Preview only show first 10 pages with watermark. For full document please download

Bb503c Datasheet

   EMBED


Share

Transcript

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. BB503C Built in Biasing Circuit MOS FET IC UHF RF Amplifier REJ03G0834-0500 (Previous ADE-208-812C) Rev.5.00 Aug.10.2005 Features • • • • Built in Biasing Circuit; To reduce using parts cost & PC board space. Low noise; NF = 1.8 dB typ. at f = 900 MHz High gain; PG = 22 dB typ. at f = 900 MHz Withstanding to ESD; Built in ESD absorbing diode. Withstand up to 200V at C=200pF, Rs=0 conditions. • Provide mini mold packages; CMPAK-4(SOT-343mod) Outline RENESAS Package code: PTSP0004ZA-A (Package name: CMPAK-4) 2 3 1 4 Notes: 1. Marking is “CS–”. 2. BB503C is individual type number of RENESAS BBFET. Rev.5.00 Aug 10, 2005 page 1 of 10 1. Source 2. Gate1 3. Gate2 4. Drain BB503C Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate1 to source voltage Symbol VDS VG1S Ratings 6 Unit V +6 –0 V Gate2 to source voltage VG2S V Drain current Channel power dissipation Channel temperature Storage temperature ID Pch Tch Tstg +6 –0 20 100 150 –55 to +150 mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate1 to source breakdown voltage Gate2 to source breakdown voltage Gate1 to source cutoff current Gate2 to source cutoff current Gate1 to source cutoff voltage Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS IG1SS IG2SS VG1S(off) Min 6 +6 +6 — — 0.5 Typ — — — — — 0.7 Max — — — +100 +100 1.0 Unit V V V nA nA V VG2S(off) 0.5 0.7 1.0 V Drain current ID(op) 7 10 13 mA VDS = 5 V, VG1 = 5 V VG2S = 4 V, RG = 47 kΩ Forward transfer admittance |yfs| 19 24 29 mS Input capacitance Output capacitance Reverse transfer capacitance Power gain Noise figure Ciss Coss Crss PG NF 1.4 0.7 — 17 — 1.7 1.1 0.025 22 1.8 2.0 1.5 0.05 — 2.4 pF pF pF dB dB VDS = 5 V, VG1 = 5 V, VG2S =4 V RG = 47 kΩ, f = 1 kHz VDS = 5 V, VG1 = 5 V VG2S =4 V, RG = 47 kΩ f = 1 MHz Gate2 to source cutoff voltage Rev.5.00 Aug 10, 2005 page 2 of 10 Test conditions ID = 200 µA, VG1S = VG2S = 0 IG1 = +10 µA, VG2S = VDS = 0 IG2 = +10 µA, VG1S = VDS = 0 VG1S = +5 V, VG2S = VDS = 0 VG2S = +5 V, VG1S = VDS = 0 VDS = 5 V, VG2S = 4 V ID = 100 µA VDS = 5 V, VG1S = 5 V ID = 100 µA VDS = 5 V, VG1 = 5 V VG2S =4 V, RG = 47 kΩ f = 900 MHz BB503C Main Characteristics Test Circuit for Operating Items (ID(op) , |yfs|, Ciss, Coss, Crss, NF, PG) VG2 VG1 RG Gate 2 Gate 1 Drain Source A ID Application Circuit VDS = 5 V VAGC = 4 to 0.3 V BBFET Input RG VGG = 5 V Rev.5.00 Aug 10, 2005 page 3 of 10 RFC Output BB503C 900MHz Power Gain, Noise Figure Test Circuit VD VG1 VG2 C6 C4 C5 R1 R2 C3 R3 RFC Output (50Ω) D G2 L3 Input (50Ω) L4 G1 S L1 L2 C1 C1, C2 : C3 : C4 to C6 : R1 : R2 : R3 : C2 Variable Capacitor (10pF MAX) Disk Capacitor (1000pF) Air Capacitor (1000pF) 47 kΩ 47 kΩ 4.7 kΩ L2: L1: 10 3 3 8 10 26 (φ1mm Copper wire) Unit: mm 21 L4: L3: 18 