Computer-on-modules

Transcript

Engineering Leadership Computer-On-Modules 03 | 2017 MSC Technologies at a Glance ”Our aim is to deliver the best engineering performance to provide our customers with a leadership position in their markets.” youtube.com/mscembedded 2 | www.msc-technologies.eu Silvano Geissler, Vice President Board Solutions, MSC Technologies 3 Computer on Module Product Range ARM Technology X86 Technology MSC has the complete portfolio of COM Ex- The SMARC 2.0 product range is steadily grow- press modules. From low end Intel Atom to ing and spans ARM Cortex-A9 to latest x86 high end Core i7 and Xeon processors, from Atom SOCs. Mini to Basic format. The nanoRISC module family combines comMSC’s widespread Qseven portfolio is one of pact size with low power and low cost. With the widest in the industry. From Single-Core ARM Cortex-A8 and A9 processors. ® ARM to Quad-Core x86, Cortex-A9 to latest x86. 4 | www.msc-technologies.eu 5 Vertical Markets Industrial Medical Gaming Transportation POS/POI Building Automation Security Scalability of COMs “Scalability of Performance“ describes the capability of COMs to allow alternative modules of different performance and feature levels to be used in the module socket of the same carrier board. Other Advantages of COMs • Reduced complexity • Focuses core competence on system design • Faster development cycles – shorter Time to Market • Lower cost-of-ownership • Minimizes development risk • High flexibility • Extended lifecycle concept • Second source availability due to standardization 6 | www.msc-technologies.eu 7 Fitness Center Smart Grid Factory Automation Smart Store Medical Devices MSC - The Standards Innovator Since 2005 MSC is an executive member of the PCI Computer Manufacturer Group (PICMG), and has been driving the development of new SMART CITY Traffic Optimization CLOUD & SERVICE Intelligent Digital Signage Hospital Information Network Optimization INTELLIGENT HOSPITAL Renewable Energy Home Automation SMART LIVING Traffic Camera INDUSTRY 4.0 Security versions of the popular COM Express™ standard. MSC was one of the founders of the Standardization Group for Embed- Microsoft Azure Cloud ded Technologies (SGeT), focusing on the development of specifications for embedded computer products. As a prominent member of SGeT, Internet of Things MSC has been driving the standardization process for the Qseven™ and In the course of the next industrial revolution, billions of intelligent the SMARC™ 2.0 specifications. devices, systems and machines are going to be interconnected by the Internet of Things. All of MSC’s Computer-on-Modules are ready for application in IoT devices, network concentrators and the cloud. MSC - The Technology Leader Cloud Services are available from Microsoft for a wide range of require- IoT Technology Id ments. Microsoft Azure is a growing collection of integrated cloud ser- Premier Partners vices implemented through Microsoft’s global network of data centers. MSC is a premier partner of Intel and AMD, and has early access to all ® new microprocessor generations. MSC is providing an On-Board Tool which allows connecting to IoT nodes consisting of Computer-on-Modules and/or Computer Boards effective- Processors ly reading out status information and application results. We are using the best ARM processors from NXP and Texas Instruments on our Qseven, SMARC 2.0 and nanoRISC® modules. Microsoft Azur for IoT product BIOS Partnership All current Computer-on-Modules from MSC are certified for the Mic- Get a head start connect Our BIOS partnership with AMI ensures that our software engineering rosoft Azure Cloud and can be employed for IoT-related applications. Azure cloud and take a capabilities in the BIOS/ UEFI development includes customization of the source code. solutions available in today with any of Av platforms (developed b for a high-quality hardw 8 | www.msc-technologies.eu Eval kits featuring support documentation an 9 to Microsoft Azure are available for Window MSC - Research & Development MSC - Production Best-in-class Engineering since 1987 Leading-Edge Manufacturing MSC has more than 30 years of experience in complex and high-speed MSC runs three state-of-the art manufacturing sites in Germany and in circuit design, development and production. Our skilled design engineers Malta. Latest production equipment and a high degree of automation have many years of experience designing boards with high-end x86 and allows us to achieve best-in-class throughput at very low manufacturing ARM CPUs as well as with fast memory technology and programmable de- cost and highest quality. Certificate of Registration This is to certify that the Quality Management System of vices (CPLD, FPGA). Ultra-fast system signal design and layout has always MSC Technologies GmbH Industriestraße 16 D-76297 Stutensee been one of our specialties. Best-in-Class Quality has been assessed and registered by Intertek Certification GmbH as conforming to the requirements of The MSC product engineering, test development and production engi- Development, production and sales of customer specific and own electronic systems, boards, components and display solutions as well as distribution of electronic components and display products at the sites listed in the annex. DIN EN ISO 9001:2015 The Quality Management System is applicable to Certificate Reg. No.: neers are working hand in hand to achieve optimized product quality. 2015-02239 Validity Date: 03.12.2015 Initial Certification on: 17.08.1999 Issue Date: 24.11.2015 till 02.12.2018 The appendix is part of this certificate and consists of 1 page. Christina Weiglein, Certification Body Intertek Certification GmbH - Hanns-Martin-Schleyer-Straße 2, D-41199 Moenchengladbach, Germany • x86 CPU Architecure Our sophisticated SAP-integrated MES and quality system ensures • ARM Cortex-Ax Architecture full traceability of our products, and includes strict version control for • FPGA / FPGA SOC Design each product made. • High Speed Designs (DDRx DRAM, PCIe, USB 3.0, Frontside Buses, Graphics, ….) • Simulation (Thermal, Signal Integrity, Functional) • Operating System support In the issuance of this certificate, Intertek assumes no liability to any party other than to the Client, and then only in accordance with the agreed upon Certification Agreement. This certificate’s validity is subject to the organization maintaining their system in accordance with Intertek’s requirements for systems certification. Validity may be confirmed via email at [email protected] or by scanning the code to the right with a smartphone. Certificate The certificate remains the property of Intertek, to whom it must be returned upon request. It is hereby confirmed that company MSC Technologies GmbH including the sites of the companies: 141026U-A MSC Technologies GmbH Industriestrasse 16 D-76297 Stutensee scope of application: Development and production of electronic devices and systems as well as distribution of electronic components and devices 141026U-B Avnet Logistics Stutensee GmbH Industriestrasse 18 D-76297 Stutensee scope of application: Services in logistics division 141026U-C Avnet Logistics PMC Stutensee GmbH Industriestrasse 16 D-76297 Stutensee scope of application: Programming of electronic components has fully implemented a management system in accordance with the standard (Windows / Windows Embedded / Linux Embedded) • BIOS and software development DIN EN ISO 14001:2009 for the above-named scope of application. Date of initial certification: 12/12/2011 Certificate registration no.: 141026U This certificate is valid until: 11/12/2017 Chemnitz, 12/12/2014 ICG Zertifizierung GmbH, Wildparkstraße 3, D-09247 Chemnitz / Germany 10 | www.msc-technologies.eu Certifying Body 11 BIOS / Software D RE U C E S UEFI BIOS Operating Systems For all x86 modules MSC is using the advanced AMI Aptio V BIOS which MSC is supporting all popular and important operating systems, i.e. Windows 10, Windows 7 and implements the UEFI architecture with Secure Boot enhancements. Linux. Older modules are supporting Windows 7 and/or Windows 8. For most recent modules, MSC ontinuously improves its BIOS solutions with new functions and Linux support is based on the Yocto Project which is the standard for up-to-date embedded sys- technologies such as Advanced Boot Device Configuration. tems