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Cd4051b, Cd4052b, Cd4053b Features

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November 2018
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CD4051B, CD4052B, CD4053B August 1998 - Revised October 2003 Data sheet acquired from Harris Semiconductor SCHS047G Features • Wide Range of Digital and Analog Signal Levels - Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V - Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20VP-P [ /Title • Low ON Resistance, 125Ω (Typ) Over 15VP-P Signal Input Range for VDD -VEE = 18V (CD405 • High OFF Resistance, Channel Leakage of ±100pA (Typ) 1B, CD4052 at VDD -VEE = 18V • Logic-Level Conversion for Digital Addressing Signals of B, to 20V (VDD -VSS = 3V to 20V) to Switch Analog CD4053 3V Signals to 20VP-P (VDD -VEE = 20V) B) • Matched Switch Characteristics, rON = 5Ω (Typ) for /SubVDD -VEE = 15V ject Low Quiescent Power Dissipation Under All Digital(CMOS • Very Control Input and Supply Conditions, 0.2µW (Typ) at Analog VDD -VSS = VDD -VEE = 10V Multi• Binary Address Decoding on Chip plexers/Dem • 5V, 10V, and 15V Parametric Ratings ultiplex- • 100% Tested for Quiescent Current at 20V ers with • Maximum Input Current of 1µA at 18V Over Full Package Temperature Range, 100nA at 18V and 25oC Logic Level • Break-Before-Make Switching Eliminates Channel Overlap Conversion) /Author Applications • Analog and Digital Multiplexing and Demultiplexing () /Key• A/D and D/A Conversion words • Signal Gating (Harris CMOS Analog Multiplexers/Demultiplexers Semiconduc- with Logic Level Conversion tor, The CD4051B, CD4052B, and CD4053B analog multiplexers CD4000 are digitally-controlled analog switches having low ON The CD4051B is a single 8-Channel multiplexer having three binary control inputs, A, B, and C, and an inhibit input. The three binary signals select 1 of 8 channels to be turned on, and connect one of the 8 inputs to the output. The CD4052B is a differential 4-Channel multiplexer having two binary control inputs, A and B, and an inhibit input. The two binary input signals select 1 of 4 pairs of channels to be turned on and connect the analog inputs to the outputs. The CD4053B is a triple 2-Channel multiplexer having three separate digital control inputs, A, B, and C, and an inhibit input. Each control input selects one of a pair of channels which are connected in a single-pole, double-throw configuration. When these devices are used as demultiplexers, the “CHANNEL IN/OUT” terminals are the outputs and the “COMMON OUT/IN” terminals are the inputs. Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE CD4051BF3A, CD4052BF3A, CD4053BF3A -55 to 125 16 Ld CERAMIC DIP CD4051BE, CD4052BE, CD4053BE -55 to 125 16 Ld PDIP CD4051BM, CD4051BMT, CD4051BM96 CD4052BM, CD4052BMT, CD4052BM96 CD4053BM, CD4053BMT, CD4053BM96 -55 to 125 16 Ld SOIC CD4051BNSR, CD4052BNSR, CD4053BNSR -55 to 125 16 Ld SOP CD4051BPW, CD4051BPWR, CD4052BPW, CD4052BPWR CD4053BPW, CD4053BPWR -55 to 125 16 Ld TSSOP NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. impedance and very low OFF leakage current. Control of analog signals up to 20VP-P can be achieved by digital signal amplitudes of 4.5V to 20V (if VDD -VSS = 3V, a VDD -VEE of up to 13V can be controlled; for VDD -VEE level differences above 13V, a VDD -VSS of at least 4.5V is required). For example, if VDD = +4.5V, VSS = 0V, and VEE = -13.5V, analog signals from -13.5V to +4.5V can be controlled by digital inputs of 0V to 5V. These multiplexer circuits dissipate extremely low quiescent power over the full VDD -VSS and VDD -VEE supply-voltage ranges, independent of the logic state of the control signals. When a logic “1” is present at the inhibit input terminal, all channels are off. