Transcript
Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
P-channel Enhancement-mode Power MOSFET Lower On-resistance
D
Simple Drive Requirement
BV DSS
Fast Switching Characteristic
RDS(ON) G
RoHS-compliant, halogen-free
-60V 64mΩ
ID
-17A
S
Description
D (tab)
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost-effectiveness.
G
The AP9575AGH-HF-3 is in the TO-252 package, which is widely used for commercial and industrial surface-mount applications, and is well suited for low voltage applications such as DC/DC converters. The AP9575AGJ-HF-3 is in the TO-251 through-hole package which is used where a small PCB footprint or an attached heatsink is required.
D
S
TO-252 (H)
D (tab) G
D
TO-251 (J)
S
Absolute Maximum Ratings Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID at TA=25°C ID at TA=100°C
Rating
Units
-60
V
±30
V
Continuous Drain Current
3
-17
A
Continuous Drain Current
3
-11
A
-60
A
36
W
1
IDM
Pulsed Drain Current
PD at TA=25°C
Total Power Dissipation Linear Derating Factor
0.29
W/°C
TSTG
Storage Temperature Range
-55 to 150
°C
TJ
Operating Junction Temperature Range
-55 to 150
°C
Thermal Data Symbol
Parameter
Rthj-c
Maximum Thermal Resistance, Junction-case
Rthj-a
Maximum Thermal Resistance, Junction-ambient (PCB Mount)3
Rthj-a
Maximum Thermal Resistance, Junction-ambient
Value
Unit
3.5 62.5
°C/W °C/W
110
°C/W
Ordering Information AP9575AGH-HF-3TR : in RoHS-compliant halogen-free TO-252, shipped on tape and reel (3000 pcs/reel) AP9575AGJ-HF-3TB : in RoHS-compliant halogen-free TO-251, shipped in tubes (80pcs/tube)
©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
201105313-3 1/6
Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
Electrical Specifications at Tj=25°C (unless otherwise specified) Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=-250uA
-60
-
-
V
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-10V, ID=-12A
-
-
64
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-1
-
-3
V
gfs
Forward Transconductance
VDS=-10V, ID=-9A
-
12
-
S
IDSS
Drain-Source Leakage Current
VDS=-60V, VGS=0V
-
-
-10
uA
Drain-Source Leakage Current (T j=125 C) VDS=-48V, VGS=0V
-
-
-250
uA
Gate-Source Leakage
VGS=±30V, VDS=0V
-
-
±100
nA
ID=-12A
-
35
56
nC
o
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=-48V
-
5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-10V
-
12
-
nC
VDS=-30V
-
12
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=-12A
-
23
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω ,VGS=-10V
-
45
-
ns
tf
Fall Time
RD=2.5Ω
60
-
ns
Ciss
Input Capacitance
VGS=0V
-
1440 2300
pF
Coss
Output Capacitance
VDS=-25V
-
160
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
120
-
pF
Min.
Typ.
