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Cm1200hg-66h

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SECURITY CODE Prepared by Checked by Approved by DATE SPEC.NAME Customer’s Std. Spec. MITSUBISHI ELECTRIC R S.Iura H,Yamaguchi E M,Yamamoto V July,4,2003 CORPORATION HIGH VOLTAGE IGBT MODULE TARGET SPECIFICATION 1. Type number 3.3kV / 1.2kA with high isolation package 2. Structure Flat base type (Insulated package, AlSiC base plate) 3. Application & Customer High power converters and inverters 4. Outline 190 × 140 × 48 (L. W. H) 5. Related specifications 6. 6.1 6.2 Maximum ratings Item Collector-emitter voltage Gate-emitter voltage 6.3 Collector current 6.4 Emitter current 6.5 Symbol VCES VGES IC ICM IE (note2) IEM(note2) Conditions VGE=0V, Tj=25ºC VCE=0V, Tj=25ºC TC=25ºC Pulse (note1) TC=25ºC Pulse (note1) Ratings 3300 ±20 1200 2400 1200 2400 Unit V V A A A A Maximum collector dissipation PC (note3) TC=25ºC, IGBT part 12500 W 6.6 Isolation voltage Viso 10200 V 6.7 6.8 6.9 Junction temperature Storage temperature Operating temperature Tj Tstg Top −40 ~ +150 −40 ~ +125 −40 ~ +125 ºC ºC ºC Charged part to base plate, rms sinusoidal, AC60Hz 1min. ― ― ― 6.10 Turn-off switching safe operating area (RBSOA/SWSOA) Test conditions: VCC=2200V,IC=2400A, Tj=125ºC,VGE1=−VGE2=15V, RG=1.6Ω Half bridge switching operation [See Fig.1(b)] 6.11 Short-circuit safe operating area (SCSOA) Test conditions: VCC=2200V, Tj=125ºC, VGE1=−VGE2=15V, RG(on)=1.6Ω, RG(off)=10Ω [See Fig.1(c)] (note4) Pulse width: tW=10µs 6.12 Reverse recovery safe operating area (RRSOA) Test conditions: VCC=2200V, IC=1600A, die/dt=−3600A/µs, Tj=125ºC, LS=100nH(=LS2) Half bridge switching operation [See Fig.1(b)] Note 1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Tjmax rating (125°C) Note 2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi). Note 3. Junction temperature (Tj) should not exceed Tjmax rating (150°C). Note 4. RG(off) can be reduced to 1.6Ω by suppressing VCE less than VCES (3300V) with soft switching that means −di/dt(off) decreasing control. HIGH VOLTAGE IGBT MODULE SPECIFICATION HCM−1265 (P2-OU) PAGE 1/5 7. Electrical characteristics Item Symbol 7.1 Collector cutoff current ICES 7.2 7.3 7.4 VGE(th) IGES 7.5 7.6 7.7 Gate-emitter threshold voltage Gate leakage current Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance 7.8 Total gate charge QG 7.9 7.10 7.11 7.12 7.13 Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Emitter-collector voltage (FWDi forward voltage) td(on) tr td(off) tf VEC VCE(sat) Cies Coes Cres trr (note3) 7.15 Reverse recovery charge Qrr 7.16 7.17 7.18 7.19 7.20 7.21 7.22 7.23 Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Reverse recovery time Reverse recovery charge Turn-on switching energy Turn-off switching energy 7.24 Reverse recovery energy (FWDi switching energy) (note3) td(on) tr td(off) tf trr (note3) Qrr(note3) Eon Eoff Erec (note3) Limits Min. Typ. Max. VCE=VCES Tj=25ºC VGE=0V Tj=125ºC IC=120mA,VCE=10V,Tj=25ºC VGE=VGES, VCE=0V,Tj=25ºC IC=1200A Tj=25ºC VGE=15V (note5) Tj=125ºC f=100kHz VCE=10V VGE=0V f=100kHz Tj=25ºC f=1MHz VCC=1650V,IC=1200A,Tj=25ºC VGE=15V ― ― 4.5 ― ― ― ― ― ― ― 24 6.0 ― 3.30 3.60 