Freescale Power Architecture® Core And Product Roadmap: The

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August, 2009 Freescale QorIQ™ Program Overview Multicore processing view Jeffrey Ho Technical Marketing TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. • We are embedded computing • Multicore processing • Power Architecture® technology roadmap • Enablement • Embedded life times Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 2 Vision: Global leadership in embedded processing and connectivity solutions Leadership in chosen markets/sub-segments • Target markets: Automotive, Consumer, Industrial, Networking, Wireless • Target position: #1, #2 or #3 in all chosen segments • IDC ranks Freescale #1 in Power Architecture communications market at 52% and predicts that comm processors will outperform other networking silicon categories – Jan 20, 2009 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 3 You touch us every day. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 4 A New Era Where Every Connection Matters At Home In the Office On the Road Richer Consumer Experience Improved Business Productivity Global Mobility ► Architecting the next wave of collaboration • Friend-to-friend, supplier-to-consumer, peer-to-peer • Rapid service introduction and flexible implementations, assured security and privacy ► Delivery of a seamless new service experience: • Grows with our preferences, behaviors, and capabilities • Flexibility to craft, integrate, and introduce new services that enhance our productivity and collaboration. Application complexity drives scalable software-based solutions that preserve and extend the user experience through new services. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 5 • We are embedded computing • Multicore processing • Power Architecture® technology roadmap • Enablement • Embedded life times Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 6 Why Multicore – Network Integration and Consolidation ► Service providers and enterprises are looking to reduce power and cost ► Network node consolidation ► Routers adding appliance services ► Discrete devices being integrated into single SoC, driving system cost down ► Multicore processors becoming a true networking “system on a chip” Firewall WAN Optimizer IPS Integrated Access Router SSL Termination Server Load Balancer Secure Load Balancer Integrated Service Switch CPU Shared Bus Shared Bus CPU CPU CPU Accel I/O I/O Accel DRAM DRAM DRAM DRAM DRAM Bridge Bridge DRAM DRAM DRAM DRAM DRAM Bridge Bridge Shared Bus CPU DRAM DRAM DRAM CPU Shared Bus Accel Accel I/O I/O I/O I/O Accel Accel I/O I/O I/O I/O Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 7 The Right Core Matters for Multicore ► Frequency does still matter ► Higher efficiency (IPC) means higher performance ► Cache ► Cache size impacts performance “stashing” and warming ► Hypervisor e500mc Core Branch Unit I-Fetcher Dispatch Unit GPR Ld/St Integer Unit Complete Unit (2) Unit I-Cache/ SRAM (32KB) point is useful in many applications FPU D-Cache/ SRAM (32KB) MMU Processor Interface Unit hardware ► Floating APUs Address 64 Read-1 128 128 Read-2 Write e500mc Core Complex ► Performance monitoring and instruction trace are keys to debug Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 8 Platform Interconnect is Critical to Delivering Multicore Scalability ► Multicore • • • • interconnects must address: Scalability of CPU cores, memory and I/O bandwidth Flexible inter-processor communication programming models QoS differentiation for control/data plane and network traffic Efficient memory subsystem, including caching and hardware coherency CoreNetTM interconnect fabric on the QorIQ™ P4080 addresses the scalability needs of multicore processors P4080 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. Aggregated interface bandwidth (MB/s) ► The Read Bandwidth 1 core 2 cores P4080 8 cores TM 9 • We are embedded computing • Multicore processing • Power Architecture® technology roadmap • Enablement • Embedded life times Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 10 Power Architecture® Technology Platform Roadmap Increasing Performance, Reducing Power First Generation 45 nm QorIQ P5 platform Increasing Performance Decreasing Power MPC86XX QorIQ P4 platform PowerQUICC III QorIQ P3 platform PowerQUICC II Pro QorIQ P2 platform PowerQUICC II PowerQUICC® I QorIQ™ P1 platform Second Generation 32 nm Third Generation 22 nm QorIQ – X5 platform QorIQ - T5 platform QorIQ – T4 platform QorIQ – X4 platform QorIQ - T3 platform QorIQ - T2 platform QorIQ - T1 platform QorIQ - X3 platform QorIQ - X2 platform QorIQ - X1 platform