Transcript
Argon i.MX6UL SOM Hardware User Manual Contents
1 Introduction This document details complete hardware description of Argon i.MX6UL SOM and verify its basic operations. It covers details about the packaging kit content, SOM overview, Baseboard overview, Core Components, Interfaces and Connectors.
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Introduction 1 Argon i.MX6UL Product Overview 2 Preparing Board 3 3.1 Kit Contents 3 3.2 PCB description 4 3.3 System-on-Module Overview 5 3.4 System-on-Module Signal 6 3.5 Baseboard Overview 7 Core Components 8 4.1 NXP i.MX6Ultralite Cortex-A7 Processor 8 4.2 PF3000 Power Management IC (PMIC) 9 4.3 Memory (Micron) 9 4.4 eMMC Storage (Kingston) 9 4.5 eMMC - Signal Description 10 4.6 Broadcom BCM4343W Wi-Fi/Bluetooth Combo Module 10 4.7 Broadcom Wi-Fi/BT - Signal Description 11 4.8 Audio Codec - SGTL5000XNLA 12 4.9 Interfaces and Connectors 12
Argon i.MX6UL SOM – Hardware User Manual
2 Argon i.MX6UL Product Overview Argon i.MX6UL SOM is a very compact, micro sized, high performance board which is highly optimized for mobile Internet of Things applications. With ultra-efficient NXP i.MX6UL processor based on ARM® Cortex®-A7 core at its heart, this SOM module can be used to develop powerful and low power IOT applications/solutions. Argon i.MX6UL SOM has rich set of peripherals (DDR3, eMMC, Wi-Fi/BT and PMIC) enabling customers to do quick development and deployment in IoT. All signals of i.MX6UL are taken to board-to-board connector. By this approach, customers can buy SOM (at low cost) and make their custom baseboard to finish system design. This speeds up customer design cycle by reducing system cost. In addition, Argon carrier baseboard offering a complete platform with large number of ready to use sensors (such as accelerometer, gyroscope) and available I/O's gives our customers' cutting edge over technology. Argon i.MX6UL combined with carrier baseboard is a treat for all those who want to accelerate time to market and easy prototyping. Argon i.MX6UL SOM is Android IOT Ready Argon i.MX6UL SOM fits the new Google’s Android IOT operating system. Thus it brings the simplicity and speed of software development to hardware for IoT with an embedded OS, core services, developer kit, and developer console.
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3 Preparing Board 3.1 Kit Contents This section illustrates the contents of Argon Board i.MX6Ultralite box, front and top elevations, as well as the main features of the top and bottom side of the SOM Board (“Micro Sized”). The Argon i.MX6UL SOM is supplied with the following contents as shown in the figure below:
1x Base Board 1x Antenna 1x SOM Board
Base Board
SOM Board
Antenna
Figure 1: Packaging Kit Contents
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3.2 PCB description The following figures of the front and top view are annotated to describe the I/O functions and indicator.
Figure 2: Argon i.MX6UL SOM mounted on Baseboard
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Figure 3: Argon i.MX6UL SOM Front view
3.3 System-on-Module Overview SOM card is designed with i.MX6Ultralite processor in a small form factor design. It integrates Wi-Fi +BT Combo module, Audio Codec and Power Management IC. It also has 3 Hirose 60 pin expansion connectors.
40 mm
35 mm Figure 4: Argon i.MX6UL SOM SOM Overview
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3.4 System-on-Module Signal Overview
Figure 5: Argon i.MX6UL SOM SOM Signal Overview
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3.5 Baseboard Overview Base Board has 3 Hirose 60 pin connector which mates with SOM Card connectors. Baseboard has interfaces like Ethernet phy, USB Host & OTG, UART, I2C,Audio Jack, etc.. Also it has header options for SPI, I2C, ADC, PWM, and GPIOs. Since all I.MX6 UL signals are brought out to SOM board expansion connectors, interfaces like LCD, Camera can be tested by customizing base board.
