Transcript
ESD II – 3 Parte 6 Embedded PCs
& Embedded PC standards
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Embedded PCs: Introduction
Market forces are forcing manufacturers to reconsider what parts of product they want to invest their limited resources on
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Industry trends
Situation ? Cost of doing Corporate Strategies business is ? Focus on core increasing competencies ? Competition is ? Improve time to increasing market ? Reduce Overhead
Design Strategies ? Focus
design activities on high leverage projects ? Buy where possible ? Avoid high maintenance low return endeavors
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“Luck follow speed” The doctrine of re-use of existing hardware and software is becoming essential to rapid and cost effective new product introduction. Project managers are adopting a philosophy of “build what you must and buy what you can” J.Pavlat, Former President PICMG
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What is an Embedded computer
Characteristics affecting design • Hardware - Customized for application requirements: size, form & functionality • Software - BIOS customized to hardware and sometimes to meet custom OS/ application requirements • Long- life - typically >5 years • Rugged - extended: temp, vibration, shock, voltage
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Choosing an Embedded Computing Architecture
Why choose the PC architecture PC development platforms are cheap & readily available PC architecture provides some standards – Reduces redesign efforts & cost Development packages are readily available – (C++, Visual Basic, etc..) Concurrent engineering is possible – Develop code on a PC and download it to target system – Verify hardware with standard DOS/ Windows environment
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Choosing an Embedded Computing Architecture
Why choose the PC architecture •High level SW Tools •Develop graphical user interfaces. •BIOS self-test functions •Verify system integrity at power-up •Connectivity & “Plug & Play” •Readily available HW and associated drivers - common peripheral devices •HW bus Structure •Defined bus structure with varying performance attributes to match application requirements
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Differences between embedded & commodity PC systems Comparing attributes •Generic Attributes •Rugged • Long life •Specific Characteristics •Low weight •Low thermal dissipation - enclosed area •High reliability - no fans •Low to no EMI - good shielding
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Differences between embedded & commodity PC systems Comparing attributes Attributes
Characteristics
Emb.Sys
Com. PC
Expandable
Ability to add modules
NO
Rugged
Ability to handle harsh environment
YES
NO
Configurable
Ability to support different sets of module
NO
YES
Upgradeable
Ability to replace old technology modules
N0
YES
Long life
Ability to manufacture for 5 or more years
YES
YES
NO
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Differences between embedded & commodity PC systems Comparing attributes Long life Ability to manufacture for 5 or more years Specific Attributes
Emb.Sys Com. PC
Low weight
Additional weight needs to be kept to a minimum
YES
NO
Low Thermal dissipation
Systems are mounted under the seat where there is little airflow and heat is difficult to dissipate
YES
NO
High Reliability
Fans are unreliable and suck in dirt which would demand unwanted maintenance
YES
NO
Low EMI
Equipment that it is embedded with is sensitive
YES
NO
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Applying PC Technology Application Driven Project Example: In Car Computer Requirement • PC Software compatibility to leverage commercially available peripherals & SW support X86 PC with: • FM/AM Tuner • GPS • TV Tuner • Vehicle Status • USB interface for • Cell phone • Mouse/kb • User Interface
Engine Control Unit (Computer)
Flat Panel Display
High Speed Network: •Firewire or MOST • Co-ax or fibre • Video, Audio, Data
DVD Player: • Audio • Video • Data
CAN-Interface
Panel-link
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Applying PC Technology Application Driven Project Example: In Car Computer Technical challenges not addressed by PCs • Extended temperature components • Rugged and dependable video displays • Advanced Power management • Instant turn on, <1sec. • Connectors don’t meet automotive requirements
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Applying PC Technology Technology Driven Project Example: Telecommunication switcher Requirement
• Initially - Leveraging x86/PC components • Today - Compatibility with SW & I/O
Legacy Compatibility
Expandability
PCI to propriety bus gasket
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Creating a Long-Life Embedded PC
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Creating a Long-Life Embedded PC
Year 1 2 3 4
Probability that none of the 14 components has gone EOL in the design 48% 23% 12% 6%
Probability that a particular MSI component has not gone EOL in the design 95% 90% 86% 81%
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Creating a Long-Life Embedded PC Part
Package
8080 8085 8086/8088 80186/80188 8048/42 8051/80C51 80386 80486 Socket 7 processor (e.g., Pentium )
40 pin DIP 40 pin DIP 40 pin DIP 68 pin PGA 40 pin DIP 40 pin DIP 132 pin PGA 168 pin PGA
