Eb-x500 - Altehandys.de

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by Toko ([email protected]) Personal Cellular Telephone EB-X500 Tx Frequency Range Rx Frequency Range Tx / Rx separation RF Channel Bandwidth Number of RF channels Speech coding Operating temperature Type RF Output Power Modulation WAP / GPRS Connection Voice digitizing Transmission speed Signal Reception Antenna Impedance (External Connector) Antenna VSWR Dimensions (Excluding antenna) Volume Weight Main Display Illumination Keys SIM External DC Supply Voltage Battery Standby Time Talk Time 900 MHz 1800 MHz 880 - 915 MHz 1710 -1785 MHz 925 - 960 MHz 1805 -1880 MHz 45 MHz 95 MHz 200 kHz 174 374 Full rate / Half rate / Enhanced Full rate -10 °C to +55 °C Class 4 Handheld Class 1 Handheld 2 W maximum 1 W maximum GMSK (BT = 0.3) WAP 2.0 / GPRS Class 8 8 ch / TDMA 13 kbps RPE-LTP / 13 kps ACLEP / 5.6 kps CELP / VSLEP 270.833 kbps Direct conversion 50 Ω < 2.1 : 1 Height : 84.4 mm Width : 47.4 mm Depth : 17.5 mm 65 cc 85 g LCD : 128 x 128 pixels, 65,536 colours 10 LEDs for Keypad Backlighting (White) 4 LEDs for LCD Backlighting (White) 3 LEDs for Sub LCD (Blue, Green, Orange) 16-key Keypad, Navigation key, 1 shutter key 3 V Plug-in type only 5.8 V 3.7 V nominal, 600mAh, Li-Ion 210 hrs 4.5 hrs Talk and standby time will be dependent on network conditions, SIM card, backlight usage and network condition. WARNING This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product. Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone else could result in serious injury or death. R 2004 Panasonic Mobile Communications Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law. COMPANY LIABILITY Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment. However, Panasonic Mobile Communications Co., Ltd. accepts no responsibility for inaccuracies which may occur and reserves the right to make changes to the specification or design without prior notice. The information contained in this manual and all rights in any design disclosed therein, are and remain the exclusive property of Panasonic Mobile Communications Co., Ltd. Other patents applying to material contained in this publication: CP8 PATENTS Comments or correspondence concerning this manual should be addressed to: Panasonic Mobile Communications Co., Ltd. 600, Saedo-cho, Tsuzuki-ku, Yokohama, 224-8539, Japan CONTENTS 1. INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1. 1.2. 1.3. Purpose of the Manual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Structure of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Servicing Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 2. GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.1. 2.2. 2.3. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Handportable Main Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 3. OPERATING INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1. 3.2. 3.3. 3.4. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Liquid Crystal Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Location of Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Alpha Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.4.1. Character Set / Key Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.4.2. Editing Alpha Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.5. Menu Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 3.6. Incoming Call Line Identification (CLI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.7. Hot Key Dial Source List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8. Public Man Machine Interface (MMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.2. Reading the Phonebook Memory Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.3. Presentation of IMEI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.4. Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.5. Call Hold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.8.6. Call Waiting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.8.7. Call Line Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.8.8. Telecommunication Services used for Public MMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.8.9. Dial Divert . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.8.10. Call Bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.9. Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 3.10. Important Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 3.11. Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 i 4. TECHNICAL SPECIFICATIONS 4.1. 4.2. Tx Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1.1. Frequency Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1.2. Modulation Phase Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1.3. Output RF Spectrum due to Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1.4. Output RF Spectrum due to Switching Transients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1.5. Spurious Emissions at Antenna Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.1.6. Residual Peak Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-2 Rx Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.2.1. Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 5. TECHNICAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.1. RF Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.1.1. RF Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . 5-1 5.1.2. RF Function Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 5.1.3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 5.1.4. Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 5.2. Baseband Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 5.3. Keypad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 5.4. Subscriber Identity Module (SIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 5.5. TPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 5.6. Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 5.7. Power Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 5.8. Battery Temperature (BATTEMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 5.9. LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 5.10. Real Time Clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 5.11. Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 5.12. Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 5.12.1. Handheld Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 5.12.2. Handfree Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 5.13. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 5.14. UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 5.15. Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 5.15.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 5.15.2. Power Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 5.15.3. Power ON/OFF Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 5.15.4. Voltage Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 5.16. Battery Charging and Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 5.16.1. Charging Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 5.16.2. Deeply Discharged Batteries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 5.17. Camera Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 5.18. Interfaces and Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15 5.18.1. External I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15 5.18.2. LCD Module Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16 5.18.3. Camera Module Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17 5.18.4. SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17 5.18.5. Battery Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17 5.18.6. Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18 ii 6. DISASSEMBLY / REASSEMBLY INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 6.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 6.1.1. Call Bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . 6-1 6.2. Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2 6.3. Reassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9 7. REPAIR PROCEDURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.2. Lead Free (PbF) solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.3. External Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.3.1. General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . 7-1 7.4. Test Equipment Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5 7.4.1. Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5 7.4.2. Fitting Handset to PCB Repair Jig . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6 8. SOFTWARE DOWNLOAD & ADJUSTMENT PROCEDURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 8.1. 8.2. 8.3. Service Software Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 Calibration Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-7 8.3.1. Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . 8-7 8.3.2. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . 8-9 8.3.3. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . 8-12 8.3.4. Handset Specific Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . 8-31 9. REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 9.1. 9.2. 9.3. Exploded View and Mechanical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 Main PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2 SUB PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5 10. BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 10.1. Baseband . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 10.2. RF Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2 11. CIRCUIT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 11.1. 11.2. 11.3. 11.4. Baseband . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Companion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 11-2 11-3 11-4 12. LAYOUT DIAGRAMS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 12.1. 12.2. 12.3. 12.4. Main PCB (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 Main PCB (Bottom View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 SUB PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3 FB PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4 iii 1. INTRODUCTION WARNING The equipment described in this manual contains polarised capacitors utilising liquid electrolyte. These devices are entirely safe provided that neither a short-circuit nor reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES. Caution The equipment described in this manual contains electrostatic devices (ESDs). Damage can occur to these devices if the handling procedures are described in Section 6. Caution This equipment may contain an internal battery in addition to the external battery packs. These batteries are recyclable and should be disposed of in accordance with local legislation. They must not be incinerated, or disposed of as ordinary rubbish. 1.1. Purpose of the Manual This Service Manual contains the information and procedures required for installing, operating and servicing the Panasonic GSM Personal Cellular Mobile Telephone system operating on GSM Digital Cellular Networks. 1.2. Structure of the Manual The manual is structured to provide service-engineering personnel with the following information and procedures: 1. General and technical information - provides a basic understanding of the equipment, kits and options, together with detailed information for each of the major component parts. 2. Installation and operating information - provides instructions for unpacking, installing and operating the equipment. 3. Servicing information - provides complete instructions for the testing, disassembly, repair and reassembly of each major component part. Step-by-step troubleshooting information is given to enable the isolation and identification of a malfunction, and thus determine what corrective action should be taken. The test information enables verification of the integrity of the equipment after any remedial action has been carried out. 4. Illustrated parts list - provided to enable the identification of all equipment components, for the ordering of spare / replacement parts. 1.3. Servicing Responsibilities The procedures described in this manual must be performed by qualified service engineering personnel, at an authorized service centre. The service engineering personnel are responsible for fault diagnosis and repair of all equipment described in this manual. – 1-1 – 2. GENERAL DESCRIPTION 2.1. General This section provides a general description and kit composition details for the GSM Handportable Telephone system and optional kits. 2.2. Features The Panasonic Telephone Model EB-X500 is a high performance, small, light, handset for business and domestic use. The following features are provided: ■ Triple Rate, which includes Full Rate, Half rate and Enhanced Full Rate (EFR) speech, codec. ■ Dual Band, E-GSM 900 and GSM 1800 operation. ■ Tegic T9 Text Entry. ■ Voice Ringer. ■ Desktop handsfree function comprising integral echo cancellation and noise suppression. ■ Wireless Application Protocol (WAP) Browser. ■ Backup Battery. ■ Downloadable polyphonic melody ring tones. ■ Clock, Calculator and Currency Converter. 2.3. Handportable Main Kit 1 3 2 Figure 2.1: Handportable Main Unit Kit Contents Item DESCRIPTION 1 Main Unit 2 Battery, Standard 3 Travel Charger – 2-1 – 3. OPERATING INSTRUCTIONS 3.1. General This section provides a brief guide to the operation and facilities available on the telephone handset. Refer to the Operating Instructions supplied with the telephone for full operational information. 