Transcript
Ceramic
Bandpass Filter 50Ω
BFCN-2900+
2700 to 3100 MHz
Maximum Ratings
Features
Operating Temperature Storage Temperature RF Power Input*
-55 C to 100 C -55oC to 100oC 1.5W at 25oC o
o
• Small size • Temperature stable • LTCC construction
CASE STYLE: FV1206-1
*Passband rating, derate linearly to 0.25W at 100oC ambient. Permanent damage may occur if any of these limits are exceeded.
Applications
Pin Connections
• Harmonic rejection • Transmitters / receivers
RF IN RF OUT GROUND
1 3 2,4,5,6
Outline Drawing
+RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications
Bandpass Filter Electrical Specifications1,2 (TAMB= 25OC) CENTER FREQ. (MHz)
PASSBAND (MHz) (Loss < 3dB)
STOPBANDS (MHz)
VSWR (:1)
Loss > 20dB
Loss 25dB Typ
Fc
F1 - F2
F3
F4
F5
2900
2700 - 3100
1850
4200
1800
F6 4900 - 7000
Passband
Stopband
Typ.
Max.
Typ.
2.3
3.6
20
1. Measured on Mini-Circuits Characterization Test Board TB-285. 2. This filter is not intended for use as a DC Blocking circuit element. In Application where DC voltage is present at either input or output ports, blocking capacitors are required at the corresponding RF port.
Typical Frequency Response ATTENUATION (dB)
PCB Land Pattern
Functional Schematic RF IN
RF OUT
25 20 3 F5 F3 F1 F2 F4 F6 FREQUENCY (MHz)
Typical Performance Data at 25oC Suggested Layout, Tolerance to be within ±.002
Outline Dimensions ( inch mm ) B .063 1.60
C .035 0.89
D .024 0.61
G .039 0.99
H .024 0.61
J .042 1.07
K .123 3.12
E .022 0.56
F .011 0.28 wt. grams .020
Demo Board MCL P/N: TB-285 Suggested PCB Layout (PL-158) 6X ø.015 PTH FOR GROUND
.012
PACKAGE OUTLINE
.010 TYP .012
Insertion Loss (dB)
VSWR (:1)
50 500 1000 1800 1850 2200 2380
68.92 59.22 51.09 29.79 27.43 12.97 6.22
1737.18 289.53 82.73 42.38 39.49 18.70 6.91
2480 2700 2900 3100 3400 3500
3.38 1.71 1.98 1.65 3.55 6.47
3.42 2.00 2.38 1.77 2.87 5.51
3650 4200 4900 5200 5500 7000
12.39 26.22 33.76 41.01 31.08 26.56
10.69 13.49 17.57 20.45 23.18 30.49
.073
BFCN-2900+ INSERTION LOSS
PIN 1
.055 .044 ± .002 TRACE WIDTH, 2 PL. (SEE NOTE BELOW)
.034 .010 TYP
.017
NOTES: 1. TRACE WIDTH IS SHOWN FOR ROGERS RO4350B WITH DIELECTRIC THICKNESS .020” ± .0015”. COPPER: 1/2 OZ. EACH SIDE. FOR OTHER MATERIALS TRACE WIDTH MAY NEED TO BE MODIFIED. 2. BOTTOM SIDE OF THE PCB IS CONTINUOUS GROUND PLANE. DENOTES PCB COPPER LAYOUT WITH SMOBC (SOLDER MASK OVER BARE COPPER) DENOTES COPPER LAND PATTERN FREE OF SOLDER MASK
INSERTION LOSS (dB)
100
2.3 2.1 1.9 1.7 1.5 2700
80 60
BFCN-2900+ VSWR
1000
3.0 2.5 2.0 1.5 1.0 2700
100 2800
2900
3000
VSWR
A .126 3.20
Frequency (MHz)
3100
40
2800
2900
3000
3100
10
20 0
1 0
1000
2000
3000
4000
5000
6000
7000
FREQUENCY (MHz)
0
1000
2000
3000
4000
5000
FREQUENCY (MHz)
Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits
®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500
[email protected]
6000
7000
REV. C M151121 EDR-8494F1 BFCN-2900+ RAV 161102 Page 1 of 1
Ceramic Band Pass Filter
BFCN-2900+
Typical Performance Data
FREQ. (MHz) 50 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1850 1900 2000 2100 2200 2300 2380 2400 2480 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 3500 3600 3650 3700 3800 3900 4000 4100 4200 4500 4900 5000 5200 5500 6000 6500 7000
INSERTION LOSS (dB)
INPUT RETURN LOSS (dB)
OUTPUT RETURN LOSS (dB)
@ +25˚ C
@ +25˚ C
@ +25˚ C
68.92 66.82 60.69 58.50 58.18 59.22 63.99 91.84 61.25 54.63 51.09 49.13 48.32 49.16 53.51 52.02 41.89 35.13 29.79 27.43 25.18 20.94 16.89 12.97 9.10 6.22 5.57 3.38 2.96 1.82 1.71 1.89 1.98 1.88 1.65 1.52 1.93 3.55 6.47 10.26 12.39 14.70 20.14 28.00 39.40 29.88 26.22 24.91 33.76 39.34 41.01 31.08 27.02 26.24 26.56
