necessary I/O connectors for user to attach cables intended for Power, Ethernet, CVBS output etc. Please note that the simplest design is to place all I/O connectors such as power, audio in/out, CVBS output, Ethernet RJ45 port, status LED etc onto one single board, but this is subject to your camera design.
When laying out the back panel that contains both video and audio signals, make sure that adequate grounding between these two signals are done properly.
5.2 Thermal consideration The main IC (ASoC 2200) on IP MODULE will heat up under 50Deg.C chamber environment with full enclosed casing. The surface temperature of our module should not exceed +120 Deg.C, otherwise failure of components may occur. The temperature dissipation of the module may cause deterioration in video quality and system performance if inappropriately placed. Basically, the ASoC2200 should be placed in a direction that is facing AWAY from the sensor module. Camera type Box camera
IP MODULE OK
Fixed dome
Depends on dome design
Placement suggestion 1. ASoC2200 face away from sensor module 2. ASoC2200 face towards bottom casing, with thermal pad in-between to dissipate heat 3. IP MODULE module is placed at a distance away from sensor module, ie. In middle of the camera or towards the back panel of the camera 1. If the dome housing has an upper compartment for mounting, then IP MODULE can be placed in that compartment. This is ideal, as it is far away from the sensro module 2. If the dome has no upper compartment and is limited for space, then IP MODULE can be placed with the board lens fixture (Limited distance in between sensor module and IP MODULE) 3. If placed with board lens fixture, then use a CERAMIC thermal pad to block the heat from affecting the sensor chip.
5.3 Cable design (i) The differential impedance of the cable for network part (J2 of IP module) needs to be at 100 Ohms
(ii) The Tx+ / Tx- cabling needs to be twisted together as a pair. The RX+ / RX- cabling needs to be twisted together as a pair. Without conditions (i) and (ii) met, IEEE802.3 network test is near imposiible to pass.
(iii) Digital ITU-R BT656 cable from sensor module to IP module. The cables for all the 8 bit signals and clock rate need to be equal length. Without being at equal length, signal reflection and wrong timing will occur. Appropriate shielding is also recommended to reduce noise effect.
5.4 Lighting for sensor In general, CMOS sensors require more lighting than CCD sensors. Therefore, in your camera design, please allow as much lighting as possible to reach the lens for best possible video quality.
5.5 Hardware Reset
Hardware reset is a necessary function for unforeseen failure, such as power surge. The picture below gives an example of the cable design. Corresponds to J7 connector (Boot up LED & Reset to Default)
Reset Button J7 (on IP module)
Standard procedure to apply hardware reset: Step 1: Power off IP module Step 2: Press and continue to hold the reset button. Reconnect the power supply while continuing to hold the reset button. Step 3: Keep the reset button pressed for about 15 seconds, and then release the reset button. The unit will start up with factory default settings.