controlled by Linux. MSC is offering to adapt the BIOS for customers, but is also offering the MSC BIOS Configuration Tool which enables users to easily modify BIOS Distributed/ Network Apps MSC-On-Board Controller MSC implements a powerful microcontroller (EC) on all advanced modules which helps to control binary images and set configuration defaults, add splash screen images, pre-define passwords etc. MSC is maintaining user-friendly interfaces Apps correct operation of the module and takes over most of the house holding functions: it controls the fan speed, monitors temperatures and voltage levels and controls power on/off of the board. such as EAPI (Embedded Application Programming Interface) to allow low-level control of non-volatile memory, I2C bus access, backlight set- OS Drivers Besides health monitoring and logging, the EC has implemented a power-on and boot watchdog and display backlight control. The optional smart battery support makes it easy to design full tings, watchdog timer etc. battery powered systems. Security The AMI Aptio V BIOS as used by MSC supports the “Chain of Trust” ® Boot Loader according to the TCG (Trusted Computing Group): Option ROMs • From power-on every step is monitored • CRTM (Core root of trust for measurement) is essential • Hash values in TPM are compared to actual values of SW modules • Boot process stops if integrity of one chain link is doubtful • SecureFlash update tool allows signed update files only BIOS (POST Phase) “Chain of Trust” OS Kernel Monitoring Fan Control Power Sequencing Watchdog Display Backlight Control Boot Block Smart Battery Support Health Data • Root of Trust cannot be modified TPM EDID Emulation Customized Functions Runtime Metering “Root of Trust”(CRTM) 12 | www.msc-technologies.eu 13 Cooling Solutions Thermal Simulations MSC is offering a large number of different cooling devices for its Com- MSC performs thermal simulations prior to producing cooling solutions puter-on-Modules portfolio. Among these are various heatspreaders, in hardware. This ensures that all requirements will be considered and heatsinks and a selection of heatsinks with fans for active cooling. All that the result will perform near the theoretical optimium. MSC provides coolers can be customized by MSC to optimize functionality, efficien- thermal consulting as a service to its customers helping to ensure that cy and cost. For high-volume applications, MSC offers to design custom the resulting cooling solutions will be adequate on the system basis. cooling solutions optimized for specific purposes. 14 | www.msc-technologies.eu 15 Environmental Testing & Certification ED RUGG Built to Fit Thermal Characteristics of Standard Products Compliance Test MSC offers customization of its standard modules accord- Customized Assembly – Individual Solutions MSC is offering most products in standard temperature and • Pre & Post Layout Signal Simulations ing to the requirements of the customers. This will help to • Mounted and tested (memory, cooling, baseboard) in industrial temperature variants. This temperature rating • EMC, ESD in Reference Environment (CE) achieve required price points for volume projects by not • Individual test profile is tested on a sample basis since all components used for • Signal Compliance of High-Speed Interfaces populating components which are not required, i.e. less • Pre-configured BIOS memory or less controllers of unnecessary functionality. • Baseboard Electronic Manufacturing Service (EMS) these products are specified accordingly. Environmental Test In addition, MSC offers to assemble Computer-on-Modules • Temperature Tests on carrier boards, optionally with suitable cooling and with For boards which are only specified in the standard tem- • Shock memory modules inserted. perature range, MSC is offering a screening service result- • Vibration Product Screening and Ruggedization ing in the same products available in an extended temperature range to be specified by the customers. Certification • Support for applications specific certifications • Collaboration with external certification agencies 16 | www.msc-technologies.eu 17 < Standard Qseven Module Customization Service FPGA Capabilities From Standard to Full-Custom MSC has been designing FPGA-based boards and systems for several de- A complete Computer-on-Module can be treated as a functional macro cades. For very many application areas, we have successfully designed and inserted into a full-custom board design. That will shorten the de- cutting-edge high-speed and high-complexity boards providing ultimate velopment time of customer-specific board designs dramatically, and performance and functionality. help to achieve the shortest possible time-to-market because the functional macro is already proven to work, and comes with full software and firmware support. < Standard Qseven Module on Baseboard Custom Development • Carrier board • Single-Board Computer • Add-on boards • Non-standard modules < Qseven Technology into 18 | www.msc-technologies.eu full-custom design 19 Global Leadership Worldwide Support No matter where in the world you are, the next Avnet regional sales office is only a phone call away. MSC Technologies is Avnet’s own brand of embedded boards and systems, and is supported by the entire Avnet sales force around the planet. Regional sales engineers are supported by local FAEs and Business Development Managers, who all have direct access to MSC’s Product Marketing and Technical Support groups. MSC Headquarters and Boards Manufacturing Plant Stutensee MSC Systems Manufacturing Plant Freiburg Design-in Services Technical Support • Pre- and Post-Sales Support • Experience sharing Avnet Headquarters Phoenix / Arizona MSC Boards Manufacturing Plant Malta • OEM baseboard design reviews and debugging • Baseboard Design Guidelines and Trainings • Benchmark performance comparisons • Customized starter kits Support Website • Drivers, BSPs, BIOS updates • Software APIs (EAPI) and other Software Tools 900 Employees • User Manuals, App Notes, Mechanical infos, etc…. 120 Engineers in R&D 4 Design Centers 3 Manufacturing Sites More than 500,000 Boards per year 20 | www.msc-technologies.eu 21 COM Express™ Properties for allsupports Form four Factors The COMCommon Express™ Standard sizes: Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only Extended only Mini, Compact, Basic and Extended. All sizes utilize Basic 220-pin only connectors except for the two high-speed, Mini format which only supports one connector. Compact only Signal distribution of this connector similar to the Compact and Basicis only other formats but by no means identical. Mini only 106.00 Compact Extended Compact 91.00 Basic Mini70.00 51.00 18.00 Mini 6.00 COM Express™ 91.00 74.20 80.00 16.50 0.00 18.00 4.00 0.00 All dimensions are shown in millimeters. 6.00 4.00 COM Express™, the widely spread COM standard as high-end computing and graphics intensive in the embedded world, has been defined by the solutions. It is designed for the latest chipsets PICMG (PCI Industrial Computer Manufacturers and serial signaling protocols, including PCI Ex- Group) in 2005. Since that time and after a few press Gen 3, SATA, USB 3.0, and high resolution COM Express™ Extended updates, COM Express has become the most ver- video interfaces. COM Express provides the high- • For special applications only satile and most scalable COM standard support- est performance of the many small form factor • Not commonly used • Highly integrated, fully featured and space saving solution ing small and cost-sensitive applications as well standards and products available. • 155 mm x 110 mm • 95 mm x 95 mm COM Express™ Basic COM Express™ Mini • Standard COM Express format for high level • Entry level format for small and rugged solutions ® COM Express™ Compact • Preferred format for entry and mid level solutions All dimensions are shown in millimeters. solutions • 125 mm x 95 mm 22 | www.msc-technologies.eu 151.00 121.00 91.00 80.00 74.20 16.50 0.00 4.00 0.00 • Reduced feature set (uses only one connector) • 84 mm x 55 mm 23 Ba COM Express™ - Basic COM Express™ - Basic MSC C6B-KLH Intel Core™ - 7th Generation ® MSC C6B-8SB NEW Intel® Core™ - 5th Generation Type 6 Type 6 95 x 125 The MSC C6B-KLH module is based on Intel‘s 7th generation Core processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. 