Transcript
In accordance with today's market demands and with the technology advancement, various new materials have been developed. We, Mitsui Mining Materials Co., Ltd. (Mitsui-MMC), are committed to assist our customers in finding best solutions, carefully selecting our fine-ceramics-based ”Advanced, Enabling, Materials”from among these materials. Expanding possibility of Fine Ceramics In the Fine Ceramics category as main products, Mitsui-MMC has a wide array of products ranging from oxide to non-oxide, such as various machinable ceramics including Macerite and engineering ceramics including Alumina / Silicon Nitride. Mitsui-MMC also meets customer’s requirements, taking advantage of our state-ofthe-art machining technology and surface treatment technology for these materials. Furthermore, Mitsui-MMC develops and produces application products such as Thermal insulator for semiconductor / LCD manufacturing equipment and Jacket heater (utilizing continuous ceramics fiber) and chucking plates for wafers / films / glasses (utilizing porous ceramics).
Macerite series Boron Nitride Shapal M Soft Almatite
High-purity Alumina Zirconia Silicon Nitride Aluminum Nitride Silicon Carbide L-TEX
Properties comparison table of various ceramics and others
Thermal insulator for semiconductor diffusion furnaces and LP-CVD equipment.
Flexible ceramics sheet
Heating the piping of semiconductor / LCD manufacturing equipment such as CVD and etcher.
Chucking stages for wafers / films / glasses, utilizing porous ceramics.
Plating Deposition Sputtering Thin film coating Resin coating
Molybdenum-manganese technology Active Metal technology Glass frit-bonding
Reflector Ultra-fine machining Materials for substrates Size tolerance Unit conversion
Fine Ceramics Products Machinable Ceramics Macerite series Macerite-S
Standard product in Macerite series Max. usable temperature: 1200℃
Macerite-NT
Material with excellent Thermal shock strength and low Thermal expansion. Excellent Light reflectance with high degree of whiteness.
Macerite-SP Inexpensive and general grade materials in the Macerite series. Suitable for large parts.
Macerite-HSP
Macerite-SP with HIP processed. Optimum material for ultra-fine machining because of its poreless property.
Macerite-PG4
Material for ultra-fine machining with high Mechanical strength and low Thermal expansion.
Machinable Ceramics (others) BN HC / BN N-1
In inert atmosphere, this has outstanding Thermal resistance, excellent Thermal shock strength and excellent Electrical insulation properties at high temperature. Inactive against molten metal and molten glass. Composite material of BN and Silicon Nitride. Better Strength and Wear resistance than those of BN.
SHAPAL M SOFT
Composite material of Aluminum Nitride and BN. High Thermal conductivity and high Strength.
ALMATITE
Very low Thermal expansion and excellent Thermal shock strength. Inactive against molten metal.
MACHINAX
Porous and inexpensive machinable ceramics. Porosity: 32%
Engineering Ceramics Oxide Alumina (MA995)
Well balanced in Mechanical strength, Electrical insulation and Wear resistance, this is the highpurity general grade alumina. Applicable to large parts.
Alumina (MA920)
High Mechanical strength and excellent ware resistance. Inexpensive and optimum for mill and ware resistance parts.
Zirconia (MZR)
Highest Mechanical strength and Tenacity among Ceramics. Excellent ware resistance.
L-TEX (Low Thermal expansion)
Low Thermal expansion and low Thermal conductivity. Having excellent Thermal shock strength, this is applicable to large parts.
High Strength Mullite (M-KML)
Excellent Mechanical strength at high temperature. Low Thermal conductivity and low Thermal expansion. Excellent Thermal shock strength.
Nonoxide Aluminum Nitride (MAN-170)
Excellent thermal conductivity and thermal shock strength. Widely used in various field as uniform heating parts and radiator parts.
Aluminum Nitride (MAN-90)
Aluminum Nitride without sintering additive. Semiconductor grade with excellent resistance to F plasma.
Silicon Nitride (MSN)
Excellent Mechanical strength at high temperature and excellent thermal shock strength. Excellent ware resistance. Highly reliable structural material.