3.2. Liquid Crystal Display The telephone handset has a graphical chip on glass display. The following icons are available: Figure 3.1: Liquid Crystal Display Icon Description Indicates received signal strength: strong signal area; weak signal area Indicates that it is possible to make an emergency call. Menu Number The number of the feature indicated by the pointer. To access a feature enter the menu number on the keypad. Displays the battery charge level: Battery is at full charge Battery requires charging The battery icon flashes during charging Menu Icon Displays a small icon related to the current status of the telephone: telephone is roaming on a non-home network. using the "Call Divert" feature or the telephone has Call-Divert set; shows that vibration alert is switched on; shows that the telephone is in silent mode - no tones; flashes to indicate that there are unread text (SMS) messages. Lit when SMS area is full; indicates the telephone is locked; shows that the normal character set has been selected; shows that the Greek character set has been selected; shows that the Extended character set has been selected; shows that numbers have been selected for text entry T9 indicates that Tegic T9R predictive text mode is selected Information Icon Displays a small icon according to the current menu level: indicates the alarm is set. indicates the current Phonebook is sourced from the Mobile Phonebook. indicates the current Phonebook is sourced from the SIM Phonebook Following some operations, the display will clear automatically after three seconds or after pressing any key except. – 3-1 – 3.3. Location of Controls Incoming / Charge indicator: Green - Incoming call. Red - Charging battery pack. External connector: Used to connect to external accessories or to charging equipment. Earpiece Headset Connector Display Centre Soft Key Right Soft Key Navigation Key Lest Soft Key Power/End Key Call Key Shutter Key Sharp/Silent Key Asterisk/Shift Key Microphone Battery Cover Camera Lens Self Portrait Mirror Photo Light Connector Figure 3.2. : Location of Controls The keypad of Type A Navigation Key. Scrolls through options or features menu and increases or decreases volume. Cancel Key. Used mainly to cancel the current operation and return to the previous menu level. In some menus it has other functions. Option key. Primarily used for accessing the Phonebook or switching character types. Send Key. Makes a call. End Key. Ends a call or switches the telephone on/off when pressed and held. Digit keys. Enter wild numbers or pauses when pressed and held. Where appropriate the 0 key scrolls up or to down through abbreviated control names and then select to reveal the international access code "+". Vibrate enable/disable Key. Press and hold to enable or disable the vibrate alert. – 3-2 – The keypad of Type B Navigation Key. Scrolls through options or features menu and increases or decreases volume. Cancel Key. Used mainly to cancel the current operation and return to the previous menu level. In some menus it has other functions. Option key. Primarily used for accessing the Phonebook or switching character types. Send Key. Makes a call. End Key. Ends a call or switches the telephone on/off when pressed and held. Digit keys. Enter wild numbers or pauses when pressed and held. Where appropriate the 0 key scrolls up or to down through abbreviated control names and then select to reveal the international access code "+". Vibrate enable/disable Key. Press and hold to enable or disable the vibrate alert. 3.4. Alpha Entry 3.4.1. Character Set / Key Assignments Alpha entry is used to enter alphanumeric characters in to the Phonebook, Short Messages and Greeting Message areas. The keypad of Type A Character / Operation Key Normal T9® Greek +- Extended +- Numeric Alternatives +- Punctuation "@–,.;:!i?¿()’&%+–/<>=£$¥¤§ abc ABCabc ΑΒΓ AÄÅÆBCÇaäåæàbc 2 def DEFdef ∆ΕΖ DEÉFdeéèf 3 ghi GHIghi ΗΘΙ GHIghiì 4 jkl JKLjkl Κ∆Μ JKLjkl 5 mno MNOmno ΝΞΟ MNÑOÖomnñoöø 6 pqrs PQRSpqrs Π Ρ Σ P Q R S p q r s É¿ 7 tuv TUVtuv Τ TUUVtuüùv 8 wxyz WXYZwxyz ΧΨΩ WXYZwxyz 9 Shift / Lock * * * * Space # # # # Φ 0+P_ 1 Each time a key is pressed, it will display the next character. When another key is pressed, or no key is pressed for a short time, the cursor will move to the next position. To cycle between Greek characters (Α Β Γ), extended characters (A Ä Å), numerals (0-9) and normal characters (A B C) press . – 3-3 – The keypad of Type B Character / Operation Key Normal T9® Greek +- Extended +- Numeric Alternatives +- Punctuation "@–,.;:!i?¿()’&%+–/<>=£$¥¤§ abc ABCabc ΑΒΓ AÄÅÆBCÇaäåæàbc 2 def DEFdef ∆ΕΖ DEÉFdeéèf 3 ghi GHIghi ΗΘΙ GHIghiì 4 jkl JKLjkl Κ∆Μ JKLjkl 5 mno MNOmno ΝΞΟ MNÑOÖomnñoöø 6 pqrs PQRSpqrs Π Ρ Σ P Q R S p q r s É¿ 7 tuv TUVtuv Τ TUUVtuüùv 8 wxyz WXYZwxyz ΧΨΩ WXYZwxyz 9 Shift / Lock * * * * Space # # # # Φ 0+P_ 1 Each time a key is pressed, it will display the next character. When another key is pressed, or no key is pressed for a short time, the cursor will move to the next position. To cycle between Greek characters (Α Β Γ), extended characters (A Ä Å), numerals (0-9) and normal characters (A B C) press . 3.4.2. Editing Alpha Entry Pressing will move the cursor up or down or left or right. When the cursor is moved over a character and another key pressed this will insert the new character. Pressing will delete the character to the left of the cursor. – 3-4 – 3.5. Features Menu Structure My Phone Normal Quite Outdoor Meeting Profile Sounds Display Slide settings Language Auto Answer Shortcut key Menu View Phone Setting Defaults Contacts Contacts List Create Sim Phone Groups Memory status My numbers Voicemail Hot Key Dial My contact Browser All SIM Phone Start Browser Bookmarks New entry Setting Game & Apps Messages Create Inbox Outbox Chat SMS User message Cell Broadcast Settings Applications Game & Apps Settings View certificate Receive Latest message Topic list Language Game & Apps Alarms Video memo Sound recorder Clock Auto power on Auto power off Calculator Melody Composer My Media – 3-5 – My Pictures My Animations My Sounds Memory Status 3.6. Incoming Call Line Identification (CLI) When a call is received the last six digits of the CLI information is matched with the phonebook. Therefore an incoming call could be matched to the wrong phonebook entry. 3.7. Hot Key Dial Source List The source for Hot Key Dial Numbers is normally 'Phonebook' or 'Service Dial Numbers'. For some OEMs it may be a requirement to store these numbers in Flash-ROM. When the source is the Flash-ROM and the telephone software is updated, the source numbers may be lost. Also, if the user changes the source of the Hot Key Dial numbers, it will not be possible to redirect the source back to Flash-ROM. However, in the event that an OEM would like the Hot Key Dial source to be stored in the Flash-ROM, it is unlikely that the user will have the option to change the Hot Key Dial source. 3.8. Public Man Machine Interface (MMI) 3.8.1. General It is possible to operate all GSM telephones in the same way using the Public MMI. The following operations will work with all GSM telephones. However, this information is restricted to those operations supported by the telephone. The * and # in the following procedures should be replaced by should be replaced with and and respectively. Also and keys. 3.8.2. Reading the Phonebook Memory Location # Leading zeros can be left out of the location number, e.g. 007 can be 7 3.8.3. Presentation of IMEI *#06# 3.8.4. Security Change PIN * * 0 4 * * * # Change PIN2 * * 0 4 2 * * * # Unblock PIN * * 0 5 * * * # Unblock PIN2 * * 0 5 * * * # 3.8.5. Call Hold Place a Call on Hold 2 Recall a Held Call 2 Make a Second Call Swap between two Held Calls 2 End Held Call 0 End Active Call 1 Reject Incoming Call 0 – 3-6 – 3.8.6. Call Waiting Enable Call Waiting * 4 3 * Disable Call Waiting # 4 3 * Call Waiting Status *# 4 3 *# 3.8.7. Calling Line Identification Feature Service Code Calling Line Identification Presentation (CLIP) 30 Calling Line Identification Restriction (CLIR) 31 Connected Line Presentation (CLOP) 76 Connected Line Restriction (CLOR) 77 Enable * * # Disable # * # Temporary Suppress Identification # 3 1 # Temporary Display Identification * 3 1 # 3.8.8. Telecommunication Services used for Public MMI Tel Service Service MMI Service Code All teleservices 10 Telephony 11 All data teleservices 12 Facsimile services 13 Short Message Services (SMS) 16 All teleservices except SMS 19 Voice group services 17 Bearer Service Service MMI Service Code All bearer services 20 All asynchronous services 21 All synchronous services 22 All data synchronous services 24 All data asynchronous services 25 All dedicated packet access 26 All dedicated PAD access 27 – 3-7 – 3.8.9. Call Divert Call Divert Type Service Code Divert all calls 21 Divert all calls if busy 67 Divert calls if no reply 61 Divert if not reachable 62 Set (except "No Reply") Call Bar Set "No Reply" Call Bar Clear Status Clear all Call Diverts * * * * # * * * * * # # # * * # * * # * * ## ##002# 3.8.10. Call Bar Call Divert Type Service Code All outgoing calls 33 Outgoing International calls 331 Outgoing International calls except those to the PLMN 332 All incoming calls 35 Incoming international calls when roaming 351 Set Clear Status Clear all Call Bar Types Change Call Bar Password * * # # # # # # 3 3 0 * # * * 0 3 * * * * # – 3-8 – 3.9. Troubleshooting The user is given the following information and advised to contact the dealer if the problems persist: Problem Cause Remedy Telephone will not switch on Check that the battery pack is fully charged and correctly connected to the telephone. Extremely short battery life for a The network in use and the Avoid areas of poor reception. Ensure batteries are fully new battery pack. condition of the battery pack charged. can affect battery life. Short battery life for an old battery The battery pack was worn out. Replace with a new one. pack. The battery level indicator If a battery is deeply discharged Leave to charge for several minutes in temperatures does not light when charging. it will take a short time before +5 ˚C and +35 ˚C. there is sufficient power in the telephone to light the battery level indicator Calls cannot be made. . The telephone is locked. Unlock the telephone (Menu: Security: Phone Lock). Outgoing calls are barred. Disable the outgoing call barring (Menu: Security: Call Bar). The telephone is not registered to a network. Move to a coverage area and operate the telephone after it has registered with a network. Emergency calls cannot be made. User's phone is not in a GSM Check that the antenna symbol coverage area. symbol is displayed is displayed. Move to a coverage area and operate the telephone when the antenna. Telephone numbers cannot be The telephone is locked. Unlock the telephone (Menu: Security: Phone Lock). recalled. Fixed Dial is switched on. Switch off Fixed Dial (Menu: Security: Fixed Dial). 3.10. Important Error Messages The following table is a list of error messages that may occur during use of the telephone, with a description and suggested course of action: Error Message Explanation / Remedy Area not Allowed Network not Allowed Roaming with the selected network is not allowed. Security Failure Roaming in the selected area is not allowed. The network has detected authentication failure because the SIM is not registered with that network. Contact the Service Provider. SIM Blocked The SIM is blocked because the wrong PUK has been entered ten times. Contact the Service Provider. SIM Error The telephone has detected a problem with the SIM. Switch the telephone off and then back on. If the message does not disappear, contact the Service Provider. Message Rejected Store Full A message has been received but the message store is full. To receive messages, delete some of the currently stored messages or set messages to automatically clear (Menu: Messages: Parameters: Auto Delete). PIN2 Invalidated The PIN2 is blocked permanently because the wrong PUK2 has been entered 10 times. Services controlled by PIN2 cannot be used. Contact the Service Provider. Warning Store The message area is full. New messages cannot be stored until some of the currently stored Full Continue? messages are deleted. Auto Redial List Full Redial list of unsuccessfully dialled numbers is full. Switch the telephone off and then on again. – 3-9 – 3.11. Glossary of Terms Term DTMF Definition Dual Tone Multiple Frequency tones. The numeric keys 0 to 9, and * and # will generate different DTMF tones when pressed during conversation. These are used to access voice mail, paging and home banking services. GSM Global System for Mobile communications. The name given to the advanced digital technology that the telephone uses. Home network The GSM network on which subscription details are held. Hot Key Dial Hot Key Dial allows quick access to numbers stored in the Phonebook of Service Dial Number list. The source of the Hot Key Dial may be defined by the user or preprogrammed by the Service Provider. It is most likely to be preprogrammed to the Service Dial Numbers by the Service Provider. Lock code Message Centre Used for security of the telephone. Factory set to "0000". Where messages are sent before they are forwarded on to their destination. The Message Centre telephone number may be programmed into the SIM or supplied by the service provider. Network operator The organisation responsible for operating a GSM network. Password Used for the control of the call bar function. Supplied by the service provider. PIN Personal Identification Number used for SIM security. Supplied by the service provider. PIN2 Personal Identification Number used for the control of Fixed Dial Memory and call charge metering. Supplied by the service provider. PUK/ PUK2 PIN/PIN2 Unblocking Key. Used to unblock the PIN/PIN2. Supplied by the service provider. Registration The act of locking on to a GSM network. This is usually performed automatically by the telephone. Roaming The ability to use the telephone on networks other than the Home network. Service Dial Numbers Service Dial Numbers are predefined numbers that allow the user to access a set of special services provided by the Service Provider. For example billing information or access to Voice Mail. Service provider SIM The organisation responsible for providing access to the GSM network. Subscriber Identification Module. A small smart-card which stores unique subscriber and user-entered information such as Phone Book, Fixed Dial Memory and short messages. Supplied by the service provider. Supplementary service Network-controlled GSM functions supported by the telephone. Supplementary services may only be available on a subscription bases. Wild numbers Spaces in a stored telephone number. When the telephone number is recalled pressing a numeric key will fill in a space. This can be used to restrict dialling to a specific area. – 3-10 – 4. TECHNICAL SPECIFICATIONS 4.1. Tx Characteristics All data is applicable to E-GSM 900 and GSM 1800 except where stated. 