Transcript
AP95T10GI-HF Halogen-Free Product
Advanced Power Electronics Corp.
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
Simple Drive Requirement
BVDSS
D
RDS(ON)
Lower On-resistance RoHS Compliant & Halogen-Free
ID
G
100V 6.4m 60A
S
Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
G
D
TO-220CFM(I)
S
The TO-220CFM isolation package is widely preferred for commercial-industrial through hole applications.
Absolute Maximum Ratings Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
+20
V
ID@TC=25
Continuous Drain Current, V GS@10V
60
A
ID@TC=100
Continuous Drain Current, V GS@10V
43
A
240
A
60
W
1
IDM
Pulsed Drain Current
PD@TC=25
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 175
TJ
Operating Junction Temperature Range
-55 to 175
Thermal Data Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
2.5
/W
Rthj-a
Maixmum Thermal Resistance, Junction-ambient
65
/W
Data and specifications subject to change without notice
1 200910271
AP95T10GI-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250uA
100
-
-
RDS(ON)
Static Drain-Source On-Resistance 2
VGS=10V, ID=30A
-
-
6.4
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=30A
-
105
-
S
IDSS
Drain-Source Leakage Current
VDS=100V, VGS=0V
-
-
10
uA
IGSS
Gate-Source Leakage
VGS= +20V, VDS=0V
-
-
+100
nA
ID=30A
-
110
176
nC
2
V m
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=80V
-
19
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
58
-
nC
2
td(on)
Turn-on Delay Time
VDS=50V
-
70
-
ns
tr
Rise Time
ID=30A
-
210
-
ns
td(off)
Turn-off Delay Time
RG=25 ,VGS=10V
-
210
-
ns
tf
Fall Time
RD=1.6
-
240
-
ns
Ciss
Input Capacitance
VGS=0V
-
4330 6930
pF
Coss
Output Capacitance
VDS=25V
-
910
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
375
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2
-
Min.
Typ.
IS=30A, VGS=0V
-
-
1.3
V
Source-Drain Diode Symbol VSD
Parameter Forward On Voltage
2 2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=30A, VGS=0V
-
105
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
365
-
nC
Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.
2
AP95T10GI-HF 320
160
ID , Drain Current (A)
ID , Drain Current (A)
10V 8.0V 7.0V 6.0V
T C = 175 o C
10V 8.0V 7.0V
T C = 25 o C
240
6.0V 160
80
120
V GS =5.0V
80
40
V GS =5.0V
0
0 0
4
8
12
16
20
24
0
28
4
8
12
16
20
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
3.0
12
I D =60A V G =10V
I D =40A 2.6
o
T A =25 C
RDS(ON) (m
)
Normalized RDS(ON)
10
8
2.2
1.8
1.4
1.0 6
0.6
0.2
4 2
4
6
8
-50
10
0
50
100
150
200
T j , Junction Temperature ( o C)
V GS ,Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.6
60
Normalized VGS(th) (V)
50
IS(A)
40
T j =175 o C
T j =25 o C
30
20
1.2
0.8
0.4 10
0
0.0 0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
200
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3
AP95T10GI-HF 12
f=1.0MHz
6000
V DS =50V V DS =60V V DS =80V
10
5000
8
C iss
4000
C (pF)
VGS , Gate to Source Voltage (V)
I D = 40 A
6
3000
4
2000
2
1000
C oxx C rss 0
0 0
40
80
120
1
160
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
1000
Operation in this area limited by RDS(ON)
ID (A)
100
Normalized Thermal Response (Rthjc)
Duty factor=0.5
100us 1ms 10ms
10
100ms 1s
1
o
T c =25 C Single Pulse
DC
0.1
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
t T Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
0.001
0.01
0.1
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS 90%
QG 10V QGS
QGD
10% VGS td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
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