Transcript
FMW30N60S1HF
http://www.fujielectric.com/products/semiconductor/ FUJI POWER MOSFET
Super J-MOS series
N-Channel enhancement mode power MOSFET
Features
Outline Drawings [mm]
Pb-free lead terminal RoHS compliant uses Halogen-free molding compound
Equivalent circuit schematic
TO-247 ②Drain
Applications For switching ①
②
① Gate
③
① CONNECTION
②
① GATE
③Source
③
② DRAIN ③ SOURCE
①
②
③
DIMENSIONS ARE IN MILLIMETERS.
Absolute Maximum Ratings at TC =25°C (unless otherwise specified) Parameter
Symbol
Characteristics
Unit
Drain-Source Voltage
VDS VDSX
Continuous Drain Current
ID
Pulsed Drain Current Gate-Source Voltage
IDP VGS
600 600 ±30 ±19 ±90 ±30
V V A A A V
Repetitive and Non-Repetitive Maximum Avalanche Current
IAR
6.6
A
Note *2
Non-Repetitive Maximum Avalanche Energy
EAS
849.2
mJ
Note *3
Maximum Drain-Source dV/dt Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt
dVDS /dt dV/dt -di/dt
kV/μs kV/μs A/μs
Maximum Power Dissipation
PD
Operating and Storage Temperature range
Tch Tstg
50 12 100 2.5 220 150 -55 to +150
W
Remarks VGS =-30V Tc=25°C Note*1 Tc=100°C Note*1
VDS ≤ 600V Note *4 Note *5 Ta=25°C TC =25°C
°C °C
Note *1 : Limited by maximum channel temperature. Note *2 : Tch ≤150°C, See Fig.1 and Fig.2 Note *3 : Starting Tch =25°C, IAS=4A, L=97.3mH, VDD =60V, RG =50Ω, See Fig.1 and Fig.2 E AS limited by maximum channel temperature and avalanche current. Note *4 : I F ≤-I D, -di/dt=100A/μs, VDD ≤400V, Tch ≤150°C. Note *5 : I F ≤-I D, dV/dt=12kV/μs, VDD ≤400V, Tch ≤150°C.
Electrical Characteristics at TC =25°C (unless otherwise specified)
• Static Ratings Parameter
Symbol
Conditions
min.
typ.
max.
Unit
Drain-Source Breakdown Voltage
BVDSS
ID =250μA VGS =0V
600
-
-
V
Gate Threshold Voltage
VGS(th)
ID =250μA VDS =VGS
2.5
3.0
3.5
V
Zero Gate Voltage Drain Current
IDSS
VDS =600V VGS =0V
Tch=25°C
-
-
25
VDS =480V VGS =0V
Tch=125°C
-
-
250
μA
Gate-Source Leakage Current
IGSS
VGS = ± 30V VDS =0V
-
10
100
nA
Drain-Source On-State Resistance
RDS(on)
ID =15A VGS =10V
-
0.106
0.125
Ω
Gate resistance
RG
f=1MHz, open drain
-
3.2
-
Ω
1
8460 OCTOBER 2015
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/
• Dynamic Ratings Parameter
Symbol
Conditions
min.
typ.
max.
Unit
Forward Transconductance
gfs
ID =15A VDS =25V
13
26
-
S
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Ciss Coss Crss
VDS =10V VGS =0V f=1MHz
-
2200 4670 430
-
Effective output capacitance, energy related (Note *6)
Co(er)
VGS =0V VDS =0…480V
-
127
-
Effective output capacitance, time related (Note *7)
Co(tr)
VGS =0V VDS =0…480V ID=constant
-
450
-
-
31 57 136 17 73 18 25 11.5
-
min.
typ.
max.
Unit
6.6
-
-
A
-
0.9
1.35
V
430
-
ns
-
8.6
-
μC
-
38
-
A
min.
typ.
max.