Figure 6: Argon i.MX6UL SOM Baseboard Overview
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4 Core Components 4.1 NXP i.MX6Ultralite Cortex-A7 Processor The i.MX 6UltraLite is an ultra-efficient processor family with featuring NXP advanced implementation of the single ARM Cortex®-A7 core, which operates at speeds of up to 528 MHz.
The device is composed of the following major subsystems: o Single-core ARM Cortex-A7 MPCore™ Platform o 32 KBytes L1 Instruction Cache o 32 KBytes L1 Data Cache o Private Timer and Watchdog o TrustZone support o Cortex-A7 NEON MPE (Media Processing Engine) Co-processor
PXP— PiXel Processing Pipeline for imagine resize, rotation, overlay and CSC. Offloading key pixel processing operations are required to support the LCD display applications.
Figure 7: NXP i.MX6Ultralite Processor Blocks
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4.2 PF3000 Power Management IC (PMIC) SOM board has on onboard NXP PF3000 power management integrated circuit (PMIC) that features a configurable architecture supporting the numerous outputs with various current ratings as well as programmable voltage and sequencing required by the components on the SOM Card NXP MC32PF3000A3EP or MC32PF3000A7EP can be used as PMIC for SOM Card To perform a hard-reset of the SOM Card a software reset signal can be implemented CPU Ball
CPU Pad Name
Signal Name
Voltage Level
Description
T9
SNVS_PMIC_O N_REQ
PMIC_PWRON
3V3
Connected to the PWRON signal of PMIC
The PMIC also provides RESETOUT signals which act as Power Good signal of PMIC output. This RESETOUT signal from PMIC is connected to Processor POR# pin and also connected to J3.47 Expansion connector. In Base Board, RESETOUT is connected to reset switch. So Reset can be applied to SOM card by pressing Reset button in Base Board
4.3 Memory (Micron) SOM Card integrates Single x16 512Mbyte (4GBit) DDR3L synchronous DRAM memory. It is operating at 1.35V with speed of 400MHz clock rate and 800Mbps data rate. This memory ideally suited for main memory application.
4.4 eMMC Storage (Kingston) The SOM Card onboard 4GB eMMC device is connected on the SD1 pins of the i.MX6Ultralite processor in an 8 bit width configuration. Kingston eMMC™ products follow the JEDEC eMMC™ 4.5 standard. It is an ideal universal storage solutions for many electronic devices, including smartphones, tablet PCs, PDAs, eBook readers, digital cameras, recorders, MP3, MP4 players, electronic learning products, digital TVs and set-top Boxes. EMMC™ encloses the MLC NAND and eMMC™ controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC™ controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing. The Kingston NAND Device is fully compatible with the JEDEC Standard Specification No.JESD84- B45. More information can be retrieved from Kingston.