Silicon Carbide (MSC)
Outstanding Hardness and excellent ware resistance. No Mechanical strength deterioration at high temperature.
Properties Table Machinable Ceramics
MACERITE-S MACERITE-NT MACERITE-SP MACERITE-HSP ALMATITE MACHINAX
Name Composition
General Color Properties Bulk Density (g/cm3) Water Adsorption Ratio (%) Mechanical Bending Strength (MPa) Properties Compressive Strength (MPa) Young's Modulus (GPa) Poisson's Ratio Hardness (GPa) Electrical Volume Resistivity［RT］(Ω・cm) Properties ［500℃］(Ω・cm) Dielectric Constant［1MHz］ Dielectric Tangent［1MHz］ Dielectric Strength (kV/mm) Thermal Max. Useable Temperature (℃) Properties Thermal Expansion［RT- 200℃］(/℃) ［RT- 400℃］(/℃) ［RT- 600℃］(/℃) ［RT- 800℃］(/℃) Thermal Conductivity［RT］(W/ m・k) ［400℃］(W/m・k) ［800℃］(W/m・k) Specific Heat［RT］(k J / kg・k) ［400℃］(k J / kg・k) ［800℃］(k J / kg・k) Thermal Shock Strength (℃) 2 Vacuum Degassing［RT］(Tor r ・I/s・cm ) Properties ［600℃］(Tor r ・I/s・cm2) Helium permeability［RT］(Torr・I/s・cm2) Remarks
General Color Properties Bulk Density (g/cm3) Water Adsorption Ratio (%) Mechanical Bending Strength (MPa) Properties Compressive Strength (MPa) Young's Modulus (GPa) Poisson's Ratio Hardness (GPa) Electrical Volume Resistivity［RT］(Ω・cm) Properties ［500℃］(Ω・cm) Dielectric Constant［1MHz］ Dielectric Tangent［1MHz］ Dielectric Strength (kV/mm) Thermal Max. Useable Temperature (℃) Properties Thermal Expansion［RT- 200℃］(/℃) ［RT- 400℃］(/℃) ［RT- 600℃］(/℃) ［RT- 800℃］(/℃) Thermal Conductivity［RT］(W/m・k) ［400℃］(W/m・k) ［800℃］(W/m・k) Specific Heat［RT］(kJ/kg・k) ［400℃］(kJ/kg・k) ［800℃］(kJ/kg・k) Thermal Shock Strength (℃)
Beige
CaSiO3 White
Hexagonal BN White
porous
＜6×10−8 ＜1×10−7 2∼10×10−9 ＜2×10−12 ＜2×10−12
＜8×10−8 ＜2×10−12
ALUMINA
Name
Remarks
Al2TiO3 Dark Gray
＜2×10−12
average pore BN: 95% diameter: 2μm, Denki Kagaku Kogyo K.K. porosity: 32%
oxidative atmosphere / no visual change in appearance, zero-weighted (3mmx3mmx40mm, span 30mm) non-oxidative atmosphere
Engineering Ceramics Composition
Fluorphlogopite (KMg3Al Si3 O10F2) White White Beige Ocher
BN HC
Beige
White
ZIRCONIA
White
White
Gray
L-TEX
High Strength Aluminum Mullite Nitride
Light Gray Light Gray
Gray
mechanical no sintering additive strength: excellent resistance 320Mpa at 1,300℃ to F plasma
BN N-1
SBN
SHAPAL M SOFT
Hexagonal BN White Light Gray
ALN-BN Light Gray
Engineering Plastics
Polyimide Polyamide-imide Polyacetal
Name General Color Properties Specific Gravity Water Adsorption Ratio (%) Mechanical Bending Strength (MPa) Properties Compressive Strength (MPa) Flexural Modulus Tensile Strength Rockwell Hardness Electrical Volume Resistivity Properties
Polyphenylene Polyether ether Polytetrafluoro sulfide ethylene ketone
107
(10% deformation)
Dielectric Constant［1MHz］ Dielectric Tangent［1MHz］ Dielectric Strength (kV/mm) Thermal Deflection Temperature under load Properties Linear coefficient of Expansion Flammability Melting point Thermal Conductivity (W/m・k)
Specific Heat (kJ/kg・k)
BN: 99% or more BN-Si3N4 Denki Kagaku Denki Kagaku Kogyo K.K. Kogyo K.K.
