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CMOS Image Sensors Compact
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Fraunhofer IMS at Vision 2016!
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Fast line-scan sensor for high-speed applications
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Digital 17 µm QVGA-IRFPA for thermal imaging applications
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Ultrasensitive sensors ensure optimum sight conditions
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FRAUNHOfER IMS AT VISION 2016! We cordially invite you to visit us at the VISION 2016 in Stuttgart from 8th to 10th November, 2016! You will find us at booth 1D73 where we exhibit our newest developments and demonstrators: In this year we present: • SPAD-ToF camera with high dynamic range and low dark count rate for 3D imaging applications • UTOFIA, an underwater imaging system based on the rangegating method with high scattered light rejection and high spatial resolution • Spectrometer evaluation kit with a CMOS linear sensor with non-destructive readout and multiple accumulation for timeresolved spectroscopy • IR sensors and cameras based on uncooled bolometers with high sensitivity and temperature resolution Visit our experts at the booth to get more information about our services.
We are looking forward to meeting you in stuttgart!
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Fast line-scan camera for high-speed applications A new high-speed sensor for line-scan camera applications with unmatched line rates up to 200 kHz (true RGB) and 600 kHz (b/w) developed by Fraunhofer IMS in cooperation with the Austrian Institute of Technology (AIT). At this speed the line sensor provides full color images with a spatial resolution of 50 µm at a transport speed of 10 m/s. With almost 100 % fill-factor the tri-linear chip guarantees high image quality with no aliasing. The CMOS sensor incorporates a total of 2048 pixel columns by 60 horizontal lines. Massive parallel signal processing reduces the bandwidth requirements of the associated on-chip signal processing electronics, thus yielding best noise performance at a data rate of 1.5 GB/sec. The color linescan sensor achieves 10 bit resolution with 32 electrons read noise. The sensitivity of the sensor yields 0.052 DN/electron @10 bit, which allows for using standard illumination and optics. The sensor can be employed as a monochrome chip, a bi-linear version (using 2 lines of different color) or even as a multi- / hyperspectral sensor utilizing a maximum of 60 lines for wavelength separation. Back end color filter deposition ensures flexible camera development based on the same sensor type. For this sensor a new line-scan camera “exposure LeMans” has been developed by AIT. It exhibits 2 galvanically isolated high speed trigger inputs and outputs, respectively. Configuration and data output connection is implemented via a QSFP 4x10 Gbit/s Ethernet interface. Based on a Dual-core ARM Cortex – A9 MPCoreTM processor and an additional FPGA, the camera system enables application specific real time image data processing. The camera is available with a monochrome or RGB color sensor. The camera dimensions are 80 mm x 80 mm x 80 mm without lens and adapter.
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Digital 17 µm qvga-irfpa for thermal imaging applications Fraunhofer IMS has developed a digital 320 x 240 (QVGA) IRFPA based on uncooled microbolometers with a pixel-pitch of 17 µm for thermal imaging applications in the LWIR (8 µm .. 14 µm) range. The IRFPA consists of an array of microbolometer as the IR sensor element, a CMOS readout circuitry for converting the thermal signal into a digital signal, and a chip-scale package for maintaining the vacuum. The IRFPAs are completely fabricated at Fraunhofer IMS on 8” CMOS wafers with an additional surface micromachining process. The digital 17 µm QVGA-IRFPAs achieve a high thermal sensitivity of NETD < 80 mK operating at full frame frequency of 30 Hz. The IRFPA provides a 16 bit video signal. A chip scale packages is used as an innovative vacuum package resulting in the smallest possible size of a vacuum package. By using a chip-on-board technology the chip scale package is fixed on a PCB as a detector board. This detector board provides all necessary electrical and mechanical interfaces for a thermal imaging camera.
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ultrasensitive sensors ensure optimum sight conditions Automotive industry research is strongly focused on technology that enables automated driving. A new sensor system developed by Fraunhofer researchers should help increase passenger safety. News of the first serious accident involving an automated electric vehicle made one of the headlines this summer. The vehicle in question collided with a truck while in autopilot mode. According to the manufacturer, the front cameras could not perceive the oncoming semitrailer properly. Additionally, an incorrect radar measurement prevented the activation of the emergency brakes. “A camera’s accuracy depends very much on the lighting available. In this case, it failed. The radar system recognized the obstacle, but couldn’t locate it precisely and mistook the truck for a road sign,” says Werner Brockherde, head of the CMOS Image Sensors business unit at the Fraunhofer Institute for Microelectronic Circuits and Systems IMS in Duisburg. Instead, the researcher and his team are counting on light detection and ranging (LiDAR) technology, which they have refined for this purpose. In combination with other components, this technology fulfills the requirements for independent steering, braking and acceleration. “LiDAR could have probably prevented the crash,” Brockherde surmises. The system could complement currently used camera and radar technology in automated driving to obtain a complete view of the driving environment and thus better perceive traffic obstacles. A LiDAR system works by emitting pulsed laser beams, which reflect on the surface of objects, and capturing any signals that are reflected back with the help of time-of-flight cameras. It can then use the time it took for the light to travel to and from the objects to calculate the distance, position and relative speed of surrounding vehicles, cyclists, pedestrians or construction sites. This data makes it possible to avoid collisions. In a flash, the scene is set Conventional LiDAR devices aim a single laser beam at a rotating mirror to capture the surroundings through 360 degrees. Google uses this technology for its driverless cars, for example. However, these mirror-based systems are rather bulky and prone to mechanical error, leading many car manufacturers to forgo installing the LiDAR system in their vehicles. For this reason, Brockherde and his team at Fraunhofer IMS use ultrasensitive sensors that can capture the car’s entire surroundings with just one laser flash and no need for mirrors. The researchers have dubbed the new generation of sensors “Flash LiDAR.” They are composed of photodiodes developed at Fraunhofer IMS known as single photon avalanche diodes (SPAD). “Unlike standard LiDAR, which illuminates just one point, our system generates a rectangular measuring field,” Brockherde explains. SPADs are a hundred times more sensitive than the photodiodes integrated into smart-phones. Their advantage over the original LiDAR system is that both the sensor and the electronic evaluation unit can be integrated on a single chip, meaning that the new devices will be considerably smaller and sleeker. As a result, car manufacturers can easily fit them behind the windshield or a headlamp. The IMS researchers’ ultimate goal is for Flash LiDAR to be able to sense road obstacles from a distance of up to 100 meters. “The first systems with our sensors will go into production in 2018,” Brockherde says. The sensitive sensors are also of interest for other application fields such as medicine, analytics and microscopy, as they also function in low light intensity.
IMPRINT Responsible editor: Werner Brockherde
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