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DESIGNS, IDEAS AND SOLUTIONS FOR TODAY’S ENGINEERS Summer 2010 Newsletter Article
Fast, Flexible Fan-less Design Intel® Atom™ Processor and the Qseven* Form Factor Make It Easier By Wolfgang Eisenbarth, Director of Marketing Embedded Computer Technology, MSC Vertriebs GmbH
with the future in mind and are compatible with state-of-the-art mobile platforms such as the Intel® Atom™ processor Z5xx series. Although it is a relatively new standard, Qseven has already proven itself through widespread adoption. Ten vendors al-
Inside the Qseven Standard
The Qseven standard derives its name from the module size: it uses quadratic (that is, square) boards measuring 70 mm x 70 mm. Unlike other COM designs, Qseven does not require a boardto-board connector. Instead, it leverages
Affiliate Member of the Intel® Embedded Alliance
Developers of small, fan-less systems are confronted with a growing list of questions, such as: What is the fastest and easiest way to build a complete system? How can I incorporate displays and other complex I/O? Will I be able to adapt to changing requirements or enhance my design for future applications? What happens if I need to change hardware suppliers? In order to address these issues, embedded systems developers often turn to computer-on-module (COM) solutions. COM solutions provide a full embedded computer on a standardized, prefabricated module. These solutions are paired with customized carrier boards that implement application-specific I/O. Because their functionality is predefined, COM solutions can simplify and speed up the design process. At the same time, COM solutions provide great flexibility. Developers can easily upgrade their processor by choosing a different COM, or can adapt their solution to a different application by using a different carrier board. In recent years, a number of small-formfactor COM standards have appeared, giving developers compelling new options. The new Qseven* form factor is particularly appealing for fan-less applications. Unlike the other COM standards, Qseven is specifically designed for mobile and battery-operated applications. Additionally, its interfaces were designed
Figure 1. The number of mobile M2M will rise to 412 million by the year 2014. Source: Juniper Research, “MSM ~ The Rise of the Machines,” 2009.
ready offer Qseven modules, with more on the way. The Qseven ecosystem has also grown to include a wide selection of carrier boards—including off-the-shelf carrier boards for automation and pointof-sale (POS)/kiosk applications—as well as fan-less enclosures for industrial environments. This robust ecosystem allows developers to build hardware solutions for a broad range of applications quickly and easily, leaving them free to concentrate their work on application software development. This article will explore the advantages of the Qseven architecture. We will also look at example systems from MSC Vertriebs GmbH and show how these solutions can be applied to specific embedded applications.
the Mobile PCI Express* Module (MXM) technology developed for graphics cards in notebook computers. As shown in Figure 1, this technology places an edge connector on the bottom of the Qseven module. The connector slides into a slot on the carrier board, making physical integration as easy as installing a DIMM memory module. The MXM connector meets several key goals for embedded designers. Because it was developed for notebook graphics applications, it is both rugged and able to support high-speed serial buses—a topic discussed later. It is also a low-cost solution. In addition to eliminating the boardto-board connector, the edge connector helps reduce costs by supporting a 5V power rail.
DESIGNS, IDEAS AND SOLUTIONS FOR TODAY’S ENGINEERS
Qseven modules are also designed for low power, fan-less designs. The specification limits heat dissipation to 12 W, and most implementations consume far less power (for example, MSC found that its Intel Atom processor-based Qseven modules consume only 7 W). The top of the module features a cooling plate to aid heat dissipation, and internal copper layers help move heat from the CPU, chipset, and DRAM to the cooling plate. Although it is designed for low cost and low power, Qseven is also designed for high performance. As part of this design philosophy, the Qseven connector eliminates legacy parallel buses in favor of modern serial connections. As a result, the 230-pin connector is able to support a large number of interfaces including: • PCI Express • USB 2.0 • ExpressCard* • Intel® High Definition Audio (Intel® HD Audio) • Serial ATA (SATA) • Low pin count (LPC) interface • Secure Digital I/O (SDIO) interface • Gigabit Ethernet • HDMI*, DisplayPort*, or Serial Digital Video Out (SDVO) interface • LVDS display interface with DisplayID flat panel detection These modern interfaces are an excellent match for the needs of today’s embedded systems. For example, the SDIO interface makes it possible to use inexpensive SD cards for bulk storage or even as a boot medium. The interface also makes it easy to add on Wi-Fi* or Bluetooth* cards that use the SD card form factor. The Qseven standard is particularly strong in the area of graphic interfaces. Unlike other COM standards, it supports the latest graphics standards such as LVDS and SDVO. These interfaces allow Qseven modules to control two large, high-resolution displays. Finally, the Qseven specification includes a software API that aids software portability. The API provides a high-level means of setting the LCD brightness, setting up the watchdog timer, and per-
forming other basic tasks. This API is a major advantage for the Qseven standard—other COM standards do not provide standardized software interfaces for these tasks, so moving between board vendors may require a software change.