Aluminum Nitride
Gray
general grade
Gray
Tokuyama Corp.
Silicon Nitride
Silicon Carbide
Gray
Black
high production production thermal outsourcing outsourcing conductivity
Remarks
Reference Data Name
Vespel DuPont
TI polymer TORAY
Cemented carbide
General Color Properties Bulk Density (g/cm3) Water Adsorption Ratio (%) Mechanical Bending Strength (MPa) Properties Compressive Strength (MPa) Young's Modulus (GPa) Poisson's Ratio Hardness (GPa) Electrical Volume Resistivity［RT］(Ω・cm) Properties ［500℃］(Ω・cm) Dielectric Constant［1MHz］ Dielectric Tangent［1MHz］ Dielectric Strength (kV/mm) Thermal Max. Useable Temperature (℃) Properties Thermal Expansion［RT- 200℃］(/℃) ［RT- 400℃］(/℃) ［RT- 600℃］(/℃) ［RT- 800℃］(/℃) Thermal Conductivity［RT］(W/m・k) ［400℃］(W/m・k) ［800℃］(W/m・k) Specific Heat［RT］(kJ/kg・k) ［400℃］(kJ/kg・k) ［800℃］(kJ/kg・k) Thermal Shock Strength (℃)
Duracon Polyplastics Co., Ltd
Carbon steel
SUS
Fortron Polyplastics Co., Ltd
Nippon Polypenco Ltd.
Aluminum
Si
Pure Monocrystalline aluminum silicon
Teflon DuPont
Silica
Manufacturing Process of Fine Ceramics High and stable quality is ensured by integrated production from raw material to finished product
Sintering
electric furnace
Sintering process with the combination of various sized electric furnace/gas furnace and original sintering technology. CNC grinding machine
gas furnace
Machining of Greenbody Dry machining to make the product form as close to the final form as possible prior to sintering.
machining center
Granulation
spray dryer
ball mill
Even granules with high purity are produced with large Spray dryer.
Raw Materials Composition of raw materials in Macerite series production
contactless 3D measuring equipment
3D measuring equipment
Inspection Well-established quality control with high precision testing equipment.
machining center
Final Machining High precision machining of low cost and short lead time is realized with the machining technology and production engineering based on original know-how.
1000t press
flat-surface grinding machine W-CIP
D-CIP
Molding V-shaped mixer
Molding for various forms is possible with various molding machines including large SIP and pressing machine.
Milling & Mixing Optimum mixing with original binding system in accordance with various uses.
Application Products of Ceramics Fiber Thermal Insulating Ring
This Thermal Insulating Ring is a patented product made of continuous Alumina fiber without boron oxide.
High temperature thermal insulating materials for semiconductor manufacturing equipment, diffusion furnace, etc.
Thermal Insulating Ring has been developed as high temperature thermal insulating materials for diffusion furnace, CVD, etc. used in semiconductor manufacturing processes. The ring can be produced in accordance with shapes of quartz tube/silicon carbide tube in furnaces. Compared with thermal insulating materials made of Silica wool, this Ring has higher thermal resistance / better sealing capability and is more unreactive to quartz tube. Because of Alumina fiber used, the Ring has longer life, less frequency for ring replacement and less waste, compared with conventional one. In accordance with demand for grade with low impurities, we have developed products made of outer materials/inner filler/sewing thread with low impurities. Conventional general grade is also available depending on customer’s request. The ring has thermal resistance of 1,200℃. It has a longer life compared with conventional one made of Silica fiber. In order to decrease particles, we are offering reed-shaped filler for the portion where Silica wool has been filled in. All products are baked prior to shipment to avoid possible smoking after installation.