10 10 7 7 29 RFC:φ1mm Copper wire with enamel 4turns inside dia 6mm Rev.5.00 Aug 10, 2005 page 4 of 10 BB503C Typical Output Characteristics 20 200 Drain Current ID (mA) Channel Power Dissipation Pch (mW) Maximum Channel Power Dissipation Curve 150 100 50 0 50 100 150 16 Drain Current ID (mA) Drain Current ID (mA) 12 4V 3V 8 4 VG2S = 1 V 2 3 2 3 4 5 4V 8 4 VG2S = 1 V 2V 8 3V VG2S = 1 V 4 Gate1 Voltage VG1 (V) Rev.5.00 Aug 10, 2005 page 5 of 10 5 Forward Transfer Admittance |yfs| (mS) 12 3 1 2 3 4 5 Forward Transfer Admittance vs. Gate1 Voltage VDS = 5 V RG = 68 kΩ 2 3V Gate1 Voltage VG1 (V) 20 4 VDS = 5 V RG = 47 kΩ 2V Drain Current vs. Gate1 Voltage Drain Current ID (mA) 1 12 0 5 4 16 Gate1 Voltage VG1 (V) 1 kΩ 47 Ω 68 k kΩ 0 0 1 20 2V 0 kΩ Drain Current vs. Gate1 Voltage 16 16 kΩ Drain to Source Voltage VDS (V) VDS = 5 V RG = 33 kΩ 1 33 4 Drain Current vs. Gate1 Voltage 0 22 RG 8 Ambient Temperature Ta (°C) 20 = 12 0 200 VG2S = 4 V VG1 = VDS 30 24 VDS = 5 V RG = 33 kΩ f = 1 kHz 4V 3V 18 2V 12 6 VG2S = 1 V 0 1 2 3 4 Gate1 Voltage VG1 (V) 5 BB503C Forward Transfer Admittance vs. Gate1 Voltage 30 24 VDS = 5 V RG = 47 kΩ f = 1 kHz 4V 3V 2V 18 12 6 VG2S = 1 V 0 1 2 3 Gate1 Voltage 4 5 Forward Transfer Admittance |yfs| (mS) Forward Transfer Admittance |yfs| (mS) Forward Transfer Admittance vs. Gate1 Voltage 30 VDS = 5 V RG = 68 kΩ 24 f = 1 kHz 6 VG2S = 1 V 0 VDS = VG1 = 5 V VG2S = 4 V f = 900 MHz 50 20 3 5 VG1 (V) 0 10 100 VDS = VG1 = 5 V VG2S = 4 V f = 900 MHz 1 20 50 100 Gate Resistance RG (kΩ) Power Gain vs. Drain Current Noise Figure vs. Drain Current 30 4 25 Noise Figure NF (dB) Power Gain PG (dB) 4 2 Gate Resistance RG (kΩ) 20 15 0 0 3 Noise Figure vs. Gate Resistance Noise Figure NF (dB) Power Gain PG (dB) 15 5 2 4 20 10 1 Gate1 Voltage 25 0 10 2V 12 VG1 (V) 30 5 3V 18 Power Gain vs. Gate Resistance 10 4V VDS = VG1 = 5 V VG2S = 4 V RG = variable f = 900 MHz 5 10 15 Drain Current ID (mA) Rev.5.00 Aug 10, 2005 page 6 of 10 20 VDS = VG1 = 5 V VG2S = 4 V RG = variable f = 900 MHz 3 2 1 0 0 5 10 15 Drain Current ID (mA) 20 BB503C Power Gain vs. Gate2 to Source Voltage Drain Current vs. Gate Resistance 25 Power Gain PG (dB) Drain Current ID (mA) 20 15 10 VDS = VG1 = 5 V VG2S = 4 V 5 0 10 50 20 20 15 10 VDS = 5 V RG = 47 kΩ f = 900 MHz 5 0 1 100 Noise Figure vs. Gate2 to Source Voltage Input Capacitance vs. Gate2 to Source Voltage 4 VDS = 5 V RG = 47 kΩ f = 900 MHz 4 Input Capacitance Ciss (pF) Noise Figure NF (dB) 5 3 2 1 1 2 4 3 Gate2 to Source Voltage VG2S (V) Gain Reduction vs. Gate2 to Source Voltage 0 Gain Reduction GR (dB) 4 3 Gate2 to Source Voltage VG2S (V) Gate Resistance RG (kΩ) 10 20 30 VDS = VG1 = 5 V VG2S = 4 V RG = 47 kΩ 40 50 2 4 3 2 1 0 Gate2 to Source Voltage VG2S (V) Rev.5.00 Aug 10, 2005 page 7 of 10 3 2 1 0 VDS = 5 V RG = 47 kΩ f = 1 MHz 0 1 2 3 4 Gate2 to Source Voltage VG2S (V) BB503C S21 Parameter vs. Frequency S11 Parameter