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated CD4051B, CD4052B, CD4053B Pinouts CD4051B (PDIP, CDIP, SOIC, SOP, TSSOP) TOP VIEW 4 1 16 VDD 6 2 15 2 COM OUT/IN 3 14 1 7 4 13 0 CHANNELS IN/OUT CD4052B (PDIP, CDIP, SOP, TSSOP) TOP VIEW 0 1 16 VDD 2 2 15 2 COMMON “Y” OUT/IN 3 14 1 Y CHANNELS IN/OUT X CHANNELS IN/OUT CHANNELS IN/OUT CHANNELS IN/OUT Y CHANNELS IN/OUT 3 4 13 COMMON “X” OUT/IN 5 5 12 3 1 5 12 0 INH 6 11 A INH 6 11 3 VEE 7 10 B VEE 7 10 A VSS 8 9 C VSS 8 9 B X CHANNELS IN/OUT CD4053B (PDIP, CDIP, SOP, TSSOP) TOP VIEW IN/OUT by 1 16 VDD bx 2 15 OUT/IN bx OR by cy 3 14 OUT/IN ax OR ay OUT/IN CX OR CY 4 13 ay IN/OUT CX 5 12 ax INH 6 11 A VEE 7 10 B VSS 8 9 C IN/OUT Functional Block Diagrams CD4051B CHANNEL IN/OUT 16 VDD 7 6 5 4 3 2 1 0 4 2 5 1 12 15 14 13 TG TG A † 11 TG B † 10 LOGIC LEVEL CONVERSION C † 9 INH † 6 BINARY TO 1 OF 8 DECODER WITH INHIBIT TG 3 TG TG TG TG 8 VSS 7 VEE † All inputs are protected by standard CMOS protection network. 2 COMMON OUT/IN CD4051B, CD4052B, CD4053B Functional Block Diagrams (Continued) CD4052B X CHANNELS IN/OUT 3 2 1 0 11 15 14 12 TG 16 VDD A † 10 B † 9 INH † 6 TG BINARY TO 1 OF 4 DECODER WITH INHIBIT LOGIC LEVEL CONVERSION TG COMMON X OUT/IN TG 13 TG TG 3 COMMON Y OUT/IN TG TG 8 VSS 7 VEE 1 5 2 4 0 1 2 3 Y CHANNELS IN/OUT CD4053B LOGIC LEVEL CONVERSION 16 VDD BINARY TO 1 OF 2 DECODERS WITH INHIBIT IN/OUT cy cx by bx ay ax 3 5 1 2 13 12 TG COMMON OUT/IN ax OR ay 14 A † 11 TG TG COMMON OUT/IN bx OR by 15 B C † † 10 TG TG 9 4 TG INH † COMMON OUT/IN cx OR cy 6 VDD 8 VSS 7 VEE † All inputs are protected by standard CMOS protection network. 3 CD4051B, CD4052B, CD4053B TRUTH TABLES INPUT STATES INHIBIT C B A “ON” CHANNEL(S) 0 0 0 0 0 0 0 0 1 1 0 0 1 0 2 0 0 1 1 3 0 1 0 0 4 0 1 0 1 5 0 1 1 0 6 0 1 1 1 7 1 X X X None CD4051B CD4052B INHIBIT B A 0 0 0 0x, 0y 0 0 1 1x, 1y 0 1 0 2x, 2y 0 1 1 3x, 3y 1 X X None CD4053B INHIBIT A OR B OR C 0 0 ax or bx or cx 0 1 ay or by or cy 1 X None X = Don’t Care 4 CD4051B, CD4052B, CD4053B Absolute Maximum Ratings Thermal Information Supply Voltage (V+ to V-) Voltages Referenced to VSS Terminal . . . . . . . . . . . -0.5V to 20V DC Input Voltage Range . . . . . . . . . . . . . . . . . . -0.5V to VDD +0.5V DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA Package Thermal Impedance, θJA (see Note 1): E (PDIP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature (Ceramic Package) . . . . . . . . .175oC Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = ±5V, AV = +1, RL = 100Ω, Unless Otherwise Specified (Note 3) Electrical Specifications LIMITS AT INDICATED TEMPERATURES (oC) CONDITIONS 25 PARAMETER VIS (V) VEE (V) VSS (V) VDD (V) -55 -40 85 125 MIN TYP MAX UNITS SIGNAL INPUTS (VIS) AND OUTPUTS (VOS) - - - 5 5 5 150 150 - 0.04 5 µA - - - 10 10 10 300 300 - 0.04 10 µA - - - 15 20 20 600 600 - 0.04 20 µA - - - 20 100 100 3000 3000 - 0.08 100 µA - 0 0 5 800 850 1200 1300 - 470 1050 Ω - 0 0 10 310 330 520 550 - 180 400 Ω - 0 0 15 200 210 300 320 - 125 240 Ω Change in ON Resistance (Between Any Two Channels), ∆rON - 0 0 5 - - - - - 15 - Ω - 0 0 10 - - - - - 10 - Ω - 0 0 15 - - - - - 5 - Ω OFF Channel Leakage Current: Any Channel OFF (Max) or ALL Channels OFF (Common OUT/IN) (Max) - 0 0 18 - ±0.01 ±100 (Note 2) nA Capacitance: - -5 5- 5 Quiescent Device Current, IDD Max Drain to Source ON Resistance rON Max 0 ≤ VIS ≤ VDD Input, CIS ±100 (Note 2) ±1000 (Note 2) - - - - - 5 - pF CD4051 - - - - - 30 - pF CD4052 - - - - - 18 - pF CD4053 - - - - - 9 - pF - - - - - 0.2 - pF 5 - - - - - 30 60 ns 10 - - - - - 15 30 ns 15 - - - - - 10 20 ns Output, COS Feedthrough CIOS Propagation Delay Time (Signal Input to Output VDD 5 RL = 200kΩ, CL = 50pF, tr , tf = 20ns CD4051B, CD4052B, CD4053B Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = ±5V, AV = +1, RL = 100Ω, Unless Otherwise Specified (Continued) (Note 3) Electrical Specifications LIMITS AT INDICATED TEMPERATURES (oC) CONDITIONS 25 PARAMETER VIS (V) VEE (V) VSS (V) VDD (V) -55 -40 85 125 MIN TYP MAX UNITS 5 1.5 1.5 1.5 1.5 - - 1.5 V 10 3 3 3 3 - - 3 V 15 4 4 4 4 - - 4 V 5 3.5 3.5 3.5 3.5 3.5 - - V 10 7 7 7 7 7 - - V 15 11 11 11 11 11 - - V ±0.1 µA CONTROL (ADDRESS OR INHIBIT), VC Input Low Voltage, VIL , Max VIL = VDD through 1kΩ; VIH = VDD through Input High Voltage, VIH , 1kΩ Min Input Current, IIN (Max) VEE = VSS , RL = 1kΩ to VSS , IIS < 2µA on All OFF Channels VIN = 0, 18 18 ±0.1 ±0.1 ±1 ±1 - ±10-5 Propagation Delay Time: Address-to-Signal tr , tf = 20ns, OUT (Channels ON or CL = 50pF, OFF) See Figures 10, RL = 10kΩ 11, 14 0 0 5 - - - - - 450 720 ns 0 0 10 - - - - - 160 320 ns 0 0 15 - - - - - 120 240 ns -5 0 5 - - - - - 225 450 ns 0 0 5 - - - - - 400 720 ns 0 0 10 - - - - - 160 320 ns 0 0 15 - - - - - 120 240 ns -10 0 5 - - - - - 200 400 ns 0 0 5 - - - - - 200 450 ns 0 0 10 - - - - - 90 210 ns 0 0 15 - - - - - 70 160 ns -10 0 5 - - - - - 130 300 ns - - - - - 5 7.5 pF Propagation Delay Time: Inhibit-to-Signal OUT tr , tf = 20ns, (Channel Turning ON) CL = 50pF, See Figure 11 RL = 1kΩ Propagation Delay Time: Inhibit-to-Signal OUT (Channel Turning OFF) See Figure 15 tr , tf = 20ns, CL = 50pF, RL = 10kΩ Input Capacitance, CIN (Any Address or Inhibit Input) NOTE: 2. Determined by minimum feasible leakage measurement for automatic testing. Electrical Specifications TEST CONDITIONS PARAMETER VIS (V) VDD (V) RL (kΩ) Cutoff (-3dB) Frequency Channel ON (Sine Wave Input) 5 (Note 3) 10 1 VOS at Common OUT/IN VEE = VSS , V OS 20Log ------------ = – 3dB V IS 6 VOS at Any Channel LIMITS TYP UNITS CD4053 30 MHz CD4052 25 MHz CD4051 20 MHz 60 MHz CD4051B, CD4052B, CD4053B Electrical Specifications TEST CONDITIONS LIMITS PARAMETER VIS (V) VDD (V) RL (kΩ) TYP UNITS Total Harmonic Distortion, THD 2 (Note 3) 5 10 0.3 % 3 (Note 3) 10 0.2 % 5 (Note 3) 15 0.12 % VEE = VSS, fIS = 1kHz Sine Wave -40dB Feedthrough Frequency (All Channels OFF) 5 (Note 3) 10 1 VOS at Common OUT/IN CD4053 8 MHz CD4052 10 MHz CD4051 12 MHz VOS at Any Channel 8 MHz Between Any 2 Channels 3 MHz Between Sections, CD4052 Only Measured on Common 6 MHz Measured on Any Channel 10 MHz Between Any Two Sections, CD4053 Only In Pin 2, Out Pin 14 2.5 MHz In Pin 15, Out Pin 14 6 MHz 10 (Note 4) 65 mVPEAK VEE = 0, VSS = 0, tr , tf = 20ns, VCC = VDD - VSS (Square Wave) 65 mVPEAK VEE = VSS , V OS 20Log ------------ = – 40dB V IS -40dB Signal Crosstalk Frequency % 5 (Note 3) 10 1 VEE = VSS , V OS 20Log ------------ = – 40dB V IS Address-or-Inhibit-to-Signal Crosstalk - 10 NOTES: V DD – V EE ----------------------------2 