Transcript
ACMD-7601 Miniature UMTS Band I Duplexer
Data Sheet
Description
Features
The Avago Technologies ACMD-7601 is a miniature duplexer designed for UMTS Band I handsets.
• Miniature Size 3.8 x 3.8 mm footprint 1.3 mm maximum height
The ACMD-7601 is designed with Avago Technologies Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. The ACMD-7601 also utilizes Avago Technologies innovative Microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a molded chip-on-board module that is less than 1.3 mm high with a footprint of only 3.8 mm x 3.8 mm. The ACMD-7601 enhances the sensi-tivity and dynamic range of UMTS Band I receivers by providing more than 51 dB attenuation of the transmitted signal at the receiver input and more than 45 dB rejection of transmit-generated noise in the receive band.
• Lead-Free Construction
Specifications • Rx Band Performance, 2110-2170 MHz, –30 to +85°C - Rx Noise Blocking: 45 dB min - Insertion Loss: 2.0 dB max • Tx Band Performance, 1920-1980 MHz, –30 to +85°C - Tx Interferer Blocking: 51 dB min - Insertion Loss: 1.6 dB max
Applications • Handsets or data terminals operating in the UMTS band I
Functional Block Diagram Ant
• High Power Rating 33 dBm Abs Max Tx Power
Port 3
Tx
Rx
Port 1
Port 2
Maximum Insertion Loss in the Tx channel is only 1.6 dB, which minimizes current drain from the power amplifier. Insertion Loss in the Rx channel is a maximum of 2.0 dB, improving receiver sensitivity. The excellent power handling capability of the FBAR bulk-mode resonators supports the high output power levels needed in UMTS Band I handsets while adding virtually no distortion.
ACMD-7601 Electrical Specifications, Z0=50 &!, TC [1] as indicated -30 to +85°C [2] Symbol
Parameter
Units
Min
Typ [3]
Max
Antenna Port to Receive Port S23
Insertion Loss in Receive Band (2110 - 2170 MHz)
dB
1.6
2.0
∆S23
Ripple (p-p) in Receive Band
dB
0.4
1.0
∆S23
Ripple (p-p) in any 5 MHz Channel within Receive Band
dB
−
0.5
S22
Return Loss of Receive Port in Receive Band
dB
10
15
S23
Attenuation 0 - 1900 MHz
dB
25
33
S23
Attenuation in Transmit Band (1920 - 1980 MHz)
dB
51
66
dB
37
46
dB
15
31
dB
15
31
[4]
S23
Attenuation in Bluetooth Band (2400 - 2500 MHz)
S23
Attenuation 2500 - 4150 MHz
S23
[4]
[4]
nd
Attenuation in Receive 2 Harmonic Band (4220 - 4340 MHz)
[4]
Transmit Port to Antenna Port S31
Insertion Loss in Transmit Band (1920 - 1980 MHz)
dB
1.2
1.6
∆S31
Ripple (p-p) in Transmit Band
dB
0.4
1.0
∆S31
Ripple (p-p) in any 5 MHz Channel within Transmit Band
dB
−
0.5
S11
Return Loss of Transmit Port in Transmit Band
dB
10
13
dB
30
40
dB
45
54
dB
32
35
dB
20
28
dB
10
13
[4]
S31
Attenuation 0 - 1800 MHz
S31
Attenuation in Receive Band (2110 - 2170 MHz)
S31 S31
Attenuation in Bluetooth Band (2400 - 2500 MHz)
[4]
Attenuation in Transmit 2nd Harmonic Band (3840 - 3960 MHz)
[4]
Antenna Port S33
Return Loss of Antenna Port in Transmit and Receive Bands Isolation Transmit Port to Receive Port
S21
Tx-Rx Isolation in Transmit Band (1920 - 1980 MHz)
dB
51
60
S21
Tx-Rx Isolation in Receive Band (2110 - 2170 MHz)
dB
48
56
Notes: 1. TC is the case temperature and is defined as the temperature of the underside of the duplexer where it makes contact with the circuit board. 2. Specifications are guaranteed over –30 to 85°C temperature range with the input power to the Tx port equal to or less than +29 dBm over all Tx frequencies, unless otherwise noted. 3. Typical data is the average value of the parameter over the indicated band at 25°C. Refer to “Characterization” section for measurement details. 4. Specification guaranteed at 25°C.
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Absolute Maximum Ratings [1] Parameter
Unit
Value
Storage temperature
°C
-65 to +125
Maximum RF Input Power to Tx Port
dBm
+33
Unit
Value
Maximum Recommended Operating Conditions [2] Parameter Operating temperature, Tc
[3]
, Tx Power ≤ 29 dBm
°C
-40 to +100
Operating temperature, Tc
[3]
, Tx Power ≤ 30 dBm
°C
-40 to +85
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.
0.0
0.0
-0.5
-0.5
Insertion Loss (dB)
Insertion Loss (dB)
ACMD-7601 Typical Performance at Tc = 25°C.
-1.0 -1.5 -2.0 -2.5 -3.0 1920
-1.0 -1.5 -2.0 -2.5
1930
1940
1950
1960
1970
-3.0 2110
1980
2120
Frequency (MHz)
2150
2160
2170
Figure 2. Rx Band Insertion Loss.
0
0
-5
-10
Insertion Loss (dB)
Return Loss (dB)
2140
Frequency (MHz)
Figure 1. Tx Band Insertion Loss.
-10
-15 Rx
Tx
-20
2130
-20
Tx
Rx
-30 -40 -50
-25 1800
1900
2000
2100
Frequency (MHz)
2200
2300
-60 1800
1900
2000
2100
2200
2300
Frequency (MHz)
Figure 3. Tx and Rx Port Return Loss.