Materials composition p of Thermal Insulating Ring
Ceramics fiber properties
low impurities type outer materials
Almax B cloth 3025-T Almax B cloth 4018-D (thick)
inner filler
Ceramics fiber blanket Ceramics fiber board Ceramics fiber board (hardened type)
Ceramics fiber blanket Ceramics fiber board Ceramics fiber board (hardened type)
sewing thread
Almax B HG-T-5760D
Almax B T-5760D
binding string
Almax B sleeve HG-SV-4
Almax B sleeve SV-4
temperature range (℃)
Almax B (low impurities)
Almax B
α-Alumina
α-Alumina
Al2O3 : 70% SiO2 : 30%
Al 2 O 3 : 70% SiO 2 : 30%
crystal phase
chemical composition fiber diameter (μm) m) bulk density (g/cm ) 3
thermal resistance (℃) features form
Soft Ceramics
general type
Almax B cloth HG-3025-T Almax B cloth HG-4018-D (thick)
7
7
2.9
2.9
1200
1200
low impurities
high strength/good machinability
・yarn ・cloth ・sleeve ・tape ・felt (Almax B)
Thin and flexible Ceramics sheet
Thin and flexible Ceramics sheet made of Alumina fiber fabric treated with special process. Excellent thermal resistance (1,250℃) and oxidation resistance. Having high spalling resistance and thermal shock strength, the Soft Ceramics are capable of maintaining the original shape and strength even after rapid quench. Composite materials of Alumina fiber. This sheet is available in any size/thickness in accordance with customer’s request.
∼1200
Jacket Heater
Heater for exhaust pipe of semiconductor/LCD manufacturing equipment i
With the growth of wafer size, equipment size and pipe size are getting bigger and there is a need to increase the heating temperature of heater over 200℃. Our Jacket Heater is capable of heating large-sized pipe/equipment efficiently and has excellent thermal resistance and safety.
Features Heater wire being double insulation type with ceramics felt and ceramics fiber braid, the heater has excellent safety and long life. Outer covering being made of fluorine resin sheet, dust particles can not be generated easily. Minimum wiring pitch of heater wire is 5mm, which is vital for excellent property of uniform temperature. Compared with rubber heater, the Jacket Heater is energy-saving type with less heat dissipation. Baked prior to shipment, the Heater emits almost no gas after installation.
Structure of heater wire in our Jacket Heater
Uses
diameter of Nichrome wire : 0.2mm〜 minimum wiring pitch : 5mm
・Inline/exhaust/auxiliaryy p pipes p (TEOS, ( , Dichlorosilane,, BC13,, Nitride)) ・Heat retention of CVD equipment body ・Plasma etching equipment, etc.
Nichrome wire
conventional heater wire
glass/silica yarn braid
Structure
g glass yyarn braid ili i h + silicon varnish
ceramic felt
Our heater wire has highly reliable double insulation structure.
Nichrome wire
In the case of conventional heater wire, insulation layer becomes hardened with heat and is broken down with bending. Consequently short circuit trouble due to overheat and electric contact could occur easily. While on the other hand, as being covered and insulated with ceramic felt and glass/silica yarn braid, our heater wire has excellent strength and causes much less trouble. The wires are sewed with high precision NC machine. (Fig. 1). Minimum wiring pitch of heater wire is 5mm, which realizes excellent property of uniform heating. (Fig. 2). We are ready to propose the optimum materials structure based on customers request. In particular, we have a wide array of materials for outer covering ranging from inexpensive silicon-coated glass cloth to Gore-Tex with much less dusting. We have two options for temperature control, thermostat (Fig. 3) or PID (Fig. 4).
Advantages over rubber heater Power dissipation: approx. 24% less than that of rubber heater (set temperature: 200℃, similar configuration). Jacket heater has longer lifetime and is less expensive. Dissipating less heat, Jacket heater puts fewer burdens on air-conditioning apparatus.