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4.5 eMMC - Signal Description CPU Ball B3
CPU Pad Name
Signal Name
Voltage Level
Description
SD1_DATA0
SDHC1_D0
3V3
eMMC Data0
B2
SDHC1_D1
SDHC1_D1
3V3
eMMC Data1
B1
SDHC1_D2
SDHC1_D2
3V3
eMMC Data2
A2
SDHC1_D3
SDHC1_D3
3V3
eMMC Data3
A3
NAND_READY#
SDHC1_D4
3V3
eMMC Data4
C5
NAND_CE0#
SDHC1_D5
3V3
eMMC Data5
B5
NAND_CE1#
SDHC1_D6
3V3
eMMC Data6
A4
NAND_CLE
SDHC1_D7
3V3
eMMC Data7
C1
SD1_CLK
SDHC1_CLK
3V3
eMMC CLK
C2
SD1_CMD
SDHC1_CMD
3V3
eMMC CMD
M15
GPIO1_IO09
SDHC1_RST_B
3V3
eMMC RST#
4.6 Broadcom BCM4343W Wi-Fi/Bluetooth Combo Module SOM Card comes with onboard Wi-Fi/BT Combo module. It is small sized LGA package that provides full function of Wi-Fi 802.11b/g/n + BT 4.1 The small size & low profile physical design make it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption and excellent radio performance make it the best solution for OEM customers who require embedded 802.11b/g/n Wi-Fi + Bluetooth features. The SIP module is based on Broadcom BCM4343 chipset which is a Wi-Fi + BT SOC. The Radio architecture & high integration MAC/BB chip provide excellent sensitivity with rich system performance. In addition to WEP 64/128, WPA and TKIP, AES, CCX is supported to provide the latest security requirement on your network. The SiP module is designed to operate with a single antenna for Wi-Fi and Bluetooth to be connected to the u.FL connector (separate purchase, please purchase part number “U.FL-R-SMT-1”)
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4.7 Broadcom Wi-Fi/BT - Signal Description
WIFI_DATA0
Voltage Level 3V3
SDIO_DATA_0
NAND_DATA01
WIFI_DATA1
3V3
SDIO_DATA_1
E2
CSI_DATA02
WIFI_DATA2
3V3
SDIO_DATA_2
E1
CSI_DATA03
WIFI_DATA3
3V3
SDIO_DATA_3
D8
NAND_RE#
WIFI_CLK
3V3
SDIO_CLK
F3
CSI_HSYNC
WIFI_CMD
3V3
SDIO_CMD
D16
ENET2_RX_ER
WIFI_HST_WK
3V3
Used as GPIO
CPU Ball
CPU Pad Name
Signal Name
E4
CSI_DATA00
B7
Description
D17
ENET2_TX_CLK
WL_REG_ON
3V3
Used to power up & power down internal regulator used by WLAN section
C6
NAND_DATA04
BT_UART2_RX_D
3V3
UART RX input for BT
B6
NAND_DATA05
BT_UART2_TX_D
3V3
UART TX output from BT
A6
NAND_DATA06
BT_UART2_RTS#
3V3
UART Request to Send for BT
A5
NAND_DATA07
BT_UART2_CTS#
3V3
UART Clear to Send for BT
D13
LCD_DATA15
BT_IIS3_DIN
3V3
BT Audio PCM Data Input
A12
LCD_DATA14
BT_IIS3_DOUT
3V3
BT Audio PCM Data Output
C12
LCD_DATA12
BT_IIS3_SYNC
3V3
BT Audio PCM SYNC
B12
LCD_DATA13
BT_IIS3_BCLK
3V3
BT Audio PCM Bit Clock
K17
GPIO1_IO06
BT_DEV_WAKE
3V3
Used as GPIO
P15
JTAG_MOD
BT_HOST_WAKE
3V3
G13
UART5_RX_DATA
BT_REG_ON
3V3
Used as GPIO Used to power up & power down internal regulator used by BT section
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4.8 Audio Codec - SGTL5000XNLA SOM Card comes with onboard Audio Codec which supports Line In, Line Out, Headphone output and Mic IN via expansion connector. Base Board has Line In/OUT, Head phone, Mic Audio jack connectors for connectivity. SGTL5000XNLA is audio codec from NXP, which is interfaced to I.MX6 UL processor via I2S and I2C. I2S1 from I.MX6 UL is connected to onboard Audio Codec and I2C2 from I.MX6UL is used for read/write control register of Audio Codec.