3. Peak-to-Peak voltage symmetrical about 4. Both ends of channel. Typical Performance Curves 300 VDD - VEE = 10V VDD - VEE = 5V rON , CHANNEL ON RESISTANCE (Ω) rON , CHANNEL ON RESISTANCE (Ω) 600 500 400 TA = 125oC 300 TA = 25oC 200 TA = -55oC 100 0 -4 -3 -2 -1 0 1 2 3 4 VIS , INPUT SIGNAL VOLTAGE (V) FIGURE 1. CHANNEL ON RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 7 5 250 TA = 125oC 200 150 TA = 25oC 100 TA = -55oC 50 0 -10 -7.5 -5 -2.5 0 2.5 5 VIS , INPUT SIGNAL VOLTAGE (V) 7.5 FIGURE 2. CHANNEL ON RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 10 CD4051B, CD4052B, CD4053B Typical Performance Curves (Continued) 600 250 rON , CHANNEL ON RESISTANCE (Ω) rON , CHANNEL ON RESISTANCE (Ω) TA = 25oC VDD - VEE = 5V 500 400 300 200 10V 15V 100 0 -10 -7.5 -5 -2.5 0 2.5 5 7.5 VDD - VEE = 15V 200 TA = 125oC 150 TA = 25oC 100 TA = -55oC 50 0 -10 10 -7.5 -5 FIGURE 3. CHANNEL ON RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) PD , POWER DISSIPATION PACKAGE (µW) 100Ω -2 -4 -2 0 2 4 VIS , INPUT SIGNAL VOLTAGE (V) TA = 25oC ALTERNATING “O” AND “I” PATTERN CL = 50pF f VDD = 15V 103 VDD = 10V 102 VDD = 5V CL = 15pF 10 1 10 TEST CIRCUIT VDD CD4029 VDD B/D A B 100Ω 10 9 1 3 CL 13 5 12 2 4 CD4052 14 15 6 11 7 8 Ι 102 103 104 SWITCHING FREQUENCY (kHz) 105 FIGURE 7. DYNAMIC POWER DISSIPATION vs SWITCHING FREQUENCY (CD4052B) 8 VDD = 5V 10 B/D CD4029 A B C VDD 100Ω 11 10 9 13 14 15 12 CD4051 1 5 3 2 48 7 6 C L 100Ω Ι CL = 15pF 1 100Ω PD , POWER DISSIPATION PACKAGE (µW) VDD = 10V 10 6 FIGURE 5. ON CHARACTERISTICS FOR 1 OF 8 CHANNELS (CD4051B) 104 7.5 f VDD = 15V 102 -4 10 102 103 104 SWITCHING FREQUENCY (kHz) 105 FIGURE 6. DYNAMIC POWER DISSIPATION vs SWITCHING FREQUENCY (CD4051B) PD , POWER DISSIPATION PACKAGE (µW) VOS , OUTPUT SIGNAL VOLTAGE (V) 1kΩ 500Ω 103 -6 5 TEST CIRCUIT VDD TA = 25oC ALTERNATING “O” AND “I” PATTERN CL = 50pF 104 RL = 100kΩ, RL = 10kΩ 0 105 2.5 105 VDD = 5V VSS = 0V VEE = -5V TA = 25oC 2 -6 0 FIGURE 4. CHANNEL ON RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 6 4 -2.5 VIS , INPUT SIGNAL VOLTAGE (V) VIS , INPUT SIGNAL VOLTAGE (V) 105 TA = 25oC ALTERNATING “O” AND “I” PATTERN CL = 50pF 104 103 VDD = 5V 102 CL = 15pF VDD = 15V VDD = 10V TEST CIRCUIT VDD f 9 4 CL 100Ω 3 12 5 13 100Ω CD4053 2 10 1 15 11 14 6 7 8 Ι 10 1 10 102 103 104 SWITCHING FREQUENCY (kHz) 105 FIGURE 8. DYNAMIC POWER DISSIPATION vs SWITCHING FREQUENCY (CD4053B) CD4051B, CD4052B, CD4053B Test Circuits and Waveforms VDD = 15V VDD = 7.5V VDD = 5V VDD = 5V 5V 7.5V 16 5V 16 16 16 VSS = 0V VSS = 0V VSS = 0V VEE = 0V 7 8 VEE = -7.5V 7 8 VEE = -10V 7 8 7 8 VEE = -5V VSS = 0V (D) (C) (B) (A) NOTE: The ADDRESS (digital-control inputs) and INHIBIT logic levels are: “0” = VSS and “1” = VDD. The analog signal (through the TG) may swing from VEE to VDD. FIGURE 9. TYPICAL BIAS VOLTAGES tr = 20ns tr = 20ns tf = 20ns 90% 50% 90% 50% 10% tf = 20ns 90% 50% 90% 50% 10% 10% 10% TURN-ON TIME 90% 50% 90% 10% 10% 10% TURN-OFF TIME TURN-OFF TIME FIGURE 10. WAVEFORMS, CHANNEL BEING TURNED ON (RL = 1kΩ) FIGURE 11. WAVEFORMS, CHANNEL BEING TURNED OFF (RL = 1kΩ) VDD VDD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CD4051 IDD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CD4052 VDD IDD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CD4053 FIGURE 12. OFF CHANNEL LEAKAGE CURRENT - ANY CHANNEL OFF 9 TURN-ON TIME tPHZ IDD CD4051B, CD4052B, CD4053B Test Circuits and Waveforms (Continued) VDD 