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Genesys Reference

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GENESYS Reference © Copyright 1986-1999 Eagleware Corporation 4772 Stone Drive Tucker, GA 30084 USA Phone: (770) 939-0156 FAX: (770) 939-0157 E-mail: [email protected] Internet: http://www.eagleware.com Printed 09/1999 Printed in the USA Table of Contents Chapter 1: Circuit Elements................................................. 9 =SuperStar= Elements .......................................................9 ABCD parameters (ABC) ..................................................12 Air core inductor (AIRIND1) ..............................................13 Bipolar transistor model (BIP) ...........................................14 Capacitor (CAP) ...............................................................16 Current controlled current source (CCC) ...........................17 Current controlled voltage source (CCV)...........................18 Coaxial open end (CEN)...................................................19 Coaxial center conductor gap (CGA).................................20 Ideal three port circulator (CIR3) .......................................21 Coaxial transmission line (CLI) .........................................22 Four terminal coaxial line (CLI4) .......................................23 Coupled lines (CPL)..........................................................24 Multiple coupled transmission lines (CPNn) ......................25 Coaxial conductor step (CST) ...........................................27 Ideal delay block (DELAY) ................................................29 Dipole antenna (DIPOLE) .................................................30 FET transistor model (FET) ..............................................31 Four-Port Data (FOU) .......................................................33 Ideal gain block (GAIN).....................................................34 Gyrator (GYR) ..................................................................35 Inductor (IND)...................................................................36 Ideal isolator (ISOLATOR) ................................................37 Microstrip Bend (MBN) .....................................................38 Multiple Coupled Microstrip Lines (MCN) ..........................39 Two Coupled Microstrip Lines (MCP)................................41 Microstrip Cross (MCR) ....................................................42 Microstrip Curved Bend (MCURVE) ..................................44 Microstrip Open End (MEN) ..............................................45 Microstrip Gap (MGA).......................................................46 Microstrip Interdigital Capacitor (MIDCAP)........................47 Microstrip Line (MLI).........................................................48 Table of Contents Monopole Antenna (MONOPOLE).................................... 49 Microstrip Rectangular Inductor (MRIND) ......................... 50 Microstrip Radial Stub (MRS) ........................................... 52 Microstrip Spiral Inductor (MSPIND)................................. 54 Microstrip Step (MST) ...................................................... 56 Microstrip Linearly Tapered Line (MTAPER)..................... 58 Microstrip Tee Junction (MTE).......................................... 59 Two Mutually Coupled Inductors (MUI)............................. 60 Microstrip Via Hole (MVH) ................................................ 61 NET Block........................................................................ 62 N-Port Data File (NPOn) .................................................. 63 1-Port Data File (ONE) ..................................................... 64 Operational Amplifier (OPA) ............................................. 65 Parallel L-C resonator (PFC) ............................................ 66 Parallel L-C resonator (PFL)............................................. 67 Ideal Phase Shift (PHASE)............................................... 68 PIN Diode (PIN) ............................................................... 69 PLC ................................................................................. 71 PRC................................................................................. 72 PRL ................................................................................. 73 PRX ................................................................................. 74 Distributed RC transmission line (RCLIN) ......................... 75 Multiple Coupled Rods (slabline) (RCN) ........................... 76 Coupled Slabline (RCP) ................................................... 77 Resistor (RES) ................................................................. 78 Rectangular Wire (RIBBON)............................................. 79 Slabline (RLI) ................................................................... 80 Stripline Bend (SBN) ........................................................ 81 Multiple Coupled Striplines (SCN) .................................... 82 Coupled striplines (SCP) .................................................. 83 Stripline Open End (SEN) ................................................ 84 SFC ................................................................................. 85 SFL.................................................................................. 86 Stripline gap (SGA) .......................................................... 87 Series inductor and capacitor network (SLC) .................... 88 Stripline (SLI) ................................................................... 