1974 1976 1978 1982 1977 1980 1985 1989
1993 1996 1996 1996 1995 Active Active Active
Life/Estimated life of pin compatible 19/25+ 20/20+ 18/20+ 14/20+ 18/20+ 17/20+ 12/15+ 8/15+
321 pin PGA
1996
Active
2/15+
Last time Year introduced buy
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Creating a Long-Life Embedded PC Part
Package
Year introdu ced
Last time buy
Life/Estimate d life of pin compatible
C&T NEAT (80386) 386 chip set
5 84/68 pin PLCC
1987
1994
7/7
TI-83000 386/486 chipset
208PQFP,100PQFP
1989
1995
6/6
VLSI-82C486 486 chipset
208 PQFP
1991
1996
5/5
Intel TX chipset
324 BGA (N. bridge)
1996
N/A
2/10+
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Creating a Long-Life Embedded PC
Life/Estimated life of pin compatible 32Kx8 EPROM 28 pin DIP 1982 Active 15/20+ 32Kx8 SRAM 28 pin DIP 1984 Active 13/20+ 16L8 PAL 20 pin DIP 1981 Active 16/20+ 74LS00 14 pin DIP 1974 Active 23/30+ Table 4: Other digital components used as building blocks for embedded systems Part
Package
Year Last time introduced buy
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Make vs buy: A technical perspective Component Selection – Long life component to avoid early product obsolescence. - Processors - Chip sets - VGA controllers – High quality component to insure high reliability - Gold plated connectors - Extended temperature components - Avoid electrolytic capacitors
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Make vs buy: A technical perspective Design Considerations – Low EMI design practices - Inductors/ferrites in series with I/O drivers (Serial ports) - Careful PCB layout design - GND planes, system GND techniques, clock routing - Clock chip selection
– EMI regulations - Board based products cannot be certified as
stand-alone. Certification must be performed with the system.
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Make vs buy:
A technical perspective Design Considerations .. cont. – Thermal dissipation Design chassis as a heatsink Power management circuitry and corresponding SW Processor selection is important
– Case temperature & power Mobile, LP, or ULP processor
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Operating System Considerations What the “HAL” is a BIOS
Minimum requirements for a system to be termed an “IBM compatible PC”.
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Operating System Considerations Making Window CE more adaptable Loader sets up processor elements processor mode, chip-sets, Memory map (RFA, FBD & DRAM), connection for monitor
Splitting up the loader and the OAL provides better code re-usability and facilitates porting to other x86 platforms
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Make vs. buy decision from a business perspective What are the Choices? Custom Solutions - Design and manufacture in house - Design in-house and contract manufacturing out - Contract design and manufacture in-house - Contract design and manufacture out - Purchase an off the shelf solution. Level of vert. integration Core Competency & Strategic fit
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Make vs. buy decision from a business perspective
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Make vs. buy decision from a business perspective
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Make vs. buy decision from a business perspective
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Summary Commodity PC technology is not all applicable in the domain of the embedded PC but with careful selection and management a vast part can be leveraged to provide lower cost and state of the art solutions. The trick is to know what to and how to leverage it. Often it is more cost effective to out-sourced.
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Embedded PC Standard
? The PCI convergence ? What is PC/104 ? What is CompactPCI ? Distributed Architectures
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The PCI convergence PCI-Mezzanine PC-MIP, PMC
ISA bus PC/104 VME bus
PCI
CompactPCI
specification PCMCIA CARDBUS
Ethernet Serial Channels
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PCI derivative from a logical perspective ISA bus PC/104
PCI-Mezzanine PC-MIP, PMC
VME bus
PCI
CompactPCI
spec. PCMCIA CARDBUS
Ethernet Serial Channels
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Embedded PC Standard from an historical perspective
XT/AT
Original PC standards
PCI
CompactPCI
PC/104
PC/104plus
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Embedded PC Mezzanine PCI
PC/104
PC/104plus
PMC
PC-MIP
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PC/104 : the Embedded PC Following the Industry Standard Architecture PC/104 Consortium
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PC/104 Modules a COMPONENT approach BUS: ISA bus (i.e. PC/AT) Mechanical: 3,6” x 3,8” Stack through Modules mounting Module to Module : 0,6”
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PC/104 spec KEY Features ? Compact Form Factor ? Unique self-stacking bus ? Pin-and-Socket Connectors ? 104 = 64 (XT) + 40 (AT extension) ? IEEE- P996.1
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PC/104 - the Stack concept
?
modules are designed to be stacked instead of using a backplane. use off-the-shelf modules for CPU and other common functions, then create their own module to perform a specific task.