1 2 3 4 5 6 7 8 IDD VDD 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 IDD VDD 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 CD4052 CD4051 16 15 14 13 12 11 10 9 IDD CD4053 FIGURE 13. OFF CHANNEL LEAKAGE CURRENT - ALL CHANNELS OFF VDD 1 2 3 4 5 6 7 8 VDD VEE VSS 16 15 14 13 12 11 10 9 OUTPUT VDD OUTPUT OUTPUT 1 RL CL 2 RL CL 3 VDD VEE 4 VDD 5 VEE 6 VEE VSS CLOCK 7 IN 8 VSS VSS CD4051 16 15 14 13 12 11 10 9 VDD VEE VDD VSS CLOCK VSS IN VSS CD4052 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CD4053 RL CL VEE VDD VSS CLOCK IN VSS FIGURE 14. PROPAGATION DELAY - ADDRESS INPUT TO SIGNAL OUTPUT VDD OUTPUT RL 1 2 3 4 5 6 7 8 50pF VEE VDD VSS VDD CLOCK VEE IN VSS 16 15 14 13 12 11 10 9 VDD OUTPUT 50pF RL VEE VDD VSS VDD CLOCK VEE IN VSS tPHL AND tPLH VSS CD4051 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 OUTPUT RL 50pF VEE VDD VDD VSS CLOCK VEE IN VSS V tPHL AND tPLH SS CD4052 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD V tPHL AND tPLH SS CD4053 FIGURE 15. PROPAGATION DELAY - INHIBIT INPUT TO SIGNAL OUTPUT VDD VIH 1K VIH VIL VDD VDD µA 1K 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VIH VIL 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1K 1K µA VIH 1K VIL VIH VIL MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL 6) 1K µA VIH VIL VIL MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL 2x) MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL by) FIGURE 16. INPUT VOLTAGE TEST CIRCUITS (NOISE IMMUNITY) 10 16 15 14 13 12 11 10 9 CD4053B CD4052B CD4051B 1 2 3 4 5 6 7 8 CD4051B, CD4052B, CD4053B Test Circuits and Waveforms (Continued) VDD VDD 1 2 3 4 5 6 7 8 Ι 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 Ι CD4051 CD4053 VDD 16 15 14 13 12 11 10 9 KEITHLEY 160 DIGITAL MULTIMETER TG “ON” 10kΩ X-Y PLOTTER FIGURE 18. CHANNEL ON RESISTANCE MEASUREMENT CIRCUIT VDD 1 2 3 4 5 6 7 8 VDD Ι VSS CD4051 CD4053 VSS X H.P. MOSELEY 7030A CD4052 VDD 16 15 14 13 12 11 10 9 Y VSS FIGURE 17. QUIESCENT DEVICE CURRENT 1 2 3 4 5 6 7 8 1kΩ RANGE VSS 16 15 14 13 12 11 10 9 VDD Ι VSS CD4052 NOTE: Measure inputs sequentially, to both VDD and VSS connect all unused inputs to either VDD or VSS . NOTE: Measure inputs sequentially, to both VDD and VSS connect all unused inputs to either VDD or VSS . FIGURE 19. INPUT CURRENT 5VP-P CHANNEL ON 5VP-P OFF CHANNEL VDD RF VM RL 1K RL RL RL FIGURE 20. FEEDTHROUGH (ALL TYPES) FIGURE 21. CROSSTALK BETWEEN ANY TWO CHANNELS (ALL TYPES) CHANNEL IN Y ON OR OFF CHANNEL IN X ON OR OFF RL RF VM RL FIGURE 22. CROSSTALK BETWEEN DUALS OR TRIPLETS (CD4052B, CD4053B) 11 RF VM CHANNEL ON RF VM CHANNEL OFF 6 7 8 5VP-P COMMON CHANNEL OFF CD4051B, CD4052B, CD4053B Test Circuits and Waveforms (Continued) DIFFERENTIAL SIGNALS CD4052 CD4052 COMMUNICATIONS LINK DIFF. AMPLIFIER/ LINE DRIVER DIFF. MULTIPLEXING DIFF. RECEIVER DEMULTIPLEXING FIGURE 23. TYPICAL TIME-DIVISION APPLICATION OF THE CD4052B Special Considerations In applications where separate power sources are used to drive VDD and the signal inputs, the VDD current capability should exceed VDD/RL (RL = effective external load). This provision avoids permanent current flow or clamp action on the VDD supply when power is applied or removed from the CD4051B, CD4052B or CD4053B. A B CD4051B C INH A B C D E Q0 A B E 1/2 CD4556 A B CD4051B C INH Q1 Q2 A B CD4051B C INH FIGURE 24. 