4.1.1. Frequency Error ±0.1 ppm max., relative to base station frequency. 4.1.2 Modulation Phase Error RMS: Equal to or less than 5 ° Peak: Equal to or less than 20 ° 4.1.3. Output RF Spectrum due to Modulation Offset from Centre Frequency (kHz) Maximum Level Relative to Carrier (dB) ±100 ±200 ±250 ±400 ±600 to 1800 +0.5 –30 –33 –60 –60 4.1.4. Output RF Spectrum due to Switching Transients Maximum Level (dBm) Offset from Centre Frequency (kHz) E-GSM 900 ±400 ±600 ±1200 ±1800 –19 –21 –21 –24 Measurement conditions for output RF spectrum measurements: Frequency Span 0 Hz Measurement Bandwidth: 30 kHz Video Bandwidth: 30 kHz (modulation) 100 kHz (switching) Average (Modulation) Over 200 burst Peak Hold (Switching) Over 10 burst – 4-1 – GSM 1800 –22 –24 –24 –27 4.1.5. Spurious Emissions at Antenna Connector Frequency offset Frequency Range Filter Bandwidth Approx Video B/W Limits (dBm) E-GSM 900 GSM1800/1900 100 kHz to 50 MHz – 10 kHz 30 kHz –36 –36 50 MHz to 500 MHz – 100 kHz 300 kHz –36 –36 100 kHz 0 to 1MHz 0 to 10 MHz 100 kHz > 10 MHz 300 kHz > 30 MHz 3 MHz (offset from edge of relevant Tx band) 300KHz 300 kHz 1 MHz 3 MHz –36 –30 –30 –30 –36 –30 (1.0 GHz - 1.710 GHz) 1.8 MHz to 6.0 MHz 30 kHz > 6.0 MHz 100 kHz 100 kHz 300 kHz 500 MHz to 1 GHz 1 GHz to 12.75 GHz Excl. relevant TX band E -GSM : 880 MHz to 915 MHz DCS : 1710 MHz to 1785 MHz -and the Rx bands 925 MHz - 960 MHz 1805 MHz - 1880 MHz Relevant TX band: E -GSM : 880 MHz to 915 MHz DCS :1710 MHz to 1785 MHz –36 (1.710 GHz - 1.785GHz) –30 (1.785 GHz - 12.75GHz) –36 –36 –36 –36 4.1.6. Residual Peak Power Equal to or less than 70 dBc (BW = 300 kHz) 4.2. Rx Characteristics 4.2.1. Sensitivity E-GSM 900 Full Rate Speech The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions. Channels Propagation Conditions TU high Test Limit Minimum error rate No of % samples 6.742*α TCH/FS FER Class lb (RBER) 0.42/α Class ll (RBER) 8.33 Propagation Conditions RA Test Limit Minimum error rate No of % samples 8,900 1,000,000 7.5 120,000 24,000 Propagation Conditions HT Test Limit Minimum error rate No of % samples 9.333 60,000 Static Conditions Test Limit error rate % Minimum No of samples 0.122*α 0.41/α 2.439 164,000 20,000,000 8,200 The reference sensitivity level is < -102 dBm. NOTE: 1 < α < 1.6. The value of α can be different for each channel condition but must remain the same for FER and class 1b RBER measurements for the same channel condition. – 4-2 – GSM 900 Half Rate Speech The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions. Propagation Conditions TU high Channels Test Limit error rate % TCH/HS (FER) TCH/HS Class lb (BFI=0) TCH/HS Class ll (RBER) TCH/HS (UFR) TCH/HS Class lb (BFI or UFI=0) 4.598 0.404 7.725 6.250 0.269 Propagation Conditions RA Propagation Conditions HT Minimum No of samples Test Limit error rate % Minimum No of samples Test Limit error rate % Minimum No of samples 13,050 148,500 25,500 9,600 227,000 8.500 20,000 7.600 20,000 GSM 1800 Full Rate Speech The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions. Channels Propagation Conditions TU high Test Limit error rate % TCH/FS FER Class lb (RBER) Class ll (RBER) 4.478*α 0.32/α 8.333 Minimum No of samples Propagation Conditions RA Test Limit error rate % 13,400 1,500,000 60,000 7.5 Minimum No of samples 24,000 Propagation Conditions HT Test Limit error rate % 9.333 Minimum No of samples 30,000 Static Conditions Test Limit error rate % Minimum No of samples 0.122*α 0.41/α 2.439 164,000 20,000,000 8,200 The reference sensitivity level is < -103 dBm. NOTE: 1 < α < 1.6. The value of α can be different for each channel condition but must remain the same for FER and class 1b RBER measurements for the same channel condition. GSM 1800 Half Rate Speech The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is appropriate) is specified in the following table, according to the propagation conditions. Channels Propagation Conditions TU high Test Limit error rate % TCH/HS (FER) TCH/HS Class lb (BFI=0) TCH/HS Class ll (RBER) TCH/HS (UFR) TCH/HS Class lb (BFI or UFI=0) 4.706 0.426 7.725 6.383 0.291 Propagation Conditions RA Propagation Conditions HT Minimum No of samples Test Limit error rate % Minimum No of samples Test Limit error rate % Minimum No of samples 12,750 141,000 25,500 9,400 206,000 8.735 20,000 7.600 20,000 – 4-3 – Blocking: Small MS level in dBµVemf( ) Frequency E-GSM 900 GSM 1800 FR ± 600 kHz to FR ± 800 kHz 70 70 FR ± 800 kHz to FR ± 1.6 MHz 70 70 FR ± 1.6 MHz to FR ± 3 MHz 80 80 915 MHz to FR - 3 MHz 90 – FR ± 3 MHz to FR 980 MHz 90 – FR ± 600 KHz to FR ± 800 KHz – 87 1785 MHz to FR - 3 MHz – 87 835 MHz to < 915 MHz 113 – > 980 MHz to 1000 MHz 113 – 100 KHz to < 835 MHz 90 – > 1000 MHz to 12.75 GHz 90 – 100 KHz to 1705 MHz – 113 > 1705 MHz to < 1785 MHz – 101 > 1920 MHz to 1980 MHz – 101 > 1980 MHz to 12.75 GHz – 90 Measurement Conditions: Wanted carrier is 3 dB above reference sensitivity. Interferer is CW. Spurious response exceptions: Six exceptions are permitted IN band 915 MHz - 980 MHz. 24 exceptions are permitted OUTSIDE band 915 MHz - 980 MHz. Intermodulation Characteristics Interferer Level ( f1 & f2) dBm Interferer Frequencies ( f1 & f2 ) –49 Wanted frequency= 2f1 - f2, and [ f1 - f2] = 800 kHz – 4-4 – 5. TECHNICAL DESCRIPTION 5.1. RF Overview 5.1.1. Introduction ■ General Specifications The telephone is a Dual Band product incorporating two switch able transceivers, one for the E-GSM 900 band and another for the GSM 1800 (DCS 1800) band. The transmit and receive bands for the mobile are given in the table below: EGSM 900 GSM 1800 GSM 850 GSM 1900 Tx 880 MHz - 915 MHz 1710 MHz - 1785 MHz 824 MHz - 849 MHz 1850 MHz - 1910 MHz Rx 925 MHz - 960 MHz 1805 MHz - 1880 MHz 869 MHz - 894 MHz 1930 MHz - 1990 MHz Other salient technical features are as follows: E-GSM 900 GSM 1800 GSM 850 GSM 1900 RX Bandwidth 35 MHz 75 MHz 25 MHz 60 MHz TX Bandwidth 35 MHz 75 MHz 25 MHz 60 MHz Duplex Spacing 45 MHz 95 MHz Number of Channels 174 374 124 299 AFRCN (Channel Numbers) 0 - 124 512 - 885 128 - 251 512 - 810 880.2 MHz 1710.2 MHz 824.8 MHz 1850.2 MHz (Ch 975) (Ch 512) (Ch 128) (Ch 512) 914.8 MHz 1784.8 MHz 848.8 MHz 1909.8 MHz (Ch 124) (Ch 885) (Ch 251) (Ch 810) 925.2 MHz 1805.2 MHz 869.2 MHz 1930.2 MHz (Ch 975) (Ch 512) (Ch 128) (Ch 512) 959.8 MHz 1879.8 MHz 893.8 MHz 1989.8 MHz (Ch 124) (Ch 885) (Ch 251) (Ch 810) 33.0 dBm 30.0 dBm 33.0 dBm 30.0 dBm {Class 4}(PL 5) {Class 1}(PL 0) {Class 4}(PL 5) {Class 1}(PL 0) 5.0 dBm 0.0 dBm 5.0 dBm 0.0 dBm (PL 19) (PL 15) (PL 19) (PL 15) 975 - 1023 1st TX Channel Last TX Channel 1st RX Channel Last RX Channel Maximum TX Power Minimum TX Power – 5-1 – PAVAPC BBVAPC PDET BBVAFC TXQN TXQP TXIN TXIP 5.1.2. RF Function Block PA ENA LE DATA CLK PA GAIN CONTROLLER EGSM900 GSM850 TxIFP TxIFN ENB D2 TXINP PFD ENB ENB CP TXCPO D1 FILTN FILTP DCS1800 PCS1900 ENB ENB ENB U502 PA VCXO_EN LO Frac-N UHFTUNE APC UHFCPO XTALTUNE XTALBUF U501 Transceiver VGA2 VGA1 I MIX OUT GSM LNA F501 LNA900 IN DCOC DCOC DCOC Q MIX OUT VGA2 SAW Filter GAFIP GAFIN DCS LNA F502 LNA1800 IN VGA1 RXQP RXQN SAW Filter DCOC DCOC DCOC GAFIP GAFIN XTAL U504 TCXO 26 MHz AFC Figure 5.1. : RF Function Block Diagram – 5-2 – U503 TR SW VC1 VC2 RXIP RXIN 5.1.3. Functional Description ■ Frequency Plan The frequency plan is shown below: TX Frequency TX IF TX UHF LO E-GSM 900 880 MHz - 915 MHz 98.3 MHz - 114.4 MHz 1474.3 MHz -1543.8 MHz GSM 1800 1710 MHz - 1785 MHz 90.3 MHz - 104.8 MHz 1354.7 MHz - 1414.5 MHz GSM 850 824 MHz - 850 MHz 82.42 MHz - 105.55 MHz 1359.93 MHz - 1424.922 MHz GSM 1900 1850 MHz - 1910 MHz 97.37 MHz - 112.34 MHz 1460.68 MHz - 1516.606 MHz RX RX LO E-GSM 900 925 MHz - 960 MHz 925.2 MHz -959.8 MHz GSM 1800 1805 MHz - 1880 MHz 1805.2 MHz - 1879.8 MHz GSM 850 869 MHz - 894 MHz 869.2 MHz - 839.8 MHz GSM 1900 1930 MHz - 1990 MHz 1930.2 MHz - 1989.8 MHz Ext Loop Filter Phase Detect fTX Tx VCO D2 Tx I Ext D1 L/C FILTER Tx Q X2 X2 Fractional-N PLL UHF VCO fVCO .. 3 Where : fTX = fLO(2D1-D2)/D1 GSM : fLO = (fVCO)/3 DCS/PCS : fLO = (2fVCO)/3 K = Frequency multplier Figure 5.2. Receiver Block Frequency Plan 5.1.4. Transmitter ■ Introduction This section provides a technical description of the transmitter circuits of the Main PCB. A circuit diagram of the whole system is provided in the Service Manual. – 5-3 – Txip Txin Txqp Txqn ❏ Functional Description TxGSM Tri-band PA Tx-VCO TxDCS/PCS PAController Fref PA module F501 RXENA SXENA Rxin GSM RF SAW U503 F502 DCS RF SAW VC3 TXENA U502 U504 VC1 LE CLK Data PCO2 Dual-band TR switch APC Transceiver AFC VCTCZO 26 MHz PCO1 ANT TxDCS/PCS VC2 UHF-VCO (LO) TxGSM Rxip LNA Rxqn Rxqp U501 Figure 5.3. Functional block diagram The handset employs a direct conversion receiver, i.e. it does not require intermediate frequency (IF) stages. A transceiver module is used which incorporates TXVCO and LO stages. The power amplifier stage (PA) is also contained in one module. PCO1 PCO2 Select 0 0 No action 0 0 EGSM 1 0 DCS TXENA RXENA SXENA ACTION 1 0 1 TX 0 1 1 RX X X 0 RF off TXENA RXENA SXENA ACTION 1 0 1 TX 0 1 1 RX X X 0 RF off – 5-4 – 5.2. Baseband Overview The Baseband circuits of the phone are required to perform the following functions: 8 Equalization 8 Channel coding / decoding 8 Speech coding / decoding 8 Data Encryption 8 Layer 1, 2 and 3 software tasks 8 Man Machine interface (MMI) 8 System Interface 8 SIM Interface and Management 8 Audio and 40 Strings Melody Generation 8 Power supply and battery management 8 RF power control 8 Synchronization 8 Real time clock 8 Camera J1 Camera Module LCM U1 Backend IC RF digital control lines RF I/F I and Q lines Baseband interface U10 Flash+S RAM AFC Key pad interface U3 Calypso G2_Lite Power ramp signal Voice band interface SIM interface CON1 SIM CONN Keypad U8 IOTA RTC (32 kHz) CON 1 Earphone Jack J6 Receiver UART MIC1 Microphone BT1 RTC Battery Melody control lines + M1 Vibrator U13 Melody IC T - J3 Battery J14 IO_Connector J6 Speaker Figure 5.4. Baseband Block Diagram The EB-X500 Baseband is built around a GSM chipset developed by Texas Instruments. One chip (Calypso_G2) carries out signal processing with DSP and CPU, and the other chip (IOTA) provides the analogue interface. The highly integrated nature of the chips means that each can contain a large number of functions. – 5-5 – 5.3. Keypad ROW0 ROW1 ROW2 ROW3 ROW4 The Keypad has a 5 x 5 matrix, allowing 25 keys to be scanned. When a key is pressed, a keypad interrupt is generated. To find which key has been pressed, the software scans each column in turn and reads which row is active. Because of key bounce, the key press is confirmed twice at approximately 20 ms intervals. S2 S3 S4 S5 ∗ 3 2 1 S7 S6 6 0 5 4 S10 S11 S12 S13 8 9 # 7 S8 VR27 VR9V 33pf S1 Soft-KeyR S17 COL2 PWON DGND S16 COL3 S14 Side S15 COL4 S9 Power / End DGND DGND SEND Soft-KeyL S18 S19 S20 S21 S22 RIGHT LEFT DWON UP MENU COL1 COL0 Figure 5.5. Keypad Circuit Diagram Keyboard scanning is controlled by software. "Key pressed" is indicated by an interrupt, but "key released" is monitored bysoftware. 5.4. Subscriber Identity Module (SIM) To allow the use of both 1.8 V and 3 V SIM types, a SIM level-shifter module in the TWL3014 device interfaces the SIM signals (DBBSRST, DBBSIO, and DBBSCK) at a constant VRIO level from the DBB device with the SIM card (SIMRST, SIMIO, and SIMCK) at a 1.8V or 3V level depending on SIM type. 5.5. TPU The TPU is a real time sequencer dedicate to the monitoring of GSM baseband processing. Working from an event table referring to a GSM TDMA time base, the TPU activates takes to control DSP peripheral with respect of the time constraints related to the GSM sequencing. To store the real time microinstructions of the sequencer, the TPU includes one 2 ports RAM of 1024 words of 16 bits with a dual page addressing capability. TPU Timing output signal assignments of G2 Name PIN No. TSPACT 1 TSPACT 2 TSPACT 3 TSPACT 4 TSPACT 5 TSPACT 6 TSPACT7:CLKX_SPI TSPACT 8:nMREQ TSPACT 9:MAS1 TSPACT 10:nWAIT TSPACT 11:MCLK M14 L12 L13 J10 K11 K13 K12 K14 J11 J12 J13 Function PAENA NC RXENA TXENA NC TRENA SXENA PCSENA NC NC NC – 5-6 – Connection RF N/A RF RF N/A RF RF RF N/A N/A N/A 5.6. Memory The ROM/RAM capacity of the X500 external memory U10 is 128-Mbit Flash + 64-Mbit SRAM. 5.7. Power Source EB-X500 uses a 730 mAh Lithium-ion battery pack. 5.8. Battery Temperature (BATTEMP) The battery packs used for EB-X500 contain a negative temperature coefficient thermistor. The basic parameters of the thermistor are 10 KΩ. 5.9. LCD The LCD module consists of a LCD glass and driver chip connection to the Main PCB via a flexible PCB strip. A 128 x RGB x 128 pixels graphical display is used which can display up to 16 characters x 6 rows-plus two rows of icons. It can accommodate Chinese and large character sets. Features: 8 8 8 8 8 8 8 8 8 8 8 8 8 Color Amorphous Silicon TFT 1.6inch display module for mobile phones, or handy electrical equipments. 