35/55 W 95 x 125 55 W This module is based on Intel's 5th generation Core™ processors produced in 14nm technology. It supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB 3.0 on a COM Express Type 6 module. Highlights • Intel® Core™ i7-7820EQ (quad-core, 3.0/3.7GHz), • Four SATA 6Gb/s mass storage interfaces Highlights Intel Core™ i5-7440EQ (quad-core, 2.9/3.6GHz), • Three DisplayPort/HDMI/DVI interfaces • Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz) • LVDS (24 Bit, dual channel) and CRT interface Intel Core™ i5-7442EQ (quad-core, 2.1/2.9GHz), • Embedded DisplayPort / LVDS (24 Bit, • Intel Core™ i7-5700EQ (quad-core, 2.6/3.4GHz) • Triple independent display support • Intel HD Graphics GT2 or GT3e • DirectX 11.1, OpenGL 3.2, OpenCL 1.2 ® ® Intel Core™ i3-7100E (dual-core, 2.9GHz), ® ® dual channel) interface ® Intel Core™ i3-7102E (dual-core, 2.1GHz), • Triple independent display support • Intel 8-Series chipset • Resolution up to 4096 x 2304 Intel Xeon E3-1505Mv6 (quad-core, 3.0/4.0GHz), • DirectX 12, OpenGL 4.4, OpenCL 2.x • Up to 16GB DDR3L-1600 SDRAM, dual channel • Seven PCI Express™ x1 lanes Intel Xeon E3-1505Lv6 (quad-core, 2.2/3.0GHz) • Resolution up to 4096 x 2304 • Four SATA mass storage interfaces, up to 6Gb/s • Four USB 3.0/2.0 and four USB 2.0 interfaces • Intel HD Graphics 630, P630 • Eight PCI Express™ x1 lanes; PEG x16 • Three DisplayPort/HDMI/DVI interfaces • Trusted Platform Module • Intel chipsets QM175, HM175 or CM238 • Four USB 3.0/2.0 and four USB 2.0 interfaces • Two embedded DisplayPort interfaces • Up to 32GB DDR4-2133 SDRAM, dual channel • Trusted Platform Module ® ® ® ® ® ® ® (ECC optional) ® • UEFI Firmware MSC C6B-SLH MSC C6B-8S / CXB-8S Intel Core™ - 6th Generation Intel® Core™ - 4th Generation Type 6 Type 6 / Type 2 ® 95 x 125 35 / 55 W The MSC C6B-SLU module is based on Intel‘s 6th generation Core™ processor family with a new processor architecture based on 14 nm process technology. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. 95 x 125 35 / 55 W Based on Intel's 4th generation Core™ processors this COM Express family supports the latest digital display interfaces like DisplayPort, HDMI and DVI and controls up to three independent displays. USB 3.0 interfaces connect to the fastest peripheral devices available. Highlights Highlights • Intel Core™ i7-6820EQ (quad-core, 2.8/3.5GHz) • Intel HD Graphics 530, P530 • Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz) • Three DisplayPort/HDMI/DVI interfaces • Intel Core™ i7-6822EQ (quad-core, 2.0/2.8GHz) • Intel chipsets QM170, HM170 or CM236 • Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz) • Two embedded DisplayPort interfaces • Intel Core™ i5-6440EQ (quad-core, 2.7/3.4GHz) • Up to 32GB DDR4 SDRAM, dual ch. (ECC opt.) • Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz) • LVDS (24 Bit, dual channel) and CRT interface • Intel Core™ i5-6442EQ (quad-core, 1.9/2.7GHz) • Three DisplayPort/HDMI/DVI interfaces • Intel Core™ i3-4100E (dual-core, 2.4GHz) • Triple independent display support • Intel Core™ i3-6100E (dual-core, 2.7GHz) • LVDS (24 Bit, dual channel) or eDP interface • Intel Core™ i3-4102E (dual-core, 1.6GHz) • DirectX 11.1, OpenGL 3.2, OpenCL 1.2 • Intel Core™ i3-6102E (dual-core, 1.9GHz) • Triple independent display support (4K) • Intel Celeron 2000E (dual-core, 2.2GHz) • Resolution up to 3800 x 2400 • Intel Celeron G3900E (dual-core, 2.4GHz) • DirectX 12, OpenGL 4.4, OpenCL 2.x • Intel Celeron 2002E (dual-core, 1.5GHz) • Seven PCI Express™ x1 lanes • Intel Celeron G3902E (dual-core, 1.6GHz) • Four SATA 6Gb/s; Trusted Platform Module • Intel HD Graphics GT1/GT2 • Four USB 3.0 and four USB 2.0 interfaces • Intel Xeon E3-1505Mv5 (quad-core, 2.8/3.7GHz) • Eight PCI Express™ x1 lanes; PEG x16 • Intel 8-Series chipset • Trusted Platform Module • Intel Xeon E3-1505Lv5 (quad-core, 2.0/2.8GHz) • Four USB 3.0/2.0 and four USB 2.0 interfaces • Up to 16GB DDR3L-1600 SDRAM, dual-channel • Also available in Type 2 pin-out ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® ® • Four SATA mass storage interfaces, up to 6Gb/s 24 | www.msc-technologies.eu 25 COM Express™ - Basic / Compact COM Express™ - Compact MSC C6B-7S / CXB-6SI MSC C6C-SLU Intel Core™ - 3rd Generation Intel® Core™ - 6th Generation Type 6 / Type 2 Type 6 ® 95 x 125 25 / 65 W Based on Intel’s 3rd generation Core™ processors this COM Express module supports the latest digital display interfaces, up to three independent displays and USB 3.0. Ultra low-power variants with only 17W CPU power dissipation allow passively cooled system designs. 95 x 95 17 / 19 W The MSC C6C-SLU module is based on Intel‘s 6th generation Core™ processor family with a new processor architecture based on 14 nm process technology. The multi-chip-package includes processor, graphics and chipset on one carrier and allows extremely compact high-performance designs. Highlights Highlights • Intel Core™ i7-3612QE (quad-core, 2.1GHz) • Three DisplayPort/HDMI/DVI interfaces • Intel Core™ i7-3615QE (quad-core, 2.3GHz) • Two embedded DisplayPort interfaces • Intel Core™ i7-3555LE (quad-core, 2.5GHz) • LVDS (24 Bit, dual channel) and CRT interface • Intel Core™ i7-3517UE (dual-core, 1.7GHz) • Triple independent display support • Intel Core™ i5-3610ME (dual-core, 2.7GHz) • DirectX 11, OpenGL 3.1, OpenCL 1.1 • Intel Core™ i3-3120ME (dual-core, 2.4GHz) • Resolution up to 2560 x 1600 • Intel Core™ i3-3217UE (dual-core, 1.6GHz) • Seven PCI Express x1 lanes, four SATA-300 • Intel Celeron 1020E (dual-core, 2.2GHz) • Four USB 3.0 and four USB 2.0 interfaces • Intel Celeron 1047UE (dual-core, 1.4GHz) • Trusted Platform Module • Integrated Intel Gen. 9 HD graphics • Intel Celeron 927UE (single-core, 1.5GHz) • Also available in Type 2 pin-out • Up to 32GB DDR4 SDRAM, dual-channel ® ® ® ® ® ® ® ® ® ® ® ® ® • Intel® Core™ i7-6600U dual-core 2.6/3.4GHz, 4MB L2, 15W TDP, 7.5/25W cTDP • Intel Core™ i5-6300U dual-core 2.4/3.0GHz, ® 3MB L2, 15W TDP, 7.5/25W cTDP • Intel Core™ i3-6100U dual-core 2.3GHz, 3MB ® L2, 15W TDP, 7.5 cTDP • Intel Celeron 3955U dual-core 2.0GHz, 2MB ® ® L2, 15W TDP, 10W cTDP ® • Three SATA 6Gb/s mass storage interfaces • MicroSD card socket • DisplayPort/HDMI/DVI interface • LVDS/embedded DisplayPort interface • Three independent displays supported • DirectX 12, OpenGL 4.4, OpenCL 2.x • Four USB 3.0/2.0 and four USB 2.0 interfaces • Eight PCI Express™ x1 lanes • Trusted Platform Module • Up to 16GB DDR3-1600 SDRAM, dual channel MSC C6C-KLU Intel Core™ - 7th Generation ® MSC C6C-AL NEW Intel® Atom™/Pentium®/Celeron® SOC Type 6 95 x 95 17 / 19 W NEW Type 6 The MSC C6C-KLU module is based on Intel‘s 7th generation Core processor family. The Intel multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier and allows extremely compact high-performance designs. 95 x 95 7/14 W The MSC C6C-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one solution. The modules with Intel® Atom™ processors are also available in extended temperature versions. -40... +85 °C Highlights Highlights • Intel Core™ i7-7600U dual-core 2.8/3.9GHz, ® 4MB L2, 15W TDP • Intel Core™ i5-7300U dual-core 2.6/3.5GHz, ® 3MB L2, 15W TDP • Intel Core™ i3-7100U dual-core 2.4GHz, • MicroSD card socket • Intel® Atom™ E3950 quad-core 1.6/2.0GHz, 12W • Two DisplayPort/HDMI/DVI interfaces • Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • Three independent displays supported • Embedded DisplayPort / LVDS • Intel® Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W (24 Bit, dual channel) interface • LVDS/embedded DisplayPort interface ® • DirectX 12, OpenGL 4.3, OpenCL 2.0 • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • Four USB 3.0/2.0 and four USB 2.0 interfaces ® ® • Three independent displays supported • Intel® Celeron® N3350 dual-core 1.1/2.4GHz, 6W • Two high-speed UARTs • DirectX 12, OpenGL 4.4, OpenCL 2.x • Integrated Intel Gen. 9 HD graphics • eMMC option • Resolution up to 4096 x 2304 • Up to 16GB DDR3L SDRAM, dual-channel • Up to five PCI Express™ x1 lanes • Four USB 3.0/2.0 and four USB 2.0 interfaces • Two SATA 6Gb/s mass storage interfaces • UEFI Firmware • Integrated Intel Gen. 9 HD graphics • Eight PCI Express™ x1 lanes • MicroSD card socket • Trusted Platform Module • Up to 32GB DDR4 SDRAM, dual-channel • Trusted Platform Module • eMMC option • Extended