Transcript
FA2100SS
model 500
Compact yet More Powerful This slim chassis of FA2100SS model 500 embodies robustness, maintainability, environmental resistance, and expansibility, all in the tiny body 100 mm wide, 310 mm high, and 340 mm deep.
As Compact as Before, but Faster and Higher in Performance High-Performance CPU 3rd Generation Intel ® Core TM i7 Processor (2.3 GHz) Built in
High-Speed, High-Performance Chipset and Memory Employed
This model incorporates a CPU 3rd generation Intel ® Core TM i7 Processor 3615QE (2.3 GHz) for high-speed processing.
A Mobile Intel HM76 Express chipset and a high-speed memory with ECC function (8 GB maximum) are employed to offer highspeed data transfer.
USB3.0 Interface Is a Standard Feature
CPU performance comparison Low
USB performance comparison
High
FA2100SS model 500
Low speed
0.022080 Intel ® Core™ i7 3615QE (2.3 GHz) Quad Core
FA2100S model 300
High speed
USB3.0
5Gbps
0.0051192
Intel ® Core™ Duo E6400 (2.13 GHz)
FA2100S model 200
USB2.0
0.00432
480Mbps Maximum data transfer speed Unit: bps
Intel ® Pentium ® Dual-Core E2160 (1.8 GHz)
*The above shows maximum data transfer speeds in theoretical value. The above performance may not always apply to your actual data transfer speed. USB 3.0 is not supported when Windows ® XP or Windows Server® 2008 is installed.
Weighted maximum performance (APPvalue) Unit: Effective tera
*The above is a comparison of the weighted maximum performance (in APP value) released by Intel, and there may be difference from the above depending on your system.
Graphic Function with built-in CPU Chipset Provided Gigabit (2-channel) Ethernet Interface is a Standard Feature Gigabit-compatible 2-channel Ethernet interface (with auto negotiation for 10BASE-T, 100BASE-TX, 1000BASE-T) is a standard feature (Compatible with the Wake On LAN ® function).
The graphic function with a built-in CPU chipset (compatible with full HD display) is provided. It permits multi display of the expansion desktop function, clone display function, etc. Expansion DesktopFunction
Clone DisplayFunction
Monitors are used for wide display
Monitors are used to show the same display on each screen
Collage DisplayFunction
Two monitors are used to display a single image
*1 When using Windows Server® 2012, the system does not support multi display. The collage display function is only supported with Windows ® 7 or Windows ® 8.1
Good Maintainability and Protection Structure High Maintainability by Front Access Ver tical or Horizontal to Make Ef fective Use of Your Space
The hard disks, cooling fan, and lithium battery can be easily replaced from the front. Example of Replacement
Ver tical Installation (standard) The stand is an optional par t.
Dimensions Front-end Replacement of Storage Devices
Front-end Replacement of Battery
Unit: mm
Operation Error Prevention
310 ±1.2
Security
Front-end Replacement of Cooling Fan
100 ±0.8
Security Lock Plate *2
Protection Cover
*2 Security lock plate is included as a standard component
AC Power Cable Clamp
340 ±1.2
Horizontal Installation
Specifications model 500
FA2100SS Processor
Single Disk Model
Main Processor
Intel ® Core™ i7 3615QE (2.3GHz)
Level 2 Cache Memory
256 KB/Core (built into main processor)
Level 3 Shared Cache Memory
6 MB (built into main processor) Mobile Intel ® HM76 Express Chipset
Chipset Main Memory*1
Auxiliary Storage
Mirroring Disk Model
Memory
DDR3 SDRAM (DDR3-1333/PC3-10600) with ECC function, DIMM 2 sockets
Capacity
Min. 2GB (2GB×1), Max. 8GB (4GB×2)
Built-in HDD Built-in SSD *2 Built-in DVD-ROM *3
Options (Refer to Optional Hardware Specifications)
Built-in DVD Super Multi-Drive *3 RAID1
RAID Compatible Interface
COM Interface
RS-232C (9-pinD-SUB)×2ch (rear)
USB Interface *4
USBx2ch (rear), (TYPE A USB 3.0), USBx4ch (front/rear 2 ports each) (TYPE A USB 2.0)
Sound Interface*5
LINE IN/LINE OUT/MIC IN (3.5φ mini jack) (rear)
LAN Interface
10BASE-T/100BASE-TX/1000BASE-T (Auto Negotiation) (RJ45)×2ch (rear) Wake On LAN ® (main unit port only compatible)
Graphic Interface
RGB×1ch, DVI-D×1ch (rear) CPU・Chipset built in Graphic Function
DI/DO Interface
Option(Refer to Optional Hardware Specifications) PCI slot 2 slots (half size *6*7) PCI 3.0
Expansion Interface
PCI-Express (x16) 1 slot (half size *8) PCI Express 3.0 Input Device
Software
Keyboard
USB109 keys (Japanese OS), 104 keys (English OS)
Mouse
USB (optical)
OS (Operating System)*9*10*11
Windows ® XP Professional SP3 (Japanese version/English version) (32bit) Windows ® 7 Professional (Japanese version/English version/Chinese version/Korean version) (32bit/64bit) *12*13 Windows ® Embedded 8.1 Industry Pro Update (Japanese version/English version)（32bit/64bit) Windows Server® 2008 R2 Standard SP1 (Japanese version/English version)(64bit） Windows Server® 2012 R2 Standard Update (Japanese version/English version)(64bit） Red Hat® Enterprise Linux® 6.4 Server compliant (32bit/64bit) Red Hat® Enterprise Linux® 7.1 Server compliant (64bit) Fan stop detection, CPU temperature rise detection, Internal temperature detection, Internal voltage detection, Memory error detection, PCI bus error detection, Digital input/output (DI/DO 4 points each, remote ON/OFF or remote initialize 1 point), Watchdog timer monitoring (at system startup, during system operation), hard disk monitor (Mirroring Disk only) Software power off (shutdown), Remote initialize, Remote power on/off, Error information save on RAS memory, Operating time monitor function, Temperature information trend function, Simulation function
RAS Function
Power Supply (Wide Range Power Supply)*14
Rated voltage 100VAC-240 VAC, allowable voltage 85 VAC - 264 VAC, allowable frequency 50 Hz/60Hz±3Hz
Electric Power Consumption
Max. 326W/340VA
Dimensions and Weight
100 (W) ×310 (H) ×340 (D) mm (without projections, stands) Weight: about 10 kg
Items included in shipment package
AC power cable (1), AC power cable clamp (1), Rubber foot (4pieces), Security lock plate (1) *15, Mouse, Keyboard, Product recovery media (with OS pre-installed models), Instruction manual PDF(included on optical media) * Items other than those listed above may be included dependingon the configuration of the system ordered.