128 x 128 pixels up to 65K colors. Transflective type TN mode. Line inversion mode 18bit CPU interface. Constructions: Display format: Color TFT transflective type Display mode: Normally White Display composition: 128 x RGB x 128 pixels Drive system: a-Si TFT active matrix Liquid Crystal: TN mode Back light: LED x 2 Figure 5.6. LCD Block Diagram – 5-7 – Dimension and weight Dimension Module size 34.5 (W) X 39.1 (H) X 3.18 (D) mm Viewing area 30 (W) X 30 (H) mm weight Typical g 0.225 Item Unit 0.225 28.80 (128 pixels) SEG384 SEG383 SEG382 SEG381 SEG380 SEG379 SEG378 SEG377 B GR B GR B G SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 BGR B GR B G 28.80 (128 X 3 (RGB) pixels) Figure 5.7. Pixel dimension The LCD driver is controlled by setting the command register through the G2 u-wire interface and an I/O line, which distinguishes between command or data. To send data or a command to the display driver, the nCS2 line is used for chip select. LCDA0 (I/0 3) is set high to send data and set low to send commands. 5.10. Real Time Clock (RTC) Clock Functions are provided by the Real Time Clock is built into G2. The module is synchronised by a 32.768 kHz crystal and has a backup power source provided by a button battery. G2 has a clock auto compensation function to take into account any inaccuracies of the crystal. This is able to calibrate out crystal tolerance / drift by writing to the compensation registers. This calibration can provide adjustments ± 555.6ppm in 0.0085 ppm increments. – 5-8 – 5.11. Microphone The microphone is a noise canceling type to provide improved speech pick-up, noise immunity and reduced echo. The GSM Standard requires that when in handheld mode, the transmitter audio frequency response must fit within the mask shown below: Figure 5.8. Handheld GSM Transmit Audio Frequency Response Mask 5.12. Receiver 5.12.1. Handheld Mode Because IOTA is powered from a 2.85 V supply, a low impedance (dynamic) speaker must be used. The GSM Standard requires that the receiver audio frequency response must fit within the mask shown below: Figure 5.9. Handheld GSM Receive Audio Frequency Response The phone is designed to meet requirements with a Type 1 artificial ear. Volume Levels PGA Volume Total Gain 1 -6 dB -12 dB +2.21 dB 2 -3 dB -18 dB -1.12 dB 3 -6 dB -18 dB -4.32dB 4 -3 dB -24 dB -7.23 dB 5 -6 dB -24 dB -10.16 dB Volume Level – 5-9 – 5.12.2. Handsfree Mode A second speaker is mounted in the rear case for handsfree operation. Ring tones and melodies are played via the speaker. The volume level of ring and melody tones are defined U13, and the voice volume is defined IOTA. Timer 1 in G2 is used to time the period between switching the ringing on and off to make the tone. For complex ringing tones, the speaker volume can be altered after each time-out of Timer 1. 5.13. Timers There is a watchdog timer and two 16 bit general-purpose timers which can be used either as auto reload or one-shot timers to provide interrupts to the ARM CPU. A pre-scaler and 16 bits register define the timer clock duration. The watchdog timer receives a 928 kHz clock signal from the G2 clock module. A combination of pre-scaler and timer register gives a time range of 1.078 µs to 9.039 s. The general-purpose timers receive a 812.5 kHz clock signal. Timer range is between 2.4615 µs and 20.649 s. Timer 1 Function = Buzzer Timer Setting = Tone frequency Timer 2 Function = N/A Setting = N/A The timer unit registers are as follows: 5.14. UART G2 has two UART ports, UART modem and UART / IrDA. The UART / modem port is used for optional accessories. The UART / IrDA port is used for software debug purposes. UART / MODEM PORT ASSIGNMENT G2 SIGNAL PIN No. FUNCTION I/O TX_MODEM B9 Transmit Data O RX_MODEM A9 Receive Data I DSR_MODEM D9 Data Set Ready I RTS_MODEM E8 Request To Send O CTS_MODEM C9 Clear To Send I – 5-10 – 5.15. Power Supplies 5.15.1. Introduction ABB VRSIM 1 µF SL VBAT RSIM 1.8 V/2.9 V 10 mA RRAM 1.8 V/2.8 V 50 mA VRRAM 4.7 µF VCRAM SLP Sel 2.8 V SL RMEM 1.8 V/2.8 V 60 mA VRMEM 4.7 µF VCMEM UPR VLMEM Sel 1.8 V VSDBB RDBB 1.3 V/1.5 V/1.8 V SL 120 mA VRDBB 10 µF VCDBB VLRTC SL VCIO2 VRIO2 ABB Digital Core I/O RABB 2.8 V 50 mA ABB VRPC Core VLRTC RRTC 1.3 V/1.5 V/1.8 V 10 µA BK DBB Core DBB I/O 4.7 µF UPR BBS Low Power Domain 1 µF BACKUP Sel 2.8 V Sel 1.8 V VRRTC 1 µF BACKUP DBB Memories I/O VRABB NM/SL VBAT Memories I/O Core DBB Split Power ABB Analogue Core VCABB SRAM Core VRIO1 RIO 2.8 V 100 mA 10 µF VCIO1 SIM Card DBB Backup RTC I/O RTC Figure 5.10. Power Management Block Diagram The Power Management Block consists of six parts as follows: 1. Power Source 2. Power On/Off Control 3. Power Source Failure detection 4. Voltage Regulation 5. Battery Charging & Monitoring 6. Accessory Control 5.15.2. Power Source The battery comprises a single Lithium-Ion (Li-Ion) cell with a nominal voltage of 3.7 V and 730 mAh capacities. This type of battery has an advantage in weight and size over Nickel Metal Hydride (Ni-MH) cells. – 5-11 – 5.15.3. Power ON/OFF Control The power on sequence can begin when VBAT >2.8 V or VBACKUP >2.8 V. In this state IOTA (U8) is in Power On Condition and internal supply UPR is active. RESPWRONZ signal to G2 (U3) is released high. If IOTA is in the Power On Condition, one of following conditions starts the Power Up sequence. 8 Power key is pushed for more than 30 ms. 8 RPWON input goes high to low for more than 30 ms (e.g. accessory is connected or external RTC signal is activated). 8 EXTPWR voltage is higher than (VBAT+0.4) V. 8 G2 RTC ALARM signal goes high. The Power Up sequence is as follows: 1. Local Oscillator OSCAS is started (if not already active for debouche operation). 2. IOTA internal band gap reference is activated. 3. If VBAT < 3.2 V after a timeout of 51.2 ms OSCAS is stopped and Power Up sequence is aborted. 4. Charge pump is enabled. 5. All regulators are enabled. 6. Power Up status bit and internal Reset bits are set. 7. ONNOFF signal is set to activate G2. 8. ARM in G2 starts running software using 32 kHz clock, and also starts 13 MHz clock. The following Power Down sequence can only be started by G2 setting the DEVICE_OFF bit in IOTA or, in emergency case, when VBAT < 2.7 V (or VBAT < Vbackup & VBAT < 2.8 V): 1. If emergency case INT1 is set low by IOTA. 2. IOTA starts an internal 150 µs watchdog timer to allow G2 to shutdown. 3. On nOff signal is reset to deactivate G2. 4. All regulators are disabled. 5. IOTA internal band gap reference is deactivated. 6. OSCAS is stopped. 5.15.4. Voltage Regulation Each power source is specified as follows. 8 VRDBB: Power supply for G2 Voltage 1.5 V Current 120 mA max Dropout 100 mV max (load max) 8 VRRAM: Power supply for SRAM and G2 Voltage 2.8 V Current 50 mA max Dropout 100 mV max (load max) 8 VRMEM: Power supply for flash memory, LCD and G2 Voltage 2.8 V Current 60 mA max Dropout 100 mV max (load max) 8 VRIO: Power supply for Melody and G2 Voltage 2.8 V Current 100 mA max Dropout 100 mV max (load max) 8 VRABB: Power supply for G2 Voltage 2.8 V Current 50 mA max Dropout 100 mV max (load max) 8 VRSIM: Power supply for SIM Voltage 2.85 V Current 10 mA max Dropout 100 mV max (load max) – 5-12 – 8 VRRTC: Power supply for SRAM and G2 Voltage 1.8 V Current 30 µA max Dropout 100 mV max (load max) 5.16. Battery Charging and Monitoring 5.16.1. Charging Current The status of the LCD battery icon is determined by the value of VBATREG returned from IOTA, as indicated in the table: Icon Status Battery Pack 3 bar 3.795 V < 2 bar 3.727 V < < 3.795 V 1 bar 3.619 V < < 3.727 V 3.53 V < < 3.619 V 0 bar (Low voltage alarm) The phone will be power down two minutes after generating a Low battery Alarm. The CPU within the phone controls Battery charging. If external power is detected and the temperature is within specified limits, the charger starts the rapid charge algorithm. When the battery is fitted, the charging algorithm is determined by constant voltage and constant current control with time, temperature and voltage safeguards. A current limit not greater than the maximum charge current for any battery option must be provided by the external power source. 5.16.2. Deeply Discharged Batteries In the case of deeply discharged batteries, there may not be enough power in the battery to initiate charging. In this case, the charging circuit automatically starts to trickle charge the battery until there is enough power to switch on the phone. 5.17. Camera Module The handset features an integrated VGA (640 x 480 pixels) size CMOS camera, comprising an OV 7649 sensor and Genius GA-8228A lens. Sensor OV7649 includes : 8 Image Sensor Array (640 x 480 resolution) 8 Timing Generator 8 Analog Processing Block 8 A/C Converters 8 Output Formatter 8 Digital Video Port 8 SCCB Interface – 5-13 – R Saturation Gain Hue WB Brightness Gamma G B MUX A/D Output Formatter Data Formatting Y Image Array (640 x 480) Cb A/D MUX Windowing Cr Row Select Analogue Processing Control Registers (To all circuits) Digital Video Port Y[7..0] Column Sense Amps RESET PWDN SCCB Interface Timing Generator 1µF CLK HREF PCLK VSYNC SIO_C SIO_D Figure 5.11. OV7649 Functional Block Diagram GA-8228A lens Optical Lens Genius 8228A Composition 2 Plastic+ 1 Glass , 3 elements , IR Coating Effective Focal Length 3.73 mm BFL 1.98 mm F No. 2.4 (Infinite) View Angle 670 Distortion -0.92% Relative illumination 54% (> 70% after backend compensation) Module Dimension 8 x 8 x 6.12mm (Approximation) Weight 0.7g (Approximation) Resolution 300 VREF TV Line (Center) 250 TV Line (Corner) – 5-14 – 5.18. Interfaces and Test Points 5.18.1. External I/O Case Front External I/O Connector 14 No. Name H/H EXT Power Connector 1 Function H/H Circuit 2.85 V 1 TDI N Data In 2 TX_IrDA B Transmit data 3 TCK B Clock 4 RX_IrDA N Receive data 5 CTS N Clear to send 6 RXD N Receive data 7 TXD B Transmit data 8 RTS B Request to send 9 DSR N Data set ready 10 TMS B TMS 11 ACC_PWR N Power Supply 12 VACCID N Analogue Input 13 TDO B Data out 2.85 V 2.85 V 2.85 V 2.85 V 2.85 V 14 GND Power supply and digital signal ground – 5-15 – 5.18.2. LCD Module Interface Signals No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Name VCC1 /CS WR RD GND D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 /RESET RS GND LED HOST1 VCC LED YSYNC IM3 PCB LCD Function IC Power supply B Chip Select at "L". Selected and Accessible B Write B Read B Power supply ground Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B Data bus B System Reset B Select Register at "H". Index/status Control at "L". B Power Supply Ground for LED IM1. 80 system at "H", 68 system at "L". N Power Supply for LED B Frame synchronizing signal B 18 or 19 bits interface at "H" B 16 or 8 bits interface at "L" – 5-16 – Connection DC 2.8 V SPCA552A#C2 SPCA552A#D3 SPCA552A#C1 DGND No Connect SPCA552A#D1 SPCA552A#E1 SPCA552A#E2 SPCA552A#E3 SPCA552A#F1 SPCA552A#F2 SPCA552A#F3 SPCA552A#G1 No Connect SPCA552A#G2 SPCA552A#H1 SPCA552A#J1 SPCA552A#H2 SPCA552A#J2 SPCA552A#G3 SPCA552A#H3 SPCA552A#J3 SPCA552A#G6 SPCA552A#D2 68 Ω to GND DC 2.8 V DC 2.8 V DC 2.8 V DGND 5.18.3. Camera Module Interface No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name GND HREF VSYNC PWDN PCLK AVDD2V5 DVDD3V3 SIO_D XCLK SIO_C Y0 Y1 Y2 Y3 GND Y4 Y5 Y6 Y7 RESET LED+ LED– OV PCB B B N B N N N B N N B B B B B B B B N N Function Connection System Ground HREF Output Vertical Sync Output Input (()) Power Down Mode Selection: Pixel Clock Output Analogue Power Supply Analogue Power Supply SCCB Serial Interface Data I/O Crystal Clock input SCCB Serial Interface Clock Input YUV Video Component Output bit [0] YUV Video Component Output bit [1] YUV Video Component Output bit [2] YUV Video Component Output bit [3] System Ground YUV Video Component Output bit [4] YUV Video Component Output bit [5] YUV Video Component Output bit [6] YUV Video Component Output bit [7] Clear all registers and resets to their default value. For LED+ For LED– 5.18.4. SIM Interface Pin Signal 1 SIM_CLK 2 SIM_IO 3 SIM_RST 4 SIMPWR 5 SIMPWR 6 Ground 5.18.5. Battery Connector Pin Signal 1 VBAT 2 BAT_TEMP 3 Ground – 5-17 – DGND SPCA552A#A1 SPCA552A#B2 220 KΩ to DGND SPCA552A#B1 DC 2.5 V DC 2.5 V SPCA552A#A2 SPCA552A#C3 SPCA552A#B3 SPCA552A#C6 SPCA552A#B6 SPCA552A#A6 SPCA552A#A5 DGND SPCA552A#B5 SPCA552A#C5 SPCA552A#A4 SPCA552A#B4 SPCA552A#C4 DC 8.2 V FLED– 5.18.6. Test Points TP No. Signal Name TP1 Main PCB XTALOUT TP2 Nbscan TP3 CLK32K_OUT TP4 RPWON TP5 TESTV TP6 BS_TDO TP7 RESPWRONZ TP8 SWITCHONOFF TP9 CLK13M_OUT TP10 PWON TP11 VRTC TP12 VCHG TP13 RTS TP14 CTS TP15 MMI_INT TP16 RX TP17 TX TP18 DSR TP19 TDI TP20 TDO TP21 TCK TP22 TMS TP23 VBAT TP24 BATTEMP TP25 RnW TP26 nCS2 TP27 MSCI_FSY TP28 MSCI_CLK TP29 MSCI_TXD TP30 MSCI_RXD TP31 TPU-WAIT TP32 BYPASS TP33 GPIO2 SUB PCB TP34 SP+ TP35 SP- TP36 EARP TP37 EARN – 5-18 – 6. DISASSEMBLY / REASSEMBLY INSTRUCTIONS 6.1. General This section provides disassembly and reassembly procedures for the main components of the telephone. These assemblies MUST be performed by qualified service personnel at an authorized service center. The following Warnings and Cautions MUST be observed during all disassembly / reassembly operations: WARNING The equipment described in this manual contains polarized capacitors utilizing liquid electrolyte. These devices are entirely safe provided that neither a short-circuit nor a reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN HANDLING THESE DEVICES. Caution The equipment described in this manual contains electrostatic devices (ESDs). Damage can occur to these devices if the handling procedures described are not adhered to. 6.1.1. Call Bar A working area where ESDs may be handled safely without undue risk of damage from electrostatic discharge must be available. The area must be equipped as follows. Working Surfaces All working surfaces must have a dissipative bench mat, safe for use with live equipment, connected via 1M2 resistor (usually built into the lead) to a common ground point. Wrist Strap A QUICK RELEASE SKIN CONTACT DEVICE WITH A FLEXIBLE CORD, WHICH HAS AN INTEGRAL SAFETY RESISTOR OF BETWEEN 5.2 kΩ AND 1.2 MΩ, SHALL BE USED. Containers All containers and storage must be of the conductive type. – 6-1 – 6.2. Disassembly 1. Place thumbs at outer edge of battery cover, press down then slide the battery cover toward to the bottom of the phone. 