Transcript
BAS3010B... Medium Power AF Schottky Diode • Forward current: 1 A • Reverse voltage: 30 V • Low forward voltage, low reverse current • For high efficiency DC/DC conversion, fast switching, protection and clamping applications • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101
BAS3010B-03W
Type BAS3010B-03W
Package SOD323
Configuration single
Marking 2/ red
Maximum Ratings at TA = 25°C, unless otherwise specified Parameter
Symbol
Diode reverse voltage2)
VR
30
V
Forward current 2)
IF
1
A
Average rectified forward current (50/60Hz, sinus) I FAV Repetitive peak forward current I FRM
Value
Unit
1 3.5
(tp ≤ 1 ms, D ≤ 0.5) Non-repetitive peak surge forward current
I FSM
10
Junction temperature
Tj
150
Operating temperature range
T op
-65 ... 125
Storage temperature
T stg
-65 ... 150
(t ≤ 10 ms) °C
1Pb-containing 2
package may be available upon special request For TA > 25°C the derating of VR and IF has to be considered. Please refer to the attached curves.
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BAS3010B... Thermal Resistance Parameter
Symbol
Junction - soldering point 1)
RthJS
Value
Unit
≤ 82
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current2) IR VR = 5 V
-
-
5
VR = 10 V
-
-
10
VR = 30 V
-
-
20
Forward voltage2)
Unit
µA
mV
VF
IF = 1 mA
-
230
280
IF = 10 mA
-
300
350
IF = 100 mA
-
360
420
IF = 500 mA
-
420
480
IF = 1 A
-
480
550
-
33
40
AC Characteristics Diode capacitance
CT
pF
VR = 5 V, f = 1 MHz 1For
calculation of RthJA please refer to Application Note Thermal Resistance
2Pulsed
test: tp = 300 µs; D = 0.01
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BAS3010B... Diode capacitance CT = ƒ (VR) f = 1MHz
Reverse current IR = ƒ (TA) VR = Parameter 10 -2
120
A pF
80
IR
CT
10 -3
10 -4
60 10 -5
VR = 30 V 20 V 10 V 5V
40 10 -6 20
0 0
5
10
15
20
V
10 -7 0
30
25
50
75
°C
100
VR
Reverse current IR = ƒ(VR)
Forward Voltage VF = ƒ (TA) IF = Parameter
TA = Parameter 10 -2
0.6
A
V
10 -3
IF = 1 A 500 mA 100 mA 10 mA
0.5 TA = 125 °C
VF
0.45
IR
150
TA
10 -4
0.4
TA = 85 °C
0.35 10 -5
0.3 0.25
10 -6
0.2
TA = 25 °C
0.15 10 -7 0
5
10
15
20
V
0.1 -50
30
VR
-25
0
25
50
75
100
°C
150
TA
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BAS3010B... Forward current IF = ƒ (VF)
Permissible Reverse voltage VR = ƒ (TA) tp = Parameter, Duty cycle < 0.01 Device mounted on PCB with Rth = 160 k/W
0
10
35
A
tp=300µs
V
tp=100ms
IF
V Rmax
10 -1 25
20 10
-2
DC
125 °C 85 °C 25 °C -40 °C
15
10
10 -3
5
10 -4 0
0.1
0.2
0.3
0.4
V
0 0
0.6
VF
25
50
75
100
°C
150
TA
Forward current IF = ƒ (T S)
1200
mA
IF
800
600
400
200
0 0
15
30
45
60
75
90 105 120 °C
150
TS
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Package SOD323
BAS3010B...
Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1
0 ±0.05 A 1.7 +0.2 -0.1
Cathode marking
0.45 ±0.15
2.5 ±0.2
2
1 0.3 +0.1 -0.05
+0.05 0.3 -0.2
0.15 +0.1 -0.06
0.25 M A
0.8
1.7
0.8
Foot Print
0.6
Marking Layout (Example)
BAR63-03W Type code Cathode marking Laser marking
Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
0.2
2 2.9 8
4
Cathode marking
0.65 1.35
5
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BAS3010B... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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