Transcript
AOT10B65M1/AOB10B65M1 650V, 10A Alpha IGBT TM With soft and fast recovery anti-parallel diode General Description
Product Summary
• Latest AlphaIGBT (α IGBT) technology • 650V breakdown voltage • Very fast and soft recovery freewheeling diode • High efficient turn-on di/dt controllability • Low VCE(SAT) enables high efficiencies • Low turn-off switching loss and softness • Very good EMI behavior • High short-circuit ruggedness
VCE IC (TC=100°C)
650V 10A
VCE(sat) (TJ=25°C)
1.6V
Applications • Motor Drives • Sewing Machines • Home Appliances • Fan, Pumps, Vacuum Cleaner • Other Hard Switching Applications
TO-263 D2PAK C
TO-220
G
C
C
E
E
AOT10B65M1
Orderable Part Number
G
G E
AOB10B65M1
Package Type
Form
Minimum Order Quantity
AOT10B65M1 TO220 Tube 1000 TO263 Tape & Reel 800 AOB10B65M1 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol AOT10B65M1/AOB10B65M1 Collector-Emitter Voltage V CE 650 Gate-Emitter Voltage
V GE
±30
Units V V
Continuous Collector TC=25°C TC=100°C Current
IC
Pulsed Collector Current, Limited by TJmax
I CM
30
A
Turn off SOA, VCE≤650V, Limited by TJmax
I LM
30
A
Continuous Diode Forward Current
TC=25°C TC=100°C
IF
20 10
20 10
A
A
Diode Pulsed Current, Limited by TJmax
I FM
30
A
Short circuit withstanding time 1) VGE=15V, VCC≤400V, TJ≤175°C
t SC
5
µs
TC=25°C Power Dissipation
TC=100°C
Junction and Storage Temperature Range
PD T J , T STG
150 75 -55 to 175
Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds 300 TL Thermal Characteristics Parameter Symbol AOT10B65M1/AOB10B65M1 R θ JA 65 Maximum Junction-to-Ambient Maximum IGBT Junction-to-Case R θ JC 1 Maximum Diode Junction-to-Case R θ JC 3.3 1) Allowed number of short circuits: <1000; time between short circuits: >1s. Rev.1.0: April 2015
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W °C °C Units °C/W °C/W °C/W
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Electrical Characteristics (TJ=25°C unless otherwise noted) Parameter
Conditions
Min
Typ
Max
Units
STATIC PARAMETERS BV CES Collector-Emitter Breakdown Voltage
IC=1mA, VGE=0V, TJ=25°C
650
-
-
V
V CE(sat)
VGE=15V, IC=10A
Symbol
VF
Collector-Emitter Saturation Voltage
VGE=0V, IC=10A
Diode Forward Voltage
V GE(th)
Gate-Emitter Threshold Voltage
VCE=5V, IC=1mA
I CES
Zero Gate Voltage Collector Current
VCE=650V, VGE=0V
TJ=25°C
-
1.6
2
TJ=125°C
-
1.86
-
TJ=175°C
-
2.02
-
V
TJ=25°C
-
1.9
2.4
TJ=125°C
-
1.96
-
TJ=175°C
-
1.91
-
-
5.1
-
V V
TJ=25°C
-
-
10
TJ=125°C
-
-
100
TJ=175°C
-
-
1000
µA
I GES
Gate-Emitter leakage current
VCE=0V, VGE=±30V
-
-
±100
nA
g FS
Forward Transconductance
VCE=20V, IC=10A
-
9
-
S
-
655
-
pF
-
68
-
pF
DYNAMIC PARAMETERS C ies Input Capacitance VGE=0V, VCC=25V, f=1MHz
C oes
Output Capacitance
C res
Reverse Transfer Capacitance
-
25
-
pF
Qg
Total Gate Charge
-
24
-
nC
Q ge
Gate to Emitter Charge
-
5.5
-
nC
Q gc
Gate to Collector Charge
-
12
-
nC
I C(SC)
Short circuit collector current
-
70
-
A
VGE=0V, VCC=0V, f=1MHz Rg Gate resistance SWITCHING PARAMETERS, (Load Inductive, TJ=25°C)
-
5.8
-
Ω
VGE=15V, VCC=520V, IC=10A VGE=15V, VCC=400V, tsc≤5us, TJ≤175°C
t D(on)
Turn-On DelayTime
-
12
-
ns
tr
Turn-On Rise Time
-
16
-
ns
t D(off)
Turn-Off Delay Time
-
91
-
ns
tf
Turn-Off Fall Time
-
14
-
ns
E on
Turn-On Energy
-