vs. Frequency .8 1 .6 90° 1.5 Scale: 1 / div. 60° 120° 2 .4 3 30° 150° 4 5 .2 10 .2 0 .4 .6 .8 1 1.5 2 3 45 10 180° 0° –10 –5 –4 –.2 –.4 –30° –150° –3 –2 –.6 –.8 –1 –90° Test Condition: VDS = 5 V , VG1 = 5 V VG2S = 4 V , RG = 47 kΩ , Zo = 50Ω 50 to 1000 MHz (50 MHz step) Test Condition: VDS = 5 V , VG1 = 5 V VG2S = 4 V , RG = 47 kΩ , Zo = 50Ω 50 to 1000 MHz (50 MHz step) S12 Parameter vs. Frequency 90° –60° –120° –1.5 S22 Parameter vs. Frequency Scale: 0.002 / div. .8 60° 120° 1 .6 1.5 2 .4 3 30° 150° 4 5 .2 10 180° 0° .2 0 .4 .6 .8 1 1.5 2 3 45 10 –10 –5 –4 –.2 –30° –150° –3 –.4 –60° –120° –90° Test Condition: VDS = 5 V , VG1 = 5 V VG2S = 4 V , RG = 47 kΩ , Zo = 50Ω 50 to 1000 MHz (50 MHz step) Rev.5.00 Aug 10, 2005 page 8 of 10 –2 –.6 –.8 –1 –1.5 Test Condition: VDS = 5 V , VG1 = 5 V VG2S = 4 V , RG = 47 kΩ , Zo = 50Ω 50 to 1000 MHz (50 MHz step) BB503C S Parameter (VDS = VG1 = 5V, VG2S = 4V, RG = 47kΩ, Zo = 50Ω) f(MHz) S11 S21 S12 S22 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 MAG. 0.975 0.977 0.975 0.972 0.968 0.963 0.954 0.946 0.937 0.930 0.920 0.914 0.902 0.886 0.879 0.873 ANG. –2.6 –6.5 –9.1 –12.4 –15.6 –18.9 –22.2 –25.3 –28.2 –31.5 –34.7 –37.4 –40.4 –43.5 –46.1 –48.9 MAG. 2.37 2.37 2.36 2.33 2.32 2.30 2.28 2.25 2.22 2.19 2.16 2.13 2.09 2.07 2.03 1.99 ANG. 176.1 172.1 168.0 163.8 159.9 156.0 151.8 148.2 144.1 140.2 136.3 132.7 129.3 125.4 122.0 118.3 MAG. 0.00097 0.00162 0.00222 0.00282 0.00388 0.00437 0.00518 0.00567 0.00631 0.00637 0.00720 0.00747 0.00738 0.00758 0.00757 0.00729 ANG. 74.4 89.8 78.2 83.8 81.1 76.0 73.6 75.6 72.5 72.7 70.3 67.0 69.2 68.6 66.0 67.5 MAG. 0.995 0.998 0.997 0.996 0.994 0.993 0.991 0.989 0.986 0.984 0.981 0.978 0.975 0.972 0.968 0.966 ANG. –1.9 –3.9 –5.8 –8.0 –10.0 –11.8 –13.9 –15.8 –17.8 –19.6 –21.6 –23.4 –25.4 –27.3 –29.0 –31.0 850 900 950 1000 0.857 0.845 0.838 0.824 –52.0 –54.5 –57.2 –59.6 1.96 1.93 1.90 1.86 114.9 111.4 108.1 104.9 0.00723 0.00706 0.00659 0.00574 68.8 68.3 67.5 71.0 0.962 0.959 0.954 0.952 –32.9 –34.8 –36.6 –38.5 Rev.5.00 Aug 10, 2005 page 9 of 10 BB503C Package Dimensions JEITA Package Code RENESAS Code SC-82A Package Name PTSP0004ZA-A CMPAK-4(T) / CMPAK-4(T)V D MASS[Typ.] 0.006g A e2 e Q b1 c B B E HE LP Reference Symbol L A A x M L1 S A e2 A2 e l1 b5 S b c A A1 y S b2 A3 b e1 b1 b3 c1 c1 c A-A Section l1 b4 B-B Section Pattern of terminal position areas A A1 A2 A3 b b1 b2 b3 c c1 D E e e2 HE L L1 LP x y b4 b5 e1 l1 Q Dimension in Millimeters Min 0.8 0 0.8 0.25 0.35 0.1 1.8 1.15 1.8 0.3 0.1 0.2 Nom 0.9 0.25 0.32 0.42 0.3 0.4 0.13 0.11 2.0 1.25 0.65 0.6 2.1 Max 1.1 0.1 1.0 0.4 0.5 0.15 2.2 1.35 2.4 0.7 0.5 0.6 0.05 0.05 0.45 0.55 1.5 0.9 0.2 Ordering Information Part Name BB503CCS-TL-E Quantity 3000 Shipping Container φ 178 mm Reel, 8 mm Emboss Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.5.00 Aug 10, 2005 page 10 of 10 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0