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PC/104 Modules: Typical Application Final Product 1- PC/104 Modules: CPU, memory, SSD and I/O 2 - User's program, 3 - User’s carrier board 4- Power supply, 5- I/O devices, 6 - Cables.
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CompactPCI: the Industrial PC
Following the Peripheral Component Interconnect
PICMG Consortium
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PCI Bus Origin The PCI Local Bus was developed to enable PC innovation in: Performance, Function and Cost.
CPU Cache Memory Subsystem
Driving a component to component connection standard for PCs, to complement existing board-to-board connection standards.
P C I
B u s
Peripheral subsystem (Video) Peripheral subsystem (Disk) Peripheral subsystem (Others)
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Core spec . of CompactPCI
IEEE 1101.11 Eurocard Packaging
or 6U 3U 2mm metric connector (IEC-1076-4)
Key
5 row high density + 2 row shield
32-bit PCI 125 Signals
Reserved 64-bit PCI 40 Signals Extension 55 Signals
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CompactPCI Mechanical form factor
J5
- Eurocard Standard - 3U & 6U board size - EMC,ESD, - keying - new injector/ extractor - locking handles
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J4 J3 J2 100
J1 160
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PCI Mezzanine
PMC PC-MIP PC/104plus
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Benefits of Standard I/O Modules over proprietary I/O modules ? ? ? ? ? ? ? ?
Less expensive (for low volume!) More types of modules will be available More software will be available Faster integration with less effort Easier to migrate between various bus platforms Easier to migrate between different microprocessors Easier to migrate between different operating systems Better protection of application's investments over many
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PMC modules Module General Appearance PMC Size
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PC•MIP modules Module General Appearance 47mm x 66mm
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PC•MIP Type II
Single and Double Size Module Major Mechanical Dimensions
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4.050 I/O Connectors may overhang in this area .250 DIA.PAD
(Includes Mating Connector)
.125 DIA. HOLE (4 PLCS.)
PC/104plus - standard
3.550
BA
3.350
2.0 mm
3.350
3.250 3.125
.075 DIA.4 PLCS.
3.150
See
CD
3.775
4.050 3.275
PC/104 mechanical dimensions with the exception of the added connector (J3) Recommended Keep Out
I/O Connectors may overhang in this area (Includes Mating Connector)
.250 DIA.PAD .125 DIA. HOLE (4 PLCS.)
3.550 BA 2.0 mm
Area For Extractor
3.350
3.350
3.250
Top(Horizontal Stripe )
3.125
.075 DIA.4 PLCS.
Bottom(Both Strips)
3.150
See
CD
Both Edges
2.0 mm
1.275
.775 .650 .475 .400
3.775
Unshaded Area 3.275 Top Clearance = .345
1
Bottom Clearance = .190 Recommended Keep Out Area For Extractor Shaded Area (3 Sides) Top(Horizontal Stripe ) Top Clearance = .435 Bottom(Both Strips)
.100
Both Edges bottom Clearance = .100
1
Recommended
DCBA
The PC/104-Plus connector for the PCI bus is a 4x30 (120pin) 2mm pitch connector. Max
2.0 mm
1.275
.350
.775 .650 DCBA .475 .400 I/O Connectors may overhang .350in this area
0
.062
.368
Rotary Switch Location 1
.100 .250
1 Sides) Shaded Area (3 Top .100Clearance = .435 bottom Clearance = .100
1
.200 Recommended Rotary Switch Location
0
.250 .200 0
1
(Includes Mating Connector) .100 0 I/O Connectors may overhang in this area (Includes Mating Connector)
-.500 00
0
-.500 00 0
Component Height = .345 .062 .368 Max
Max Max Component Height = .190 .410
.440 .410
Unshaded Area Top Clearance = .345 Bottom Clearance = .190
.435 Component Height = .345
.435
Component Height = .190
.440
Connector Shroud
.420
.420
Connector Shroud
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Module Stack - Hyerarchy Stackthrough 8-bit module 0.6 in. (15mm) Spacers (4 plcs.) Stackthrough 16-bit module 0.6 in. (15mm) Spacers (4 plcs.) Stackthrough PC/104-Plus module 0.6 in. (15mm) Spacers (4 plcs.) Non-stackthrough PC/104-Plus module
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Mezzanine Plug-in Example with a 3U CompactPCI 3U CompactPCI
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3U CompactPCI ?
