Transcript
FR2100SS
model 500
2U Rack Mount Solution Third-generation Intel® Core™ i7 Processor (2.3 GHz) Quad Core, highly reliable ECC memory (8 GB maximum), RAS function for hardware internal monitoring, hot-swap compatible mirroring disk (option), etc. combine to support 24-hour continuous, stable operation, which is demanded of industrial computers. This is backed up by product supply and maintenance over a long period of time.
Graphic Function with built-in CPU Chipset Provided
Faster and Better Performance
The graphic function with a built-in CPU chipset (compatible with full HD display) is provided. It permits multi display of the expansion desktop function, clone display function, etc.
High-performance CPU 3rd Generation Intel ® Core TM i7 Processor (2.3 GHz) Built in This model incorporates a CPU 3rd generation Intel® CoreTM i7 Processor 3615QE (2.3 GHz) for high-speed processing.
Expansion DesktopFunction
Clone DisplayFunction
Monitors are used for wide display
Monitors are used to show the same display on each screen
CPU performance comparison Low
High
FR2100SS model 500
0.022080 Intel ® Core™ i7 3615QE (2.3 GHz) Quad Core
FR2100S model 300
High Reliability for Supporting 24/7 Continuous Operation
Intel ® Core™ Duo E6400 (2.13 GHz)
FR2100S model 200
0.00432
Two monitors are used to display a single image
*1 When using Windows Server® 2012, the system does not support multi display. The collage display function is only supported with Windows ® 7 or Windows ® 8.1
0.0051192
Collage DisplayFunction
Intel ® Pentium ® Dual-Core E2160 (1.8 GHz)
Weighted maximum performance (APPvalue) Unit: Effective tera
*The above is a comparison of the weighted maximum performance (in APP value) released by Intel, and there may be difference from the above depending on your system.
Technology and Quality that Support 24-Hour Continuous Operation
A Mobile Intel ® HM76 Express chipset and a high-speed memory with ECC function (8 GB maximum) are employed to offer highspeed data transfer.
Highly reliable, long-life parts are used, based on assumption of 24-hour continuous operation. The individual parts are tested, and the products in your shipment configuration are put to function and temperature tests to determine that they fully satisfy the specifications (in the temperature range of 5 to 40°C) and the high quality requirements.
USB3.0 Interface Is a Standard Feature
ECC Memory Employed
High-Speed, High-Performance Chipset and Memory Employed
USB performance comparison Low speed
High speed
USB3.0 USB2.0
5Gbps
A highly reliable ECC memory capable of detecting and correcting memory errors is installed. RAID1 Available (RAID Disk model), Option The hot swap function permits replacement of failed hard disks without computer shutdown, thus assuring improved reliability.
Newly Developed RAID Controller Board
480Mbps Maximum data transfer speed Unit: bps
*The above shows maximum data transfer speeds in theoretical value. The above performance may not always apply to your actual data transfer speed. USB 3.0 is not supported when Windows ® XP or Windows Server® 2008 is installed.
In addition to the RAID disk monitor function, this controller board has the patrol function for periodic read check on all disk areas, outputs a buzzer sound in case of a drive failure, the RAS function for logging, and lights the status lamps for warning.
Good Maintainability and Protection Structure High Maintainability by Front Access Hard disks, cooling fan, and lithium battery can be easily replaced from the front of the main unit. Example of Mounting in a Type 19 Rack
Example of Replacement
Rack mounting parts (EIA compliant) are supplied as standard accessories * In selecting slide rails, consult the manufacturer of the racks you use.
Dimensions Front-end Replacement of Storage Devices
Front-end Replacement of Cooling Fans
Unit: mm 21.8 ２Ｘ４−Ｍ４
For slid rail attachment
Operation Error Prevention
AC Power Cable Clamp 88±0.8 76.2 50
87±0.8
°
°
5.9 19
90
90
*2 By fastening the power button mini-door and USB mini-door with the parts inside the front panel, illegal access can be prevented with this security key lock. *3 This can be used for preventing theft and access to the internal parts of the product.
