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6th Gen Intel® CoreTM Modular-Designed Systems A complete product line for a variety of embedded applications Available in fanless and fan solutions with high performance
EC500-SD
EC510/EC511-SD
EC531/EC532-SD
Intel® Xeon® E3-1200 v3/ 4th Generation Intel® CoreTM
6th Generation Intel® CoreTM
Processor Intel® Q170/H110
Chipset
Intel® Q170
Memory Display Output
EC553-DL
Intel® C226
2 DDR4 SODIMM up to 32GB
2 DDR3 SODIMM up to 16GB
1 VGA, 1 DVI (DVI-D signal), 1 HDMI
1 VGA, 1 DP
Storage
1x 2.5" SATA drive bay
Ethernet
2 Intel® GLAN
5 Intel® GLAN
2 Intel® GLAN
2 Intel® GLAN
2 Mini PCIe (USB/PCIe/mSATA)
1 PCI (EC510)/ 1 PCIe x16 (EC511) 2 Mini PCIe (USB/PCIe/mSATA)
2 PCI +1 PCIe x16 (EC531) 1 PCI +2 PCIe x16 (EC532) 2 Mini PCIe (USB/PCIe/mSATA)
2 PCI + 2 PCIe x16 (x8 signal) + 1 PCIe x4 (x1 signal) 1 Mini PCIe (USB/PCIe/mSATA)
USB
4 USB 3.0 (Type A) 2 USB 2.0 (Type A) (Intel® Q170 only)
4 USB 3.0 (Type A)
8 USB 3.0 (Type A)
2 USB 3.0 (Type A) 4 USB 2.0 (Type A) 1 vertical USB 2.0
COM
4 RS-232/422/485
1 RS-232, 4 RS-232/422/485
1 RS-232, 4 RS-232/422/485
4 RS-232/422/485
DIO
N/A
16-bit
8-bit
8-bit
235mm x 153.8mm x 222mm
235mm x 208.2mm x 222mm
Expansion
2x 2.5" SATA drive bays
Power Input
Wide Voltage 9~36V DC-in
Operating Temp
0°C ~ 45°C
Construction
Aluminum + SGCC
Mounting
Wall mount
Dimensions (W x H x D)
235mm x 63.2mm x 222mm
235mm x 102.5mm x 222mm
Features 6th Gen Intel Core Desktop platform delivers cost efficiency and high CP ratio
Replaceable I/O modules provide I/O variations for embedded applications
Multiple expansion configuration via different riser cards offers flexibility
We accept custom-made I/O board on an MOQ basis Intel Q170
A LG 1
5 11 Intel H110 Expandable platform
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DFI Technologies LLC
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Revision Control • Long Product Life Cycle DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Copyright © DFI Inc. All Rights Reserved.