3U CompactPCI
?
?
?
?
PC-MIP
PC/104
PMC
?
?
PC-MIP
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Modular System approach 2nd Bus Front Panel I/Os
Plug-in Board
PC-MIP
CTBus, VME64, …
6U CompactPCI
PMC
Back Panel Back Panel I/O I/Os Adaptor
Insertion / Removal
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PCI Bridges •PCI to PCI transparent •PCI to PCI non-transparent •PCI to VME •PCI to ISA •PCI to general Purpose BUS •PCI to ….. ??
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Host CPU to PCI bridge
PCI bridge
PCI to PCI bridge
DRAM
CPU
L2 cache
Typical CompactPCI architecture ISA Bus
Local PCI Bus (theoretical 133 MB/s)
VGA
LAN
PCI to ISA bridge
SCSI
Mouse Keyboard
Serial Parallel
PC/104
PMC
6U CPU board
... ...
CompactPCI bus Adapter Adapter Adapter Adapter Adapter Adapter Adapter #1 #2 #3 #4 #5 #6 #7
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Host CPU to PCI bridge
PCI bridge
PCI to VME bridge
DRAM
CPU
L2 cache
Typical VME architecture ISA Bus
Local PCI Bus (theoretical 133 MB/s)
VGA
LAN
PCI to ISA bridge
SCSI
Mouse Keyboard
Serial Parallel
PC/104
PMC
6U CPU board
... ...
VME bus Adapter Adapter Adapter Adapter Adapter Adapter Adapter #1 #2 #3 #4 #5 #6 #7
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CompactPCI CPU System Master
CPU Host CPU to PCI bridge
PCI bridge
DRAM
L2 cache
System Master CPU
ISA Bus
Local PCI Bus (theoretical 133 MB/s)
PCI to PCI bridge TRANSPARENT
VGA
LAN
PCI to ISA bridge
SCSI
Mouse Keyboard
Serial Parallel
PC/104
PMC
6U CPU board
... ...
CompactPCI bus Adapter Adapter Adapter Adapter Adapter Adapter Adapter #1 #2 #3 #4 #5 #6 #7
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CompactPCI CPU Peripheral Master System Master CPU CompactPCI bus Adapter Adapter Adapter Adapter Adapter Adapter #2 #3 #4 #5 #6 #7
Adapter # 1
Host CPU to PCI bridge
PCI bridge
PCI to PCI bridge non-Transparent
DRAM
L2 cache
CPU
Peripheral Master CPU ISA Bus
Local PCI Bus (theoretical 133 MB/s)
VGA
LAN
PCI to ISA bridge
SCSI
Mouse Keyboard
Serial Parallel
PC/104
PMC
... ...
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CompactPCI Multiprocessing
Possible Multiprocessing schemes • Symmetric Multi Processing (SMP)
• Asymmetric Multiprocessor (Multi master) • Intelligent I/O (I2O)
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Loosely coupled Multiprocessor in CompactPCI
CompactPCI bus
Host CPU to PCI bridge
PCI device
PCI toPCI bridge Non Transparent
Local PCI Bus (theoretical 133 MB/s) PCI device
Peripheral Master CPU
PCI toPCI bridge Transparent
CPU
DRAM
System slot L2 cache
L2 cache
CPU
DRAM
Adapter slot # 1
Host CPU to PCI bridge
Local PCI Bus (theoretical 133 MB/s)
PCI device
PCI device
System Master CPU
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Tightly coupled Multiprocessor (SMP) in CompactPCI
Adapter # 8
DRAM
CPU
compactPCI bus
L2 cache
System slot
Adapter # 7 Adapter # 6 Adapter # 5 Adapter # 4 Adapter # 3 Adapter # 2
PCI toPCI bridge Transparent
CPU
L2 cache
CPU toCPU bridge
Host CPU to PCI bridge
Local PCI Bus (theoretical 133 MB/s)
PCI device
PCI device
System Master CPU
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Loosely coupled Multiprocessor in CompactPCI I2O adapter I2O PCI toPCI bridge
CompactPCI bus
Adapter # 6 Adapter # 5 Adapter # 4 Adapter # 3
PCI toPCI bridge Transparent
CPU
DRAM
System slot
Adapter # 7
L2 cache
CPU
Host CPU to PCI bridge
Local PCI Bus (theoretical 133 MB/s)
PCI device
PCI device
Adapter # 2 System Master CPU
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Loosely-coupled Multiprocessor : Network backplane
PM
PM
PM
SM PM
PM
PM
PM
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