The Qseven Concept in Action
MSC Vertriebs GmbH was one of the initiators of the Qseven specification and introduced its first modules in late 2008. MSC currently provides five versions of its MSC Q7-US15W Qseven module family, all of which leverage the Intel Atom processor Z5xx series and the Intel® System Controller Hub US15W chipset (see Figure 1 above). Thanks to its compact dimensions and power-saving processor technology, these highly integrated modules are excellent matches for mobile, battery-operated, and fan-less applications. As is typical for Qseven modules, the Q7US15W modules provide a wide range of industry standard interfaces. These include eight USB 2.0 ports, a Gigabit Ethernet interface, an Intel HD Audio interface and a LPC output. In addition, The Intel® Graphics Media Accelerator 500 (Intel® GMA 500) integrated in the Intel Atom chipset Controller Hub offers 18/24-bit LVDS and SDVO interfaces for displays up to 1600 x 1200 pixels. The boards differ in processor performance, the number of SATA and PCI Express* x1
Summer 2010 Newsletter Article
interfaces, DRAM size, and availability of a Flash disk. Figure 2 summarizes the differences between the modules. Modules that include Flash do not require an external hard disk. These modules can boot via the on-board Flash, and the boot speed and memory capacity of the Flash drive are sufficient for most applications. Eliminating the external hard disk reduces system size and cost, while increasing mechanical stability. The Q7-US15W series also integrates innovative hardware and BIOS-based security functions in compliance with the requirements of the Trusted Computing Group (TCG). In addition, the modules integrate the Trusted Platform Module (TPM) from Infineon and the SecureCore* BIOS from Phoenix Technologies.
The Qseven Ecosystem
To help developers get their designs to market faster, MSC also offers two Qseven carrier boards: the MSC Q7-MB-EP1 and the MSC Q7-MB-EP2, which target automation and retail applications, respectively. Both boards measure 148 x 102 mm and are ready to use for small and medium production quantities. The boards can run Microsoft* Windows* XP, Microsoft* Windows* 7, and Linux* operating systems. The MSC Q7-MB-EP1 is intended for general industrial use.
Figure 2. Available configurations of the MSC Q7-US15W Qseven module.
DESIGNS, IDEAS AND SOLUTIONS FOR TODAY’S ENGINEERS
As shown in Figure 3, the MSC Q7-MBEP1 offers a selection of interfaces for automation applications. These include two USB 2.0 ports, an RS-232 interface, a Gigabit LAN port, and an LVDS interface. The platform can be extend-
Digital Visual Interface (DVI) for largescale signage displays with resolutions up to 1080p, LVDS and backlight interfaces, and a touch-screen controller. Other important interfaces include dual Gigabit Ethernet interfaces, four USB 2.0 ports, two SATA ports, RS-232, and Intel HD Audio. To complete the system, the Qseven platforms can be paired with a fan-less enclosure. One example is the PicoBox manufactured by DSM Computer GmbH. This enclosure, shown in Figure 4, measures a mere 180 mm x 180 mm x 55 mm. Despite its small size, the enclosure has space for a 2.5 inch hard disk, and a CF socket permits data storage on a Compact Flash. The PicoBox can support a wide range of interfaces, including Gigabit Ethernet, Figure 3. The MSC Q7-MB-EP1 offers various USB 2.0, and serial outputs. For specific interfaces for industrial applications. customers, a separate interface panel allows additional external interfaces to be ed via the Mini PCI Express* socket, made available. The rugged enclosure is which supports UMTS and Wi-Fi modules, specially designed for industrial environadditional Flash memory, solid state ments and is specified for a temperature disks, and other modules. It also in- range of 0° to +50° C. Power is provided cludes an integrated socket for MMC/SD via a direct 12 V DC input, an external 8 cards. Reflecting its intended industrial to 30 V DC supply, or an external 100 to use, the board can take a wide range of 240 V AC 45 W power pack. power inputs from 10 to 28 VDC, enabling both battery operation and stationary Faster, Easier, Smaller operation. Qseven modules powered by the Intel The MSC Q7-MB-EP2 supports the de- Atom processor give developers of small, velopment of POS/kiosk and digital sig- fan-less systems compelling new options. nage applications. This platform has a Together with the ecosystem of carrier
Figure 4. The DSM PicoBox measures a scant180 mm x 180 mm x 55 mm.
Summer 2010 Newsletter Article
boards and enclosures, Qseven modules present a quick and easy way to build a complete system. The Qseven standard’s robust support for high-speed serial IO is an excellent match for the needs of today’s embedded systems, and frees developers from the constraints imposed by preceding standards. Best of all, the wide availability of Intel Atom processor-based Qseven modules and carrier cards gives developers the flexibility to meet the needs of a rapidly evolving marketplace. The embedded industry moves fast. Keep up with the Embedded Innovator magazine that brings you cuttingedge design ideas from industry leaders. http://intel.com/design/network/ica/embeddedinnovatormag Join the discussion at http://community.edc.intel.com Learn more about the Intel® Embedded Alliance www.intel.com/go/embeddedalliance MSC Vertriebs GmbH is an Affiliate member of the Intel® Embedded Alliance. It is a leading computeron-module (COM) supplier for OEMs and a pan-European distributer for active and passive components. With its extensive development and production facilities, MSC is well positioned to customize design based on embedded Intel hardware in form, fit and function according to customer demands. MSC is also distributor of Phoenix BIOS and source code licenses since 2002 to adopt and extend BIOS functions for embedded designs.