Unit
-
-
0.57 50
°C/W °C/W
Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source crossover Charge
td(on) tr td(off) tf QG QGS QGD QSW
VDD =400V, VGS =10V ID =15A, RG =13Ω See Fig.3 and Fig.4 VDD =480V, ID =30A VGS =10V See Fig.5
pF
ns
nC
Note *6 : C o(er) is a fixed capacitance that gives the same stored energy as C oss while VDS is rising from 0 to 80% BVDSS . Note *7 : C o(tr) is a fixed capacitance that gives the same charging times as C oss while VDS is rising from 0 to 80% BVDSS .
• Reverse Diode Parameter
Symbol
Conditions
Avalanche Capability
IAV
L=21.7mH, Tch=25°C See Fig.1 and Fig.2
Diode Forward On-Voltage
VSD
IF=30A, VGS =0V Tch=25°C
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
Peak Reverse Recovery Current
Irp
IF=30A, VGS =0V VDD =400V -di/dt=100A/μs Tch=25°C See Fig.6
Thermal Resistance Parameter
Symbol
Channel to Case Channel to Ambient
Rth(ch-c) Rth(ch-a)
2
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/ Safe Operating Area ID=f(VDS): Duty=0(Single pulse), Tc=25 °c
Allowable Power Dissipation PD=f(Tc)
250
t= 1µs
2
10
10µs
200 1
10
100µs
ID [A]
PD [W]
150
100
0
10
1ms Power loss waveform : Square waveform
-1
10
50
PD t -2
0 0
25
50
75 TC [°C]
100
125
10
150
-1
Typical Output Characteristics ID=f(VDS): 80µs pulse test, Tch=25°C
100
2
10 VDS [V]
3
10
10
20V
10V 20V 50
8V
80
1
10
Typical Output Characteristics ID=f(VDS): 80µs pulse test, Tch=150°C
60
10V
0
10
8V
7V
6V
40
6.5V
ID [A]
ID [A]
60
5.5V
30
6V
40
5V
20
5.5V 20
VGS=4.5V
0 0
5
10
VDS [V]
15
0 0
25
Typical Drain-Source on-state Resistance RDS(on)=f(ID): 80µs pulse test, Tch=25°C
0.50
5V
5.5V
0.45
0.9
0.40
0.8
10
VDS [V]
15
20
25
4.5V
5V
5.5V
0.7
7V 8V 10V
0.6 RDS(on) [Ω]
0.30
5
Typical Drain-Source on-state Resistance RDS(on)=f(ID): 80µs pulse test, Tch=150°C
1.0
6V
0.35
RDS(on) [Ω]
20
VGS=4.5V
10
5V
0.25 0.20
VGS=20V
8V
0.5
0.3
0.10
0.2
0.05
0.1
10V VGS=20V
0.4
0.15
0.00
6V
0.0 0
20
40
60
80
100
ID [A]
0
10
20
30 ID [A]
3
40
50
60
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/
Drain-Source Breakdown Voltage BVDSS=f(Tch): ID=10mA, VGS=0V
700
Drain-Source On-state Resistance RDS(on)=f(Tch): ID=15A, VGS=10V
0.40
This curve is not a guaranteed performance and is a reference value.
680
0.35
660 0.30
640
0.25
RDS(on) [Ω]
BVDSS [V]
620 600 580
0.20 max. 0.15
560
typ.
0.10
540
0.05
520 500 -50
-25
0
25
50 Tch [°C]
75
100
125
0.00
150
-50
Gate Threshold Voltage vs. Tch VGS(th)=f(Tch): VDS=VGS, ID=250µA
6
0
25
50 Tch [°C]
75
100
125
150
9
10
Typical Transfer Characteristic ID=f(VGS): 80µs pulse test, VDS=25V
100
5
-25
10
1
150℃
ID[A]
VGS(th) [V]
4
3 typ.