Optional Hardware Specifications Expansion Main Memory
DDR3 SDRAM (DDR3-1333/PC3-10600) 2GB/4GB selectable
Built-in HDD
Single disk model capacity: 160GB/1TB HDD 2 units mountable Mirroring disk model capacity:160GB/500GB (Hot swap compatible mirroring disk) Single disk model capacity: 128GB/512GB 2 units mountable
Built-in SSD *2
Mirroring disk model capacity:160GB/400GB (Hot swap compatible mirroring disk) Read drive DVD-ROM,CD-ROM,DVD-R,DVD+R,DVD-RW,DVD+RW,DVD-RAM, CD-R,CD-RW
Built-in DVD-ROM *3
Built-in DVD super multi-drive*3
Write/Read drive DVD-ROM,CD-ROM,DVD-R,DVD+R,DVD-RW,DVD+RW,DVD-RAM, CD-R,CD-RW
DI/DO Interface *3
(DI/DO board) Digital input/output (half-pitch 20-pin) DI 4 points, DO4 points, remote input 1point
RAS Terminal Board
DI 4 points, DO 4 points, remote input 1 point
RAS Cable
Half-pitch 20-pin male at both ends, 2m max.
RAS Terminal Board Mounting Panel Simplified type
Installation Environment Conditions Installation Environment Temperature (Operating/While Stored) 5 to 40°C / -10 to 50°C Humidity (Operating/While Stored) 20 to 80% RH (no condensation)/10 to 90% RH (no condensation) Vibration (Operating)*16
(While Packed)
With HDD configuration: 2.0 m/s 2 (JIS C60068-2-6:9 to 150Hz 1 cycle) With SSD configuration: 4.9 m/s 2 (JIS C60068-2-6:9 to 150Hz 1 cycle) 19.6m/s 2 or less
Shock (Operating/While Packed) 19.6 m/s 2 or less / 245 m/s 2 or less Dust
0.3mg/m 3 or less (JEITA IT-1004A Class B compliant)
Corrosive gas / chemicals
Not to be detected (JEITA IT-1004A Class A compliant)
Allowable Instantaneous Power Failure Time
Terminal Maximum Voltage LINE IN
20 ms or less at the rated input voltage
1Vrms
LINE OUT 1Vrms MIC IN
2 pieces per set
Stand
*1 If a main memory of 4GB or more is installed with a 32-bit OS already installed in your system, the available memory capacity will be about 2.6GB (default) in order to reserve the memory address area for PCI device, etc. *2 The “S・M・A・R・T (Self Monitoring Analysis and Reporting Technology) data monitoring software (XSMART)” that can be used to predict SSD life is not pre-installed. Customers can install and use the program as required. SSD and HDD cannot be mixed in the mirroring disk model. *3 No expansion at customer site because of pre-shipment options. *4 USB interface does not always guarantee the operation of all the USB peripherals. Not compatible with USB3.0 when Windows® XP or Windows Server® 2008 R2 is installed. Use withUSB2.0. *5 Use correcting units that meet the specifications below.
0.1Vrms
Remarks Input impedance 10kΩ Load impedance 10kΩ to 600kΩ Input impedance 10kΩ
*6 PCI slot board size (174.63 mm (L) x 106.68 mm (H) or less) mountable *7 Installable PCI boards are 5V key boards and 5V/3.3V shared key boards. (Boards of 3.3V keys only cannot be installed) *8 PCI Express slot board size (167.65 mm (L) x 111.15 mm (H) or less) mountable *9 Of the Opening Systems listed here, your specified OS will be installed. *10 OS supply period is subject to change depending on the OS distribution period of the OS supplier. The Windows® XP preinstalled model was discontinued in November 2016. *11 Pre-installed Windows is licensed. *12 If Windows ® 7 is in use, the following functions are outside the scope of your support. Windows ® Bitlocker, Windows ® XP mode, XP mode, power-saving modes (suspend, hibernation) *13 If the language to be used is English, Chinese, or Korean, please specify the English version in your order. You will be asked to select English, Chinese (simplified/traditional), or Korean at the stage of Windows ® 7 initial setup. If the wrong language is selected, your OS will have to be re-installed using the recovery media provided as an accessory. *14 This model has a power supply with a built-in PFC (power factor correction) circuit. If you are using a UPS (uninterrupted power supply), select a sine wave output type. *15 Security lock plate are not mounted before shipment. *16 Except while optical drive is in operation
EG15643 2017-02 TBLS
