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1CD$Installa+on$Manual$ FCC#ID#of#this#product#is#as#follows:# #FCC#ID:#VPYLB1CDIMP003.# For#OEM#integraDon#only#–#device#cannot#be#sold#to#the#general# public.#Therefore#we#will#ask#OEM#to#include#the#following# statements#required#by#FCC#on#the#product#and#in#the# installaDon#manual#noDce.# Contents:# 1.  Land#PaMern#(Recommended)# 2.  Chip#antenna#details# 3.  Layout#Guidelines#–#chip#antenna# 4.  Antenna#circuit#schemaDc#–#chip#antenna# 5.  PIFA#antenna#details# 6.  Layout#Guidelines#–#PIFA#antenna# 7.  Antenna#circuit#schemaDc#–#PIFA#antenna# 8.  4Ylayer#PCB#stackup#details#–#chip#antenna#&#PIFA#antenna# 9.  Test#procedure#for#design#verificaDon# 10. ProducDon#test#procedure#to#ensure#compliance# 11. FCC#&#IC#statements# 1.)Land)PaRern)(Recommended)) 2014/12/08 2.#Chip#antenna#details# The#chip#antenna#is#Antenova#part#number#A5839,#please#refer#to#Antenova's#datasheet#for#detailed#specifica0ons. 3. Layout Guidelines: Chip Antenna This section provides required guidelines for PCB designs incorporating the 1CD module. Figure 1 through Figure 4 show the four-layer 1CD wireless certification board. Refer to Figure 5 through Figure 7 for examples demonstrating good layout practices. Figure 1: Top Layer Figure 2: Ground Plane (Layer 2, Negative Image) Figure 3: Power Plane (Layer 3, Negative Image) Figure 4: Bottom Layer (Top View) Tie together the ground pads surrounding the RF_OUT for ground reference Figure 5: RF_OUT Pad and Surrounding Ground Pads Figure 5 shows the RF_OUT pad on the 1CD footprint. The RF_OUT pad is surrounded by ground pads; these should be tied together to form a ground reference around the end of the RF trace. RF traces must have constant impedance; the RF feed is a microstrip transmission line. RF traces should be shielded by via stitching on both sides RF trace must be kept as short as possible. Figure 6: RF Trace from Module to Antenna Figure 6 shows the entire RF trace, from the 1CD module to the PIFA antenna. The RF trace must be a 50Ω  ±  2Ω  impedance  controlled  transmission  line  which  is  referenced  to  a  solid,  unbroken  ground.  The   trace width and distance to the ground plane must be adjusted to achieve the target impedance. The trace must be shielded by applying stitching vias along the edge of the ground pour on both sides of the RF trace. The Antenna must be placed on the edge of the PCB. There must be no copper on any layer below the antenna section. Figure 7: Antenna and Stitching Vias Stitching vias are required along the edge of the ground plane below the antenna section. Figure 7 shows the chip antenna. The antenna must be placed at the edge of the PCB, with a copper keep-out under the entire antenna on all PCB layers. No other traces or components may be placed in this region. A row of stitching vias is required along the edge of the ground pour below the antenna section. The module, antenna, and RF Trace must all be placed on the top layer of the board. 4.#Antenna#circuit#schema0c#1#chip#antenna#(Antenova#A5839) C14"="Cap,"C0G,"10pF,"+/!0.25pF,"50V,"0402 R8"&"R9"="DNS"(do"not"stuff) 5.#PIFA#antenna#details COANT1 PA NT102 PAANT101 PAR902 PAR901 PAL202 PAL201 PAC1401 PAC1402 COR9 COL2 COC14 PAJ301 COJ3 PAJ304 PAJ303 PAJ302 COU1 COC4COC2COC1 COC9COC7COC5 PAC902 PAC702 PAC502 PAC401 PAC201 PAC101 PAC402 PAC202 PAC102 PAC901 PAC701 PAC501 COC10COC8COC6 PAC1002 PAC802 PAC602 PAC1001 PAC801 PAC601 COC11 PAU1014 PAU1013PAU1012PAU101 PAU1010PAU109PAU108 PAU108 PAU107 PAU106PAU105 PAU104 PAU103PAU102PAU101 PAU1054PAU1053 PAU1052PAU1051PAU1050 PAU1049 PAU1048PAU1047 PAU1046 PAU1045 PAU1070PAU1069 PAU1070 PAU1069PAU1068 PAU1067 PAU1066 PAU1066PAU1065 