2. Use the T5 screwdriver to remove the four case screws located inside the battery compartment. 3. Slide open handset and carefully insert the case separation tool into the gap between keyboard upper case A and keyboard lower case B. Lift up the tool along the gap and bend it outside to unhook the keyboard upper case from keyboard lower case. A B – 6-2 – 4. Slide close the handset and the gently lift up the case from 1 first and 2 second. 2 1 5. Use case separation tool to unhook the hook in both side of main PCB then lift up the PCB assembly from 1 and Use case separation tool to remove the board-to-board connector. – 6-3 – 2 . 6. Remove the keypad and microphone. 7. Remove the two screw cap and discard. Use the T5 screwdriver to remove the two screws of display lower case. 8. Use T5 screwdriver to remove the four screws located in keyboard upper case. – 6-4 – 9. Use separation tool insert the gap of the display lower case and then push to the direction of the arrow. 2 1 10. Slide close the handset and insert case separation tool into the gap between display upper case A and display lower case B from front side. A B Gap – 6-5 – 11. Separate the display upper cover and display lower case. Caution : Separate carefully to present damage to the connector or FPC. 1 A 2 12. Disconnect the vibrator plug A from the MMI board. 13. Remove the FPC from MMI board and then remove the MMI board from display upper case. FPC A – 6-6 – 14. Remove the speaker/receiver from MMI board. 15. Remove LCD Module from MMI PCB. – 6-7 – 16. Unhook the two hooks and then remove the antenna box and shield case from main board. A. Base band area shield case cut point 1 - 5 . B. RF area shield case cut point 1 - 6 . Hooks – 6-8 – 6.3. Reassembly 1. Use T5 screwdriver to screwed the six screws located inside the display lower case and slide hinge. 2. Use T5 screwdriver to screwed the four screws located inside the keyboard upper case and slide hinge. – 6-9 – 3. Assemble number keypad and microphone to keyboard upper case. 4. Assemble antenna assembly, two shielding case and FPC to main board. – 6-10 – 5. Slide opens the handset. Insert the FPC through the keyboard upper case and display lower case (Area A). Then assemble the main board assembly to keyboard upper case. 6. Assemble keyboard lower case to keyboard upper case. 7. Assemble LCM to MMI board. – 6-11 – 8. Connect the Mulch speaker M1 on the MMI board. M1 J1 MMI board 9. Attach the vibrator and keypad into he display upper cover. 10. Attach the MMI board into the display upper case and then connect vibrator plug M1 to the MMI board. M1 – 6-12 – 11. Connect FPC board to the MMI board and then assembly the display upper case A with the display lower case B. A B 12. Insert the four screws located keyboard lower case A and two screws located display lower case B. Then adhere two screw cap. B A 13. Push and close the battery cover. – 6-13 – 7. REPAIR PROCEDURES 7.1. Introduction This section provides information on testing the telephone. The layout is as follows: Section 7.2. : Lead Free (PbF) solder: Identification and repair of PCBs using PbF solder. Section 7.3. : External testing: describes equipment requirements and general set up procedure. Section 7.4. : Complete Unit Test Setup: Describes how the items of test equipment are used together and general set up procedure. Adjustment Procedures are described in Section 8. 7.2. Lead Free (PbF) solder CAUTION The Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder. (SPARKLE ECO SOLDER : Part No. ESC F3 M705 0.3) Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 °C higher. Always use a high temperature soldering iron When using a soldering iron with temperature control, it should be set to 370 ± 10 °C (700 ± 20 °F). When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF solder until it melts before applying lead solder. Avoid overheating PbF solder as it has a tendency to splash at temperatures above 600 °C (1100 °F). 7.3. External Testing 7.3.1. General Information The handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section provides a description of the equipment required to perform those tasks. Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 6, and then the PCB connected to the PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysers and oscilloscope. The unit must be tested and calibrated for all frequency bands (900 MHz and 1800 MHz). Personal Computer (PC) The PC (IBM compatible) is used as a Unit Under Test controller. This, in conjunction with the channel box software, allows all of the test facilities normally provided through the Keypad of the Unit Under Test. The Microsoft Windows ®, 98SE, 2000 or XP operating system must be installed on the PC. A Universal Serial Bus (USB) port must be installed on the PC if automatic RF calibration is to performed. Power Supply A power supply is required to provide to the PCB via the PCB Repair Jig while a second unit is required to provide power baseband calibration and unit testing. – 7-1 – Dummy Battery (Part No. PS2DUMBAT) The Dummy Battery via power supply equipment to provide stable power for the phone. It is required for software download. Figure 7.1. : Dummy Battery PCB Repair Jig (Part No. PS2PCBAJIG) The PCB Repair Jig provides the necessary connections between the PCB Assembly and external test equipment. It is required for RF calibration. Figure 7.2. : PCB Repair Jig A cable with SMA female connector is provided to make the RF connection. An SMA to N-Type male adaptor will be required to connect the Repair Jig to the service equipment. Cable losses for the RF connection are 0.5 dBm (GSM 900) and 0.7 dBm (GSM 1800). A replacement RF Probe for the Repair Jig is available as a spares item. Extension Board (Part No. PS2PCBPANEL) The Extension Board makes the necessary connections between the Main board and Sub board. Figure 7.3. : Extension Board – 7-2 – RF Test Jig (Part No. PS2G66RFJIG) The RF Test Jig provides the connections between the test equipment and the phone for unit testing. It also provides power supply for the phone. A replacement RF Probe for the Repair Jig is available as a spares item. Figure 7.4. : RF Test Jig RF Cable (Part No.73PV104001W) The RF cable provides the necessary connections between the PCB Repair Jig/RF Adapter and external test equipment. Figure 7.4. : RF Cable Figure 7.5. : RF Cable A cable with SMA female connector is provided to make the RF connection. An SMA to N-Type male adaptor will be required to connect the Jig to the service equipment. Cable losses for the RF connection are 0.5 dBM (GSM 900) and 0.7 dBM (GSM 1800). – 7-3 – Data Cable (Part No.733PS20301W) The data cable is used for calibration and downloading software. Figure 7.6. : Data Cable Power Cable (Part No. 3WZ001130AAA) The power cable provides the necessary connections between the PCBA repair jig / dummy battery and external power supply. Figure 7.7. : Power Cable GSM Tester This unit acts as a base station providing all the necessary GSM signalling requirements and also provides GSM signal measuring facilities. – 7-4 – 7.4. Test Equipment Setup 7.4.1. Equipment Required Extension Board GSM Tester 3.8 V DC Power PC PCB TEST SETUP Handset GSM Tester 3.8 V DC Power RF Cable RF Test Power Cable Data PC COMPLETE UNIT TEST SETUP Figure 7.8. : Test Connection Diagram IMPORTANT NOTE To allow accurate measurement of the complete unit, the test equipment must be connected as shown in the diagram. For testing the handheld unit the following equipment is required: 1. PCB Repair Jig 2. Power Cable 3. Download Cable 4. RF Cable 5. 12 V power supply 6. Personal computer with RS232 interface and running Microsoft Windows® 95, 98, XP or 2000 7. GSM test station 7. EB-X500 Service software The EB-X500 Service software should be installed onto the main drive of the personal computer. The RF cable is connected to the GSM test station via suitable adaptor. The 3.8 V supply is connected to the RF Adaptor and PCB Repair Jig with power cable. NOTE: A suitable test SIM card compatible with the GSM test station will be required. – 7-5 – 7.4.2. Fitting Handset to PCB Repair Jig 1. Referring to the Disassembly procedure in Section 6, separate the Main Board and Sub Board/Display upper cover. 2. Connect the Extension board to the Sub Board/Display upper cover. 3. Connect the other end of the Extension board to the Main Board. 4. Locate both parts of the handset into their respective locations on the PCB Repair Jig. – 7-6 – 8. SOFTWARE DOWNLOAD & ADJUSTMENT PROCEDURE 8.1. Introduction The purpose of this document is to describe the manual of the Dmtool V8.x.xx.1 ■ System overview PC(with "Dongle") Phone USB Headset Jack Stabilized Power Supply voltage : 5.8 V Data Cable Connect Power Supply via Dummy Battery to ensure steady voltage to phone. ■ Overview Service Tool is an application that integrates the following functions: 1. Data Reserve function: Some data fields (like Phone books, Calibration data . . . etc.) can be stored into files with this function. If data is lost, use use this function to restore the original data back to the handset. 2. Re-Flash function: Use to ownload the new versions of the core software and flex file, either individually or together. 3. Calibration function: Use to calibrate RF parameters, ADC values, or NTC values. 4. The Service Tool runs on Microsoft Win95, Win98 (1st & 2nd edition), WinNT 4.0, Win2K and WinXP platforms. 8.2. Procedure 1. Open Dmtool_V8.x.xx.1.exe Dmtool_v8.x.xx.1 2. Procedure the Project Settings, (a) The Tool is for PS2. (b) Download path is RS232 or USB_RS232 (c) User can select COM port (COM1, COM2, . . .). – 8-1 – 3. Select the "All Mode" Check-Box B Dmtool will update the BootCode Region (flash block 0) when the user download the MainCode to the handset. (Default setting is the "Skip Mode", this will not update the BootCode Region). 4. Select the download path. Up to three download path can be selected. The default setting is RS232. Turbo DL – 8-2 – USB_RS232 DL 5. Click the "Add" Icon B To add a select-download-mot-file to the download-list. Click the "Remove" Icon B To remove one select-download-mot-file from the download-list. Click the "Clear" Icon B To clear all download-mot-file from the download-list. Clicking the "Add" button will open a Browse window which is used to select the download file. – 8-3 – 6. Click the "Execute" Icon B Start the download process. Click the "Abort" Icon B Abort the download process. Click the "Close" Icon B Abort the download process and close the execution. 7. Add mot file to the tool and press Execute button. After that press the power key in handset the Interface shows as below. – 8-4 – 8. While downloading, the status window (top right) will flash yellow. 9. When the download process is complete, the target sector information data will be compared with the binary data in the PC RAM buffer. If the data in these two buffers is identical, the status window will change green and the message "PASS!" will be displayed below it. This indicates the download was successful with no errors occurring. – 8-5 – 10. If any errors were found (i.e. there were differences in data between the two buffers) the Dmtool will report in which block of code the error was found. – 8-6 – 8.3. Calibration Procedure 8.3.1. Getting Started To run the program, double-click on the Service Tool desktop icon. The main program window will be displayed: A message log window also appears at the bottom of the main window to display the processing and status information. – 8-7 – Click on "option" to change the COM port. The COM port setting is password protected to prevent accidental change. The password is "Compal PV1" and is case-sensitive. The password must be entered before the COM port setting can be changed. Setup menu 1). Connection Setup: COM Port Select the COM port to which the data cable is connected. The Default is COM1. 2). Select the Personal INI File. After selecting the COM port and Personal INI File, press "Apply" to confirm the setting. 3). Click on the "RF Configure (RF Configuration)" tab to enter the required parameters for RF calibration and test environment. On completion, click on "Apply". Input Cable Loss for RF Connection Select Test Platform and Address Check box if DC Source available Check box for ADC calibration – 8-8 – 8.3.2. Function Description ■ Restore User data Select to eead and write user data between the handset and PC. Currently, only the phonebook option is available. ❏ Read 1. Select the area you want to read from the "Tree view". If "All" is ticked, it means all of the items on the tree will be selected automatically for reading purpose. Otherwise you can select the specific items individually. 