0.01 0.01 0.02 0.04 0.04 0.06 0.09 0.11 0.14 0.17 0.21 0.22 0.25 0.27 0.30 0.33 0.36 0.39 0.41 0.44 0.47 0.53 0.66 0.93 1.51 2.53 2.93 5.23 6.00 9.79 9.52 8.15 7.79 8.57 11.12 19.37 14.29 6.32 3.19 1.93 1.63 1.43 1.25 1.20 1.23 1.26 1.29 1.24 0.99 0.93 0.85 0.75 0.67 0.62 0.57
0.00 0.01 0.01 0.02 0.03 0.04 0.05 0.08 0.10 0.13 0.16 0.18 0.22 0.25 0.29 0.33 0.37 0.42 0.48 0.51 0.54 0.66 0.82 1.16 1.89 3.17 3.68 6.84 8.04 15.74 12.17 9.06 8.16 8.68 11.00 17.51 13.32 6.02 2.92 1.61 1.27 1.04 0.79 0.66 0.62 0.58 0.57 0.52 0.45 0.46 0.45 0.45 0.47 0.55 0.64 REV. X1 BFCN-2900+ 090820 Page 1 of 1
Ceramic Band Pass Filter
BFCN-2900+
Typical Performance Curves INSERTION LOSS vs. TEMPERATURE 0 10 20 30 (dB)
40 50 60 70
+25°C @ Input Power = 0 dBm
80 90 100 0
500
1000
1500
2000
2500
3000 3500 4000 Frequency (MHz)
4500
5000
5500
6000
6500
7000
INPUT RETURN LOSS vs. TEMPERATURE 0 2 4 6 (dB)
8 10 12 14 +25°C @ Input Power = 0 dBm
16 18 20 0
500
1000
1500
2000
2500
3000 3500 4000 Frequency (MHz)
4500
5000
5500
6000
6500
7000
OUTPUT RETURN LOSS vs. TEMPERATURE 0 2 4 6 (dB)
8 10 12 14
+25°C @ Input Power = 0 dBm
16 18 20 0
500
1000
1500
2000
2500
3000 3500 4000 Frequency (MHz)
4500
5000
5500
6000
6500
7000
REV. X1 BFCN-2900+ 090820 Page 1 of 1
Case Style
FV FV1206-1
Outline Dimensions PCB Land Pattern
Suggested Layout, Tolerance to be within ±.002
CASE #
A
B
C
D
E
F
G
H
J
K
L
M
N
P
WT. GRAM
FV1206-1
.126 (3.20)
.063 (1.60)
.035 (0.89)
.024 (0.61)
.022 (0.56)
.011 (0.28)
.039 (0.99)
.024 (0.61)
.042 (1.07)
.123 (3.12)
---
---
---
---
.020
Dimensions are in inches (mm). Tolerances: 2 Pl. + .01; 3 Pl. + .005
Notes: 1. Open style, ceramic base. 2. Termination finish: For RoHS Case Styles: Tin plate over Nickel plate. All models, (+) suffix. For RoHS-5 Case Styles: Tin-Lead plate. All models, no (+) suffix.
98-FV Rev.: T (05/02/14) M145992 File: 98-FV.doc This document and its contents are the property of Mini-Circuits.
Sheet 2 of 7
Tape & Reel Packaging TR-F75
Tape Width, mm
Device Cavity Pitch, mm
Reel Size, inches
Devices per Reel Small quantity standards (see note)
20 50 100 8 4 7 200 500 1000 Standard 3000 Note: Please consult individual model data sheet to determine device per reel availability.
Mini-Circuits carrier tape materials provide protection from ESD (Electro-Static Discharge) during handling and transportation. Tapes are static dissipative and comply with industry standards EIA-481/EIA-541. Go to: www.minicircuits.com/pages/pdfs/tape.pdf
98-TR-F75 Rev.: F (03/22/11) M130947 File: 98-TR-F75.doc This document and its contents are the property of Mini-Circuits.
Sheet 1 of 1
Mini-Circuits
Environmental Specifications
ENV06
All Mini-Circuits products are manufactured under exacting quality assurance and control standards, and are capable of meeting published specifications after being subjected to any or all of the following physical and environmental test. Specification
Test/Inspection Condition
Reference/Spec
Operating Temperature
-55° to 100°C Ambient Environment
Individual Model Data Sheet
Storage Temperature
-55° to 100° C Ambient Environment
Individual Model Data Sheet
Humidity
90 to 95% RH, 240 hours, 50°C
MIL-STD-202, Method 103, Condition A, Except 50°C and end-point electrical test done within 12 hours
Solder Reflow Heat
Sn-Pb Eutetic Process: 225°C peak Pb-Free Process 245° - 250°C peak
J-STD-020, Table 4-1, 4-2 and 5-2, Figure 5-1
Solderability
10X Magnification
J-STD-002, Para 4.2.5, Test S, 95% Coverage
Vibration (High Frequency)
20g peak, 10-2000 Hz, 12 times in each of three perpendicular directions (total 36)
MIL-STD-202, Method 204, Condition D
Mechanical Shock
50g, 11 ms, 1/2-sine, 18 shocks: 3 each direction, each of 3 axes
MIL-STD-202, Method 213, Condition A
ENV06
Rev: A
02/25/11
M130240
File: ENV06.pdf
This document and its contents are the property of Mini-Circuits.
Page: 1