IS=-12A, VGS=0V
-
-
-1.3
V
Source-Drain Diode Symbol VSD
Parameter 2
Forward On Voltage
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=-12A, VGS=0V,
-
43
-
ns
Qrr
Reverse Recovery Charge
dI/dt=-100A/µs
-
75
-
nC
Notes: 1.Pulse width limited by safe operating area 2.Pulse test - pulse width < 300µs, duty cycle < 2%
3.Surface mounted on 1 in2 copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. ©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
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Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
Typical Electrical Characteristics 60
40
-10V -7.0V
40
-5.0V -4.5V 20
V G =-3.0V
30
-5.0V 20
-4.5V V G =- 4 .0V
10
0
0 0
2
4
6
8
0
10
2
-V DS , Drain-to-Source Voltage (V)
4
6
8
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
210
2.0
I D = -9 A T C =25 ° C
I D = - 12 A V G =-10V
1.8
Normalized RDS(ON)
170
RDS(ON) (mΩ )
-10V -7.0V
TC=150oC -ID , Drain Current (A)
-ID , Drain Current (A)
T C =25 o C
130
90
1.6
1.4
1.2
1.0
0.8
0.6
50
0.4 2
4
6
8
10
-50
50
100
150
Fig 4. Normalized On-Resistance vs. Junction Temperature
16.0
3.0
12.0
2.5
-VGS(th) (V)
-IS(A)
Fig 3. On-Resistance vs. Gate Voltage
T j =150 o C
0
T j , Junction Temperature ( o C)
-V GS , Gate-to-Source Voltage (V)
T j =25 o C
8.0
4.0
2.0
1.5
0.0
1.0 0
0.2
0.4
0.6
0.8
1
1.2
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of Reverse Diode
©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
1.4
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage vs. Junction Temperature
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Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
12
2400
10
2000
8
f=1.0MHz
1600
I D = -12A V DS = -48V
C (pF)
-VGS , Gate to Source Voltage (V)
Typical Electrical Characteristics (cont.)
6
C iss 1200
4
800
2
400
0
0 0
20
10
40
30
C oss C rss 1
50
5
9
13
17
21
25
29
-V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthjc)
Operation in this area limited by RDS(ON)
100us
-ID (A)
10
1ms 10ms 100ms DC
1
o
T C =25 C Single Pulse 0.1
Duty factor=0.5
0.2
0.1
0.1 0.05
PDM 0.02
t T
0.01
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01 0.1
1
10
100
1000
0.00001
0.0001
-V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
30
-ID , Drain Current (A)
V DS = -5V
T j =25 o C
VG
T j =150 o C
QG 20
-10V QGS
QGD
10
Charge
Q
0 0
2
4
6
8
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
Fig 12. Gate Charge Waveform
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Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
Package Dimensions: TO-252 D D1
E2
E3
B1
Millimeters
SYMBOLS
F1
e
E1
MIN
NOM
MAX
A2
1.80
2.30
2.80
A3
0.40
0.50
0.60
B1
0.40
0.70
1.00
D
6.00
6.50
7.00
D1
4.80
5.35
5.90
E3
3.50
4.00
4.50
F
2.20
2.63
3.05
F1
0.50
0.85
1.20
E1
5.10
5.70
6.30
E2
0.50
1.10
1.80
e
--
2.30
--
C
0.35
0.50
0.65
F
e
1. All dimensions are in millimeters. 2. Dimensions do not include mold protrusions.
R : 0.127~0.381
A2
A3
(0.1mm
C
Marking Information Laser Marking Product: AP9575A
9575AGH YWWSSS
©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
Package code GH = RoHS-compliant halogen-free TO-252 Date/lot code (YWWSSS) Y: Last digit of the year WW: Work week SSS: Lot code sequence
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Advanced Power Electronics Corp.
AP9575AGH/J-HF-3
Package Dimensions: TO-251 D
Millimeters
A
SYMBOLS
c1 D1 E2
E1
E
A1 B2 F
B1
c
e
MIN
NOM
MAX
A
2.20
2.30
2.40
A1
0.90
1.20
1.50
B1
0.40
0.60
0.80
B2
0.60
0.85
1.05
c c1
0.40
0.50
0.60
0.40
0.50
0.60
D
6.40
6.60
6.80
D1
4.80
5.20
5.50
E
6.70
7.00
7.30
E1
5.40
5.60
5.80
E2
1.30
1.50
1.70
e
----
2.30
----
F
7.00
8.30
9.60
1. All dimensions are in millimeters. 2. Dimensions do not include mold protrusions.
e
Marking Information
Product: AP9575A
9575AGJ YWWSSS
©2011 Advanced Power Electronics Corp. USA www.a-powerusa.com
Package Code GJ = RoHS-compliant halogen-free TO-251 Date Code (YWWSSS) Y : Last digit of the year WW : Work week SSS : Lot code sequence
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