約
Security Lock Plate *3
約
Security Key Lock*2
20±0.8
152.4 55.4
101.6
450±2
101.6
Security
Front-end Replacement of Lithium Battery
４３１±２ ４６５ ４６６ ４８０±２
Specifications model 500
FR2100SS Processor
Single Disk Model Intel ® Core™ i7 3615QE (2.3GHz)
Level 2 Cache Memory
256 KB/Core (built into main processor)
Level 3 Shared Cache Memory
6 MB (built into main processor)
Memory
DDR3 SDRAM (DDR3-1333/PC3-10600) with ECC function, DIMM 2 sockets
Capacity
Min. 2GB (2GB×1), Max. 8GB (4GB×2)
Mobile Intel ® HM76 Express Chipset
Chipset Main Memory*1
Auxiliary Storage
Mirroring Disk Model
Main Processor
Built-in HDD Built-in SSD*2
Options (Refer to Optional Hardware Specifications)
Built-in DVD-ROM*3*4 Built-in DVD Super Multi-Drive*3*4 RAID1
RAID Compatible Interface
COM Interface
RS-232C (9-pinD-SUB)×2ch (rear)
USB Interface*5
USB3.0 (TYPE A) ×2 ports (rear), USB2.0 (TYPE A) ×4 ports (front/rear 2 ports each)
Sound Interface*6
LINE IN/LINE OUT/MIC IN (3.5φ mini jack) (rear)
LAN Interface
10BASE-T/100BASE-TX/1000BASE-T (Auto Negotiation) (RJ45)×2ch (rear) Wake On LAN ® (main unit port only compatible)
Graphic Interface
RGB×1ch, DVI-D×1ch (rear) CPU・Chipset built in Graphic Function
DI/DO Interface
Option(Refer to Optional Hardware Specifications)
Expansion Interface Main Unit Type A
Main Unit Type B
Input Device
Software
Specify Main Unit Type A or B in your order. PCI slot*7 3 slots (full size ×2, half size ×1) PCI 3.0 PCI-Express *8 1 slot (full size) PCI Express 3.0 Specify Main Unit Type A or B in your order. PCI slot*7 2 slots (full size ×1, half size ×1) PCI 3.0 PCI-Express *8 2slots (full size ×1, half size ×1) PCI Express 3.0
Keyboard
Option(Refer to Optional Hardware Specifications)
Mouse
Option(Refer to Optional Hardware Specifications)
OS (Operating System)*9*10*11*12
Windows ® XP Professional SP3 (Japanese version/English version) (32bit) Windows ® 7 Professional SP1 (Japanese version/English version/Chinese version/Korean version) (32bit/64bit) *13 Windows ® Embedded 8.1 Industry Pro Update (Japanese version/English version)（32bit/64bit) Windows Server® 2008 R2 Standard SP1 (Japanese version/English version)(64bit） Windows Server® 2012 R2 Standard Update (Japanese version/English version)(64bit） Red Hat® Enterprise Linux® 6.4 Server compliant (32bit/64bit) Red Hat® Enterprise Linux® 7.1 Server compliant (64bit) Fan stop detection, CPU temperature rise detection, Internal temperature detection, Internal voltage detection, Memory error detection, PCI bus error detection, Digital input/output (DI/DO 4 points each; remote ON/OFF or remote initialize 1 point), Watchdog timer (at system startup, during system operation), hard disk monitor (RAID only) Software power off (shutdown), Remote initialize, Remote power on/off, Error information save on RAS memory, Operating time monitor function, Simulation function
RAS Function
Power Supply (Wide Range Power Supply)*14
Rated voltage100VAC-240 VAC, allowable voltage 85 VAC - 264 VAC, allowable frequency 50 Hz/60Hz±3Hz
Electric Power Consumption
Max. 365W/380VA
Dimensions and Weight
Rack mount (horizontal mounting) 431 (W) ×87 (H) ×470 (D) mm (without projections) (No vertical mounting) Weight: About 13.0 kg
Items included in shipment package
Instruction manual,AC power cable (1), AC power cable clamp (1), Rubber foot (4pieces), rack mounting brackets (2 in each set),Security key (1 set), Product recovery media (with OS pre-installed models) * Items other than those listed above may be included depending on the configuration of the system ordered.