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Figure 4. Tx Rejection in Rx Band and Rx Rejection in Tx Band.
-40
0
-5
Return Loss (dB)
Insertion Loss (dB)
-50
-60
-70
-10
-15
-20 -80 1800
1900
2000
2100
2200
-25 1800
2300
Frequency (MHz)
1900
2000
2100
2200
2300
Frequency (MHz)
Figure 6. Antenna Port Return Loss.
0
0
-10
-10
Insertion Loss (dB)
Insertion Loss (dB)
Figure 5. Tx to Rx Isolation.
-20
-30
-40
-20
-30
-40
-50 3.6
3.8
4.0
4.2
-50
4.4
3.6
3.8
4.0
Frequency (GHz)
-20
-20
-30
-30
-40
-50
-40
-50
2.35
2.40
2.45
2.50
2.55
Frequency (GHz)
Figure 9. Tx Bluetooth Rejection, 2400–2500 MHz.
4
4.4
Figure 8. Rx Second Harmonic Rejection.
Insertion Loss (dB)
Insertion Loss (dB)
Figure 7. Tx Second Harmonic Rejection.
-60 2.30
4.2
Frequency (GHz)
2.60
-60 2.30
2.35
2.40
2.45
2.50
2.55
Frequency (GHz)
Figure 10. Rx Bluetooth Rejection, 2400–2500 MHz.
2.60
0
0
-10
Tx
-20
Insertion Loss (dB)
Insertion Loss (dB)
-10
Rx -30 Rx -40
Tx
-50
-20 -30 -40 -50
-60 0
1
2
3
4
5
6
-60
Frequency (GHz)
0.0
0.5
1.0
1.5
2.0
4.0
4.5
Frequency (GHz)
Figure 12. Tx Rejection, 0–1800 MHz.
0
0
-10
-10
Insertion Loss (dB)
Insertion Loss (dB)
Figure 11. Tx and Rx Wideband Response.
-20 -30 -40 -50
-30 -40 -50
-60
-60 0.0
0.5
1.0 Frequency (GHz)
Figure 13. Rx Rejection, 0–1900 MHz.
5
-20
1.5
2.0
2.5
3.0
3.5 Frequency (GHz)
Figure 14. Rx Rejection, 2500–4150 MHz.
Characterization The test circuit shown in Figure 15 was used to measure typical device performance. This circuit is designed to interface with coplanar Ground-Signal-Ground (GSG) RF probes of the type used to test semiconductor wafers. The test circuit is a 7 x 7 mm PCB with a well-grounded pad to which the device under test (DUT) is soldermounted.
Figure 15. GSG Probe Test Circuit.
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Short lengths of 50-ohm microstripline connect the DUT to GSG probe patterns on the board. A test circuit with the DUT mounted in place is shown in Figure 16. S-parameters are then measured using a network analyzer and calibrated GSG probe set. Phase data for s-parameters measured with GSG probe circuits are adjusted to place the reference plane at the edge of the duplexer.
Figure 16. Test Circuit with Duplexer.
PACKAGE ORIENTATION
3.8 MAX
RX
SOLDER MASK OVER INTERNAL VIAS (2 PLS)
1.3 MAX
[PRODUCT MARKING]
3.8 TX MAX
TX
RX
3.66
ANT
ANT 3.66 TOP VIEW
BOTTOM VIEW
Notes: 1. Dimensions in millimeters 2. Dimensions nominal unless otherwise noted 3. Tolerance: X.X = ± 0.1 X.XX = ±0.05 4. I/O pads (3 ea) Size: 0.40 x 0.40 Spacing to ground plane: 0.40 Ground inside corner chamfers: 0.35 x 0.35 5. Contact areas are gold plated 6. Internal vias (2 ea) shown for reference only; covered with Ø 0.51 mm solder mask Figure 17. Package Outline Drawing.
PACKAGE ORIENTATION
RX
TX
ANT Figure 18. Product Marking.
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N = ACMD-7601 FB = Avago ID Y = Year WW = Work Week DC = Date Code NNNN = Lot Number
1.0
1.8
1.0
1.2
1.2 0.8 0.2 0.4 0.3
1.0
1.8
T
W
1.4
Figure 19. Recommended PCB Land Print.
Figure 20. Duplexer Superposed on PCB Land Print.
8
1.2
1.2
0.3 0.4 0.2 0.5 0.3
1.4
0.3 0.5 0.2 0.4 0.3
1.2
Notes: Dimensions in mm All vias Ø 0.40 Angles 45° RF ports are CPW T and W selected for 50 ohms Pattern centered on Duplexer
1.2
0.3 0.6
10.0 1.00 10.0 1.00
34.0 3.40
16.3 1.63 0.40 4.0
12.5 1.25
2.70 27.0
3.25
Figure 22. Duplexer Superposed on Solder Stencil.
Notes: Dimensions in mm Solder stripes (14 pls) are 0.20 wide, pitch = 0.40 Solder pads for I/O are 0.35 X 0.35 Stencil pattern is centered on duplexer Figure 21. Recommended Solder Stencil.
300 250
Temperature, ˚C
200 150 100 50 0 0
50
100
150 200 Time, seconds
Figure 23. Verified SMT Solder Profile.
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250
300
Figure 24. SMD Tape Packing.
SPROCKET HOLES
PACKAGE PIN 1 ORIENTATION
TAPE WIDTH
POCKET CAVITY Figure 25. Unit Orientation In Tape.
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OrderingInformation
Part Number
No. of Devices
Container
ACMD-7601-BLK
25
Anti-static Bag
ACMD-7601-TR1
1000
7-inch Reel
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited, in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-3075EN AV01-0603EN - November 16, 2006
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