2. Make sure your handset is correctly connected with your pc, switch on your handset and click the button "Read Data". It will automatically enter Factory Test Mode and start to read data. Wait for "Reading Data finish" shown on the log list. At the mean time, you can see the status of process on progress bar. Note: Before doing any operation of Service Tool (except reflash, reflexing), You need to turn on your handset first. If you have SIM card inserted, it is suggested that to wait until the Network searching complete and then start your operation. If the Network searching takes a long time to finish, the handset may enter sleep mode and will not be able to get the command from PC, please press any key to wake up the handset. – 8-9 – 3. All the data that have been read from MS will be saved automatically as a file in the assigned folder. 1. Select the area you want to write from the "Tree view". ❏ Write If "All" is ticked, it means all of the items on the tree will be selected automatically for writing purpose. Otherwise you can select the specific items individually. 2. Make sure your handset is correctly connected with your pc, switch on your handset and click the button "Write Data". will automatically enter Factory Test Mode. Wait for "Writing Data finish" shown on the log list. At the mean time, you can see the status of process on progress bar. 3. Restart the MS to make sure userdata has been written back on. – 8-10 – ■ Mobile Kit 1) In "Download" frame, you can choose either Flex Only, Language Pack Only, or Main Code Only, individually. 2) Click "..." to select the desired version of flex file, language pack file, or main code. Please notice that the selected flex, language pack, and main code should be with the same version. Unmatched version of flex, language pack, and main code could make the handset operate abnormally. 3) To start download, first make sure the phone is connected correctly with PC and switch off the phone. Click button "RS232" to start downloading and you can see the status of the process from the progress bar. – 8-11 – 8.3.3. Calibration Function Purpose : ADC NTC AGC AFC APC : : : : : FIt can calibration battery in 4.2V and 3.4V, or choose one. FIt can calibration battery of temperature in 0 °C and 40 °C or choose one. FIt can calibration gain value. FIt can calibration frequency error and slope. FIt can calibration power for each level. Warning: Before calibration, you must check parameter of instrument. Is it correct? 1) Snapshot of Calibration Screen – 8-12 – 2) Example for Calibration In this case, we select dual band (900/1800) and calibration all (ADC, NTC, AGC, AFC, APC). Enter "FTM" mode Calibration "ADC" & Write ADC value Calibration "NTC" & Write NTC value Calibration "AGC" in GSM900 Calibration "AFC" in GSM900 Calibration "APC" in GSM900 Write Data for GSM900 Calibration "AGC" in DCS1800 Calibration "AFC" in DCS1800 Calibration "APC" in DCS1800 Write Data for DCS1800 Final – 8-13 – Step 1 Make sure your handset is correctly connected with your PC, switch on your handset and click the button "FTM". It will automatically enter Factory Test Mode and start to read data for calibration. Step 2 Press "Next" to continue. Step 3 Click "ADC" and doing calibration battery Step 3.1. Change to 4.2 V and click "OK" to start calibration battery in 4.2 V. Please change to 4.2V – 8-14 – Step 3.2. After Calibration battery in 4.2 V, please turn to 3.4 V and click "OK" to start calibration battery in 3.4 V. Please change to 3.4V Step 3.3. After Calibration battery in 3.4 V, Don't forget turn to 3.8 V. Please change to 3.8V Step 3.4. ADC is complete. Step 4. Press "Next" to continue. – 8-15 – Step 5. Click "NTC" and doing calibration temperature of battery. Temp Calibration. NTC is supposed to prevent battery Temp too higher or too lower. NTC-High (40 °C) approve of range in 233 to 170 (6.95KΩ - 4.83KΩ). NTC-Low (0 °C) approve of range in 965 to 671 (33.9KΩ - 21.6KΩ). Step 5.1. Change to NTC-High (40 °C) and click "OK" to start calibration temperature of battery in NTC-High (40 °C). Please change NTC High Step 5.2. After calibration battery in NTC-High, please turn to 0 °C and click "OK" to start calibration temperature of battery in NTC-Low (0 °C). Please change NTC Low – 8-16 – Step 6. After calibration NTC-Low, NTC is complete. Step 6. Press "Next" to continue. Step 7. After configure parameter of instrument, click "AGC", find gain value and RSSI of full channel. In this case, If you use CMU200, please see Annex notex2-1 to Configure. If you use HP8960, please see Annex notes2-2 to Configure. – 8-17 – Step 8. After find gain value, change channel (Generator and Analyzer channel) to RSSI value, press "OK" to next channel. (In this case, channel 1, channel 49, channel 85, channel 975). Generator setting for Cmu200 Analyzer setting for Cmu200 Setting for HP8960 Change Channel To (chan=1) 935.2MHz Step 9. AGC calibration is complete, press "Next" to continue. – 8-18 – Step 10. After configure parameter of instrument, click "AFC" and doing AFC calibration. In this case, if you use CMU200, please see Annex notex2-1 to Configure. If you use HP8960, please see Annex notes2-2 to Configure. Step 11. AFC calibration is complete, press "Next" to continue. Step 12. After configure parameter of instrument, Click "APC" and doing APC calibration. ("factory" key : Return APC value each level of the handset.) In this case, if you use CMU200, please see Annex notes3-1 to Configure. If you use HP8960, please see Annex notes3-2 to Configure. – 8-19 – 9. REPLACEMENT PARTS LIST 9.1. Exploded View and Mechanical Parts List 2PCS 2PCS 306 349 6PCS 305 349 002 319 252 307 004 003 315 001 316 302 314 253 318 ZZZ-2 313 301 312 304 ZZZ-1 303 251 311 4PCS 349 349 4PCS ZZZ-3 308 006 317 310 309 005 REF. NO. ZZZ-1 ZZZ-2 ZZZ-3 001 002 003 004 005 006 301 302 303 304 305 306 307 308 309 PART NO. 8610PS2001W 8609PS2004W 8610PS2002W 3921003403W 2251813401W 7630112351W 2210614001W 2220061201W 7650361201W 2541PS2001W 2541PS2002W 2516PS2001W 2516PS2002W 3104PS2002W 3104PS2004W 3109PS2002W 2517PS2001W 3064PS2001W 3400617001W 2518PS2001W 2518PS2002W 3104PS2001W 3104PS2003W 3104PS2021W DESCRIPTION PROTECT TAPE FOR LCD PANEL ADHESIVE LENS PROTECT TAPE FOR CAMERA VIBRATOR S P E AKE R LCD MODULE LITHIUM BATTERY MICROPHONE CAMERA ASS'Y LCD-LENS SILVER LCD-LENS RED DISPLAY UPPER COVER S ILVER DISPLAY UPPER COVER RED FUNCTION KEYPAD SILVE R FUNCTION KEYPAD RED METAL DOME FOR FUNCTION KEY DISPLAY LOWER COVER SILVER SCREW CAP HINGE SLIDE KEYBOARD UPPER ASS'Y S ILVER KEYBOARD UPPER ASS'Y RED NUMBER KEYPAD SILVER-ENGLISH NUMBER KEYPAD RED-ENGLISH NUMBER KEYPAD SILVER-BOPOMOFO REF. NO. 310 311 312 313 314 315 316 317 318 319 349 251 252 – 9-1 – PART NO. 3104PS2022W 3104PS2031W 3104PS2032W 3104PS2061W 3104PS2062W 3104PS2071W 3104PS2072W 3109PS2001W 3052PS2007W 3052PS2009W 23A1PS2001W 2519PS2001W 2519PS2002W 251APS2001W 251APS2002W 3028PS2001W 3028PS2002W 306APS2001W 306APS2002W 3064PS2002W 3501434202W 7807620R 01W DESCRIPTION NUMBER KEYPAD RED-BOPOMOFO NUMBER KEYPAD SILVER-STROKE NUMBER KEYPAD RED-STROKE NUMBER KEYPAD SILVER-RUSSIAN NUMBER KEYPAD RED-RUSSIAN NUMBER KEYPAD SILVER-ARABIC NUMBER KEYPAD RED-ARABIC METAL DOME FOR KEY BOARD SHIELD CASE FOR BASEBAND SHIELD-CASE FOR RF ANTENNA ASS'Y KEYBOARD LOWER ASS'Y SILVER KEYBOARD LOWER ASS'Y RED BATTERY COVER ASS'Y SILVER BATTERY COVER ASS'Y RED RF-CAP GRAY RF-CAP RED CONDUCT FOR MAIN BOARD CONDUCT FOR LCD BOARD MYLAR SCREW MAIN PCB ASS'Y (900/1800) To be announced from PMCP FRU KEY PCB ASS'Y 9.2. Main PCB Assembly Ref. No. Part No. Part Name & Description Grid Ref. No. Part No. Part Name & Description C1 C2 C3 C4 C5 1310473411W 1310473411W 1310473411W 1310473411W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 100nF 16V 100nF 16V 100nF 16V 100nF 16V C64 C65 C66 C67 C69 1310473411W 1310562821W 1310562821W 1310662831W 1310562821W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 1uF 10V 1uF 10V 10uF 10V 1uF 10V C6 C7 C8 C9 C10 1310473411W 1310473411W 1310473411W 1310473411W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 100nF 16V 100nF 16V 100nF 16V 100nF 16V C70 C71 C72 C73 C74 1322046111W 1322046111W 1322046111W 1310473411W 1310662831W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 100nF 16V 10uF 10V C11 C12 C13 C14 C15 1322046111W 1322046111W 1310026111W 1310473411W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 10pF 50V 100nF 16V 100nF 16V C75 C76 C77 C78 C81 1322046111W 1333046111W 1333046111W 1333046111W 1310562821W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 33pF 50V 33pF 50V 33pF 50V 1uF 10V C16 C17 C19 C20 C21 1310473411W 1310473411W 1310473411W 1322046111W 1322046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 100nF 16V 100nF 16V 22pF 50V 22pF 50V C82 C84 C85 C86 C87 1310562821W 1310473411W 1310473411W 1310562821W 1333046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 1uF 10V 100nF 16V 100nF 16V 1uF 10V 33pF 50V C22 C23 C24 C25 C26 1310026111W 1310473411W 1310473411W 1310473411W 1310562821W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 10pF 50V 100nF 16V 100nF 16V 100nF 16V 1uF 10V C88 C89 C91 C92 C93 1310662831W 1310256311W 1310562821W 2011001532W 2011001532W CERAMIC CAPACITOR 10uF 10V CERAMIC CAPACITOR 1nF 50V CERAMIC CAPACITOR 1uF 10V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C27 C28 C30 C32 C33 1310662831W 1310562821W 1310562821W 1310562821W 1347562831W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 10uF 10V 1uF 10V 1uF 10V 1uF 10V 4.7uF 10V C94 C95 C96 C97 C98 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C34 C35 C36 C37 C38 1347562831W 1347562831W 1310562821W 1310662831W 1310662831W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 4.7uF 10V 4.7uF 10V 1uF 10V 10uF 10V 10uF 10V C99 C100 C101 C102 C103 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C39 C40 C41 C42 C43 1310662831W 1322046111W 1322046111W 1310562821W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 10uF 10V 22pF 50V 22pF 50V 1uF 10V 100nF 16V C104 C105 C106 C107 C108 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C44 C45 C46 C47 C48 1310473411W 1312046111W 1333046111W 1333046111W 1310146111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 12pF 50V 33pF 50V 33pF 50V 100pF 50V C109 C110 C111 C112 C113 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C49 C50 C51 C52 C53 1310473411W 1333046111W 1333046111W 1310473411W 1333046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 33pF 50V 33pF 50V 100nF 16V 33pF 50V C114 C115 C116 C117 C118 2011001532W 2011001532W 1322046111W 1322046111W 1322046111W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V CERAMIC CAPACITOR 22pF 50V CERAMIC CAPACITOR 22pF 50V CERAMIC CAPACITOR 22pF 50V C54 C55 C56 C57 C58 1310146111W 1333046111W 1310473411W 1333373411W 1310562821W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100pF 50V 33pF 50V 100nF 16V 33nF 16V 1uF 10V C119 C120 C121 C122 C123 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C59 C60 C61 C62 C63 1310473411W 1310473411W 1310473411W 1310473411W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 100nF 16V 100nF 16V 100nF 16V 100nF 16V C124 C125 C126 C127 C128 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V – 9-2 – Grid Ref. No. Part No. Part Name & Description Grid Ref. No. Part No. Part Name & Description C129 C130 C131 C132 C133 1322044151W 1322044151W 1322044151W 1322044151W 1322044151W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C527 C528 C530 C532 C533 1322046111W 1322046111W 1312046111W 113R91N111W 1310353311W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR INDUCTOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 12pF 50V 3.9nH 10nF 16V C134 C136 C137 C138 C139 1310473411W 1310662301W 1310473411W 1333046111W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 10uF 10V 100nF 16V 33pF 50V 100nF 16V C534 C535 C536 C537 C538 1310146111W 1310452211W 1310452211W 1368156311W 1333046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100pF 50V 100nF 10V 100nF 10V 680pF 50V 33pF 50V C140 C141 C142 C143 C144 1310473411W 1310146111W 1333046111W 1310662831W 1310473411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 16V 100pF 50V 33pF 50V 10uF 10V 100nF 16V C539 C540 C541 C542 C543 1310662831W 1333046111W 112212N121W 11220N3201W 1339046111W CERAMIC CAPACITOR CERAMIC CAPACITOR INDUCTOR INDUCTOR CERAMIC CAPACITOR 10uF 10V 33pF 50V 220nH 22nH 39pF 50V C145 C146 C147 C148 C149 2011001532W 2011001532W 1310473411W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V CERAMIC CAPACITOR 100nF 16V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C544 C547 C548 C549 C551 1310452211W 1310452211W 134R716111W 1310256311W 1282211112W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR FILM CAPACITOR 100nF 10V 100nF 10V 4.7pF 50V 1nF 50V 8.2nF C150 C151 C180 C181 C182 1322044151W 1322044151W 1322044151W 1322044151W 1322044151W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C553 C555 C560 C561 C565 1333256311W 07R0014111W 1347156311W 1347156311W 1239211112W CERAMIC CAPACITOR FIXED RESISTOR CERAMIC CAPACITOR CERAMIC CAPACITOR FILM CAPACITOR 3.3nF 50V 0Ω 1/16W 470pF 50V 470pF 50V 3.9nF C183 C184 C185 C186 C187 1322044151W 1322044151W 1322044151W 1322044151W 1322044151W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C566 C571 C574 C590 C600 1310146111W 131R016111W 1310452211W 137R016111W 1410721226W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR TANTALUM CAPACITOR 100pF 50V 1pF 50V 100nF 10V 7pF 50V 100uF 6.3V C188 C189 C190 C191 C192 1322044151W 1322044151W 1322044151W 1322044151W 1322044151W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C601 C602 C603 C604 C605 1347471411W 131R016111W 132R716111W 