Tch=25℃
0.1
2
0.01
1
0 -50
-25
0
25
50 75 Tch [°C]
100
125
150
1E-3 0
Typical Transconductance gfs=f(ID): 80µs pulse test, VDS=25V
100
1
2
3
4
5 VGS[V]
6
7
8
Typical Forward Characteristics of Reverse Diode IF=f(VSD): 80µs pulse test
100
Tch=25℃ 10
10
gfs [S]
IF [A]
150℃
Tch=25℃
150℃
1
1
0.1
0.1 0.1
1
10
0.0
100
0.5
1.0 VSD [V]
ID[A]
4
1.5
2.0
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
100000
Typical Coss stored energy 20 18
10000
16 14
Ciss
1000
Eoss [uJ]
C [pF]
12 100 Coss
10 8
10
6 Crss
4
1
2 0.1 0.01
3
10
0 0.1
1 VDS [V]
10
100
0
Typical Switching Characteristics vs. ID Tch=25°C t=f(ID): Vdd=400V, VGS=10V/0V, RG=13Ω, L=500uH
100
200
300 VDS [V]
400
500
600
Typical Gate Charge Characteristics VGS=f(Qg): ID=30A, Tch=25°C
10
Vdd=480V 300V
8
120V
tr
VGS [V]
t [ns]
6 2
10
td(off)
4
td(on)
2
tf 0
1
10
0
1
10
10
20
30
40
50
60
70
80
90
100
Transient Thermal Impedance Zth(ch-c)=f(t):D=0
1
10
IAS=2.0A 100
1600 Zth(ch-c) [℃/W]
1400 1200 EAV [mJ]
10
Qg [nC]
Maximum Avalanche Energy vs. startingTch E(AV)=f(starting Tch): Vcc=60V, I(AV)<=6.6A
2000 1800
0
2
10 ID [A]
1000
10-1
IAS=4.0A
10-2
IAS=6.6A
10-3
800 600
10-6
400
10-5
10-4
10-3 t [sec]
200 0 0
25
50
75
100
125
150
starting Tch [°C]
5
10-2
10-1
100
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/ +10V
L
VGS -15V BVDSS
Rg
IAV
VDD
D.U.T.
VDS 0
Fig.1 Avalanche Test circuit
ID
Fig.2 Operating waveforms of Avalanche Test
VDS L
Diode
VGS
VDS × 90%
VDS × 90%
VGS × 90%
VDD
RG
D.U.T.
VDS × 10%
VDS × 10%
VGS × 10%
PG td(on)
Fig.3 Switching Test circuit
tr
td(off)
Fig.4 Operating waveform of Switching Test
VGS,VDS
VDS peak
IF VDS
QSW QGS
VDS
trr
VGS QG
tf
10V
Irp× 10%
QGD
Irp Qg Fig.5 Operating waveform of Gate charge Test
trr
Qrr= ∫ 0 ir・dt
Fig.6 Operating waveform of Reverse recovery Test
6
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/
Outview: TO-247 Package
①
②
③
CONNECTION ① GATE ② DRAIN ③ SOURCE
①
②
DIMENSIONS ARE IN MILLIMETERS.
③
Marking
Manufacturer Code No. Logo Type Type Name
hf : Halogen-free mark P2 hf
30N60S1
Symbol Mark of "Lead-Free"
YMNNN
Lot No. Y : Last digit of year M : Month code 1~9 and O,N,D NNN : Lot serial number
* The font (font type,size) and the logo type size might be actually different. 7
FMW30N60S1HF
FUJI POWER MOSFET http://www.fujielectric.com/products/semiconductor/
WARNING
1.This Catalog contains the product specifications, characteristics, data, materials, and structures as of October 2015. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specifications. 2.All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3.Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design failsafe, flame retardant, and free of malfunction. 4.The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. • Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment • Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc. 5.If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. • Transportation equipment (mounted on cars and ships) • Trunk communications equipment • Traffic-signal control equipment • Gas leakage detectors with an auto-shut-off feature • Emergency equipment for responding to disasters and anti-burglary devices • Safety devices • Medical equipment 6.Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). • Space equipment • Aeronautic equipment • Nuclear control equipment • Submarine repeater equipment 7.Copyright ©1996-2015 by Fuji Electric Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd. 8.If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.
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