180 18.0 5.4 15 60 7.5 0.5 4.29 ― ― ― ― ― 8.6 ― Resistive load switching operation [See Fig.1(a),Fig.2] VCC=1650V,IC=1200A,Tj=25ºC VGE1=−VGE2=15V,RG=1.6Ω Tj=25ºC Tj=125ºC Tj=25ºC ― ― ― ― ― ― ― ― ― ― ― 2.80 2.70 ― 1.60 2.00 2.50 1.00 3.64 ― 1.40 Tj=125ºC ― ― 1.40 Tj=25ºC ― 400 ― Tj=125ºC ― ― ― ― ― ― ― ― ― 800 ― ― ― ― ― 800 1.60 1.55 ― 1.60 1.00 2.50 1.00 1.40 ― ― ― ― 0.90 ― IE=1200A VGE=0V (note5) VCC=1650V IE=1200A die/dt=−2400A/µs, VGE3=−15V [See Fig.3] (note3) 7.14 Reverse recovery time Conditions Half bridge switching operation [See Fig.1(b),Fig.2,Fig.3] VCC=1650V,Tj=125ºC IGBT(N): IGBT operation IC=1200A,VGE1=−VGE2=15V, RG=1.6Ω IGBT(P): FWDi operation IE=1200A,VGE3=−15V, RG=1.6Ω Unit Note 5. Pulse width and repetition rate should be such as to cause negligible temperature rise. HIGH VOLTAGE IGBT MODULE SPECIFICATION HCM−1265 (P2-OU) PAGE 2/5 mA V µA V nF µC µs V µs µC µs µC J/P 8. Thermal characteristics Item Symbol Conditions Junction to case, IGBT part Junction to case, FWDi part Case to fin, conductive grease applied (note6) 8.1 8.2 Thermal resistance Thermal resistance Rth(j-c)Q Rth(j-c)R 8.3 Contact thermal resistance Rth(c-f) Limits Min. Typ. Max. ― ― ― ― 0.010 0.020 ― 0.006 ― Unit K/W Note 6. Typical value is measured by using Shin-etsu Silicone “G-747” with a thickness of 100µm. 9. Mechanical characteristics Item 9.1 9.2 9.3 9.4 Mounting torque Mounting torque Mounting torque Mass Symbol Conditions ― ― ― ― Main terminal screw : M8 Mounting screw : M6 Auxiliary terminal screw : M4 ― Limits Min. Typ. Max. 6.67 2.84 0.88 ― 7.45 3.14 0.98 1.5 13.0 6.00 2.00 ― Unit N·m 10. Shipping inspection report item (note7) ICES[7.1], VGE(th)[7.2], IGES[7.3], VCE(sat)[7.4 @Tj=25ºC], VEC[7.13 @Tj=25ºC], td(on)[7.16], tr[7.17] , ton[Fig.2], td(off)[7.18], tf[7.19], toff[Fig.2], ICP[6.11] (note8) Note 7. One shipping inspection report with the above item values is submitted when modules are delivered. The conditions are defined in bracket. Note 8. ICP shows the maximum collector current value in short-circuit test. HIGH VOLTAGE IGBT MODULE SPECIFICATION HCM−1265 (P2-OU) PAGE 3/5 kg LS1 IGBT(P) RG Rload VGE3 + CS + C VCC IGBT(N) VGE1 Lload L S2 RG RG VGE1 C IGBT(N) CS VGE2 VGE2 C=2[mF],CS=20[µF] C=2[mF],CS=20[µF],LS1=500[nH],LS2=100[nH] (a) Resistive load switching test circuit (b) Half bridge switching test & turn-off switching safe operating area (RBSOA/SWSOA) & reverse recovery safe operating area (RRSOA) test circuit LS + CS VGE1 RG C VCC IGBT(N) VGE2 C=2[mF],CS=40[µF],LS=80[nH] (c) Short-circuit safe operating area (SCSOA) test circuit Fig.1 HIGH VOLTAGE IGBT MODULE SPECIFICATION Switching test circuit HCM−1265 (P2-OU) PAGE 4/5 VCC vCE IC vCE 90% 90% di VCC di/dt 50% 10% 10% 10% 10% dt VGE1 90% 0 VGE2 td(on) tf td(off) tr t1 ton=td(on)+tr Eon = t4 t3 t2 toff=td(off)+tf ∫ t2 ic•vce dt Eoff = t1 Fig.2 tf=(0.9iC-0.1iC)/(di/dt) ∫ t4 ic•vce dt t3 Definitions of switching time & energy of IGBT part die/dt vEC VCC IE 50% die trr 10% 0% 0 Qrr = ― t 10% Irr dt 0 Fig.3 HIGH VOLTAGE IGBT MODULE SPECIFICATION Erec= ― 0.5Irr t5 ∫ t6 ∫ t6 0 ie dt ie•vec dt t5 t6 Definitions of switching time, charge & energy of FWDi part HCM−1265 (P2-OU) PAGE 5/5