1322046111W 1322046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 470nF 6.3V 1pF 50V 2.7pF 50V 22pF 50V 22pF 50V C194 C195 C196 C198 C502 1322044151W 1322044151W 1322044151W 1310026111W 1310353311W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 22pF 50V 22pF 50V 10pF 50V 10nF 16V C606 C607 C608 C609 C610 1322046111W 1347471411W 1347561221W 1347561221W 1347471411W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 22pF 50V 470nF 6.3V 4.7uF 6.3V 4.7uF 6.3V 470nF 6.3V C504 C505 C506 C507 C508 1310026111W 1322046111W 1339256311W 1310452211W 1310146111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 10pF 50V 22pF 50V 3.9nF 50V 100nF 10V 100pF 50V C612 C613 CON1 CON2 D8 1347471411W 1347561221W 2311003053W 2304506061W 1725203001W CERAMIC CAPACITOR 470nF 6.3V CERAMIC CAPACITOR 4.7uF 6.3V AUDIOJACK SIM CONNECTOR SCHK DIODE SOD-523 ON_SEMI C509 C510 C511 C513 C514 1310146111W 1310146111W 1368156311W 1322046111W 1310452211W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100pF 50V 100pF 50V 680pF 50V 22pF 50V 100nF 10V D9 D10 D11 D12 D13 1720016001W 1720055101W 1770060303W 1770060303W 1770060303W SCHK DIODE RB160M-30 PMDU SCHK DIODE RB551V-30 UMD2 LED SP0603B-WW WHITE TOP SOLIDITE LED SP0603B-WW WHITE TOP SOLIDITE LED SP0603B-WW WHITE TOP SOLIDITE C515 C516 C517 C518 C519 1310452211W 1310553221W 1310452211W 1310452211W 1333046111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 100nF 10V 1uF 16V 100nF 10V 100nF 10V 33pF 50V D14 D22 D23 D24 D25 1770060303W 1725203001W 1725203001W 1725203001W 1725203001W LED SP0603B-WW WHITE TOP SOLIDITE SCHK DIODE SOD-523 ON_SEMI SCHK DIODE SOD-523 ON_SEMI SCHK DIODE SOD-523 ON_SEMI SCHK DIODE SOD-523 ON_SEMI C520 C522 C524 C525 C526 132R716111W 1339046111W 1322046111W 130R516111W 130R516111W CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR CERAMIC CAPACITOR 2.7pF 50V 39pF 50V 22pF 50V 0.5pF 50V 0.5pF 50V D26 EF1 EF2 F501 F502 1725203001W 2090220001W 2090220001W 2020900002W 2021800002W SCHK DIODE SOD-523 ON_SEMI EMIF ESD SC-88A ON-SEMI EMIF ESD SC-88A ON-SEMI SAW FILTER GSM900 SAW FILTER GSM1800 – 9-3 – Grid Ref. No. Part No. Part Name & Description Grid Ref. No. Part No. Part Name & Description R536 R537 R538 R539 R540 0730114111W 0715114111W 0739014111W 0715114111W 0718014111W CF FIXED RESISTOR SPECIAL FIXED RESISTOR SPECIAL FIXED RESISTOR SPECIAL FIXED RESISTOR FIXED RESISTOR 300Ω 1/16W 150Ω 1/16W 39Ω 1/16W 150Ω 1/16W 18Ω 1/16W R541 R542 R544 R545 R546 0730114111W 07R0014111W 111R01N111W 111R21N111W 0710214111W CF FIXED RESISTOR FIXED RESISTOR INDUCTOR INDUCTOR FIXED RESISTOR 300Ω 1/16W 0Ω 1/16W 1nH 1.2nH 1K 1/16W 0Ω 1/16W R547 R548 R552 R555 R560 0720214111W 07R0014111W 0718014111W 07R0014111W 07R0014111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 2K 1/16W 0Ω 1/16W 18Ω 1/16W 0Ω 1/16W 0Ω 1/16W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 220K 1/16W 2.2K 1/16W 2.2K 1/16W 220K 1/16W 10K 1/16W R576 R577 R603 R701 R702 07R0014111W 07R0014111W 07R0014111W 07R0014111W 07R0014111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 0Ω 1/16W 0Ω 1/16W 0Ω 1/16W 0Ω 1/16W 0Ω 1/16W 07R0014111W 0710414111W 0710414111W 0710414111W 0710414111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 0Ω 1/16W 100K 1/16W 100K 1/16W 100K 1/16W 100K 1/16W U1 U2 U3 U5 U8 0100552001W 1623276333W 0151992131W 0440111404W 0103014001W IC DSC SPCA552A TFBGA CRYSTAL 32.768KHz 12.5pF IC ASIC IC LDO IC INTE R14 R15 R16 R17 R18 0710414111W 0710214111W 0710214111W 0710114111W 0751214111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR SPECIAL FIXED RESISTOR 100K 1/16W 1K 1/16W 1K 1/16W 100Ω 1/16W 5.1K 1/16W U9 U10 U11 U12 U13 1820032601W 0203050111W 0301708031W 0440002801W 0510076201W MOSFET IC FLASH IC LOGIC IC LDO IC MELODY R19 R20 R21 R22 R23 0710114111W 0710414111W 0722414111W 0720414111W 07R0014111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR CF FIXED RESISTOR FIXED RESISTOR 100Ω 1/16W 100K 1/16W 220K 1/16W 200K 1/16W 0Ω 1/16W U14 U16 U17 U17 U501 2305033831W 0450189601W 04D0003101W 04D0003101W 0417496301W I/O CONNECTOR IC INV. IC SWITCH IC SWITCH IC TRANSCEIVER R24 R25 R30 R31 R33 07R0014111W 07R0014111W 0739014111W 0710114111W 07R0014111W FIXED RESISTOR FIXED RESISTOR SPECIAL FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 0Ω 1/16W 0Ω 1/16W 39Ω 1/16W 100Ω 1/16W 0Ω 1/16W U502 U503 U504 U505 U506 0427732501W 04B0615401W 1610018003W 0470011402W 0470012301W IC P.A. IC T/R-SW TCXO 26MHz IC TR. IC TR. R34 R35 R37 R38 R39 07R0014111W 07R0014111W 07R0014111W 0710414111W 0710214111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 0Ω 1/16W 0Ω 1/16W 0Ω 1/16W 100K 1/16W 1K 1/16W U603 U604 U605 VR1 VR2 0440111405W 0440111405W 0440111405W 2011001532W 2011001532W IC LDO IC LDO IC LDO VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V R43 R44 R46 R47 R48 0710214111W 0710314111W 0710414111W 0710414111W 0739014111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR SPECIAL FIXED RESISTOR 1K 1/16W 10K 1/16W 100K 1/16W 100K 1/16W 39Ω 1/16W VR7 VR8 VR9 VR10 VR11 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V R49 R50 R51 R52 R53 08R1501131W 0722214111W 0710114111W 0727012401W 07R0014111W CF FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR CF FIXED RESISTOR FIXED RESISTOR 0.15Ω 1/4W 2.2K 1/16W 100Ω 1/16W 27Ω 1/4W 0Ω 1/16W VR12 VR13 VR14 VR15 VR16 2011001532W 2011001532W 2011001532W 2011001532W 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V R54 R56 R57 R58 R560 0710414111W 07R0014111W 0710214111W 07R0014111W 0710114111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 100K 1/16W 0Ω 1/16W 1K 1/16W 0Ω 1/16W 100Ω 1/16W VR17 VR18 VR19 VR20 VR21 2011001532W 2011001532W 2012002931W 2011001532W 2012002931W VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR MLVS-0402-M07 20A 9V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR MLVS-0402-M07 20A 9V J1 J2 J3 JP1 L1 2306019221W 2308502271W 2303110101W 2302000301W 111012N111W FPC CONNECTOR BTB CONNECTOR BATTARY CONNECTOR RF SWITCH INDUCTOR 100nH L2 L5 L510 L511 L513 111012N111W 112200U5B1W 111202N111W 118202N111W 113R31N111W INDUCTOR 100nH POWER INDUCTOR C3-Y1.5R INDUCTOR INDUCTOR INDUCTOR L514 L520 L521 Q5 R2 111812N121W 1310146111W 111012N111W 1805585012W 07R0014111W INDUCTOR CERAMIC CAPACITOR INDUCTOR XTOR 2SC5585 EMT3 FIXED RESISTOR 180nH 100pF 50V 100nH R3 R4 R5 R6 R7 0722414111W 0722214111W 0722214111W 0722414111W 0710314111W R8 R10 R11 R12 R13 22uH 12nH 82nH 3.3nH – 9-4 – Grid 9.3. Sub Board PCB Assembly Ref. No. Part No. Part Name & Description Grid Ref. No. Part No. Part Name & Description VR22 VR23 VR24 VR25 VR26 2012002931W 2012002931W 2012002931W 2012002931W 2012002931W VARISTOR MLVS-0402-M07 20A 9V VARISTOR MLVS-0402-M07 20A 9V VARISTOR MLVS-0402-M07 20A 9V VARISTOR MLVS-0402-M07 20A 9V VARISTOR MLVS-0402-M07 20A 9V BT1 C79 C80 C150 C151 2316000011W 1322046111W 1322046111W 1322046111W 1322046111W VR27 VR28 VR29 VR30 2012002931W 2011001532W 2011001532W 2011001532W VARISTOR MLVS-0402-M07 20A 9V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V C152 C153 C154 C155 C156 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C157 C158 C159 C160 C161 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C162 C163 C164 C165 C166 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C167 C168 C169 C171 C172 1322046111W 1322046111W 1322046111W 1322046111W 1322046111W 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22pF 50V C173 C174 C175 C17 CON3 1322046111W 1322046111W 1322046111W 1322046111W 2308501251W 22pF 50V 22pF 50V 22pF 50V 22pF 50V AXK8L50125J 50P P=0.4(M)-NAIS D15 D20 D21 J6 L10 1710016201W 1770060303W 1770060303W 2306001961W 11220N3201W BAS16XV2T1 SOD523 ON_SEMI SP0603B-WW WHITE TOP SOLIDITE SP0603B-WW WHITE TOP SOLIDITE FH19S-6S-0.5SH HRS ELJPE22NKF 22nH L11 M1 Q6 Q7 R28 11220N3201W 2333080051W 1810201801W 1810461701W 0747114111W ELJPE22NKF 8005 502 2PIN 1.27P AVX 2SA2018 EMT3 2SC4617 EMT3 FIXED RESISTOR 470Ω 1/16W R110 R111 R112 R113 R114 0722314111W 0722214111W 0710014111W 0718014111W 0710414111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 22K 1/16W 2.2K 1/16W 10Ω 1/16W 18Ω 1/16W 100K 1/16W R123 R124 R125 R131 R143 0768014111W 0710014111W 0710014111W 07R0014111W 0710414111W FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR 68Ω 1/16W 10Ω 1/16W 10Ω 1/16W 0Ω 1/16W 100K 1/16W U18 VR3 VR4 VR28 VR29 2306019302W 2012002931W 2012002931W 2011001532W 2011001532W FH19S-30S-0.5SH HRS VARISTOR MLVS-0402-M07 20A 9V VARISTOR MLVS-0402-M07 20A 9V VARISTOR V-PORT-0402-220M-V05 1A 5V VARISTOR V-PORT-0402-220M-V05 1A 5V VR30 2011001532W VARISTOR V-PORT-0402-220M-V05 1A 5V – 9-5 – BAT SINGATRON 2BA-0003-001 22pF 50V 22pF 50V 22pF 50V 22pF 50V 22nH Grid 10. BLOCK DIAGRAMS 10.1. Baseband – 10-1 – PAVAPC BBVAPC PDET BBVAFC TXQN TXQP TXIN TXIP 10.2. RF Band PA ENA LE DATA CLK PA GAIN CONTROLLER EGSM900 GSM850 TxIFP TxIFN ENB D2 TXINP PFD ENB ENB CP TXCPO D1 FILTN FILTP DCS1800 PCS1900 ENB ENB ENB U502 PA VCXO_EN LO Frac-N UHFTUNE APC UHFCPO XTALTUNE XTALBUF U501 Transceiver VGA2 VGA1 I MIX OUT GSM LNA F501 LNA900 IN DCOC DCOC DCOC Q MIX OUT VGA2 SAW Filter GAFIP GAFIN DCS LNA F502 LNA1800 IN VGA1 RXQP RXQN SAW Filter DCOC DCOC DCOC GAFIP GAFIN XTAL U504 TCXO 26 MHz AFC – 10-2 – U503 TR SW VC1 VC2 RXIP RXIN 11. CIRCUIT DIAGRAMS 11.1. Main PCB (Baseband) D[0..15] D[0..15] D[0..15] A[1..22] D23 1 2 D25 1 2 R88 1K 2 D24 1 2 1 2 8 7 6 5 D26 1 2 3 4 COL4G M5 COL3G COL2G COL1G COL0G P5 L5 K5 N4 R89 1K L6 ROW4G ROW4 KBC4/XDIO2 KBC3/XDIO1 KBC2/XDOP0 KBC1/NIRQ KBC0/NFIQ KBR4/XDIO7 R90 1K 22p 22p 22p 22p 22p C129 C130 C131 C132 C133 VR9V33pf VR9V33pf R92 1K N6 P6 M6 K6 ROW3G ROW2G ROW1G ROW0G 1 2 3 4 KBR3/XDIO6 KBR2/XDIO5 KBR1/XDIO4 KBR0/XDIO3 VR25 VR23 VR9V33pf VR24 VR9V33pf VR9V33pf 8 7 6 5 TSPEN3/NSCS2 TSPACT11/MCLK TSPACT10/NWAIT TSPACT9/MAS1 SD_IRDA/CLKOUT_DSP nCS2 TO IOTA LCD_A0 TO COMPANION M4 L4 P8 K7 L7 L8 N2 LCD_A0 MMI_INT By Pass LEDLCM_EN KeyLED_En CMOS_EN nRESET R21 220K E12 E14 G14 C14 M2 P11 F1 K1 P2 P4 N8 P10 B1 P13 A2 A7 A10 nRESET DGND IO3/SIM_RmW IO2/IRQ4 MCUEN(1)/IO8 BU/PWT LT/PWL MCUEN(2)/IO13 nRESET VSSANG VSSPLL VSS VSSRTC IDDQ BCLKR/ARMCLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VR5.5V33pf VR5.5V33pf VR5.5V33pf VR5.5V33pf VR5.5V33pf VR5.5V33pf VR5.5V33pf VR5.5V33pf VR9V33pf VR9V33pf VR14 VR15 VR16 VR12 VR17 VR18 VR6 VR5 R15 D12 1K F10 R16 1K F12 R17 100 0 R55 CLK32K_OUT VFSRX VCLKRX VDX VDR BDX BFSR BFSX RTC_ALARM K5 TO IOTA RESPPWRONZ nCS0 R131 CLK13M_OUT RF_DATA R19 100 DSC_13MHZ nCS2 C1 nCS1 C3 F4 nCS1 FDP RnW B2 RNW U11 1 2 TO COMPANION MCSI_CLK/IO11 MCSI_TXD/IO9 TSPDI/IO4 nCS4 OSC32_IN OSC32K_OUT VSSO H12 0 1 2 4 3 1 2 4 3 4 R132 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 P_VCC C66 1U DGND H2 H3 G3 H4 J5 G5 J6 H7 G2 J3 G4 J4 H5 G6 H6 J7 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 P_MODE VSS VSS VSS VSS VSS VSS R_WE# ADV# VCCQ L1 L5 L6 L7 L8 B4 C4 E5 L2 DGND A7 DU A8 DU R132 FOR M6MGD13BW34DDGC59 3 M1 DU M2 DU nCS0 nCS3 M7 DU M8 DU R58 0 nCS1 FDP D6 RNW F5 P_CS# F4 RST# WE# R_LB# D5 VRIO J2 H8 H1 nFOE nBLE nBHE nBLE nBHE C2 F3 TP31 RF_DATA J14 H14 E13 A12 A13 K14 K12 K13 J10 L13 M14 G7 A1 DU A2 DU 0 R20 100K E2 E4 F5 OE#1 OE#2 P_OE R_UB# s_vcc C3 A23 D3 A24 E3 A25 VBAT RF_CLK RF_LE 13MHZ TCXOEN RFEN PCSENA SXENA TRENA TXENA RXENA PAENA M10 RNW 28 R67 AUXOP R69 20K C82 DATnIRQ nCS4 1 30 3 29 DATnIRQ nCS4 C85 C89 C13 B13 4 LCD_A0 TP29 MCSI_TXD H10 C11 R14 68K 14 13 12 1U nRESET TP30 MCSI_RXD L10 31 nFOE TO RF BAND CLK13M_OUT TP28 MCSI_CLK N10 A14 WAIT A22 K4 VSS J1 S_CS1 C5 S_CS2# K1 CE#1 G8 CE#2 5 nCS0 nCS3 RF_DATA MCSI_RXD/IO10 100n C7 VRMEM FDP/NIACK TSPACLKX TSPEN2 CLKTCXO TCXOEN RFEN TSPACT8/NMREQ TSPACT7/CLKX_SPI TSPACT6/NCS6 TSPACT4/NREADYMEM TSPACT3 TSPACT1 C63 F_VCC1 U10 Memory K8 DGND IO0/TPU-WAIT L3 DGND DGND CLK13M_OUT TEN EAR_DETECT TDR G12 J13 J12 J11 B8 N3 100n SWICHONOFF H13 N11 H11 nCS0 nCS3 nFOE/X_A(3) nBLE/IO15 nBHE/IO14 C62 VRMEM 0 TP3 CLK32K_OUT C2 D3 MCUDI MCUDO MCUEN(0) BDR SIM_RST EXT_IRQ EXT_FIQ C65 1U 100K 100K 100K 100K R10 R11 R12 R13 VRRAM C12 M13 N12 P14 N13 M11 L11 P12 B14 G11 K7 F_VCC1 J8 VCCQ DGND SIO3 SCLK3 nCS0 nCS3/INT4N TSPEN1 N7 M7 M8 K10 G10 M3 P1 DGND 100n R18 5.1K U3 Baseband LSI SIM_CD/MAS0 MCUDI MCUDO MCUEN0 BDR SRST3 EXT_IRQ EXT_FIQ DGND S_PWCT nFOE RnW DGND DGND 5 100n C61 100n 1n 6 R70 3.3K 100K 9 8 8 U2 VRIO /RD /WR EQ3 EQ2 EQ1 NC SPVDD VDD IOVDD /RST CLKI A0 /IRQ /CS VREF PLLC U13 Melody Generator D0 D1 D2 D3 D4 D5 D6 D7 HPOUT-R LED HPOUT-L/MONO VSS SPOUT2 SPVSS SPOUT1 MTR DGND DGND – 11-1 – 5 15 7 32 27 26 25 24 23 22 21 20 11 2 10 18 17 19 D0 D1 D2 D3 D4 D5 D6 D7 33p TSPEN0 BCLKX/IO6 TSPDO NC 100n C60 D4 B5 B6 L4 K6 C87 COL3 COL2 COL1 COL0 VR22 MCSI_FSY F14 L12 M12 G13 F13 Vout C59 VCCQ VPP VSS F_VCC2 F_VCC2 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 0 D22 1 COL4 VR21 B11 E10 K11 Vin GND STBY WP# R66 ON_OFF CLK13M_OUT/START_BIT IO_PWR_EN TDI TDO TCK TMS RX_IRDA ACCID TX_IRDA ACC_PWR GND G1 F1 E1 D1 B1 C1 F2 E2 F6 D7 E7 B8 C8 D8 F7 E8 F8 D2 B2 B3 E6 B7 1U RESPWRONZ 0 R78 0 4 3 15 5 12 6 14 4 13 16 E4 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 0 10U VDDS-1 VDDS-1 VDDS-2 VDDANG C18 47K C7 nlBOOT DGND ROW3 ROW2 ROW1 ROW0 R23 K9 U12 3 2 1 TDI TDO TCK TMS RX_IRDA VACCID TX_IRDA RTS CTS RXD TXD DSR VRMEM R59 CLK C86 N5 L14 A11 E11 100n 100n C22 C24 R149 100K 100n N1 VBAT VRIO R22 200K 10 7 8 9 11 DGND DGND C84 100n VRIO DGND TO IOTA TP27 MCSI_FSY 2 C88 C7 100n C22 DGND CLK32K_OUT VFSRX VCLKRX VDX VDR BDX BFSR BFSX IT_WAKEUP VDDRTC VDDS-RTC RX_IRDA TX_IRDA 8 7 6 5 3 1K SIM_PWRXTRL/IO5 TSPACT2 TSPACT0 SIM_IO SIM_CLK C7 A8 R74 10 1 TDI 2 TDO 3 TCK TMS 4 R75 100 1 4 2 3 100 RTS CTS RXD TXD DSR VR13 nEMU0 nEMU1 TSPACT5/DPLLCLK RX_IRDA TX_IRDA R72 GND F1.8V R57 VDDS-MIF VDDS-MIF VDDS-MIF VDDS-MIF MCSI_FSYNCH/IO12 D8 C8 8 7 