Increasing Performance (Frequency, System Performance) Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 11 In the News: Three 45 nm SOI Products – Sampling Now PowerQUICC® MPC8569 Flip chip PBGA 130 M transistors >1B vias and contacts • Single 1.33 GHz e500 core with quad core QUICC Engine™ modules • Designed for broadband access equipment • Currently sampling StarCore® MSC8156 DSP QorIQ™ P2020 Wire bond TEPBGA-II ~100 M transistors Flip chip PBGA 0.5 B transistors 2.5 B vias and contacts >2 miles of interconnect >1B vias and contacts • Dual 1.2 GHz e500 V2 processor • Six 1 GHz SC3850 DSP cores cores with MAPLE-B baseband accelerator • Designed for networking, wireless • Designed for next-generation infrastructure and wireless standards (LTE, WiMAX, telecommunications architecture HSPA+ and TDD-LTE) • Currently sampling • Currently sampling Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 12 45 nm SOI Process – Power Savings ► Provides 50% savings in static and dynamic power over 90nm SOI ► SOI provides lower Ceff, allowing improved performance/power trade-off ► Multi-VTH transistor options performance/power transistor options available Example of power savings for a “typical” PowerQUICC® product FSL 90SOI Fmax = 1.33GHz PWR = 11 W 90SOI Vdd=1.0V • Multiple • Design flow and tools make use of Multi-VTH transistors to optimize performance/leakage FSL 45SOI Fmax = 1.65GHz PWR = 6.6 W and gate-oxide optimization Freq= +15-20% Pwr = -35-40% or FSL 45SOI ► Transistor 45SOI Vdd=1.0V Fmax = 1.33GHz PWR = 5.5 W 45SOI Vdd=1.0V Freq= 0% Pwr = -50% • Optimization of transistor and gate dielectric provides reduced static power Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 13 13 Power Architecture® Product Roadmap Scaleable Price, Performance and Features for your Applications Increasing Performance Decreasing Power MPC86XX e600 SOC (5 Families) * e600 core (800 to 1500 MHz) * Backside L2 256K to 1MB * Single and Dual Core * GbE, USB, PCI, PCI-e, DDR2, sRIO PQIII (12Families) * e500 core (667 to 1500MHz) PowerQUICC III PowerQUICC II Pro PowerQUICC II * < 4W to 17W * Single and Dual Core * GbE, USB, PCI, PCI-e, DDR2/3, Encryption, RIO QorIQ P5 platform QorIQ P4 * 8 Cores, Tri-level Cache * GbE, PCI-e, DDR2/3, IEEE 1588 * Encryption, Hypervisor QorIQ P3 platform PQII Pro Platform (13 Families) * e300 core (266 to 800MHz) * < 2W to 6W * QuiccEngine, GbE, USB, PCI * PCI-e, SATA, DDR2, IEEE 1588 QorIQ P4 (1 Family] * e500 core (1000 to 1500MHz) QorIQ P2 QorIQ P2 (2 Families) * e500 core (800 to 1200 MHz) * Single and Dual Core * GbE, PCI-e, DDR2/3, IEEE 1588 * Encryption, SPI, SD/MMC PQII Platform (15 Families) * 603 core (166 to 450MHz) * < 1W to 2.8W * CPM, 100bT, USB, PCI, Encryption QorIQ P1 PowerQUICC® I PQI Platform (16 Families) QorIQ P1 (2 Families) * e500 core (533 to 800 MHz) * Single and Dual Core * GbE, PCI-e, DDR2/3, IEEE 1588 * Encryption, TDM. USB * 50 to 133MHz * <1W * QUICC, 100bT, USB, Increasing Performance Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 14 In the News: Wireless LAN Solution from Freescale and Flextronics Available now, May 13, 2009 – Freescale Semiconductor announced that it has partnered with Flextronics to create a high performance reference design for the enterprise WLAN access point market. Based on Freescale’s PowerQUICC® II Pro MPC8377E processor, the IEEE® 802.11N access point reference design offers a comprehensive, production-ready solution which scales from 400 MHz to 800 MHz and speeds time-to-market. ► Application • • • • Highly competitive market – time to market and revenue Power - Power over Ethernet (IEEE® 802.3af) Ability to stream data wirelessly with little interruption Ability to secure data streams using high levels of encryption ► Device • • • • • challenges advantages Time to market, class B certified production ready system Support for Power over Ethernet and 802.11N Based on market-proven open source software secure router Support for miniPCI and miniPCI-Express Variable applications depending on configuration Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 15 QorIQ™ P1 Platform Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 16 QorIQ™ P2 Platform Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 17 QorIQ™ P4080 Block Diagram Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 18 • We are embedded computing • Multicore processing • Power Architecture® technology roadmap • Enablement • Embedded life times Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 19 Core Usage Model Flexible choice of OS model on cores– any combination of SMP/AMP. IP Services router example (mixed control and data plane): Upper