Transcript
Advanced Power Electronics Corp.
AP2325GEU6-HF-3
P-channel Enhancement-mode Power MOSFET Simple Gate Drive
D BV DSS
Small Package Outline
G
Low Gate Charge
-20V
R DS(ON)
145mΩ
ID
RoHS-compliant, halogen-free
-1.8A
S
Description S
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost-effectiveness.
D
D
The AP2325GEU6-HF-3 is in the popular SOT-363 ultra-small surface-mount package which is widely used in commercial and industrial applications where a small board footprint is required. This device is well suited for use in applications such as load switches.
D
G
D
SOT-363 (SC-70-6)
Absolute Maximum Ratings Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID at TA =25°C ID at TA= 70°C
Rating
Units
-20
V
±12
V
Continuous Drain Current
3
-1,8
A
Continuous Drain Current
3
-1.5
A
-7.2
A
0.74
W
1
IDM
Pulsed Drain Current
PD at TA=25°C
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 150
°C
TJ
Operating Junction Temperature Range
-55 to 150
°C
Thermal Data Parameter
Symbol Rthj-a
Maximum Thermal Resistance, Junction-ambient
3
Value
Unit
170
°C/W
Ordering Information AP2325GEU6-HF-3TR
RoHS-compliant halogen-free SOT-363, shipped on tape and reel, 3000pcs/reel
©2013 Advanced Power Electronics Corp. USA www.a-powerusa.com
201308261-3
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Advanced Power Electronics Corp.
AP2325GEU6-HF-3
Electrical Specifications at Tj=25°C (unless otherwise specified) Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=-250uA
-20
-
-
V
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-4.5V, ID=-1.5A
-
120
145
mΩ
VGS=-2.5V, ID=-1.0A
-
145
200
mΩ
-0.3
-0.7
-1
V
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
gfs
Forward Transconductance
VDS=-5V, ID=-1A
-
4.6
-
S
IDSS
Drain-Source Leakage Current
VDS=-16V, VGS=0V
-
-
-10
uA
IGSS
Gate-Source Leakage
VGS=±12V, VDS=0V
-
-
±30
uA
Qg
Total Gate Charge
ID=-1A
-
6
9.6
nC
Qgs
Gate-Source Charge
VDS=-10V
-
1
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-4.5V
-
2
-
nC
td(on)
Turn-on Delay Time
VDS=-10V
-
4
-
ns
tr
Rise Time
ID=-1A
-
22
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω
-
16
-
ns
tf
Fall Time
VGS=-5V
-
18
-
ns
Ciss
Input Capacitance
VGS=0V
-
500
800
pF
Coss
Output Capacitance
VDS=-10V
-
70
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
55
Min.
Typ.
-
-
pF -
pF
Source-Drain Diode Symbol
Parameter 2
Forward On Voltage
VSD
Test Conditions IS=-0.6A, VGS=0V
Max. Units -1.2
V
trr
Reverse Recovery Time
IS=-1A, VGS=0V,
-
15
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
7
-
nC
Notes: 1. Pulse width limited by maximum junction temperature. 2. Pulse test - pulse width < 300µs , duty cycle < 2%
3.Surface mounted on 1in2 copper pad of FR4 board ; 260°C/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. ©2013 Advanced Power Electronics Corp. USA www.a-powerusa.com
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Advanced Power Electronics Corp.
AP2325GEU6-HF-3
Typical Electrical Characteristics 8
10
-5.0V -4.5V -3.5V -2.5V
-ID , Drain Current (A)
8
T A = 150 o C
-ID , Drain Current (A)
T A =25 o C
6
V G = -2.0V 4
-5.0V -4.5V -3.5V -2.5V
6
V G = -2.0V 4
2
2
0
0
0
2
4
6
8
0
3
4
5
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
200
2
I D = -1A
I D = -1.5A V GS = -4.5V
T A =25 o C 1.6
Normalized RDS(ON)
180
RDS(ON) (mΩ )
2
1
-V DS , Drain-to-Source Voltage (V)
160
140
1.2
0.8
0.4
120
0
100 1
2
3
4
-50
5
-V GS , Gate-to-Source Voltage (V)
Fig 3.
0
50
100
150
T j , Junction Temperature ( o C)
On-Resistance vs. Gate Voltage
Fig 4. Normalized On-Resistance vs. Junction Temperature
2
2
I D = -250uA 1.6
T j =150 o C
Normalized -VGS(th)
1.6
T j =25 o C
-IS(A)
1.2
0.8
1.2
0.8
0.4
0.4
0
0 0
0.2
0.4
0.6
0.8
1
1.2
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of Reverse Diode
©2013 Advanced Power Electronics Corp. USA www.a-powerusa.com
1.4
-50
0
50
T j , Junction Temperature (
100
o
150
C)
Fig 6. Gate Threshold Voltage vs. Junction Temperature
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Advanced Power Electronics Corp.
AP2325GEU6-HF-3
Typical Electrical Characteristics (cont.) f=1.0MHz 8
800
6
600
C (pF)
-VGS , Gate to Source Voltage (V)
I D = -1A V DS = -10V
C iss
4
400
2
200
0
0 0
2
4
6
8
C oss C rss 1
10
5
9
13
17
21
25
-V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
10
1
100us
DUTY=0.5
Normalized Thermal Response (Rthja)
Operation in this area limited by RDS(ON)
1ms -ID (A)
1
10ms
100ms 0.1
1s DC
o
T A =25 C Single Pulse 0.01
0.2
0.1
0.1
0.05
PDM
0.02
t
0.01
T
0.01
Duty factor = t/T Peak Tj = PDM x Rthja + T a
Single Pulse
Rthja = 260°C/W
0.001 0.1
1
10
100
0.0001
0.001
0.01
-V DS , Drain-to-Source Voltage (V)
0.1
1
10
100
1000
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
p Fig 10. Effective Transient Thermal Impedance
2.4
VG -ID , Drain Current (A)
2
QG
1.6
-4.5V QGS
1.2
QGD
0.8
0.4
Charge
Q
0 25
50
75
100
125
150
T A , Ambient Temperature ( o C )
Fig 11. Switching Time Waveform
©2013 Advanced Power Electronics Corp. USA www.a-powerusa.com
Fig 12. Gate Charge Waveform
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Advanced Power Electronics Corp.
AP2325GEU6-HF-3
Package Dimensions: SOT-363 Millimeters
D
b
E1
E
SYMBOLS
MIN
NOM
MAX
A
0.80
0.95
1.10
A1
0.00
0.05
0.10
A2
0.70
0.85
1.00
b
0.15
0.25
0.35
C
0.05
0.15
0.25
D
1.80
2.00
2.20
E1
1.15
1.25
1.35
E
1.80
2.15
2.50
0.65 (ref.)
e L
e
A
A2
0.26
0.36
0.46
1. All dimensions are in millimeters. 2. Dimensions do not include mold protrusions.
A1
C L
Marking Information:
Product: .4U = AP2325GEU6-HF-3
.4UXX
©2013 Advanced Power Electronics Corp. USA www.a-powerusa.com
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