An example of Jacket heater materials configuration We are ready to design and manufacture the Jacket Heater in accordance with customer’s needs. Applicable to complicated piping and thin piping
Comparison of power dissipation Jacket heater rubber heater
power dissipation outer covering temperature (℃) 0.85KWH 1.12KWH
74.9 99.3
parts name materials remarks Teflon-coated glass cloth thermal resistance 260℃ outer covering silica-mat thermal resistance 700℃ thermal insulator heater wire with double insulation thermal resistance 800℃ heater wire baked glass cloth thermal resistance 700℃ inner thermal insulator e-PTFE thermal resistance 260℃ sewing thread for outer covering glass fiber thermal resistance 500℃ sewing thread for heater wire Teflon UL No.1331 AWG-18 thermal resistance wire Teflon L-RZ5-TF resistance thermometer bulb (PT) nylon SMP-03V connector phenol off at 150℃, automatic reset thermostat
Technology for Ceramics Application Chucking Plate
Making the most of property of porous ceramics, the chucking plate is capable of fixing whole substrates such as wafer, film, etc. evenly and firmly.
Application examples ・Fixing thin semiconductor devices and 3D memory substrates ・Fixing thin films, etc. ・Chucking stage for philip-chip bonder ・Fixing/carrying glass substrate for FPD
Structure ・Chucking portion : porous ceramics 〈av. pore diameter : 60μm, porosity : 33% (representative value)〉 ・Outer frame : ① metal (various SUS materials, various aluminum materials, etc.) ② ceramics (Alumina, Macerite, etc.)
chucking plate with metal frame
Specifications ・Flatness : 5μm ・Usable temperature : ① metal frame ⇒ RT ② ceramics frame ⇒ up to 700℃ ・Materials/size/shape: Please tell us your requests. ・Pore diameter and porosity of the porous ceramics is selectable. ・As flatness varies with size and operating temperature, please contact us for details.
Table of Pore diameter ＆ Porosity
chucking plate with ceramics frame
product name
av. pore diameter (μm)
porosity (%)
580
230
130
100
60
40
28
29
30
31
33
35
Standard products Round plates (6 types) and square plates (2 types) are available as standard products. Sample for rent is also available. Please contact us.
Standard products table shape
size
chucking portion
remarks for 3- inch wafer for 4- inch wafer
round plate
for 5- inch wafer for 6- inch wafer for 8- inch wafer for 12- inch wafer
square plate
Chucking plate with heater unit This chucking plate is capable of keeping uniform chucking capability at high temperature. ・Chucking portion : porous ceramics. ・Outer frame : ceramics (Alumina, Aluminum nitride, etc.) ・Usable temperature : up to 400℃
Chucking plate with heater unit
Surface Treatment Plating Metallic thin film is made on ceramics by wet plating process. A wide range of requirements from fine patterning to partial plating over threedimensional parts is fulfilled through broad technology from image processing to etching. ・Metals for plating: Cu, Ni, Au, Pb, Sn, PbSn, Cr. Ag, etc. ・Suitable ceramics: Macerite series, Alumina, Zirconia, Aluminum nitride, etc.
Vacuum deposition and Sputtering Various thin films are made on ceramics surfaces by vacuum deposition and sputtering. Fine patterning is also possible with masking/etching technology. ・Metals for deposition and sputtering: Au, Ag, Al, Ni, Ti, Cu, Cr, etc. ・Suitable ceramics: Macerite series, Alumina, Zirconia, Aluminum nitride, etc.
plated ceramics
We are ready to make a trial for other materials. Please contact us.
Thin film coating For the purpose of having high strength, wear resistance, electrostatic-proof, etc., thin film can be coated with PVD process. ・Materials for coating: TiN, TiAIN, DLC, SiC, etc. ・Suitable materials: various ceramics, metal, resin. ・Uses: wear resistance parts, sliding parts, semiconductor wafer carrier.
Resin coating Various resin coating on the surface of ceramics to have better lubrication, low wettability, and low surface electric resistance (electrostatic-proof). ・Resin for coating: Teflon, PEEK, etc. ・Uses: Si-wafer carrier, plastic film thermo-compression parts, etc.
resin-coated / PVD-coated ceramics
Bonding technology Brazing for ultra-vacuum environment Brazing of molybdenum-manganese process to bond ceramics-metal used under ultra-vacuum environment. ・Ceramics : Alumina99.7%, Alumina96%, etc. ・Metal : Kovar, etc. ・Uses : vacuum equipment, various electron tube, etc.
