Transcript
Advanced Power Electronics Corp.
IRF830P-HF-3
N-channel Enhancement-mode Power MOSFET Simple Drive Requirement
D
Low On-resistance Fast Switching Performance G RoHS-compliant, Halogen-free
BV DSS
500V
RDS(ON)
1.5Ω
ID
4.5A
S
Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost-effectiveness. The IRF830P-3 is in the TO-220 through-hole package which is widely used in commercial and industrial applications where a small PCB footprint or an attached heatsink is required. This device is well suited for low voltage applications such as DC/DC converters and DC motor drives.
G
D
S
TO-220 (P)
Absolute Maximum Ratings Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID at TC=25°C
Continuous Drain Current
ID at TC=100°C
Continuous Drain Current
3
1
IDM
Pulsed Drain Current
PD at TC=25°C
Total Power Dissipation Linear Derating Factor 2
Rating
Units
500
V
+20
V
4.5
A
2.8
A
18
A
74
W
0.59
W/°C
101
mJ
4.5
A
EAS
Single Pulse Avalanche Energy
IAR
Avalanche Current
TSTG
Storage Temperature Range
-55 to 150
°C
TJ
Operating Junction Temperature Range
-55 to 150
°C
Thermal Data Parameter
Symbol
Value
Unit
Rthj-c
Maximum Thermal Resistance, Junction-case
1.7
°C/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
62
°C/W
Ordering Information IRF830P-3TB
©2010 Advanced Power Electronics Corp. USA www.a-powerusa.com
RoHS-compliant TO-220, shipped in tubes
200704202-3
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Advanced Power Electronics Corp.
IRF830P-HF-3
Electrical Specifications at Tj=25°C (unless otherwise specified) Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=1mA
500
-
-
V
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=2.7A
-
-
1.5
Ω
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=2.7A
-
2.4
-
S
VDS=500V, VGS=0V
-
-
25
uA
Drain-Source Leakage Current (Tj=125 C)
VDS=400V, VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS=±20V
-
-
±100
nA
ID=3.1A
-
28
45
nC
o
IDSS
Drain-Source Leakage Current (Tj=25 C) o
IGSS
3
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=400V
-
4
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
16
-
nC
3
td(on)
Turn-on Delay Time
VDD=250V
-
10
-
ns
tr
Rise Time
ID=3.1A
-
15
-
ns
td(off)
Turn-off Delay Time
RG=12Ω, VGS=10V
-
41
-
ns
tf
Fall Time
RD=80.6Ω
-
20
-
ns
Ciss
Input Capacitance
VGS=0V
-
710
1140
pF
Coss
Output Capacitance
VDS=25V
-
170
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
60
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2
3.0
Ω
Min.
Typ.
Tj=25°C, IS=4.5A, VGS=0V
-
-
1.5
V
Source-Drain Diode Symbol VSD
Parameter Forward On Voltage
3 3
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=3.1A,VGS=0V,
-
370
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
3.9
-
uC
Notes: 1.Pulse width limited by maximum junction temperature. o 2.Starting Tj=25 C , VDD=50V , L=10mH , RG=25Ω
3.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.
©2010 Advanced Power Electronics Corp. USA www.a-powerusa.com
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Advanced Power Electronics Corp.
IRF830P-HF-3
Typical Electrical Characteristics 8
5
4
10V 7 .0V 6 .0V
3
5 .0 V
o
T C =25 C
ID , Drain Current (A)
6
ID , Drain Current (A)
T C =150 o C
10V 7.0V 6.0V
4
2
V G = 4. 5 V
5.0V
2
1
V G =4.5V 0
0 0
4
8
12
16
0
20
V DS , Drain-to-Source Voltage (V)
4
8
12
16
20
24
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics 3
1.2
1.1
Normalized RDS(ON)
Normalized BVDSS (V)
I D =2.7A V G =10V
1
2
1
0.9
0
0.8 -50
0
50
100
-50
150
T j , Junction Temperature ( o C)
0
50
100
150
T j , Junction Temperature ( o C )
Fig 3. Normalised BVDSS vs. Junction Temperature
Fig 4. Normalized On-Resistance vs. Junction Temperature
10
1.4
1.2
o
Normalized VGS(th) (V)
8
o
T j = 150 C
T j = 25 C
IS (A)
6
4
1
0.8
0.6
2
0.4
0 0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of Reverse Diode
©2010 Advanced Power Electronics Corp. USA www.a-powerusa.com
1.4
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage vs. Junction Temperature
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Advanced Power Electronics Corp.
IRF830P-HF-3
Typical Electrical Characteristics (cont.) f=1.0MHz 10000
12
I D =3.1A V DS =100V V DS =250V V DS =400V
8
1000
C iss C (pF)
VGS , Gate to Source Voltage (V)
10
6
C oss 4
100
C rss 2
0
10 0
10
20
30
40
1
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
10
ID (A)
100us 1ms 1
o
T c =25 C Single Pulse
10ms 100m 1s DC
0.1 1
10
100
1000
Normalized Thermal Response (Rthjc)
100
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t 0.02
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01 0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
T
0.01
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS 90%
QG 10V QGS
QGD
10% VGS td(on) tr
td(off) tf
Fig 11. Switching Time Waveforms
©2010 Advanced Power Electronics Corp. USA www.a-powerusa.com
Charge
Q
Fig 12. Gate Charge Waveform
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Advanced Power Electronics Corp.
IRF830P-HF-3
Package Dimensions: TO-220 E
A
E1
SYMBOLS
φ
Millimeters MIN
L1 L5 c1
D1 D L4
4.40
4.60
4.80
b D c E
0.76
0.88
1.00
8.60
8.80
9.00
0.36
0.43
0.50
9.80
10.10
10.40
L4
14.70
15.00
15.30
L5
6.20
6.40
6.60
5.10 REF.
c1
1.25
1.35
1.45
b1
1.17
1.32
1.47
L
13.25
13.75
14.25
e
L
MAX
A
D1
b1
NOM
2.54 REF.
L1
2.60
2.75
2.89
φ E1
3.71
3.84
3.96
7.4 REF,
1. All dimensions are in millimeters. 2. Dimensions do not include mold protrusions.
b
c
e
Marking Information:
Product: IRF830P-HF-3
IRF830 YWWSSS
©2010 Advanced Power Electronics Corp. USA www.a-powerusa.com
Date/lot code (YWWSSS) Y: Last digit of the year WW: Work week SSS: Lot code sequence
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