Transcript
CPC1008N Single-Pole, Normally Open 4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max)
Rating 100 150 8
Units VP mArms / mADC
Features • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • Low Drive Power Requirements • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Wave Solderable • Tape & Reel Version Available
Description CPC1008N is a miniature, low-voltage, low on-resistance, single-pole, normally open (1-Form-A) solid state relay in a 4-Pin SOP package. It uses IXYS Integrated Circuits Division’s patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation. Using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging, the CPC1008N is one of the world’s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays.
Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security Systems • Aerospace • Industrial Controls • Reed Relay Replacement
Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: Certificate B 13 12 82667 003 Ordering Information Part # CPC1008N CPC1008NTR
Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel)
Pin Configuration + Control
– Control
1
4
3
2
Load
Load
Switching Characteristics of Normally Open Devices Form-A IF 90% 10%
ILOAD ton
DS-CPC1008N-R10
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INTEGRATED CIRCUITS DIVISION
CPC1008N
Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms)
Ratings Units
100 5 50 1 Input Power Dissipation 70 Total Power Dissipation 1 400 Isolation Voltage, Input to Output (60 Seconds) 1500 Operational Temperature -40 to +85 Storage Temperature -40 to +125 1
VP V mA A mW mW Vrms °C °C
Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC Parameter Conditions Symbol Output Characteristics Load Current Continuous 1 IL Peak t=10ms ILPK On-Resistance 2 IL=150mA RON Off-State Leakage Current VL=100VP ILEAK Switching Speeds ton Turn-On IF=5mA, VL=10V Turn-Off toff COUT Output Capacitance IF=0mA, VL=50V, f=1MHz Input Characteristics Input Control Current to Activate 3 IL=150mA IF Input Control Current to Deactivate IF Input Voltage Drop IF=5mA VF IR Reverse Input Current VR=5V Common Characteristics Capacitance, Input to Output CI/O 1 2 3
2
Min
Typ
Max
Units
-
4.8 -
150 ±350 8 1
mArms / mADC mAP
-
1 0.17 6
2 1 -
0.2 0.9 -
0.45 1.2 -
2 1.4 10
mA mA V µA
-
1
-
pF
µA
ms pF
Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC. Measurement taken within 1 second of on time. For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC1008N
PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)* Typical LED Forward Voltage Drop (N=50, IF=5mA)
15 10 5
15
10
5
0
0 1.250
1.255 1.260 1.265 1.270 LED Forward Voltage (V)
Typical IF for Switch Operation (N=50, IL=100mA)
5
0 0.40
0.42 0.45 0.47 LED Current (mA)
0.50
IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA
1.0 -40
-20
20 40 60 Temperature (ºC)
80
5
5.4
106
5.6
109
112 115 118 121 Blocking Voltage (VP)
124
Typical Turn-Off Time vs. LED Forward Current
2.5
0.25
2.0
0.20
1.5 1.0 0.5
0.15 0.10 0.05 0.00
0
100
Typical IF for Switch Operation vs. Temperature (IL=120mA)
1.0
4.8 5.0 5.2 On-Resistance (:)
0.0 0
10
0 4.6
Turn-Off Time (ms)
1.3
15
Typical Turn-On Time vs. LED Forward Current
Turn-On Time (ms)
LED Forward Voltage (V)
20
5
4.4
1.6
1.1
Typical Blocking Voltage Distribution (N=50)
10
Typical LED Forward Voltage Drop vs. Temperature
1.4
5
0.166 0.168 0.170 0.172 0.174 0.176 0.178 Turn-Off Time (ms)
15
0.53
1.5
10
1.15
0 0.38
1.2
0.95 1.00 1.05 1.10 Turn-On Time (ms)
Device Count (N)
Device Count (N)
Device Count (N)
10
0.90
Typical On-Resistance Distribution (N=50, IF=2mA, IL=150mA)
20
15
15
0 0.85
1.275
20
Typical Turn-Off Time (N=50, IF=5mA, IL=100mA)
20
Device Count (N)
20
20
Device Count (N)
Device Count (N)
25
Typical Turn-On Time (N=50, IF=5mA, IL=100mA)
10
20 30 LED Current (mA)
40
50
0
10
20 30 LED Current (mA)
40
50
Typical Turn-Off Time vs. Temperature
Typical Turn-On Time vs. Temperature 1.0
1.6
0.6 0.4 0.2
1.2
Turn-Off Time (ms)
0.8
Turn-On Time (ms)
LED Current (mA)
1.4 IF=5mA
1.0 0.8 0.6
IF=10mA
0.4
0.8
IF=10mA IF=5mA
0.6 0.4 0.2
0.2 0.0
0.0
0.0 -40
-20
0
20 40 60 Temperature (ºC)
80
100
-40
-20
0
20 40 60 Temperature (ºC)
80
100
-40
-20
0
20 40 60 Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R10
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INTEGRATED CIRCUITS DIVISION
CPC1008N
PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)* Typical On-Resistance vs. Temperature (IF=2mA, IL=120mA)
10
Typical Load Current vs. Load Voltage (IF=2mA)
200
Maximum Load Current vs. Temperature (IF=5mA)
160
6 4 2
Load Current (mA)
8
Load Current (mA)
On-Resistance (:)
150 100 50 0 -50 -100
-40
-20
0
20 40 60 Temperature (ºC)
80
-200 -1.0
100
20
116 114 112
-0.5
0.0 0.5 Load Voltage (V)
15 10
0
108 -40
-20
0
20 40 60 Temperature (ºC)
80
100
-40
-20
0
20 40 60 Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz)
50
5
110
120
100
1.0
Output Capacitnace (pF)
118 Leakage (nA)
Blocking Voltage (VP)
25
130
Typical Leakage vs. Temperature (VL=100V)
Typical Blocking Voltage vs. Temperature 120
140
110
-150 0
150
40 30 20 10 0
-40
-20
0
20 40 60 Temperature (ºC)
80
100
10s
100s
0
20
40 60 Load Voltage (V)
80
100
Energy Rating Curve
Load Current (A)
1.0 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time (s)
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC1008N
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device
Moisture Sensitivity Level (MSL) Rating
CPC1008N
MSL 3
ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device
Maximum Temperature x Time
CPC1008N
260ºC for 30 seconds
Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1008N MECHANICAL DIMENSIONS
CPC1008N 4.089 ± 0.203 (0.161 ± 0.008)
Recommended PCB Land Pattern 0.200 ± 0.025 (0.008 ± 0.001)
0.60 (0.0217)
6.096 ± 0.102 (0.240 ± 0.004)
3.810 ± 0.076 (0.150 ± 0.003)
0.432 ± 0.127 (0.017 ± 0.005)
5.60 (0.2205)
1.02 ± 0.025 (0.040 ± 0.001)
Pin 1 2.54 Typ (0.100 Typ)
1.30 (0.0512)
2.184 Max (0.086 Max)
2.54 (0.10) Lead to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015)
0.762 ± 0.102 (0.030 ± 0.004)
Dimensions mm (inches)
0.381 TYP. (0.015 TYP.)
CPC1008NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max)
W=12.00 (0.472)
B0=4.70 (0.185)
K0=2.70 (0.106) K1=2.30 (0.091)
P=8.00 (0.315)
A0=6.50 (0.256)
User Direction of Feed Dimensions mm (inches)
Embossed Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC1008N-R10 ©Copyright 2014, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/18/2014