CPU Ball
CPU Pad Name
Signal Name
D1 D2 D3 D4 E3
CSI_DATA07 CSI_DATA06 CSI_DATA05 CSI_DATA04 CSI_DATA01
AUD_IIS1_DIN AUD_IIS1_DOUT AUD_IIS1_BCLK AUD_IIS1_SYNC AUD_IIS1_MCLK
Voltage Level 3V3 3V3 3V3 3V3 3V3
Description I2S Data In I2S Data Out I2S Bit Clock I2S Word Clock I2S Master Clock
4.9 Interfaces and Connectors Expansion Connector- J4 Pin Out Conn Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
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Signal Name SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V SYS_5V Ground LICELL Ground LICELL Ground LICELL ENET1_MDC LICELL ENET1_MDIO LICELL
CPU PAD NAME
CPU Ball
Battery Power In Battery Power In Battery Power In ENET2_RX_DATA1 Battery Power In ENET2_RX_DATA0 Battery Power In
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C16 C17
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21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
Ground PWM4_OUT ENET1_RX_ER USB_OTG1_OC ENET1_RX_EN USB_OTG1_PWR ENET1_RX_D0 USB_OTG1_CHD# ENET1_RX_D1 Ground ENET1_RX_D2 USB_OTG1_DP ENET1_RX_D3 USB_OTG1_DN Ground Ground ENET1_RX_CLK USB_OTG1_ID Ground USB_OTG1_VBUS Ground Ground ENET1_TX_CLK USB_OTG2_OC Ground USB_OTG2_VBUS ENET1_TX_D0 USB_OTG2_PWR ENET1_TX_D1 Ground ENET1_TX_D2 USB_OTG2_DP ENET1_TX_D3 USB_OTG2_DN ENET1_TX_EN Ground ENET1_TX_ER ENET1_COL Ground ENET1_CRS
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GPIO1_IO05 ENET1_RX_ER GPIO1_IO01 ENET1_RX_ GPIO1_IO04 ENET1_RX_DATA0 USB_OTG1_CHD# ENET1_RX_DATA1 Ground UART1_TX_DATA USB_OTG1_DP UART1_RX_DATA USB_OTG1_DN
M17 D15 L14 E16 M16 F16 U16 E17
UART1_CTS# GPIO1_IO00
K15 K13
USB_OTG1_VBUS
T12
ENET1_TX_CLK ENET2_TX_EN
F14 B15
USB_OTG2_VBUS ENET1_TX_DATA0 ENET2_TX_DATA1 ENET1_TX_DATA1
U12 E15 A16 E14
UART2_TX_DATA USB_OTG2_DP UART2_RX_DATA USB_OTG2_DN ENET1_TX_EN
J17 U13 J16 T13 F15
UART1_RTS# UART2_RTS#/
J14 H14
UART2_CTS#
J15
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K14 U15 K16 T15
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Expansion Connector- J3 Pin Out Conn Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
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Signal Name Ground Ground CAN1_RX CAN1_TX Ground Ground SPI1_SS0 GPIO3_IO6 SPI1_SS1 GPIO3_IO23 SPI1_SS2 GPIO_MUX4 SPI1_SS3 GPIO3_IO22 Ground GPIO3_IO3 SPI1_CLK GPIO3_IO9 Ground GPIO3_IO21 SPI1_MOSI Ground SPI1_MISO GPIO3_IO2 Ground GPIO_MUX3 IIS3_MCLK GPIO3_IO24 Ground GPIO3_IO7 IIS3_RX_SYNC GPIO_MUX5 Ground GPIO_MUX2 BT_IIS3_BCLK Ground
CPU PAD NAME
CPU Ball
LCD_DATA09 LCD_DATA08
A11 B11
LCD_DATA21 LCD_DATA01 LCD_DATA05 LCD_DATA18 LCD_DATA06 NAND_DATA03 LCD_DATA07 LCD_DATA17
B14 A9 B10 A13 A10 D6 D11 B13
LCD_VSYNC LCD_DATA20 LCD_DATA04
C9 C14 C10
LCD_DATA16 LCD_DATA22
C13 A14
LCD_DATA23 LCD_DATA16
B16 C13
NAND_DATA02 LCD_CLK LCD_DATA19
A7 A8 D14
LCD_DATA02 LCD_DATA10 NAND_DATA00
E10 E12 D7
LCD_ENABLE LCD_DATA13
B8 B12