6 5 VR11 VDDPLL nFWE/X_A(0) SDO/INT10n nSCS0/SCL nSCS1/X_A(2) SCLK/INT1n SDI/SDA TDI TDO TCK TMS 1 2 3 4 VR5.5V33pf VDD TXIR_IRDA RXIR_IRDA/X_A1 D10 C10 B10 E9 RTS_MODEM CTS_MODEM RX_MODEM TX_MODEM DSR_MODEM Vout CE DGND C6 R71 200 Vin VRMEM CHG DGND C64 100n D14 D13 100n 100n C10 100n 100n C20 D1 G1 A4 B6 VDD D9 VRRTC C8 100n C14 DGND VDD DGND VR5.5V33pf VRMEM RX_IRDA TX_IRDA U14 PS2_IO 1 2 VR10 100n 100n E3 K8 L9 N9 P9 M9 C19 C6 100n C9 F11 VDD TP12 VCHG TP19 TP20 TP21 TP22 TDI TDO TCK TMS 10K VR5.5V33pf A5 B12 VDD 1 VR9 100n 100n E1 C15 C23 C25 C21 100n 100n N14 VDD 1K TP13 TP14 TP16 TP17 TP18 RTS CTS RXD TXD DSR VR5.5V33pf P7 DGND TDI TDO TCK TMS R76 VR8 VRDBB M1 DGND IO1/TPU-IDLE TMS TP2 RTS_MODEM CTS_MODEM RX_MODEM TX_MODEM DSR_MODEM F1.8V (Flash Core) U18 4 VACCID VRIO R7 VBAT TCK VR7 P3 D11 E8 C9 A9 TO IOTA C91 1U FOLD nBSCAN RTS_MODEM/TOUT CTS_MODEM/XF RX_MODEM TX_MODEM/XIOSTRBN DST_MODEM/LPG VRMEM TDO D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 C12 22p 2 CC1 22p Out 1 B3 A3 D4 C4 B4 E5 D5 B5 C5 E6 C6 A6 D6 E7 D7 B7 DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA9 DATA8 DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 C13 10p Vcc GND VCHG ADD0 CS4/ADD22 ADD1 ADD2 ADD3 ADD4 ADD5 ADD6 ADD7 ADD8 ADD9 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21/CK16_IRDA C11 22p U17 3 F3 D2 F2 G5 G4 G2 G3 H1 H3 H2 H4 H5 J1 J2 J3 J4 K3 K2 K4 J5 L1 L2 L3 A22 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 VRIO A[1..22] R56 TO COMPANION DGND DGND C83 1U HSO2 SP+ SP– MTR DGND TO IOTA TP501 RXIP RXIP VBAT C608 4.7U Vdd 3 4 22p NM C606 470n 4.7p C604 C605 C607 1p 2.7p C603 470n V_RF Gn d Vout C574 100n C602 + B-case TP504 RXQN 100U TP503 RXQP R531 0 R999 : NM for 900/1800 0Ω for 850/1900 C601 R532 0 C513 22p VDDBB TxEN LE 2 3 4 VCXO EN DATA PDETVCC XTAL TUNE 34 VCCD 31 13 30 29 R513 39K CapQN 28 CapQP 27 CapIN 26 CapIP 25 VCC 2 24 TxIFN 23 TxIFP 22 TxQN 21 TxIN TxQP 20 19 TxIP 18 22p BBVAPC C525 0.5p 16 17 PAVAPC GND 5 2 8 9 3 470p C560 L511 82nH C553 : 3.3n for TXO 0 for VCXO 10 1 GSM/850 RX VC_DCS-TX NC 11 U505 4 R517 2.4K V_RF VC_GSM-TX DCS/PCS-RX U506 3 6 1 C508 100p VCC 1 AFC C502 : 10n for TXO 1n for VCXO Interface-2/2 V_TCXO AFC U8.J4 APC U8.K4 TXIP U8.D9 TXIN U8.D10 TXQP U8.C10 TXQN U8.C9 RXQP U8.E10 RXQN U8.E9 RXIP U8.F9 RXIN U8.F10 C524 22p U508 2 R507 10/NM 1 R553 NM DCS/PCS TX 4 afc/in R507 : 10 for TXO NM for VCXO R552 : 18 for TXO NM for VCXO C553 C580 100p/NM ANT 1 NM C544 100n GND F503 NM vcc/gnd 2 K T 18-26Mhz V_RF C556 NM GND R552 18/NM 3.3n/0 470p C561 C526 5p L513 3.3nH C554 NM GND 4 OUT R515 2 1 S2 S1 S2 S1 4 3 2 TXQN TXQP 3 2 x 6.8K LM-D61554 IN NM OUT 5 C552 NM C531 DNI V_RF 3 7 GSM/850-TX 3 C572 NM C573 0.75p L506 0 2 R702 0 C549 1n F502 DRDA3 (for 900/18 ) EFCH1960TCD1 (for 850/1900) 1 4 5 3 R514 0 4 R544 1nH LPF ADJ F501 DRDA2 (for 900/18 ) EFCH881MTCD1 (for 850/1900) C529 DNI 5 L510 12nH 12 GND U 503 GND C570 NM C571 1p R545 1.2nH 6 U504 R578 0/NM XTAL BUF NC C555 0 C510 220p GNDD LNA PCS IN 14 C504 : 10p for TXO 0p for VCXO C502 10n/1n PDET 3 C702 22p V_TCXO 32 NC C530 12p R510 0/NM 33 C504 10p/0p VCCF 12 C543 3.9n C543 39p XTAL LNA DCS IN C505 C522 39p R526 510 L514 180nH GND LNA GSM 11 C598 NM 35 GNDFN 15 4 R504 0 C507 0.1U C548 10p 36 UHF CPO 9 LNA GSM IN 2 SXENA R509 0 V_RF 10 1 RF_DATA VCC FN CP Triband GSM Transceiver TxINP 5 R503 0 C547 0.1U 8 C532 3.9nH 40 37 U501 TxCPO VC_PCS-RX 0 0 0 0 1 RF_CLK SX ENA VCC 1 VC_D/P-TX 0 1 0 0 0 RF_LE R502 0 38 6 CP Current : GSM, DCS = 1.0mA PCS = 0.75mA R501 0 41 39 5 R527 220 42 CLK PCO R576 0 C511 680p R547 2.0K C551 8.2n 45 46 44 UHF Byp UHF Tune 48 49 50 51 52 53 47 VCC 3 RxQN RxQP RxIN RxIP VCC 4 55 54 TxGSM VCC UHF V_TCXO R555 0 43 RxEN 7 VC_GSM-TX EGSMTx 1 PCS/DCSTx 0 EGSMRx 0 DCSRx 0 PCSRx 0 2 R519 0 C514 100n C516 0.1U C518 100n C519 33p 1 C701 NM C533 10n C534 100p V_RF R560 0 VCXOEN R548 0 C537 680p C538 33p C539 10U R533 510 56 VBAT R546 1K + C517 100n C520 2.7n R537 150 C590 7p 22 VBAT R701 0 21 R508 5600 C506 3.9n 20 2 1 VCCTxVCO 19 CP Current : 400 µA TxDCS_PCS VCC_CMOS C515 100n TxVCOTune PAC ENABLE R575 NM GND 3 C566 100p DCS/PCS OUT 4 R534 390 VCC1 R536 100 BAND SELECT GND 5 R541 100 U502 PA RSVD R539 150 C535 100n GND GND DCS/PCS IN TCXOEN R540 18 R535 51 18 GND R577 0 6 C536 100n 17 GSM850/900 IN R603 0 VCXOEN V_TIC 8 VAPC 16 GND GND 15 GND GND 14 VCC1 VBATT 13 7 9 GSM850/900 OUT VSENSE 12 10 11 GND 23 U603 R1114Q281D 1 R520 0 R521 0 R538 39 CE V_RF R507a R999 NM/0 V_TCXO TP502 RXIN C600 RXIN RXQP RXQN RXENA TXENA PAENA APC 11.2. Main PCB (RF Band) 13MHz 4 GND TO IOTA C559 NM R518 2.4K C613 4.7U 3 Vout Gnd 2 Vdd 4 V_TIC CE U605 R1114Q 1 1 VBAT V_RF C612 470n R524 3.3K C527 22p R525 3.3K C528 22p VBAT C609 4.7U RN2902FEEMT6 R543 3.3K C541 220nH U604 R1114Q RFEN U3.A13 TCXOEN U3.A12 TXENA U3.J10 RXENA U3.L13 SXENA U3.K12 TRENA U3.K13 PAENA U3.M14 PCSENA U3.K14 13MHz U3.E13 RF_CLK R601 20K R602 8.2K RFEN RF_LE RF_DATA PCSENA TRENA C542 22nH C521 100nH L520 100p Interface-1/2 13MHz 2 x 6.8K 4 ANTSW RFSW ANT1 ANTENNA R554 NM TXIN TXIP Vout RN2905FEEMT6 4 3 Gnd 2 S2 S1 3 3 R 516 S2 S1 2 RF 3 0404 4 GND ANT 1 6 2 1 Vdd ANTENNA GND V_RF CE 1 5 2 C610 270n 4 2 5 R523 NM JP1 C540 33p R542 0 C509 100p TC7SZU04AFE NMEMT5 U3.J14 U3.H14 U3.H11 TO BASEBAND – 11-2 – 11.3. Companion 22p 22p 22p C125 C126 VR5.5V33p C115 22p VR5.5V33p C114 C124 VR5.5V33p C113 22p VR5.5V33p C112 C123 VR5.5V33p C111 22p VR5.5V33p C110 C120 VR5.5V33p C109 22p VR5.5V33p C108 C119 VR5.5V33p C107 22p VR5.5V33p C106 C195 GPIO2 C118 VR5.5V33p C105 SP+ SP– 22p VR5.5V33p VR5.5V33p C104 VR5.5V33p C103 DAC VRTC CON50A TP1 XTALOUT R4 2.2K R5 2.2K 22p 22p 22p C190 C191 DGND DGND DGND J4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 GPIO0 XTALOUT G4 SENPW_ON SP– 4 LCM22 R145 100K Q8 DGND D_VDD TopLED_EN VRMEM R146 0 O_VDD U6 3 O_VDD (O_VDD 2.8V) LED+ D10 RB551V-30 VBAT DGND 0 4 LCMLED_EN LCM_D0 LCM_D1 LCM_D2 LCM_D3 LCM_D4 LCM_D5 LCM_D6 LCM_D7 LCM_D8 LCM_D9 LCM_D10 LCM_D11 LCM_D12 LCM_D13 LCM_D14 LCM_D15 LCM_RESET LCM_A0_RS LCMLED– LCM_D8 LCM_D9 LCM_D10 LCM_D11 LCM_D12 LCM_D13 LCM_D14 LCM_D15 LCM_RESET LCM_A0_RS LCMLED– SHDN FB 2 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p C157 C158 C159 C160 C161 C162 C163 C164 C165 C166 C167 C168 C169 C171 C172 C173 3 DGND R97 100K DGND DGND – 11-3 – VCC1 /CS WR RD GND D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 /RESET RS GND LED HOST1 VCC LED VSYNC IM3 VR30 VR5.5V 2.2p VR29 VR5.5V 2.2p TP51 L11 22nH L10 22nH 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 R132 0/NM 22p 1 C156 GND VR3 VR9V C174 150p LCM_D0 LCM_D1 LCM_D2 LCM_D3 LCM_D4 LCM_D5 LCM_D6 LCM_D7 D15 BAS16XV2T1 2 LCM_CSB LCM_WR LCM_RD_E 22p LX SS C176 22p 1 R111 2.2K 3 1 R113 18 R114 100K DGND U18 PS2 LCM Connector LCM_CSB LCM_WR LCM_RD_E C155 IN DGND 3 R50 2.2K C56 100N Q7 DGND VR28 VR5.5V 33p 5 C198 10P U16 6 DGND R8 2 R131 0 (Backend Core 1.5V) TO BASEBAND TP50 O_VDD R95 560K D_VDD 2 BT1 Backup BAT DGND Q6 2SA2018 EMT3 M1 2 C196 22P GND SP+ SP– DGND C197 22P Vout CE C32 1U Vin 1 C136 10U D_VDD 3 1 R147 0 L5 C3Y1.5-22UH C180 22P U7 4 CMOS_EN VRDBB R191 0 DGND R112 10 22p R148 0 2 0 DAC VRTC C154 GND R108 DAC VRTC 22p Vout CE 0 EARP EARN C153 Vin 1 C30 1U 4 CON50A R109 TP11 LED+ C152 VBAT O_VDD LCMLED_EN 2 22p 5 6 R28 470 H6 Q2 R122 68 TP37 CON6 DGND BACKUP R143 100K TG1 3 2 1 A3 LCM_RESET LCM_17 LCM_16 LCM_D15 LCM_D14 LCM_D13 LCM_D12 LCM_D11 LCM_D10 LCM_D9 LCM_D8 LCM_D7 LCM_D6 LCM_D5 LCM_D4 LCM_D3 LCM_D2 LCM_D1 LCM_D0 LCM_A0_RS LCM_WR LCM_RD_E LCM_CSB G6 J6 G5 J3 H3 G3 J2 H2 J1 H1 G2 G1 F3 F2 F1 E3 E2 E1 D1 D2 D3 C1 C2 R110 22K 22p 12p R31 100 FlashPreview DGND VBAT COL1 COL0 ROW4 ROW3 ROW2 ROW1 ROW0 PWON LED+ VR1 V5.5V LCM23 LCM21 LCM20 LCM19 LCM18 LCM17 LCM16 LCM15 LCM14 LCM13 LCM12 LCM11 LCM10 LCM9 LCM8 LCM7 LCM6 LCM5 LCM4 LCM3 LCM2 LCM1 LCM0 TopLED_EN 1 DVDD 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 2 OVDD E4 VSS D5 VSS FlashCapture VR4 VR9V CON3 LCM_D0 LCM_D1 LCM_D2 LCM_D3 LCM_D4 LCM_D5 LCM_D6 LCM_D7 LCM_D8 LCM_D9 LCM_D10 LCM_D11 LCM_D12 LCM_D13 LCM_D14 LCM_D15 LCM_D16 LCM_D17 LCM_RESET LCM_WR LCM_RD_E LCM_CSB LCM_A0_RS C151 12p C29 12p C31 C201 12p R30 39 FLED– C175 22p VBAT TG2 TG3 TG4 TG5 TG6 TG7 3 C202 R29 300 D4 R125 10 EARN DGND L201 4 5 D6 100n LED+ KeyLight (Display PCB) D21 LED 2 1 R123 68 6 100n C4 J6 1 2 3 4 5 6 EARP O_VDD C5 DGND TP35 TP36 C150 D20 LED LCMLED_EN 22p 22p C151 L200 DGND U1 Companion D_VDD O_VDD C150 DGND DGND PWON,COL0,COL1,ROW0-ROW4 TP34 R124 10 RGB6 RGB7 RGB8 RGB9 TG0 B3 A2 A1 B2 B1 C3 VD PCLK MCLK 39 39 TO IOTA R130 100K R6 220K 22p 22p R3 220K R189 R190 LCM25 LCM24 RGB0 RGB1 RBG2 RGB3 RGB4 RGB5 B5 C5 A4 B4 C4 SCK SD C188 22p C187 22p 22p C186 C185 C184 22p C183 22p C182 C181 C194 22p RGB_D4 RGB_D5 RGB_D6 RGB_D7 SEN_RST C80 22p H7 J7 B7 A7 C6 B6 A6 A5 C79 22p SP+ 22p GND HREF VSYNC PWDN PCLK AVDD2V5 DVDD3V3 SIO_D XCLK SIO_C Y0 Y1 Y2 Y3 GND Y4 Y5 Y6 Y7 RESET LED+ LED– C192 J1 CMOS CAMERA EARP EARN 22p DSC_13MHZ VR5.5V33p H4 O_VDD COL1 COL0 ROW4 ROW3 ROW2 ROW1 ROW0 PWON LED+ LED– C117 R86 MMI_INT RnW LCD_A0 nFOE nCS2 4 3 C102 H5 G7 H9 H8 J9 R85 100 1 2 100 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 C116 TO BASEBAND VR5.5V33p TP33 DGND TP26 nCS2 C101 GPIO1 HBUS3 HBUS2 HBUS1 HBUS0 XTALIN DGND TP25 RnW VR5.5V33p E6 VSS F5 VSS J8 BYPASS TP15 MMI_INT C100 2 HBUS20 DVDD VR5.5V33p F6 C99 100n 4 3 2 1 VR5.5V33p GND C2 5 6 7 8 C98 CE R25 0 3 A8 VR5.5V33p Vout OVDD 4 3 2 1 4 3 2 1 C97 Vin F4 C28 1U 1 100n R83 100 VR5.5V33p U5 4 C1 R82 100 5 6 7 8 C96 DVDD2V5 (Sensor Power) DGND TP32 BYPASS D_VDD O_VDD VR5.5V33p 2.5V FOR OV7649 R24 0 NM DVDD2V5 C95 DGND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 4 3 2 1 4 3 2 1 VR5.5V33p C27 10U 2 nRESET C94 GND XPREST_N 5 6 7 8 R81 100 5 6 7 8 VR5.5V33p CE 1 SENPW_ON 3 5 6 7 8 R80 100 C93 Vout 22p Vin R2 0 J5 C195 U4 O_VDD R1 10K C26 1U VBAT 4 HBUS19 HBUS18 HBUS17 HBUS16 HBUS15 HBUS14 HBUS13 HBUS12 HBUS11 HBUS10 HBUS9 HBUS8 HBUS7 HBUS6 HBUS5 HBUS4 AVDD2V5 C92 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 A9 B8 B9 C8 C9 D7 D8 D9 E7 E8 E9 F9 F8 F7 G9 G8 AVDD2V5 L1 LCM_D0 LCM_D1 LCM_D2 LCM_D3 LCM_D4 LCM_D5 LCM_D6 LCM_D7 LCM_D8 LCM_D9 LCM_D10 LCM_D11 LCM_D12 LCM_D13 LCM_D14 LCM_D15 LCM_D16 LCM_D17 LCM_RESET LCM_WR LCM_RD_E LCM_CSB LCM_A0_RS D[0..15] VBAT J2 R79 100 TO BASEBAND DGND 11.4. IOTA UPR VBAT TP6 VCMEM C2 IBIAS VREF C51 33p PWON 5 R43 1K ROW4 4 COL3 1 S12 C46 33p DGND Vbias (2.5V - 2.8V) HSMICP K7 # VRRTC 7 22K D1 B9 A9 A3 S1 VRTC DGND S17 Soft-KeyR SEND Soft-KeyL S18 S19 S20 S21 S22 RIGHT LEFT DWON UP MENU E1 VBACKUP 39 SRST5 D4 DGND O2 I1 GND I2 1 2 3 DGND C145 VR5V33pf DGND C4 SCLK5 R105 1 C45 12P C1 C146 VR5V33pf CLK 5 SIMCK 39 VXRTC I/O RST VCC GND C28 VR5V33pf VPP C134 100n VBAT R107 20K C147 100n DGND 3 Power / End DGND L2 100nH DGND DGND DGND DGND DGND DGND VCK VFS VDR VDX TDR TEN DAC TEST1/INT1 TEST2/INT2 UEN UDR UDX K3 G5 F5 H5 G3 H1 H4 H6 E6 R53 EAR_DETECT HSO2 VCLKRX VFSRX VDX VDR TDR TEN DAC EXT_FIQ EXT_IRQ MCUEN0 MCUDO MCUDI 0 K6 K5 J5 TO BASEBAND MICP MICN R96 MICBIAS B8 B10 0 LEDB A10 C8 J8 MICBIAS LEDA LEDB1 LEDB2 TEST3 TEST4 GNDAV J6 F6 G6 C140 5 100n 4 O1 I1 O2 GND I2 R99 10 1 Q5 2SC5585 EMT3 DGND – 11-4 – 1 1 2 3 2 MIC+ MICMIC1 R101 330 R102 1K C143 10U C144 100n LEDC DGND 2 R100 1K C137 100n 3 DGND MICIN C53 33p TOP VIEW LEDA VR26 2K H7 100n DGND C142 33p 6 2 MICIN C139 MICIP DGNA LEDC R98 J7 GNDA DGND KeyLed_En EF2 SIMIO MICIP G10 C141 100p B3 C149 VR5V33pf C148 VR5V33pf D14 LED WHITE 1 2 1 D13 LED WHITE D12 LED WHITE 2 D11 LED WHITE 2 1 DGND 1 4 39 TO BASEBAND 2 DGND SIO5 1 2 1 2 DGND CON2 SIM CONN R94 39 4 3 4 3 R54 100K R93 TO COMPANION CON1 Jack SIMRST COL0 S14 COL0-COL4,ROW0-ROW4 DGND O1 R62 22K VRSIM PWON,COL0,COL1,ROW0-ROW4 10U 22K 4 COL1 R106 PWON C74 C56 100n VR1 V5.5V S16 H9 HSO DGND R50 2.2K S15 DGND HSO TP11 EF1 5 22p Side DGND VRRTC GNDL1 GNDL2 GNDD DGND 1U 2 Q4 COL2 C42 1U VR27 VR9V 33pf C69 1 9 HSMICIP C50 33p DGND 8 C67 10U R60 100 HSMICBIAS K8 PWON S13 VRIO C138 33p S11 U8 IOTA 2 D8 TP10 S10 100p C7 C6 C40 22p 0 6 ADIN3 ADIN4 HSMICBIAS F8 C48 5 S9 CK13M CK32K DBBSCK DBBSIO DBBSRST BFSX BDX BFSR BDR Mic2 S8 COL4 EARP EARN AUXOP AUXON AUXI Mic Speaker G1 1 DLPWR J9 J10 K9 K10 G7 4 EARP EARN AUXOP AUXON AUXI R39 1K F7 R103 330 S6 2 TO BASEBAND TP4 R104 1K S7 S5 E4 E2 F4 E5 G4 K2 J2 H3 J3 22p C54 100p 3 S4 C41 100n C55 33p ∗ ROW0 ROW1 ROW2 ROW3 ROW4 S3 C44 A8 G2 RPWON PCHG VCHG TP9 S2 R47 100K B7 DGND VCHG CLK13M_OUT CLK32K_OUT SCLK3 SIO3 SRST3 BFSX BDX BFSR BDR C128 22p A7 REFGND 1 2 3 C34 C57 33n C58 1U VCHG DGND R61 220K B5 A5 J3 TO RF BAND C47 33p 1 4 U9 FDG326P 3 3 2 1 VR2 V5.5V PCHG VCHG VCIO ICTL 2 5 6 VCMEM VCRAM VCABB VCIO2 VCIO1 VCDBB VBATS VBAT VCCS ICTL APC AFC TXIP TXIN TXQP TXQN RXIP RXIN RXQP RXQN R63 3.3K 4.7U 4.7U VCIO VCDBB VBATS VBATD VCCS ICTL G2 F2 G9 A1 A2 K1 C5 A4 D5 D6 VCMEM C33 10U C38 10U C37 C35 C36 1U 4.7U PCHG R52 39 1/4W APC AFC BULIP BULIM BULQP BULQM BDLIP BDLIM BDLQP BDLQM K4 J4 D9 D10 C10 C9 F9 F10 E10 E9 33p C52 100n D9 RB160M-30 1 2 R49 0.15Ω 1% VCCS R51 100 ADIN2 VSABB VRABB VRSIM VRIO1 VRIO2 VRDBB VRRAM VRMEM C70 22p H2 H10 B4 B2 B1 J1 F1 G1 VSABB CON3 R91 1K BATTEMP A6 C127 22p VRMEM C76 VRRAM 100n VRDBB C73 VRIO R65 22K VRSIM TP24 BATTEMP G8 C78 33p C49 100n TESTV VRABB VBATS TP23 VBAT VBAT TP5 VLMEM VR20 VR5.5V33pf TESTRESTZ F3 TO BASEBAND C77 33p H8 R40 100K SWITCHONOFF RESPWONZ TDO TMS TCK RTC_ALARM VACCID 22p VBATD E3 D3 D7 E8 D8 D2 B6 C72 DGND ONNOFF RESPWONZ TDI TMS TCK ITWAKEUP ADIN1 VR19 VR5.5V33pf VLRTC R46 100K R38 100K R37 0 22p C3 TP8 C71 R44 10K VCIO R48 39 BS_TDO TP7 C75 C39 10U R35 0 TDO E7 3 R34 0 C43 100n VCDBB UPR R45 10K R33 0 12. LAYOUT DIAGRAMS 12.1. Main PCB (Top View) – 12-1 – 12.2. Main PCB (Bottom View) – 12-2 – 12.3. SUB PCB TOP VIEW BOTTOM VIEW – 12-3 – 12.4. FB PCB – 12-4 –