Transcript
BAS21... Silicon Switching Diode • For high-speed switching applications • High breakdown voltage • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101
BAS21
BAS21-03W
BAS21U $
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" #
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Type
Package
Configuration
Marking
BAS21 BAS21-03W BAS21U
SOT23 SOD323 SC74
single single parallel triple
JSs D JSs
Maximum Ratings at TA = 25°C, unless otherwise specified Parameter
Symbol
Diode reverse voltage
VR
200
Peak reverse voltage
VRM
250
Forward current
IF
250
Peak forward current
IFM
625
Peak forward current
IFM
625
Surge forward current, t = 10 µs
IFS
4
Non-repetitive peak surge forward current
IFSM
-
Total power dissipation
Ptot
Value
V mA mA A mW
BAS21, T S ≤ 70°C
350
BAS21-03W, TS ≤ 124°C BAS21U, TS ≤ 122°C
250 250
Junction temperature
Tj
Storage temperature
Tstg
1Pb-containing
Unit
150
°C
-65 ... 150
package may be available upon special request
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BAS21... Thermal Resistance Parameter
Symbol
Junction - soldering point 1)
RthJS
Value
Unit K/W
BAS21
≤ 230
BAS21-03W
≤ 105
BAS21U
≤ 110
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics 250 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current
IR
µA
VR = 200 V
-
-
0.1
VR = 200 V, TA = 150 °C
-
-
100
Forward voltage
V
VF
IF = 100 mA
-
-
1
IF = 200 mA
-
-
1.25
CT
-
-
5
pF
trr
-
-
50
ns
AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 30 mA, IR = 30 mA, measured at IR = 3mA, RL = 100 Ω Test circuit for reverse recovery time D.U.T.
ΙF
Puls generator: tp = 1µs, D = 0.05 tr = 0.6ns, Ri = 50Ω Oscillograph
Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF
EHN00018
1For
calculation of RthJA please refer to Application Note Thermal Resistance
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BAS21... Reverse current IR = ƒ (TA)
Forward Voltage VF = ƒ (TA) IF = Parameter
VR = 200V 10 2
BAS 19...21
EHB00027
µA
ΙR
BAS 19...21
1.5
VF
EHB00029
Ι F = 625 mA
V
max
10 1 5
250 mA
1.0 typ.
100 mA
10 0
10 mA 5
0.5 10 -1 5
10 -2
0
50
100
˚C
0.0
150
50
0
100
TA
˚C
150
TA
Forward current IF = ƒ (VF)
Forward current IF = ƒ (T S) BAS21-03W
BAS 19...21
EHB00028
300
mA
600 200
500
IF
ΙF
800 mA 700
400
150
300 100
200 50
100 0
0.0
0.5
1.0
V
0 0
1.5
15
30
45
60
75
90 105 120 °C
150
TS
VF
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BAS21... Forward current IF = ƒ (T S)
Permissible Puls Load R thJS = ƒ (tp) BAS21
BAS21U
10 3
250
mA
RthJS
IF
10 2
150
10 1
D = 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
100
10 0 50
0 0
15
30
45
60
90 105 120 °C
75
10 -1 -6 10
150
10
-5
10
-4
10
-3
10
-2
TS
s
10
0
tP
Permissible Puls Load R thJS = ƒ (tp) BAS21-03W
Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21 10 2
10 3
IFmax/IFDC
K/W
10 2
10 1
RthJS
D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
10 1
10 0
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
s
10
10 -1 -6 10
0
tP
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
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BAS21... Permissible Puls Load R thJS = ƒ (tp) BAS21U
Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21-03W 10 2
10 3 K/W
10 1
10 2
RthJS
I Fmax/IFDC
D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
10 1
D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
10 0
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
s
10
10 -1 -6 10
0
tP
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21U
IFmax/IFDC
10 2
D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
10 1
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
s
10
0
tP
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Package SC74
BAS21...
Package Outline B
1.1 MAX.
1
2
3
0.35 +0.1 -0.05
Pin 1 marking
0.2
B 6x
M
A
0.1 MAX.
0.95 0.2
1.9
1.6 ±0.1
4
10˚ MAX.
5
2.5 ±0.1
6
0.25 ±0.1
0.15 +0.1 -0.06
(0.35)
10˚ MAX.
2.9 ±0.2 (2.25)
M
A
Foot Print
2.9
1.9
0.5
0.95
Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible.
Manufacturer 2005, June Date code (Year/Month)
Pin 1 marking Laser marking
BCW66H Type code
Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel.
0.2
2.7 8
4
Pin 1 marking
3.15
1.15
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Package SOD323
BAS21...
Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1
0 ±0.05 A 1.7 +0.2 -0.1
Cathode marking
0.45 ±0.15
2.5 ±0.2
2
1 0.3 +0.1 -0.05
+0.05 0.3 -0.2
0.15 +0.1 -0.06
0.25 M A
0.8
1.7
0.8
Foot Print
0.6
Marking Layout (Example)
BAR63-03W Type code Cathode marking Laser marking
Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
0.2
2 2.9 8
4
Cathode marking
0.65 1.35
7
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Package SOT23
BAS21...
0.4 +0.1 -0.05
1)
2
0.08...0.1
C 0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9 0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example) Manufacturer
EH s
2005, June Date code (YM)
Pin 1
BCW66 Type code
Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
4 0.2
8
2.13 2.65
0.9
Pin 1
1.15
3.15
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BAS21... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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