Layer 3rd Party Processing Service Data Plane Control Plane AMP SMP OS (optional shared code) AMP AMP L2 Cache L2 Cache L2 Cache L2 Cache L2 Cache L2 Cache L2 Cache L2 Cache Power Architecture™ Power Architecture™ Power Architecture™ Power Architecture™ Power Architecture™ Power Architecture™ Power Architecture™ Power Architecture™ Core Core Core Core Core Core Core Core D-Cache I-Cache D-Cache I-Cache D-Cache I-Cache D-Cache I-Cache D-Cache I-Cache D-Cache I-Cache CoreNet™ Interconnect Fabric Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. D-Cache I-Cache D-Cache I-Cache Front-side L3 Cache DDR2/3 Memory Controller Front-side L3 Cache DDR2/3 Memory Controller TM 20 Hypervisor and Trusted Computing ► Machine • modes and states New privilege level for hypervisor ► Freescale • • CPU technology Two major states: Hypervisor and Guest Within each state, a privileged state ► Shadow • e500mc core based on Power Architecture® MMU L1 registers: one set for OS, another for hypervisor L1 Avoids need to save them ► Secure boot and threat protection Previous Cores e500mc MSRPR User State 0 Hypervisor Supervisor State 1 Hypervisor State Hypervisor or bare-metal OS run here User State Applications running directly on Hypervisor or bare-metal OS run here Guest Guest Supervisor State OS running on hypervisor run here Guest User State Applications on an OS under control of a hypervisor run here Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. MSRGS MSRPR 0 0 0 1 1 0 1 1 TM 21 Comprehensive Leading Embedded Ecosystem • Pre-silicon ƒ ƒ ƒ DOGAV • Software ƒ ƒ ƒ ƒ • ƒ ƒ ƒ ƒ ƒ Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. Custom off the shelf Standard product Various form factors Integration design services Development ƒ All trademark rights acknowledged Operating systems Application stacks Protocol acceleration Development services Board offerings ƒ • Functional simulation I/O simulation Power simulation ƒ Integrated development environments Debuggers Compilers Probes TM 22 QorIQ™ Platforms Ecosystem Applications Applications Optimized High-Speed Drivers Hypervisor Simics® Virtualized Development Environment Functional Model IDE (compiler / debugger / build tools) Multicore Operating System Multicore Operating System Optimized High-Speed Drivers Hypervisor Freescale QorIQ Silicon API Performance Model Simulation to Hardware: Same Software Multicore enablement Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. Freescale-supplied SDK items TM 23 Single Board Computer Partners Subset of a comprehensive partner ecosystem COM-express Freescale Actis ATCA AMC 9 9 9 9 9 KONTRON Emerson EuroTech ATCA Blades 9 GE Fanuc Interphase Mercury Radisys TQ Embedded 9 9 9 9 9 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. AMC COMexpress 9 9 9 Compact PCI PMC’s CompactPCI VME PMC’s 9 9 9 9 9 9 9 9 9 9 9 9 9 ATX,uATX 9 9 9 9 TM 24 • We are embedded computing • Multicore processing • Power Architecture® technology roadmap • Enablement • Embedded life times Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 25 20 Years of Communications Processing Evolution PowerPC® AIM Alliance 603e Started 1991 First silicon 1992 Dual-core processor MPC8641D with e600 Power cores PowerPC® 75X Dual-core with integrated content processing MPC8572E with e500 Power core First PowerQUICC® communications processors Includes Communications Processor Module (CPM) MC68302 68K core 1989 1994 QUICC® 1995 MC68360 68K core 1996 1997 PowerQUICC III e500 Power core 1998 2002 PowerQUICC II 603e Power core 2003 2004 2005 2006 Security integration with PowerQUICC line PowerQUICC II Pro e300 Power core 2007 2008 GPON processor Integrated DSP + Power core QUICC Engine™ Next-gen CPM / dual RISC engines Power Architecture™ Host Processors MPC7xxx e600 core In Production Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 26 In the News: Freescale Introduces Product Longevity Program ► The embedded market needs long-term product support, which allows OEMs to provide assurance to their customers. ► Freescale has a longstanding track record of providing long-term production support for our products. ► We are now pleased to announce that we are introducing a formal product longevity program for the market segments we serve. • • ► In the automotive and medical segments, Freescale will manufacture select devices for a minimum period of 15 years. For all other market segments in which Freescale participates, Freescale will manufacture select devices for a minimum period of 10 years. A list of applicable Freescale products is available for quick access at www.freescale.com. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. TM 27 TM