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Datasheet For Aoi4130 By Alpha And Omega Semiconductor

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AOD4130/AOI4130 60V N-Channel MOSFET General Description Product Summary The AOD4130/AOI4130 combines advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). This device is ideal for boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting. VDS 60V 30A ID (at VGS=10V) RDS(ON) (at VGS=10V) < 24mΩ RDS(ON) (at VGS=4.5V) < 30mΩ 100% UIS Tested 100% Rg Tested TO252 DPAK TopView Top View Bottom View TO-251A IPAK D D S D D G G Gate-Source Voltage S VGS TC=25°C Pulsed Drain Current C Continuous Drain Current Avalanche Current C IAS, IAR Avalanche energy L=0.1mH C TC=25°C EAS, EAR Power Dissipation B TA=25°C Power Dissipation A Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Case Rev 1: June 2011 Steady-State Steady-State A A 27 A 36.5 mJ 52 W 25 2.5 RθJA RθJC W 1.6 TJ, TSTG Symbol t 1 10s V 5 PDSM TA=70°C ±20 6.5 PD TC=100°C Units V 74 IDSM TA=70°C Maximum 60 20 IDM TA=25°C S D 30 ID TC=100°C G D Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage Continuous Drain Current G S S G D Bottom View -55 to 175 Typ 12.4 34 2.4 www.aosmd.com °C Max 20 50 2.9 Units °C/W °C/W °C/W Page 1 of 6 AOD4130/AOI4130 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS Drain-Source Breakdown Voltage BVDSS IDSS Zero Gate Voltage Drain Current Conditions Min ID=250µA, VGS=0V Max 60 1 TJ=55°C µA 5 IGSS Gate-Body leakage current VDS=0V, VGS= ±20V Gate Threshold Voltage VDS=5V, ID=250µA 1.6 ID(ON) On state drain current VGS=10V, VDS=5V 74 Units V VDS=60V, VGS=0V VGS(th) 100 nA 2.2 2.8 V 19.5 24 37.5 45 VGS=4.5V, ID=20A 24 30 55 VGS=10V, ID=20A RDS(ON) Typ Static Drain-Source On-Resistance TJ=125°C gFS Forward Transconductance VDS=5V, ID=20A VSD Diode Forward Voltage IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current G DYNAMIC PARAMETERS Ciss Input Capacitance A 0.76 mΩ mΩ S 1 V 46 A 1265 1582 1900 pF VGS=0V, VDS=30V, f=1MHz 70 100 130 pF 40 67 95 pF VGS=0V, VDS=0V, f=1MHz 1.8 3.6 5.4 Ω SWITCHING PARAMETERS Qg(10V) Total Gate Charge 23 28.3 34 nC Qg(4.5V) Total Gate Charge 11 13.4 16 nC 3.6 4.5 5.4 nC 4.3 7.2 10 nC Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime VGS=10V, VDS=30V, ID=20A VGS=10V, VDS=30V, RL=1.5Ω, RGEN=3Ω 7.5 ns 6.5 ns 33 ns tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs 15 7.5 22 30 ns Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs 53 76 100 ns nC A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allow s it. B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse ratin g. G. The maximum current rating is package limited. H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 1: June 2011 www.aosmd.com Page 2 of 6 AOD4130/AOI4130 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 80 80 10V VDS=5V 6V 40 60 ID(A) 60 ID (A) 4.5V 4V 40 125°C 20 20 25°C VGS=3.5V 0 0 0 1 2 3 4 0 5 1 30 Normalized On-Resistance VGS=4.5V RDS(ON) (mΩ ) 3 4 5 6 2.8 25 20 VGS=10V 15 10 2.4 VGS=10V ID=20A 2 17 5 2 10 1.6 VGS=4.5V ID=20A 1.2 0.8 0 15 20 25 30 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 5 10 0 25 50 75 100 125 150 175 200 0 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 18 (Note E) 60 1.0E+02 ID=20A 1.0E+01 50 40 125°C 1.0E+00 40 IS (A) RDS(ON) (mΩ ) 2 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) 30 20 125°C 1.0E-01 25°C 1.0E-02 1.0E-03 25°C 1.0E-04 10 1.0E-05 0 2 4 6 8 10 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev 1: June 2011 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 AOD4130/AOI4130 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 2500 10 VDS=30V ID=20A 2000 Capacitance (pF) VGS (Volts) 8 6 4 Ciss 1500 1000 Coss 500 2 Crss 0 0 0 5 10 15 20 25 Qg (nC) Figure 7: Gate-Charge Characteristics 0 30 10 20 30 40 50 VDS (Volts) Figure 8: Capacitance Characteristics 60 500 1000.0 10µs 100.0 TJ(Max)=175°C TC=25°C 400 RDS(ON) limited 10.0 100µs 1ms DC 1.0 TJ(Max)=175°C TC=25°C 0.1 Power (W) ID (Amps) 10µs 17 5 2 10 300 200 100 0.0 0 0.01 0.1 1 VDS (Volts) 10 100 0.0001 0.001 0.01 0.1 1 10 0 Pulse Width (s) 18 Figure 10: Single Pulse Power Rating Junction-toCase (Note F) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) Zθ JC Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 40 RθJC=2.9°C/W 0.1 PD 0.01 Ton T Single Pulse 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev 1: June 2011 www.aosmd.com Page 4 of 6 AOD4130/AOI4130 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 100 60 IAR (A) Peak Avalanche Current TA=25°C Power Dissipation (W) 50 TA=100°C TA=150°C TA=125°C 40 30 20 10 10 0 1 10 100 1000 Time in avalanche, tA (µ µs) Figure 12: Single Pulse Avalanche capability (Note C) 0 25 50 75 100 150 175 10000 35 TA=25°C 30 1000 25 Power (W) Current rating ID(A) 125 TCASE (°C) Figure 13: Power De-rating (Note F) 20 15 17 5 2 10 100 10 10 5 1 0.00001 0 0 25 50 75 100 125 150 0.001 0.1 10 1000 0 18 175 TCASE (°C) Figure 14: Current De-rating (Note F) Pulse Width (s) Figure 15: Single Pulse Power Rating Junction-toAmbient (Note H) Zθ JA Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 40 RθJA=50°C/W 0.1 PD 0.01 Single Pulse Ton T 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance (Note H) Rev 1: June 2011 www.aosmd.com Page 5 of 6 AOD4130/AOI4130 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC - DUT Vgs Ig Charge Resistive Switching Test Circuit & Waveforms RL Vds Vds 90% + Vdd DUT Vgs VDC - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf toff Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L 2 E AR = 1/2 LIAR Vds BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Test Circuit & Waveforms Q rr = - Idt Vds + DUT Vds Isd Vgs Ig Rev 1: June 2011 Vgs L Isd + Vdd t rr dI/dt I RM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6