Optional Hardware Specifications Expansion Main Memory
DDR3 SDRAM (DDR3-1333/PC3-10600) 2GB/4GB selectable
Built-in HDD
Single disk model capacity:160GB/1TB HDD 2 units mountable Mirroring disk model capacity:160GB/500GB (Hot swap compatible mirroring disk) Single disk model capacity:128GB/512GB 2 units mountable
Built-in SSD *2
Mirroring disk model capacity:160GB/400GB (Hot swap compatible mirroring disk) Read drive DVD-ROM,CD-ROM,DVD-R,DVD+R,DVD-RW,DVD+RW,DVD-RAM, CD-R,CD-RW
Built-in DVD-ROM *3*4
Built-in DVD super multi-drive*3*4
Write/Read drive DVD-ROM,CD-ROM,DVD-R,DVD+R,DVD-RW,DVD+RW,DVD-RAM, CD-R,CD-RW
Keyboard
USB109 keys (Japanese OS), 104 keys (English OS)
Mouse
USB (Optical)
DI/DO Interface *4
(DI/DO board) Digital input/output (half-pitch 20-pin) DI 4 points, DO 4 points, remote input 1point
RAS Terminal Board
DI 4 points, DO 4 points, remote input 1 point
RAS Cable
Half-pitch 20-pin male at both ends, 2m max.
RAS Terminal Board Mounting Panel
Simplified type
Installation Environment Conditions Installation Environment Temperature (Operating/While Stored) 5 to 40°C/-10 to 50°C Humidity (Operating/While Stored) 20 to 80% RH (no condensation)/10 to 90% RH (no condensation) Vibration (Operating)*15
(While Packed)
With HDD configuration: 2.0 m/s 2 (JIS C60068-2-6:9 to 150Hz 1 cycle) With SSD configuration: 4.9 m/s 2 (JIS C60068-2-6:9 to 150Hz 1 cycle) 19.6m/s 2 or less
Shock (Operating/While Packed)
19.6 m/s 2 or less / 245 m/s 2 or less
Dust
0.3mg/s 3 or less(JEITA IT-1004A Class B compliant)
Corrosive gas / chemicals
Not to be detected (JEITA IT-1004A Class A compliant)
Allowable Instantaneous Power Failure Time
20 ms or less at the rated input voltage
*1 If a main memory of 4GB or over is installed in your system that uses a 32-bit version OS, available memory capacity will be about 2.6GB (default) to secure memory address area for PCI device, etc. Operation will not be guaranteed if you combine other than genuine storage devices for Toshiba industrial computers. *2 The “S・M・A・R・T (Self Monitoring Analysis and Reporting Technology) data monitoring software (XSMART)” that can be used to predict SSD life is not pre-installed. Customers can install and use the program as required. SSD and HDD cannot be mixed in the mirroring disk model. *3 Model without optical drive can be selected. If you have selected a model without optical drive, you need an external DVD driver for OS recovery. *4 No expansion at customer site because of pre-shipment options. *5 USB interface does not always guarantee the operation of all the USB peripherals. Not compatible with USB3.0 when Windows® XP or Windows Server® 2008 R2 is installed. Use withUSB2.0. *6 Use connecting units that meet the specifications below.
Terminal
Maximum Voltage
LINE IN
1Vrms
Input impedance 10kΩ
Remarks
LINE OUT
1Vrms
Load impedance 10kΩ to 600kΩ
MIC IN
0.1Vrms
Input impedance 10kΩ
*7 PCI slot (half size) board size (174.63 mm (L) x 106.68 mm (H) or less) mountable PCI slot (full size) board size (312 mm (L) x 106.68 mm (H) or less) mountable Installable PCI boards are 5V key boards and 5V/3.3V shared key boards.(Boards of 3.3V keys only cannot be installed. *8 PCI Express slot (full size) board size (312 mm (L) x 111.15 mm (H) or less) mountable PCI Express connector types correspond to x1, x4, x8, x16. Effective lanes of main unit type A are x16, and those of main unit type B are x8. *9 Of the Operating Systems listed here, your specified OS will be installed. *10 OS supply period is subject to change depending on the OS distribution period of the OS supplier. The Windows ® XP preinstalled model was discontinued in November 2016. *11 Windows ® pre-installed models: Windows ® license granted *12 The following functions are not supported if your system uses Windows®. Windows ® Bitlocker, Windows ® XP mode, power-saving mode (suspend, hibernation) *13 If your language is English, Chinese, or Korean, specify an English version in your order. You may select English, Chinese (simplified/traditional), or Korean at the time of Windows® 7 initial setup. If you have made a wrong selection, the OS must be reinstalled using the recovery media, supplied as an accessory to the product. *14 This model has a power supply with a built-in PFC (power factor corrector) circuit,. If you are using a UPS (uninterrupted power supply), select a sine wave output type. *15 Except while optical drive is in operation
EG15645 2017-02 TBLS
