Transcript
SHRINK DUAL IN-LINE PACKAGE
FUJITSU SEMICONDUCTOR DATA SHEET
24 PIN PLASTIC To Top / Package Lineup / Package Index
DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP
Lead pitch
70 mil
Row spacing
300 mil
Sealing method
Plastic mold
(DIP-24P-M05)
24-pin plastic SH-DIP (DIP-24P-M05) +0.20
22.05 –0.30 .868
+.008 –.012
INDEX-1 6.60±0.25 (.260±.010)
INDEX-2
5.00(.197)MAX
0.51(.020)MIN 0.25±0.05 (.010±.002)
3.00(.118)MIN
0.45±0.10 (.018±.004) +0.50
1.00 –0
+.020
.039 –0 1.778±0.18 (.070±.007) 1.778(.070) MAX
C
1994 FUJITSU LIMITED D24034S-3C-2
7.62(.300) TYP
15°MAX
19.558(.770)REF
Dimensions in mm (inches).
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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