Brazing by active metal Brazing by active braze alloy (Ag-Ti, etc.) for ceramics-ceramics and ceramics-metal. ・Ceramics : Alumina99.7%, Zirconia, Silicon nitride ・Metal : Kovar, Iron-Nickel alloy
Glass frit-bonding
bonded products of ceramics and various materials
This is applicable to ceramics with complex form and is suitable for products that require thermal resistance.
Technical Information Macerite application technology Reflector Materials : Macerite-S, Macerite-NT Having excellent light reflectance with high degree of whiteness, the Macerite has been widely used as reflectors in various field including YAG Laser oscillator. For materials selection, detailed reflectance data, etc., please contact us
wave length Macerite-S Macerite-NT
Ultra-fine hole drilling ・Materials : Macerite-HSP, Macerite-PG4 ・Min. hole diameter : 20μm ・Machining tolerance: diameter±5μm, positioning±7μm Drilling of holes with high precision diameter/positioning for machinable ceramics is realized with special carbide drill.
ultra-fine holes (Macerite-PG4)
These key parts contribute to the cutting-edge high integration technology in semiconductor/LCD manufacturing equipment and testing equipment. cross section of ultra-fine holes (Macerite-PG4)
Ultra-fine slit machining ・Materials : Macerite-HSP, etc. ・Min. slit width : 24μm ・Machining tolerance: width±2μm, width pitch ±2μm Our high precision slit machining technology has been highly evaluated in cutting-edge medical field including CT scanner.
35μm slit (Macerite-HSP)
Substrate materials for electronic components ・Materials: Macerite-HSP, etc. These are new substrate materials realizing machinability and high strength and are used as substrates for electronic components in various field. We are capable of pattern designing and various metalization.
Structural materials for fuel cell ・Materials: Macerite-S. Having thermal resistance of 1200℃, this can maintain stable properties at high temperature. Although this has similar thermal expansion coefficient as Zirconia, we are prepared to assist to develop materials that matches other construction materials. This draws attention as new materials to expand the possibilities of coming new energy field.
thermal expansion coefficient (X10-6/℃)
Macerite-PG4/HSP
Thermal expansion coefficient of Macerite-S
temperature (℃)
Reference data Screw machining Various screws in the table below are available on request at low price in short lead time. Small quantity also is available. Please inform us of requested size, shape, quantity, etc.
shape
min. male screw
Macerite series
engineering ceramics
min. female screw min. Helisert
Dimensional tolerance JIS B 0405 (excerpt) size 0.5≦∼≦3
(unit mm) low-grade
medium-grade
high-grade
3＜∼≦6
6＜∼≦30
30＜∼≦120
120＜∼≦400
400＜∼≦1000
1000＜∼≦2000 ・Dimensional tolerance immediately after sintering is roughly ±1%. However, it may vary to some extent depending on shape/size. Please contact us for details. ・Although high precision machining is available, it is relatively expensive. It would be recommendable to order, when possible, the medium-grade or no machining after sintering , if dimensional tolerance is not so strict.
Surface roughness (unit μm)
JIS B 0601 (excerpt) finish mark
machining process (reference) lapping grinding as fired none
Unit conversion table
ĂThe data in this catalog are representative values for reference only and are not guaranteed values. ĂThe data in this catalog are subject to change without notice. ĂThe uses / applications of the products in this catalog are some typical examples for reference only. The description dose not mean any license or guarantee for exclusive use of the industrial property right, etc.
http://www.ariake-materials.co.jp New Materials Division / 3-3-3 Toyosu, Koto-ku, Tokyo, Japan 135-6006 Tokyo Business Office / 3-3-3 Toyosu, Koto-ku, Tokyo, Japan 135-6006 Osaka Business Office / 1-3-15 Awaza, Nishi-ku, Osaka-city, Osaka, Japan 550-0011 Kyusyu Business Office / 1-21-4 Nishiminatomachi, Omuta-city, Fukuoka, Japan 836-0062
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