0.18
-
mJ
E off
Turn-Off Energy
-
0.13
-
mJ
E total t rr
Total Switching Energy
-
0.31
-
mJ
Diode Reverse Recovery Time
-
263
-
Q rr
Diode Reverse Recovery Charge
TJ=25°C VGE=15V, VCC=400V, IC=10A, RG=30Ω
-
0.4
-
ns µC
Diode Peak Reverse Recovery Current SWITCHING PARAMETERS, (Load Inductive, TJ=175°C)
-
3.8
-
A
t D(on)
Turn-On DelayTime
-
10
-
ns
tr
Turn-On Rise Time
-
17
-
ns
t D(off)
Turn-Off Delay Time
-
111
-
ns
tf
Turn-Off Fall Time
-
26
-
ns
E on
Turn-On Energy
-
0.2
-
mJ
E off
Turn-Off Energy
-
0.23
-
mJ
E total t rr
Total Switching Energy
-
0.43
-
mJ
Diode Reverse Recovery Time
-
262
-
Q rr
Diode Reverse Recovery Charge
-
0.7
-
ns µC
I rm
Diode Peak Reverse Recovery Current
-
5
-
A
TJ=25°C IF=10A, di/dt=200A/µs, VCC=400V
I rm
TJ=175°C VGE=15V, VCC=400V, IC=10A, RG=30Ω
TJ=175°C IF=10A, di/dt=200A/µs, VCC=400V
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.1.0: April 2015
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Page 2 of 9
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 50
50 20V 17V
20V
15V
40
40
17V 15V
IC (A)
IC (A)
13V 30 11V 20
30
13V
20
9V
11V 9V
10
10 VGE= 7V
VGE=7V 0
0 0
1
2
3
4
5
6
0
7
1
30
3
4
5
6
7
30 VCE=20V
25
25
20
-40°C
20 175°C
IF (A)
IC (A)
2
VCE (V) Figure 2: Output Characteristic (Tj=175°C)
VCE (V) Figure 1: Output Characteristic (Tj=25°C)
15
175°C
15 25°C
10
10
25°C -40°C
5
5
0
0 3
6
9
12
15
0
1
VGE (V) Figure 3: Transfer Characteristic
3
4
2.5 IC=20A
4
5
20A
2
3
VSD (V)
VCE(sat) (V)
3
VF (V) Figure 4: Diode Characteristic
5
IC=10A
2
2
10A 1.5 5A 1
1
IF=1A
IC=5A
0.5
0
0 0
25
75 100 125 150 175 Temperature (°C) Figure 5: Collector-Emitter Saturation Voltage vs. Junction Temperature
Rev.1.0: April 2015
50
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0
25
50
75
100
125
150
175
Temperature (°C) Figure 6: Diode Forward voltage vs. Junction Temperature
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TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15
10000 VCE=520V IC=10A
12
Cies
Capacitance (pF)
1000 VGE (V)
9
6
Cres
10
3
0
1 0
5
10
15 20 25 Qg (nC) Figure 7: Gate-Charge Characteristics
30
0
16
24
32
40
200
10µs
100µs 1
DC 1ms 10ms
0.1
Power Disspation (W)
160
10
120
80
40
0
0.01 1
10
100
25
1000
VCE (V) Figure 9: Forward Bias Safe Operating Area (TC=25°C, VGE=15V)
50
75
100
125
150
175
TCASE (°C) Figure 10: Power Disspation as a Function of Case
30
1E-03
25
1E-04
20
1E-05 ICE(S) (A)
Current rating IC (A)
8
VCE (V) Figure 8: Capacitance Characteristic
100
Ic (A)
Coes
100
15
1E-06 VCE=520V
10
1E-07
5
1E-08
0
VCE=650V
1E-09 25
50
75
100
125
150
175
TCASE (°C) Figure 11: Current De-rating
Rev.1.0: April 2015
0
25
50
75
100
125
150
175
Temperature (°C) Figure 12: Diode Reverse Leakage Current vs. Junction Temperature
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Page 4 of 9
≤ TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10000
Td(off) Tf Td(on) Tr
1000 Switching Time (ns)
1000 Switching Time (ns)
10000
Td(off) Tf Td(on) Tr
100
10
1
100
10
1 5
8
11
14
17
20
0
IC (A) Figure 13: Switching Time vs. IC (Tj=175°C, VGE=15V, VCE=400V, Rg=30Ω)
150
200
250
300
7
Td(off) Tf Td(on) Tr
1000
100
Rg (Ω) Figure 14: Switching Time vs. Rg (Tj=175°C, VGE=15V, VCE=400V, IC=10A)
6 5 VGE(TH) (V)
Switching Time (ns)
10000
50
