Fmp08n50e

Transcript

FMP08N50E FUJI POWER MOSFET Super FAP-E3 series N-CHANNEL SILICON POWER MOSFET Features Outline Drawings [mm] Maintains both low power loss and low noise Lower RDS (on) characteristic More controllable switching dv/dt by gate resistance Smaller VGS ringing waveform during switching Narrow band of the gate threshold voltage (3.0±0.5V) High avalanche durability Equivalent circuit schematic TO-220AB Drain(D) Applications Gate(G) Source(S) Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters Maximum Ratings and Characteristics Absolute Maximum Ratings at Tc=25°C (unless otherwise specified) Description Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Repetitive Maximum Avalanche Energy Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt Symbol VDS VDSX ID I DP VGS I AR E AS E AR dV/dt -di/dt Maximum Power Dissipation PD Operating and Storage Temperature range Tch Tstg Drain-Source Voltage Characteristics 500 500 ±7.5 ±30 ±30 7.5 301.1 3.7 5.9 100 2.02 105 150 -55 to +150 Unit V V A A V A mJ mJ kV/µs A/µs Remarks VGS = -30V Note*1 Note*2 Note*3 Note*4 Note*5 Ta=25°C Tc=25°C W °C °C Electrical Characteristics at Tc=25°C (unless otherwise specified) Description Drain-Source Breakdown Voltage Gate Threshold Voltage Symbol BVDSS VGS (th) Zero Gate Voltage Drain Current I DSS Gate-Source Leakage Current Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance I GSS R DS (on) gfs Ciss Coss Crss td(on) tr td(off) tf QG Q GS Q GD I AV VSD trr Qrr Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Conditions I D =250µA, VGS =0V I D =250µA, VDS =VGS VDS =500V, VGS =0V VDS =400V, VGS =0V VGS =±30V, VDS =0V I D =3.8A, VGS =10V I D =3.8A, VDS =25V Tch =25°C Tch =125°C VDS =25V VGS =0V f=1MHz Vcc =300V VGS =10V I D =3.8A RGS =18Ω Vcc =250V I D =7.5A VGS =10V L=3.93mH, Tch=25°C I F =7.5A, VGS =0V, Tch =25°C I F =7.5A, VGS =0V -di/dt=100A/µs, Tch=25°C min. 500 2.5 4 7.5 - typ. 3.0 10 0.68 8 1100 100 7.5 17 8.0 80 15 35 9.0 10 0.90 0.35 3.5 max. 3.5 25 250 100 0.79 1650 150 11 26 12 120 23 53 14 15 1.35 - Unit V V min. typ. max. 1.19 62.0 Unit °C/W °C/W µA nA Ω S pF ns nC A V µs µC Thermal Characteristics Description Thermal resistance Symbol Rth (ch-c) Rth (ch-a) Note *1 : Tch≤150°C Note *2 : Stating Tch=25°C, IAS =3.0A, L=61.3mH, Vcc=50V, RG =50Ω E AS limited by maximum channel temperature and avalanche current. See to 'Avalanche Energy' graph. Test Conditions Channel to Case Channel to Ambient Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature. See to the 'Transient Themal impeadance' graph. Note *4 : I F ≤-I D, -di/dt=100A/µs, Vcc≤BVDSS, Tch≤150°C. Note *5 : I F ≤-I D, dv/dt=5.9kV/µs, Vcc≤BVDSS, Tch≤150°C. 1 FMP08N50E 150 FUJI POWER MOSFET Allowable Power Dissipation PD=f(Tc) Safe Operating Area ID=f(VDS):Duty=0(Single pulse),Tc=25 °c t= 1µs 1 10 125 10µs 100µs 0 10 1ms 75 ID [A] PD [W] 100 -1 10 50 Power loss waveform : Square waveform -2 10 25 D.C. PD t -3 0 10 0 25 50 75 100 125 150 0 1 10 2 10 Tc [°C] 3 10 VDS [V] 10 Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C 18 10V 16 10 6.0V 5.5V 14 10 ID[A] ID [A] 12 8 1 5.0V 6 4 VGS=4.5V 2 0.1 0 0 4 8 12 VDS [V] 16 20 0 24 1 2 3 4 5 VGS[V] 6 7 8 9 10 Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C 100 VGS=4.5V 2.4 5.0V 2.2 2.0 10 gfs [S] RDS(on) [ Ω ] 1.8 1.6 5.5V 1.4 6.0V 10V 1.2 1 1.0 0.8 0.6 0.1 0.1 1 ID [A] 10 0 100 2 4 6 8 10 ID [A] 2 12 14 16 18 FMP08N50E 2.5 FUJI POWER MOSFET Drain-Source On-state Resistance RDS(on)=f(Tch):ID=3.8A,VGS=10V 6 Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µA 5 2.0 VGS(th) [V] RDS(on) [ Ω ] 4 1.5 1.0 max. 3 typ. min. max. 2 typ. 0.5 1 0 0.0 -50 -25 0 25 50 Tch [°C] 75 100 125 -50 150 -25 0 25 50 75 Tch [°C] 100 125 150 Typical Capacitance C=f(VDS):VGS=0V,f=1MHz Typical Gate Charge Characteristics VGS=f(Qg):ID=7.5A,Tch=25 °C 4 14 10 12 Vcc= 100V 250V 400V 10 C [pF] 8 VGS [V] Ciss 3 10 2 10 6 Coss 4 1 10 Crss 2 0 0 0 5 10 15 20 25 30 35 40 45 10 50 -1 0 10 10 Qg [nC] 100 1 10 2 3 10 10 VDS [V] Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C 3 10 Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=18 Ω tf 2 10 td(off) t [ns] IF [A] 10 td(on) 1 1 0.1 0.00 10 tr 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 10 2.00 -1 10 0 10 ID [A] VSD [V] 3 1 10 FMP08N50E 350 FUJI POWER MOSFET Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=50V,I(AV)<=7.5A 1 Maximum Transient Thermal Impedance Zth(ch-c)=f(t):D=0 10 IAS=3.0A 300 0 10 Zth(ch-c) [°C/W] EAV [mJ] 250 IAS=4.5A 200 150 -1 10 -2 10 IAS=7.5A 100 -3 10 50 -6 10 -5 10 -4 10 -3 10 t [sec] 0 0 25 50 75 100 125 150 starting Tch [°C] 4 -2 10 -1 10 0 10 FMP08N50E FUJI POWER MOSFET WARNING 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of October 2008. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sure to obtain the latest specifications. 2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. • Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment • Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. • Transportation equipment (mounted on cars and ships) • Trunk communications equipment • Traffic-signal control equipment • Gas leakage detectors with an auto-shut-off feature • Emergency equipment for responding to disasters and anti-burglary devices • Safety devices • Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). • Space equipment • Aeronautic equipment • Nuclear control equipment • Submarine repeater equipment 7. Copyright ©1996-2008 by Fuji Electric Device Technology Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Device Technology Co., Ltd. 8. If you have any question about any portion in this Catalog, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein. 5