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37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
Ground BT_IIS3_SYNC BT_IIS3_DOUT Ground Ground IIS3_RX_BCLK BT_IIS3_DIN Ground Ground GPIO_MUX1 RESETB ADC1_IN7 Ground IIC4_SCL UART3_CTS# UART3_RTS# UART3_TX_D UART3_RX_D Ground Ground UART4_TX_D UART4_RX_D IIC4_SDA ONOFF
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LCD_DATA12 LCD_DATA14
C12 A12
LCD_DATA11 LCD_DATA15
D12 D13
NAND_WE# POR# GPIO1_IO07
C8 P8 L16
ENET2_RX_EN UART3_CTS# UART3_RTS# UART3_TX_DATA UART3_RX_DATA
B17 H15 G14 H17 H16
UART4_TX_DATA UART4_RX_DATA ENET2_TX_DATA0 ONOFF
G17 G16 A15 R8
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Expansion Connector- J2 Pin Out Conn Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 ©2016 | Argonboards.com
Signal Name Ground Ground WIFI_CMD GPIO1_IO13 WIFI_DATA0 GPIO1_IO12 WIFI_DATA1 GPIO1_IO14 WIFI_DATA2 GPIO5_IO0 WIFI_DATA3 GPIO1_IO15 WIFI_CLK GPIO1_IO11 USDHC2_CD_B PMIC_PWRON USDHC2_WP Ground Ground AUD_IIS1_MCLK PWM3_OUT Ground Ground AUD_IIS1_SYNC PWM5_OUT Ground Ground AUD_IIS1_BCLK GPIO5_IO6 Ground GPIO5_IO4 AUD_IIS1_DOUT GPIO5_IO3 Ground GPIO5_IO2 AUD_IIS1_DIN GPIO5_IO9
CPU PAD NAME
CPU Ball
CSI_HSYNC JTAG_TDI CSI_DATA00 JTAG_TDO NAND_DATA01 JTAG_TCK CSI_DATA02 SNVS_TAMPER0 CSI_DATA03 JTAG_TRST# NAND_RE# JTAG_TMS CSI_MCLK SNVS_PMIC_ON_REQ CSI_PIXCLK
F3 N16 E4 N15 B7 M14 E2 R10 E1 N14 D8 P14 F5 T9 E5
CSI_DATA01 NAND_ALE
E3 B4
CSI_DATA04 NAND_DQS
D4 NAND_DQS
CSI_DATA05 SNVS_TAMPER6
D3 N11
SNVS_TAMPER4 CSI_DATA06 SNVS_TAMPER3
P9 D2 P10
SNVS_TAMPER2 CSI_DATA07 SNVS_TAMPER9
P11 D1 R6
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38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
Ground GPIO5_IO1 AUD_HP_L_CAP GPIO5_IO8 AUD_HP_R_CAP GPIO5_IO7 Ground AUD_LINEOUT_L Ground AUD_LINEOUT_R AUD_LINEIN_L Ground AUD_LINEIN_R AUD_MICIN Ground Ground AUD_IIC2_SDA AUD_IIC2_SCL BT_UART2_CTS# BT_UART2_RTS# BT_UART2_TX_D BT_UART2_RX_D
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SNVS_TAMPER1
R9
CSI_VSYNC UART5_TX_DATA NAND_DATA07 NAND_DATA06 NAND_DATA05 NAND_DATA04
F2 F17 A5 A6 B6 C6
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Argonboards Argonboards provide complete board and software solutions based on NXP solutions revolutionizing the IOT market. The idea behind Argonboards is to allow companies to quickly evaluate the next generation NXP architectures and build a demo of their end application. This may also lead to the user contracting a tailored production board. Argonboards brings to the delight of all the developers, tech enthusiasts, hobbyists, engineers by making it easy to shop for production ready reference designs, assembled and tested PCBs and modules all included with BSP (Board Support Package), applications and documentations. For more details visit: www.argonboards.com
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