100
4 3
10 2 1
1 25
Rev.1.0: April 2015
50
75
100 125 150 TJ (°C) Figure 15: Switching Time vs.Tj (VGE=15V, VCE=400V, IC=10A, Rg=30Ω)
175
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0
25
50
75
100
125
150
175
TJ (°C) Figure 16: VGE(TH) vs. Tj
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≤ TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1.5
1.5 Eoff
Eoff 1.2 Switching Energy (mJ)
1.2 SwitchIng Energy (mJ)
Eon
Eon Etotal
0.9
0.6
0.3
Etotal
0.9
0.6
0.3
0
0 5
8
11
14
17
20
0
IC (A) Figure 17: Switching Loss vs. IC (Tj=175°C, VGE=15V, VCE=400V, Rg=30Ω)
50
150
200
250
300
Rg (Ω) Figure 18: Switching Loss vs. Rg (Tj=175°C, VGE=15V, VCE=400V, IC=10A)
0.6
0.6 Eoff
Eoff Eon
Eon
0.48 Switching Energy (mJ)
0.48 Switching Energy (mJ)
100
Etotal 0.36
0.24
0.12
Etotal 0.36
0.24
0.12
0
0 25
50
75
100
125
150
175
TJ (°C) Figure 19: Switching Loss vs. Tj (VGE=15V, VCE=400V, IC=10A, Rg=30Ω)
Rev.1.0: April 2015
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200
250
300
350
400
450
500
VCE (V) Figure 20: Switching Loss vs. VCE (Tj=175°C, VGE=15V, IC=10A, Rg=30Ω)
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□ TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 360
25
175°C
300
20
Trr
25
175°C
Irm (A)
15
25°C Qrr 400
10
Trr (ns)
Qrr (nC)
240 600
180
15
120
Irm
175°C
20
25°C
5
200
5
175°C
0
0 8
11
14
17
0
20
0 5
IF (A) Figure 21: Diode Reverse Recovery Charge and Peak Current vs. Conduction Current (VGE=15V, VCE=400V, di/dt=200A/µs) 1000
175°C
8
11
14
17
20
IF (A) Figure 22: Diode Reverse Recovery Time and Softness Factor vs. Conduction Current (VGE=15V, VCE=400V, di/dt=200A/µs) 360
25
800
S
60
25°C 5
10
25°C
30
300
20
25
175°C
Qrr
25°C
400
Trr (ns)
15 Irm (A)
Qrr (nC)
240 600
20
25°C
Trr 180
15
S
800
30
S
1000
10 120
175°C 200
Irm
5
25°C 0
0 100
60
5
S
25°C
0
200
300 400 500 600 di/dt (A/µs) Figure 23: Diode Reverse Recovery Charge and Peak Current vs. di/dt (VGE=15V, VCE=400V, IF=10A)
Rev.1.0: April 2015
10
175°C
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0 100
200
300
400
500
600
di/dt (A/µs) Figure 24: Diode Reverse Recovery Time and Softness Factor vs. di/dt (VGE=15V, VCE=400V, IF=10A)
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□ TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
ZθJC Normalized Transient Thermal Resistance
10
1
D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=1°C/W
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1 PDM Single Pulse 0.01
Ton T
0.001 1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s) Figure 25: Normalized Maximum Transient Thermal Impedance for IGBT
ZθJC Normalized Transient Thermal Resistance
10
1
D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=3.3°C/W
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1 PDM
Single Pulse 0.01
Ton T
0.001 1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s) Figure 26: Normalized Maximum Transient Thermal Impedance for Diode
Rev.1.0: April 2015
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Page 8 of 9
Figure A: Gate Charge Test Circuit & Waveforms
Figure B: Inductive Switching Test Circuit & Waveforms
Figure C: Diode Recovery Test Circuit & Waveforms
Rev.1.0: April 2015
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Page 9 of 9