temperature variants • Three SATA 6Gb/s mass storage interfaces • UEFI Firmware • DisplayPort/HDMI/DVI interface ® 3MB L2, 15W TDP • Intel Celeron™ 3965U dual-core 2.2GHz, ® 2MB L2, 15W TDP ® 26 | www.msc-technologies.eu ® 27 COM Express™ - Compact COM Express™ - Compact MSC C6C-BW MSC C6C-GX Intel Pentium / Celeron ® ® AMD Embedded G-Series SOC ® Type 6 Type 6 Segments: Embedded and Server 95 x 95 8 / 14 W The MSC C6C-BW module is based on Intel‘s next generation Atom processors in14nm techno- This compact COM Express Type 6 module is based on AMD‘s Embedded G-Series SOC platform, Opteron 95 x 95 Embedded logy . These multi-core systems-on-chip provide outstanding computing and graphics power a high-performance, low-power System-on-Chip solution with outstanding HD graphics and 12 / 30 W and are more power efficient compared to their predecessors. The new module brings triple in- -40 +85 °C Embedded Solutions dependent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power 53120B saving and cost-efficient module. Dual- and quad-core processors are supported by this design. multimedia capabilities. The power saving and cost-efficient module offers dual independent Embedded Solutions “R” Series X 53057B Embedded Solutions Family fast DDR3 Opteron X memory and Opteron AUSB 3.0. display support, DirectXOpteron 11.1, “R” Series A 53117B 53118B 53119B (showcase specific Opteron X86 technology platform) (For future use) Highlights Highlights • AMD GX-420CA quad-core 2.0GHz, 25W TDP, Embedded Solutions “G” Series X 53058B • Intel Pentium N3700 quad-core 2.40GHz, 6W TDP • DisplayPort/HDMI/DVI interface ® ® Embedded Solutions “G” SeriesB • Intel Celeron N3150 quad-core 2.08GHz, 6W TDP • LVDS/embedded DisplayPort interface ® • Intel Celeron N3000 dual -core 2.08GHz, 4W TDP • DirectX 11.1, OpenGL 4.2, OpenCL 1.2 ® • AMD GX-217GA dual-core 1.65GHz, 15W TDP, ® • Integrated Intel Gen. 8 HD graphics • Four USB 3.0 and four USB 2.0 interfaces • Up to 8GB DDR3L SDRAM, dual-channel • Up to five PCI Express™ x1 lanes • Two SATA 6Gb/s mass storage interfaces • Trusted Platform Module (option) ® Embedded Solutions Radeon Graphics 53121B Embedded Solutions Opteron X 53116B Embedded Solutions Opteron A 95 x 95 • Integrated AMD HD 8000E graphics • Two USB 3.0 and six USB 2.0 interfaces 8 / 14 W PAGE 12 MSC C6C-BT / CXC-BT MSC C6C-A7 Intel Atom™ / Celeron SOC AMD Embedded R-Series Type 6 / Type 2 Type 6 ® 95 x 95 Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express module brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent displays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module. Based on AMD‘s Embedded R-Series platform this compact COM Express Type 6 module offers 25 / 35 W Segments: Embedded and Server -40 +85 °C • Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP • Two SATA 3Gb/s mass storage interfaces • Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP • MicroSD card socket ® • Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP • DisplayPort/HDMI/DVI interface • Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP • LVDS/embedded DisplayPort interface • Intel Atom™ E3815 single-core 1.46GHz, 5W TDP • VGA interface • Intel Celeron N2920 • Two independent displays supported ® ® ® ® ® quad-core 1.86/2.00GHz, 7.5W TDP • Intel Celeron J1900 ® ® quad-core 2.00/2.42GHz, 10W TDP • Integrated Intel Gen. 7 HD graphics ® • Up to 8GB DDR3L SDRAM, dual-channel 28 | www.msc-technologies.eu • DirectX 11.1, OpenGL 3.2, OpenCL 1.1 display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding / Opteron Highlights • AMD R-460L quad-core 2.0/2.8GHz, 25W TDP, Embedded Solutions 53120B Embedded Solutions “R” Series X 53057B Embedded Solutions “R” Series A Opteron Family 53117B Radeon HD 7620G Opteron X 53118B (showcase specific Opteron X86 technology platform) Opteron A 53119B (For future use) • AMD R-252F dual-core 1.7/2.3GHz, 17W TDP , Radeon HD 7400G Embedded Solutions “G” Series X 53058B Embedded Solutions “G” SeriesB Embedded Solutions Geode • One USB 3.0 and up to seven USB 2.0 interface • AMD R-452L quad-core 1.6/2.4GHz, 19W TDP, Radeon HD 7600G • AMD R-260H dual-core 2.1/2.6GHz, 17W TDP, • Trusted Platform Module (option) • Also available in Type 2 pin-out unprecedented integrated graphics and multi-display capabilities. It brings quad independent decoding support graphics- and video-centric applications. Embedded Highlights • Two independent displays supported • DirectX 11.1, OpenGL 4.2, OpenCL 1.2 Radeon HD 8310E AMD PRODUCT BADGE GUIDELINES ® • LVDS/embedded DisplayPort interface • VGA interface (For future use) Radeon HD 8280E • AMD GX-210HA dual-core 1.0GHz, 9W TDP, • MicroSD card socket • MicroSD card socket • DisplayPort/HDMI/DVI interface Radeon HD 8330E ® • Up to 16GB DDR3 SDRAM, dual-channel • Two SATA 3Gb/s mass storage interfaces Radeon HD 8400E • AMD GX-415GA quad-core 1.5GHz, 15W TDP, ® • Intel Celeron N3050 dual -core 2.16GHz, 6W TDP • Three independent displays supported ® Embedded Solutions Geode Radeon HD 7500G Embedded Solutions Radeon Graphics 53121B Embedded Solutions Opteron X 53116B Embedded Solutions Opteron A (For future use) • Four SATA 3Gb/s mass storage interfaces • MicroSD card socket, bootable • Three DisplayPort/HDMI/DVI interfaces • LVDS/embedded DisplayPort interface • VGA interface • Four independent displays supported • DirectX 11, OpenGL 4.2, OpenCL 1.1 • Resolution up to 4000 x 2000 @ 30 Hz • Integrated AMD HD 7000G graphics • Six PCI Express x1 lanes • Up to 16GB DDR3-1333 SDRAM, dual-channel • Four USB 3.0 and four USB 2.0 interfaces 29 COM Express™ - Mini COM Express™ - Accessories MSC C10M-AL Intel Atom™/Pentium /Celeron SOC ® ® ® MSC C6-MB-EV NEW Evaluation Motherboard Type 10 55 x 84 7/14 W -40... +85 °C Type 6 The MSC C10M-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation 170 x 170 that integrates next generation Intel processor core, graphics, memory, and I/O interfaces. The This evaluation board in the popular Mini-ITX format provides the interface infrastructure for COM Express Type 6 modules and offers various PC type connectors for external access. ® rugged design with soldered memory, optional ECC support and extended temperature range combined with a long-term availability commitment make it perfectly suited for modern IoT solutions. Highlights Highlights • Socket for COM Express™ Type 6 modules • GbE interface • PCI Express x16 slot (useable as PEG or x4) • SD Card slot • Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W • LVDS/embedded DisplayPort interface • PCI Express Mini Card slot • HD audio codec • Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • Two independent displays supported • Four SATA connectors • Super I/O • Intel Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W • DirectX 12, OpenGL 4.3, OpenCL 2.0 • Four USB 3.0 interfaces • Various additional COM Express™ specific interfaces • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • Two USB 3.0/2.0 and six USB 2.0 interfaces • Up to four USB 2.0 ports • Power supply via ATX-style power connector or • Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W • Two high-speed UARTs • Three DisplayPort connectors • Integrated Intel Gen. 9 HD graphics • Up to four PCI Express™ x1 lanes • LVDS and eDP connectors • Up to 8GB DDR3L SDRAM (ECC option) • UEFI Firmware • Two SATA 6Gb/s mass storage interfaces • Trusted Platform Module (option) • eMMC option • Extended temperature variants ® ® ® ® ® ® ® ® 12V-only power jack • Wide power input range • DisplayPort/HDMI/DVI interface MSC C10M-BT / C10M-BTC MSC C6-MB-EVA Intel Atom™ / Celeron SOC Evaluation Motherboard Type 10 Type 6 ® 55 x 84 8 /14 W -40... +85 °C ® Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 mod- 305 x 244 This versatile carrier board was designed for evaluation, prototyping and software development. ule brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very com- It provides the interface infrastructure for COM Express Type 6 modules and offers various PC pact, power saving and cost-efficient COM Express Mini module. The rugged design with soldered type connectors for external access. memory, optional ECC support and extended temperature range opens new application areas. Highlights Highlights • Socket for COM Express Type 6 modules in • LVDS interface • Intel Atom™ E3845 quad-core 1.91GHz, 10W TDP • eMMC option • Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP • DisplayPort/HDMI/DVI interface • One PCI Express x4 slot • HD audio codec; six audio jacks and SPDIF • Intel Atom™ E3826 dual-core 1.46GHz, 7W TDP • LVDS/embedded DisplayPort interface • Four PCI Express x1 slots • LAN interface • Intel Atom™ E3825 dual-core 1.33GHz, 6W TDP • Two independent displays supported • One PCI Express x16 PEG slot • mSATA and Mini PCI Express sockets • Intel Atom™ E3815 single-core 1.46GHz, 5W TDP • DirectX 11.1, OpenGL 3.2, OpenCL 1.1 • Four SATA connectors • Various additional COM Express specific interfaces • Intel Celeron N2930 quad-core 1.83/2.16GHz, 7.5W TDP • One USB 3.0 and up to seven USB 2.0 interfaces • Four USB 3.0, four USB 2.0 interfaces • ATX-style power connector • Intel Celeron J1900 quad-core 2.00/2.42GHz, 10W TDP • Trusted Platform Module (option) • Two DisplayPort/HDMI connectors • POST code LED display • Integrated Intel Gen. 7 HD graphics • Extended temperature variants • VGA/DVI connector • ATX form factor • Up to 8GB DDR3L SDRAM (ECC option) • Also available with USB client support ® ® ® ® ® ® ® ® ® ® Basic or Compact form factor • Embedded DisplayPort connector • Two SATA 3Gb/s mass storage interfaces 30 | www.msc-technologies.eu 31 COM Express™ - Accessories 170 x 170 COM Express™ - Accessories MSC C10-MB-EV MSC C10-SK Evaluation Motherboard Starterkits for COM Express Type 10 Type 10 This evaluation board in the popular Mini-ITX format provides the interface infrastructure for The COM Express Starterkit for Type 10 modules is available for the whole range of Type 10 mod- COM Express Type 10 modules and offers various PC type connectors for external access. ules. The kit contains all necessary products to quickly enable the user to run and evaluate COM Express Type 10 modules. The kit does not include a COM Express module in order to give the user greater flexibility as to which particular module variant and CPU core and speed is desired. Highlights • Socket for COM Express™ Type 10 modules • GbE interface Highlights • PCI Express x4 slot • SD Card slot • COM Express Type 10 Baseboard • PCI Express Mini Card slot • HD audio codec • Two SATA connectors • Super I/O • Two USB 3.0 interfaces • Various additional COM Express™ specific interfaces • Up to six USB 2.0 ports • Power supply via ATX-style power connector or • DisplayPort connectors • LVDS and eDP connectors in Mini-ITX format • Suitable Heatspreader for COM Express Mini Modules Type 10 • 12V Power Supply with suitable connector for COM Express baseboard 12V-only power jack • Getting Started Manual with download links • Wide power input range for drivers and BSP • PCI-Express x4 Slot • PCI-Express Mini Card Socket and SD Card Socket • 2x SATA Gen. 3.0 Connectors • 2x USB 3.0 and 8x USB 2.0 Connectors • DisplayPort Connector • Embedded DisplayPort Connector • LVDS Single-Channel JILI30 Connector • Audio Codec with 1x3 Jacks and SPDIF In/Out • Gigabit LAN Connector • Baseboard Size 170 x 170 mm COM Express™ Cooling Solutions MSC C6-SK Starterkits for COM Express Type 6 Depending on the computing performance, MSC has developed various solutions that help The COM Express Starterkit for Type 6 modules is available for the whole range of Type 6 processor technology and system environ- the system designer to quickly solve the heat modules. The kit contains all necessary products to quickly enable the user to run and evaluate ment, COM Express modules require different dissipation problems and ensure optimal envi- COM Express Type 6 modules. The kit does not include a COM Express module in order to give the cooling measures. ronmental conditions for the module. user greater flexibility as to which particular module variant and CPU core and speed is desired. Highlights • COM Express™ Type 6 baseboard • Up to three DisplayPort connectors • 2x 4GB DDR3L SO-DIMM memory modules • LVDS and eDP connectors • Heatsink for safe operation of module • GbE Interface, SD Card slot • Type 6 module socket • HD audio codec, Super I/O • PCI Express Mini Card slot • Baseboard size 170 x 170 mm Heatspreaders Passive cooling Active cooling • Up to four SATA connectors • Getting Started Manual Standardized thermal interfaces for easy Optimized heatsinks for best cooling Heatsinks combined with a dedicated • Up to four USB 3.0 interfaces • Download link for drivers and BSPs integration in customers' cooling con- performance even in industrial envi- speed controlled fan. Off-the-shelf solu- • Up to four USB 2.0 ports • Optional display kits with cables cepts and full interchangeability. ronments. tions for demanding ambient conditions. 32 | www.msc-technologies.eu 33 The most popular embedded Computer-On- The Qseven™ specification has been extended to The Qseven™ Standard uses the inexpensive Module standard for entry level performance include module architectures based on the ARM MXM-2 connector which provides 230 pin con- and low power applications with a very attractive processor which is renowned for its excellent nections. The connector is robust and proven, price performance ratio. Qseven is an open stan- performance to power ratio. Providing differ- and there are versions available which are certi- dard of the SGeT Standardization Group. Taking ent processor architectures and a wide range fied for automotive use. The edge contacts en- advantage of the ongoing development in pro- of modules for commercial and extended tem- able a low-resistance high-speed contact which cessor technology towards smaller and more perature together with matching baseboards, is usable even for advanced signal speed up to power efficient CPUs, Qseven has in recent years the MSC Qseven family leads the way to feature Gigabit Ethernet, PCI-Express and SATA. become the most widely adopted new standard rich and small, low power modular systems. 70 mm Qseven™ Properties Qseven™ for small form factor modules. 70 mm 34 | www.msc-technologies.eu 35 Qseven™ Qseven™ MSC Q7-AL Intel Atom™/Pentium /Celeron SOC ® ® ® MSC Q7-BT NEW Intel® Atom™ E3800 SoC Qseven™ Rev. 2.1 70 x 70 Qseven™ Rev. 2.0 The new MSC Q7-AL module features Intel's next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom™ Processor E3900 series integrates processor core, 70 x 70 ® 7/12 W -40... +85 °C graphics, memory, and I/O interfaces into one solution and provides considerably higher graphics and computing performance compared to its predecessors. 7/12 W -40 +85 °C Highlights The quad-core, dual-core or single-core Atom processor provides outstanding computing and graphics power and is accompanied by a comprehensive set of peripherals. • Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W • LVDS/embedded DisplayPort interface • Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP • Integrated Intel® Gen. 7 HD Graphics • Intel® Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • Triple Independent Display support • Intel® Atom™ E3827 dual-core 1.75GHz, 8W TDP • HDMI up to 1920x1200 • Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W • DirectX 12, OpenGL 4.3, OpenCL 2.0 • Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP • DisplayPort 1.1a up to 2560x1600 • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • Up to 4x PCI Express x1 Gen. 2 • Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP • Dual-Channel LVDS 24 or 18 bit up to 1920x1200 • Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W • Up to 3x USB 3.0 Host interfaces • Intel Atom™ E3815 single-core 1.46GHz, 5W TDP • 3x PCI Express x1 Gen. 2.0 ports, GbE LAN • Integrated Intel Gen. 9 HD graphics • Up to 8x USB 2.0 Host interfaces • Up to 8GB DDR3L SDRAM (opt. ECC) • USB 3.0 Host, optional USB 3.0 Device • Up to 8GB DDR3L SDRAM (ECC option) • 1x USB 2.0 Host/Device support • Up to 64GB SATA Flash Disk (optional) • Up to 6x USB 2.0 Host, optional USB 2.0 Device • Up to 64GB eMMC Flash (optional) • Trusted Platform Module (optional) • Up to 32GB eMMC Flash (optional) • UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM • Two SATA-III interfaces (6Gbps) • Qseven Rev. 2.1 compliant • 2x SATA interfaces (1 used for opt. Flash Disk) • DisplayPort/HDMI/DVI interface • UEFI Firmware ® ® ® ® ® ® ® ® ® MSC Q7-BW MSC Q7-IMX6PLUS Intel Atom™ / Pentium / Celeron SOC NXP™ i.MX6 ARM® Cortex™ -A9 SoC Qseven™ Rev. 2.0 Qseven™ Rev. 2.0 ® 6/9 W System-On-Chip (SOC) Atom E3800 generation based on Intel’s 22nm processor technology. Highlights ® 70 x 70 The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel‘s multi-core ® ® The MSC Q7-BW module is based on Intel‘s next generation Atom™ processors in 14nm technology. These multi-core systems-on-chip provide outstanding computing and graphics power and are more power efficient compared to their predecessors. The new module brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, 70 x 70 4/6 W -40 +85 °C The MSC Q7-IMX6PLUS module provides the NXP™ i.MX6 ARM Cortex-A9 CPU (quad, dual, dual-lite or single core) as well as the new i.MX 6QuadPlus and 6DualPlus Processors with up to 1.2 GHz, up to 4GB DDR3 DRAM and up to 64GB eMMC Flash memory as well as an extensive set of interface controllers. power saving and cost-efficient module. Highlights • NXP™ i.MX6 ARM® Cortex™-A9 Highlights • HDMI/DVI up to 1920 x 1200 @30Hz • Intel Pentium N3710 quad-core 2.56GHz, 6W TDP • HDMI/DVI interface up to 3840x2160 • Intel Celeron N3160 quad-core 2.24GHz, 6W TDP • DisplayPort 1.1a up to 3840x2160 • Supports i.MX 6QuadPlus, i.MX 6DualPlus • Triple independent display support • Intel Celeron N3060 dual-core 2.48GHz, 6W TDP • Dual-Channel LVDS 24 or 18 bit up to 1920x1200 • “Triple-Play“ Graphics and Video Subsystem • SATA-II (3Gbps, quad-/dual-core only) • Intel Celeron N3010 dual-core 2.24GHz, 4W TDP • DirectX 11.1, OpenGL 4.2, OpenCL 1.2 • Up to 4GB DDR3L SDRAM • USB Host / Device + up to 4x USB 2.0 • Intel Atom™ x5-E8000 quad-core 2.0GHz, 5W TDP • Triple Independent Display support • Up to 64GB eMMC or 4GB NAND Flash • MMC / SD / SDIO Interface • Integrated Intel Gen. 8 HD Graphics • 3x PCIe x1, GbE, SATA-III, UART, LPC, SPI, I2C, SMBus • Gigabit Ethernet • CAN Interface, I2S Audio • Up to 8GB DDR3L SDRAM (dual-channel) • USB 3.0, opt. USB 3.0 Device • PCI Express x1 port • MIPI CSI-2 Camera Interface • Up to 64GB SATA Flash Disk (optional) • Up to 7x USB 2.0, opt. USB 2.0 Device ® ® ® ® ® ® ® ® ® ® quad-, dual-, dual-lite or single-core CPU • Dual-Channel LVDS 18/24 bit up to 1920 x 1200 • Up to 64GB eMMC Flash (optional) 36 | www.msc-technologies.eu 37 Qseven™ - Accessories Qseven™ - Accessories MSC Q7-MB-EP5 MSC Q7-MB-EP6 Embedded Platform Qseven™ Rev. 2.0 Embedded Platform Qseven™ Rev. 2.0 The new Qseven™ Rev. 2.0 embedded platform MSC Q7-MB-EP5 offers a variety of interfaces 148 x 102 -40... +85 °C 148 x 102 The Qseven™ Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded commonly used in embedded applications such as Gigabit LAN, USB 3.0, USB 2.0, RS232/485 interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI, and CAN as well as DisplayPort and LVDS display interfaces. By design the EP5 was optimized DisplayPort and LVDS display interfaces. In addition a mini PCI Express™, an mSATA and an SD for low production cost and simple customization. MSC is offering to produce any customized Card socket are supported. Module slot on bottom side. variant of the MSC Q7-MB-EP5 for medium to high volume. Highlights • HDMI and DisplayPort connectors for direct Highlights • Low-cost application board for any Qseven • RS-232, RS-485 or opt. CAN output of TMDS signals from Qseven module • USB 3.0 host connector • 2x USB 2.0 host connector • Dual-channel LVDS on JILI30 connector • Dual Gigabit Ethernet • 1x USB 2.0 on pin header • Dual Gigabit Ethernet • Backlight power 3.3V, 5V or 12V • Mini PCI Express card slot • 1x microUSB 2.0 OTG connector • Up to 2x SATA-II connectors • Adjustable Backlight intensity • MMC/SD card and mSATA card sockets • LVDS / eDP via Jili30 connector • Mini PCI Express Card • WLAN / Bluetooth / NFC with antenna (option) • 1x SATA connector • Backlight interface 3.3 / 5 / 12VDC • mSATA Card socket • 4-wire touch controller (option) • RS-232 on DB9 connector • SPI / I2C / SMBus, CAN bus, I2S audio • MMC/SD Card slot • I2S or HD Audio codec (option) • RS-485 and RS-232 on pin header • Wide input range from 10 - 28VDC • 1x USB 3.0, up to 3x USB 2.0 connectors • SPI / I2C / GPIO on Feature Connector • LPC / GPIO on pin header • 1x USB 2.0 Host/Client on µUSB connector • Input voltage up to 36V • DisplayPort connector for output of graphics • Industrial temperature versions available computer module (x86 and ARM based) signals from Qseven module MSC Q7-MB-EP4 Embedded Platform DDI QSeven Slot Note: can also be used as PCAP Touch I/F MicroAB Host/Client 4-Wire Res. USB Touch Controller Microchip AR1100 4-Wire Touch USB1 USB2 5 Pin Header USB0 USB3 Single USB 2.0 Type A USB5 Single USB 2.0 Type A Micro SIM card slot SATA Conn Intel® mSATA Card Socket SATA 0 Feature Connector 2 20 Pin Header 4 Pin JST Conn 4 Pin JST Conn Feature Connector 1 20 Pin Header POWER IN 38 | www.msc-technologies.eu USB4 PCIe 0 WLAN Module H&D Wireless SPB209A SDIO UART RS232 Driver RS485 Driver CAN Driver PCI Mini Card Socket PCI 1 LAN Controller PCIe intel® I210 Q7 Eth LVDS/eDP CAN 3.3V and 5V Regulator Other Regulator The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as DVI/HDMI. In addition a mini PCI Express™ and an mSATA slot as well as an SD-Card socket are supported. Module slot on bottom side. HDMI/DP Power Highlights • One DVI port up to 1920 x 1080 for Qseven Gbit LAN RJ45 Analog/PWM 3.3V/5V/12V Opto Coupler Gbit LAN RJ45 Backlight LVDS JILI 30 HDMI-DP Converter DisplayPort SPI, I2C, GPIO 12V Regulator 148 x 102 SATA 1 uSD / SD Card Socket System Signals Single USB 3.0 Type A USB6/7 modules with SDVO • One CAN interface • Six USB 2.0 interfaces, four external • Dual Gigabit Ethernet • Touch screen controller on board • Mini PCI Express slot • LVDS display connection via Jili30 • MMC/SD Card socket • Backlight interface 3.3 / 5 / 12VDC • Two SATA onboard connectors • Size 148 x 102 mm • One RS-232 onboard pin header • Wide input range from 10 - 28VDC I25 Codec Audio Audio Header HDA Codec 39 Qseven™ - Accessories 435 x 170 Qseven™ - Accessories MSC Q7-MB-RP3 MSC Q7-SK-IMX6-EP4 Reference Platform Qseven™ 2.0 Starterkit for ARM-based Qseven™ 2.0 Modules The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify The MSC Q7-SK-IMX6-EP4 Starterkit is based on the 3.5" carrier board MSC Q7-MB-EP4 and Qseven™ Rev. 2.0 modules for compatibility with the specification. It offers a large variety of contains all necessary products to quickly enable the user to run and evaluate the Qseven™ interfaces commonly used in industrial applications. It is a key instrument to shorten design range of ARM-based modules. The kit does not contain a Qseven module allowing the user to cycles and to improve time to market of new Qseven™ based systems. select the most suitable one from MSC’s wide offerings. Highlights Highlights • One PCI Express™ x16 slot and 3 x1 slots • EXAR X28V384 Super I/O • Two graphic card slots for • 7x COM, HW monitor HDMI / DP / eDP / LVDS • CAN Transceiver • Mini PCI Express™ & mSATA slot • HD audio codec • SD Card socket and SIM Card slot • USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces • Two SATA onboard connectors • 3.5" Qseven carrier board with socket for Qseven module • Heatspreader with heatsink for all module variants of the Q7-IMX6PLUS module family • 12V power supply and cable kit included for immediate operation of the Starter Kit • Winbond W83627DHG Super I/O • Resource USB Flash stick with drivers, manuals etc. • DVI/HDMI graphics output • LVDS graphics output on standard 30-pin connector; backlight connector includes adjustable backlight voltage and dimming • 2x Ethernet (10/100/1000 LAN) connector • SATA connector • 4x USB 2.0, 1x microUSB OTG • UART/RS-232 on pin header • MMC/SD-Card socket, mSATA slot • I2C, CAN connectors • Optional 7" WVGA (800 x 480) and 12.1" XGA MSC Q7-SK-AL-EP6 MSC Q7-SK-BT-EP6 (1024x768) TFT kit Starterkits for x86-based Qseven™ 2.0 Modules The MSC SK-AL-EP6 is the new Starterkit for Qseven™ modules based on the Intel E3900 Qseven™ Cooling Solutions "Apollo Lake" processor family. The MSC SK-BT-EP6 is the Starterkit suitable for Qseven™ modules based on the Intel E3800 “BayTrail" and the N3000 “Braswell” processors. Both kits are For all its Qseven modules, MSC is offering tai- MSC is providing a heatspreader for each Qseven based on the 3.5" Qseven 2.0 carrier board MSC Q7-MB-EP6 and contain all necessary products lored cooling solutions which perfectly fit the module, and a