24-TO-1 MUX ADDRESSING 12 COMMON OUTPUT PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 7901502EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7901502EA CD4052BF3A 8101801EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8101801EA CD4053BF3A CD4051BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type -55 to 125 CD4051BE CD4051BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4051BE CD4051BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4051BF CD4051BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4051BF3A CD4051BF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI CD4051BM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BM96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BM96E4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BM96G3 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BMG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BMT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BMTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BMTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051BM CD4051BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051B Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD4051BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051B CD4051BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4051B CD4051BPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM051B CD4051BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM051B CD4051BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM051B CD4051BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM051B CD4051BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM051B CD4051BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM051B CD4052BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4052BE CD4052BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4052BE CD4052BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4052BF CD4052BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7901502EA CD4052BF3A CD4052BM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BM96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BM96E4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BM96G3 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD4052BMG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BMT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BMTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BMTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052BM CD4052BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052B CD4052BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052B CD4052BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4052B CD4052BPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWRE4 ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWRG3 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 CM052B CD4052BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM052B CD4053BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4053BE CD4053BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4053BE CD4053BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4053BF CD4053BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8101801EA CD4053BF3A Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD4053BF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI CD4053BM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BM96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BM96G3 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BMG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BMT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BMTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BMTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053M CD4053BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053B CD4053BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053B CD4053BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4053B CD4053BPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM053B CD4053BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM053B CD4053BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM053B CD4053BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM053B Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM053B (4/5) CD4053BPWRE4 ACTIVE TSSOP PW 16 CD4053BPWRG3 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 CM053B CD4053BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM053B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4051B, CD4051B-MIL, CD4052B, CD4052B-MIL, CD4053B, CD4053B-MIL : • Catalog: CD4051B, CD4052B, CD4053B • Automotive: CD4051B-Q1, CD4051B-Q1, CD4053B-Q1, CD4053B-Q1 • Military: CD4051B-MIL, CD4052B-MIL, CD4053B-MIL NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Military - QML certified for Military and Defense Applications Addendum-Page 6 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD4051BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4051BM96G3 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 CD4051BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4051BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4051BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4051BPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4052BM96 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 CD4052BM96G3 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 CD4052BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4052BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4052BPWRG3 TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4052BPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD4053BM96 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 CD4053BM96G3 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 CD4053BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4053BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4053BPWRG3 TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 CD4053BPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4051BM96 SOIC D 16 2500 333.2 345.9 28.6 CD4051BM96G3 SOIC D 16 2500 364.0 364.0 27.0 CD4051BM96G4 SOIC D 16 2500 367.0 367.0 38.0 CD4051BM96G4 SOIC D 16 2500 333.2 345.9 28.6 CD4051BPWR TSSOP PW 16 2000 364.0 364.0 27.0 CD4051BPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 CD4052BM96 SOIC D 16 2500 364.0 364.0 27.0 CD4052BM96G3 SOIC D 16 2500 364.0 364.0 27.0 CD4052BM96G4 SOIC D 16 2500 333.2 345.9 28.6 CD4052BPWR TSSOP PW 16 2000 364.0 364.0 27.0 CD4052BPWRG3 TSSOP PW 16 2000 364.0 364.0 27.0 CD4052BPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 CD4053BM96 SOIC D 16 2500 364.0 364.0 27.0 CD4053BM96G3 SOIC D 16 2500 364.0 364.0 27.0 CD4053BM96G4 SOIC D 16 2500 333.2 345.9 28.6 CD4053BPWR TSSOP PW 16 2000 364.0 364.0 27.0 CD4053BPWRG3 TSSOP PW 16 2000 364.0 364.0 27.0 CD4053BPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Cd4051b, Cd4052b, Cd4053b Features

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