PAU1065 PAU1015 PAU1016 PAU1017 PAU1018 PAU1019 PAU1020 PAU1021 PAU1071PAU1072PAU1073 PAU1074 PAU1075PAU1076 PAU1071PAU1072PAU1073 PAU1075PAU1076 PAU105 PAU1056 PAU1057PAU1058PAU1059 PAU1060 PAU1061PAU1062 PAU1063 PAU1064 PAU1022 PAU1044 PAU1043 PAU1042 PAU1041 PAU1040 PAU1039 PAU1038 COC3 COR4 PAC1101 PAC1102 COU2 COC12 PAC1201 PAR1002 PAC1202 PAR1001 PAC1901 PAU208 PAU202 PAU207 PAR501 PAU203 COR5 PAR502 PAU204 PAU206 PAC1902 COD1 PAD10AG PAD10KG PAR201 PAR202 PAD10AR PAD10KR PAR401 PAR402 COR10COC19COC18 PAL101 PAL102 PAR601 COR6 PAR602 PAU201 COR3 PAR301 PAR302 COR2 PAU1037 PAU1023 PAU1024PAU1025PAU1026 PAU1027PAU1028PAU1029 PAU1030 PAU1031PAU1032 PAU103 PAU1034PAU1035PAU1036 COL1 COR1 PAR101 PAR102 COQ1 PAQ10E PAQ10C PAC301 PAC302 COU3 PAC1802 PAU304 PAC1801 PAU301 PAU302 PAU303 PAU205 COC17 PAC1702 PAC1602 PAC1601 PAXW2002 PAXW2001 COC16 COXW20 PAC1502 PAC1501 COC15 PAJ20M1 PAJ201 PAJ202PAJ203 PAJ204 PAJ205 PAJ20M2 PAJ20H1 PAQ202 PAQ201 COJ1 PAJ106 PAJ105 PAJ104 PAJ103 PAJ102 PAJ101 PAQ203 COQ2 PAC1701 COW1 PAW101 PAW102 PAJ20M3 PAJ20H2 PAS101 COS2 PAS104 PAS203 PAS202 COJ2 PAJ20M4 COS1 PAS102 PAS103 PAS204 PAS201 6. Layout Guidelines: PIFA Antenna This section provides required guidelines for PCB designs incorporating the 1CD module. Figure 1 through Figure 4 show the four-layer 1CD wireless certification board. Refer to Figure 5 through Figure 7 for examples demonstrating good layout practices. Figure 1: Top Layer Figure 2: Ground Plane (Layer 2, Negative Image) Figure 3: Power Plane (Layer 3, Negative Image) Figure 4: Bottom Layer (Top View) Tie together the ground pads surrounding the RF_OUT to form a ground reference Figure 5: RF_OUT Pad and Surrounding Ground Pads Figure 5 shows the RF_OUT pad on the 1CD footprint. The RF_OUT pad is surrounded by ground pads; these should be tied together to form a ground reference around the end of the RF trace. RF traces must have constant impedance; the RF feed is a microstrip transmission line. RF traces should be shielded by via stitching on both sides RF trace must be kept as short as possible. Figure 6: RF Trace from Module to Antenna Figure 6 shows the entire RF trace, from the 1CD module to the PIFA antenna. The RF trace must be a 50Ω  ±  2Ω  impedance  controlled  transmission  line  which  is  referenced  to  a  solid,  unbroken  ground.  The   trace width and distance to the ground plane must be adjusted to achieve the target impedance. The trace must be shielded by applying stitching vias along the edge of the ground pour on both sides of the RF trace. The Antenna must be placed on the edge of the PCB There must be no copper on any layer below the antenna section. Figure 7: Antenna and Stitching Vias Stitching vias are required along the edge of the ground plane below the antenna section. Figure 7 shows the PIFA antenna. The antenna must be placed at the edge of the PCB, with a copper keep-out under the entire antenna element on all PCB layers. No other traces or components may be placed in this region. A row of stitching vias is required along the edge of the ground pour below the antenna section; this ground pour, including the vias, is part of the antenna. The module, antenna, and RF Trace must all be placed on the top layer of the board. 7.#Antenna#circuit#schema0c#1#PIFA#antenna L2#=#Ind,#2.4nH,#+/.#0.1nH,#300mOhm,#0402#(Recommend#Murata#LQP15MN2N4B02D) C14#=#DNS(do#not#stuff) R9#=#DNS#(do#not#stuff) 8.#41layer#PCB#stackup#details#1#chip#antenna#&#PIFA#antenna =#PCBA#PIFA#antenna#is#printed#on#the#GTL#layer# =#PIFA#finish#is#ENIG#per#IPC=4552#with#typical#thickness#range#of#0.075um#to#0.125um =#GL2#is#the#ground#layer =#GL3is#the#power#layer =#PCB#laminate#material#is#FR4,#which#has#a#rela