single-piece heatsink for the high- to quickly enable the user to run and evaluate the Qseven module range. geometry of the COM product. er-performance modules. Heatspreaders Heatsinks • MiniPCIexpresss and mSATA slots A heatspreader offers a blank surface allowing to A heatsink is shaped like the heatspreader, • Optional 7" WVGA (800 x 480) and 12.1" XGA mount a cooling device or to contact the metal but shows cooling fins on the upper side so housing of a system, while the underside provides as to maximize the surface used to dissipate contact areas for the heat generating parts of the heat into the surrounding air. Highlights • 3.5" Qseven carrier board with socket for Qseven 2.0 module • Heatspreader with heatsink for all module variants of the respective Qseven family • 12V power supply and cable kit included for immediate operation of the Starter Kit • Resource USB Flash stick with drivers, manuals etc. • DP graphics output • LVDS graphics output on standard 30-pin connector; backlight connector includes adjust- • 2x Ethernet (10/100/1000 LAN) connector • SATA connector • USB 3.0, 3x USB 2.0, 1x microUSB OTG • 2x UART • SD-Card socket (1024x768) TFT kit module’s geometry. able backlight voltage and dimming 40 | www.msc-technologies.eu 41 SMARC™ 2.0 Properties The SMARC™ 2.0 Standard uses the inexpensive MXM-3 connector which provides 314 pin connections. The connector is robust and proven, and there are versions available which are certified for automotive use. The edge contacts enable a low-resistance high-speed contact which is usable even for advanced signal speed up to Gigabit Ethernet, PCI-Express and SATA. The Standard SMARC™ 2.0 alternatively can be used for embedded Dis- standard (Smart Mobility ARChitecture) has playPort (eDP) or for DSI, two Gigabit Ethernet every ingredient to become the best and most ports are now supported, Audio has indepen- future-proof standard for small form-factor dent HDA and I2S ports and up to 4 UARTs are embedded modules. With 314 pins available available. In addition to SPI, also eSPI is sup- on its inexpensive and robust MXM3 connec- ported for attachment of peripheral devices tor, SMARC has ample space for proven and on the baseboard or the application hardware. popular interfaces. In the new standard revi- And still there are a lot of reserved pins left for sion, PCIe now features 4 lanes instead of 3, future upgrades. Never again has it been so USB now covers up to 2x USB 3.0 and up to easy and natural to use ARM-based and x86- 6x USB 2.0 interfaces, LVDS now supports two based computer modules on a modern and up- independent dual-channel connections which to-date module standard. 80 mm The recent revision 2.0 of the SMARC module 50 mm defines two Module sizes: 82mm x 50mm (short size) and 82mm x 80mm (full size). 82 mm 82 mm 42 | www.msc-technologies.eu 43 SMARC™ 2.0 SMARC™ 2.0 MSC SM2F-AL Intel Atom™/Pentium /Celeron SOC ® ® ® MSC SM2S-IMX6 NEW SMARC™ 2.0 SMARC™ 2.0 82 x 80 7/14 W -40... +85 °C The MSC SM2F-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one ® solution. Fast DDR3-1866 memory, eMMC, SATA Flash, USB 3.0 and a on-board Wireless Module are 82 x 50 4/6 W -40... +85 °C integrated on this SMARC 2.0 Full Size module. Highlights The MSC SM2S-IMX6 module is fully compliant with the new SMARC™ 2.0 standard and is based on NXP's i.MX6 CPUs offering quad-, dual- and single-core ARM Cortex-A9 compute performance at very low power consumption and excellent graphics performance combined with a high dregree of functional integration. Highlights • Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W • DisplayPort++ / HDMI interface • Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • LVDS / embedded DisplayPort interface • Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W • Triple Independent Display support • Supports i.MX 6QuadPlus, i.MX 6DualPlus • 1x SATA-II (3Gbps, quad-/dual-core only) • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • DirectX 12, OpenGL 4.3, OpenCL 2.0 • MPEG-4 Video En-/Decoding 1080p, • 1x USB Device/Host + up to 5x USB 2.0 Host • Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W • Dual MIPI CSI-2 Camera Interface • HDMI graphics 1920x1080x30fps, • 1x MMC / SD / SDIO interface • Integrated Intel Gen. 9 HD graphics • Up to 4x PCI Express x1 Gen. 2 • dual-channel LVDS 1920x1080x30fps • 2x CAN interface • Up to 8GB DDR3L SDRAM (ECC option) • 2x USB 3.0 Host, 5x USB 2.0 Host interfaces • Up to 4GB DDR3L DRAM • I2S Audio interface • Up to 64GB eMMC Flash (optional) • 1x USB 2.0 Host/Device interface • Up to 64GB eMMC Flash memory • MIPI CSI-2 camera interface • Up to 64GB SATA NAND Drive (optional) • Gigabit Ethernet, Wireless Module (optional) • SATA-III interface (6Gbps) • Trusted Platform Module (optional) ® ® ® ® ® ® ® ® MSC SM2S-AL Intel Atom™/Pentium /Celeron SOC ® ® ® • NXP™ i.MX6 ARM® Cortex™-A9 quad-, dual-, dual-lite or single-core CPU • 10/100/1000 GbE LAN interface • 1x PCI Express x1 MSC SM2-MB-EP1 NEW SMARC™ 2.0 SMARC™ 2.0 82 x 50 The MSC SM2S-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation 7/14 W that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into ® one solution. Fast LPDDR4 memory, eMMC and USB 3.0 are integrated on this SMARC 2.0 Short -40... +85 °C 170 x 170 2W -40...+85 °C Size module. Highlights The SMARC™ 2.0 Embedded Platform MSC SM2-MB-EP1 offers many embedded interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, SATA, UART/RS232 and CAN as well as DVI/HDMI, embedded DisplayPort and LVDS display interfaces. In addition a PCI Express™ socket and an SD Card socket are supported. Highlights • Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W • DisplayPort++ interface • Socket for SMARC™ 2.0 modules • SATA connector • Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • LVDS / embedded DisplayPort interface • PCI Express x4 slot • Two GbE interfaces • Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W • Triple Independent Display support • SD Card slot • Two CAN interfaces • Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • DirectX 12, OpenGL 4.3, OpenCL 2.0 • Mini-PCI-Express Card slot • I2S audio and HD audio codec • Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W • Dual MIPI CSI-2 Camera Interface • Two USB 3.0 interfaces • Two UART interfaces • Integrated Intel Gen. 9 HD graphics • Up to 4x PCI Express x1 Gen. 2 • USB 2.0 OTG, two USB 2.0 Host • Various additional SMARC™ specific interfaces • Up to 8GB LPDDR4 SDRAM • 2x USB 3.0 Host, 5x USB 2.0 Host interfaces • DVI/HDMI and DisplayPort connectors • Power supply via ATX-style power connector • Up to 64GB eMMC Flash (optional) • 1x USB 2.0 Host/Device interface • LVDS and eDP connectors • Power jack for 12-24V input voltage • SATA-III interface (6Gbps) • Gigabit Ethernet ® ® ® ® ® ® ® ® • Trusted Platform Module (optional) 44 | www.msc-technologies.eu 45 SMARC™ 2.0 - Accessories SMARC™ 2.0 - Accessories SMARC™ 2.0 Cooling Solutions MSC SM2F-SK-AL-EP1 MSC SM2S-SK-AL-EP1 Starterkits for x86-based SMARC™ 2.0 Modules For all its SMARC modules, MSC is offering tai- MSC is providing a heatspreader for each SMARC The SMARC 2.0 Starter Kits for SMARC modules with the Intel E3900 “Apollo Lake” processors are lored cooling solutions which perfectly fit the module, and a single-piece heatsink for the high- based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contain all necessary products to geometry of the COM product. er-performance modules. ® quickly enable the user to run and evaluate the SM2F-AL and SM2S-AL module families, respectively. The kits do not contain a SMARC 2.0 module allowing the user to select the most suitable one from MSC’s offerings. Heatspreaders Full and Short Size Highlights • SMARC 2.0 carrier board in Mini-ITX format with socket for SMARC 2.0 modules • Heatspreader suitable for all module variants of the SM2F-AL or SM2S-AL module families • 12V power supply and cable kit included for immediate operation of the Starterkit • Bootable Linux installation in Flash, ready-to-run • DVI/HDMI graphics output • DisplayPort Connector • LVDS graphics output on standard 30-pin connector; backlight connector includes adjustable backlight voltage and dimming • Ethernet (10/100/1000 LAN) connector • SATA, 4x USB 2.0 Host, USB Host/Client, UART, SD-Card socket • Optional TFT Kits available A heatspreader offers a blank surface allowing to mount a cooling device or to contact the metal housing of a system, while the underside provides contact areas for the heat generating parts of the MSC SM2-SK-IMX6-EP1 module’s geometry. Starterkit for ARM-based SMARC™ 2.0 Modules Heatsinks Full and Short Size The SMARC 2.0 Starter Kit for SMARC modules with the NXP™ i.MX6 processors is based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contains all necessary products to quickly enable the user to run and evaluate the SM2S-IMX6 module range. The kit does not contain a SMARC 2.0 module allowing the user to select the most suitable one from MSC’s offerings. Highlights • SMARC 2.0 carrier board in Mini-ITX format with socket for SMARC 2.0 modules • Heatspreader suitable for all variants of the SM2S-IMX6 module family • 12V power supply and cable kit included for immediate operation of the Starterkit • Bootable Linux installation in Flash, ready-to-run • LVDS graphics output on standard 30-pin connector; backlight connector includes adjustable backlight voltage and dimming • Ethernet (10/100/1000 LAN) connector A heatsink is shaped like the heatspreader, • SATA, 4x USB 2.0 Host, USB Host/Client, UART, SD- but shows cooling fins on the upper side so Card socket • Optional TFT Kits available as to maximize the surface used to dissipate heat into the surrounding air. • DVI/HDMI graphics output 46 | www.msc-technologies.eu 47 Module PCB Depending of socket used Carrier PCB 1.20±0.1 max. 6.00, typ. 3.01.20 (depending on module) 0±0.1 max. 2.501.20±0.1 ® nanoRISC® Properties The nanoRISC module standard has been created nanoRISC modules can be used as a processing The nanoRISC® Standard uses a compact module for applications requiring a small form factor and “supercomponent”, while users only need to add size of 70mm x 50mm. The module PCBs have lowest power consumption. application-specific periphery. The 230-pin MXM 230 edge fingers that mate with a low profile 230 connector used as interface to the baseboard is pin 0.5mm pitch connector called MXM-2 which The nanoRISC modules simplify the design of inexpensive but robust and proven. A variety of is available in abundance, rugged and proven. embedded systems by providing a processor easy-to-use interfaces are available. All popular core with an extensive set of interfaces on a embedded interfaces are included, and addi- small form factor board. Boot loader and adap- tional interfaces can be provided by adding tations for popular Operating Systems will be suitable controllers on the baseboard and con- provided by MSC so that design times will be necting them to the processor bus available on shortened dramatically. the MXM connector. 48 | www.msc-technologies.eu ® 50 mm nanoRISC® 70 mm 49 nanoRISC® 70 x 50 2.5 /4.5 W -40 +85 °C nanoRISC® MSC NANORISC-IMX6 MSC NANORISC-MB2 NXP™ i.MX6 ARM MPU Embedded Platform The MSC NANORISC-IMX6 module is based on the NXP™ Cortex™-A9 processor i.MX6x which is available as quad-core, dual-core and single-core CPU. On the module it is combined with up to 4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB eMMC Flash and Gigabit and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are Highlights Highlights • Graphics Interfaces: HDMI/DVI, LVDS, RGB up to 1920 x 1080, dual independent display support • Socket for nanoRISC compatible modules • ITU656 video input interface on ext. connector • LCD panel interfaces with RGB TTL output • 2x COM ports on 9pin Sub-D connector • Up to 4GByte DDR3 SDRAM soldered • Video decoder and scaler • Backlight power 8..20VDC • I2S audio codec with standard audio connectors • Up to 4GByte SLC NAND Flash soldered • CAN 2.0B, 3x UART, 2x SPI, 2x I²C • Graphics extension connector for optional • SD Card socket • Up to 64Gbyte eMMC Flash • I²S audio interface • Gigabit Ethernet interface • SD V3.0 / SDIO V2.0 / MMC V4.3 • 2x 10/100 Base-T Ethernet interface or GbE • USB 2.0 Host • Parallel bus interface • 2x USB Host, USB OTG Host/Client port • Battery charger support (Lithium cell) • USB 2.0 OTG Host/Client High Speed • Camera interface ITU656 / CSI • Touch Screen support (capacitive + resistive) • 8..20V power supply input graphics modules (LVDS, HDMI) • PCIe, SATA, CAN, Local Bus, SPI, I2S on extension pad field MSC NANORISC- AM335X MSC NANORISC-SK Texas Instruments AM335X Evaluation and Development Kit The MSC NANORISC-AM335X module is based on the Texas Instruments® Cortex™-A8 processor The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC’s range of nanoRISC AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to processor modules. It consists of the nanoRISC Embedded Platform board MB2, a 7-inch WVGA 512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB eMMC Flash and display with capacitive touch and a suitable power supply. ® -40 +85 °C RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C provided. An SD Card socket is supported. clocked up to 1.2GHz 2.0 W -40 +85 °C The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics Ethernet LAN. • NXP™ i.MX6 Cortex™-A9, 1/2/4 core(s) CPU 70 x 50 160 x 110 10/100 Ethernet LAN, optionally second LAN or GbE LAN. Highlights • Evaluation and Development Kit for all Highlights • Texas Instruments Cortex™-A8 CPU AM335x clocked up to 800MHz • CAN 2.0B, 3x UART, 2x SPI, 2x I²C • I²S audio interface nanoRISC modules ® • Includes 7" LCD panel 800 x 480 pixels with • nanoRISC CPU module not contained - please order separately • Complete range of usable interfaces • Up to 512MB DDR3 SDRAM soldered • SD V2.0 / SDIO V1.0 / MMC V4.2 • Up to 512MB SLC NAND Flash soldered • Optional SGX530 graphics acceleration • Power supply included • 1 or 2 USB Host Port (dep. on module) • Up to 64GB eMMC Flash soldered • Optional industrial (Realtime) Ethernet • Integrated Debug Adapter on-board • USB OTG Port (dep. on module) • 10/100 Base-T Ethernet Interface • Commercial and extended commercial • SD Card with pre-installed Linux or Android • CAN Bus, 2x COM Ports on 9-pin Sub-D • Optional 2nd 10/100 LAN or GbE • USB 2.0 HS Host, USB 2.0 HS OTG • RGB 16/18/24 bit up to 1366 x 768 50 | www.msc-technologies.eu temperature range • Support for Linux all required interface cables Operating System to be ordered with CPU module of choice • GbE or 2x 10/100 Base-T (dep. on module) • I2S or AC97 audio codec with standard audio connectors (Android, Windows EC7 on demand) 51 Engineering Leadership HEADQUARTERS STUTENSEE HEADQUARTERS FREIBURG Industriestrasse 16 Munzinger Strasse 3 76297 Stutensee 79111 Freiburg im Breisgau Phone +49 7249 910 0 Phone +49 761 8819 0 Fax Fax +49 7249 799 3 [email protected] www.msc-technologies.eu +49 761 8819 849 AUSTRIA/SLOVENIA FRANCE MALTA SWITZERLAND Aredstrasse 13 Parc Club du Moulin à Vent 33, UB40 Triq Dun Korm, San Ĝwann Industriestrasse 25 A - 2544 Leobersdorf rue du Dr.G. Levy – Bât 10 Phone +356 2148 4804 CH - 8604 Volketswil Phone +43 2256 63975 0 F - 69693 Venissieux Cedex (Lyon) BENELUX COUNTRIES Phone +41 43 355 33 66 Phone +33 472 78 02 61 HUNGARY ROMANIA TURKEY NL - 4815 NG Breda Budafoki út 91-93 West Irodahaz Calea Floreasca 175, et 8 Inonu Cd. Seylan Is Merkezi Phone +31 76 5722 400 H - 1117 Budapest R - 014459 Bucharest 83/6 Kozyatagi TR - 34736 Istanbul Stadionstraat 2, 6th fl Phone +36 1 436 72 29 Phone +40 725 944 401 CZECH REPUBLIC/ POLAND/SLOVAKIA ITALY SPAIN Nádražní 2369/10 Via Vittorio Emanuele II, Nr. 55 Calle Chile 10, 2nd Planta, Oficina 222 CZ - 678 01 Blansko I - 31029 Vittorio Veneto ES - 28290 Las Matas, Madrid Phone +420 516 411 494 Phone +39 0438 939 21 Phone +34 91 721 69 51 www.avnet.com Phone +90 216 411 2333 www.avnet-embedded.eu HEADQUARTERS USA AND CANADA DENMARK ITALY Phone +45 3678 6250 Phone +39 02 660 92 1 Phone +1 480-643-2000 [email protected] [email protected] FINLAND SOUTH AFRICA Phone +358 20 749 9 260 Phone +27 11 319 8600 [email protected] [email protected] FRANCE SWEDEN/NORWAY Phone +33 1 64 47 29 29 Phone +46 8 587 46 400 [email protected] [email protected] ISRAEL UNITED KINGDOM Phone +972 9 7780 280 Phone +44 1628 518 900 [email protected] [email protected] [email protected] AUSTRALIA Phone +61 3 97604250 [email protected] NEW ZEALAND Phone +64 3 9620580 [email protected] © MSC Technologies. All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions. All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.