89 2 Table of Contents SMTLP and MMTLP .........................................................90 S-parameters (SPA) .........................................................91 Spiral Inductor (SPIND) ....................................................92 SRC .................................................................................94 SRL..................................................................................95 SRX..................................................................................96 Stripline Step in Width (SSP) ............................................97 Stripline Tee Junction (STE) .............................................98 Thin film capacitor (TFC) ..................................................99 Thin Film Resistor (TFR).................................................100 3-Port Data File (THR)....................................................101 Transmission line (TLE)..................................................102 Four Terminal Transmission Line (TLE4) ........................103 Transmission Line (TLP).................................................104 Four Terminal Transmission Line (TLP4) ........................105 Distortionless TEM Transmission Line (TLRLDC)............106 Uniform TEM Transmission Line (TLRLGC) ....................107 Exponential TEM Transmission Line (TLX) .....................108 Toroidal Core Inductor (TORIND) ...................................109 Ideal Transformer (TRF) .................................................110 Tapped Transformer (TRFCT) ........................................111 Ruthroff transformer (TRFRUTH)....................................112 2-Port Data File (TWO)...................................................113 Voltage Controlled Current Source (VCC).......................115 Voltage Controlled Voltage Source (VCV).......................116 Waveguide-to-TEM Adapter (WAD) ................................117 Length of Conducting Wire (WIRE) .................................118 Rectangular Waveguide Line (WLI).................................119 Piezoelectric resonator (XTL)..........................................120 Chapter 2: Measurements ................................................ 121 Overview ........................................................................121 Linear Measurements .....................................................121 Operators .......................................................................123 Sample Measurements...................................................124 Using Non-Default Simulation/Data.................................124 3 Table of Contents Using Equation Results (post-processing) ...................... 125 Chapter 3: Equations ........................................................127 Statements..................................................................... 127 Assignment .............................................................127 REF.........................................................................128 Comment ................................................................128 LABEL.....................................................................128 GOTO .....................................................................128 IF ............................................................................129 FUNCTION..............................................................129 RETURN .................................................................130 BASE ......................................................................130 Viewing Variable Values................................................. 131 Operators....................................................................... 131 Sample Expressions....................................................... 132 Built-in Functions............................................................ 132 Constants....................................................................... 135 Strings ........................................................................... 135 Arrays (Vectors and Matrices) ........................................ 136 Post Processing ............................................................. 138 Logical Operators........................................................... 141 User Functions............................................................... 142 Calling Your FORTRAN/C/C++ DLLs ............................. 143 Chapter 4: Units ................................................................145 Global Units ................................................................... 145 Chapter 5: Menus..............................................................147 File Menu....................................................................... 147 Edit Menu ...................................................................... 149 View Menu ..................................................................... 150 Workspace Menu ........................................................... 151 Actions Menu ................................................................. 152 Tools Menu .................................................................... 153 Schematic Menu ............................................................ 154 Layout Menu .................................................................. 155 4 Table of Contents Synthesis Menu ..............................................................156 Window Menu.................................................................157 Chapter 6: Toolbars.......................................................... 159 Main GENESYS Toolbar.................................................159 Main Graph Toolbar........................................................160 Main Layout Toolbar.......................................................160 Main =SCHEMAX= Toolbar ............................................161 Lumped Toolbar .............................................................162 Device Toolbar ...............................................................163 T-Line Toolbar ................................................................164 Coax Toolbar..................................................................165 Microstrip Toolbar...........................................................165 Slabline Toolbar .............................................................166 Stripline Toolbar .............................................................166 Waveguide Toolbar ........................................................167 Chapter 7: Dialog Boxes .................................................. 169 GENESYS Global Options..............................................169 General Options...................................................... 169 =SCHEMAX= Global Options.................................. 171 Export Dialogs ................................................................173 DXF Setup .............................................................. 173 Gerber .................................................................... 174 Gerber Setup ...........................................................174 Editing an Aperture List ............................................175 Custom Apertures -- When Should You Use Them? ..176 HPGL Setup............................................................ 178 SPICE Preferences ................................................. 179 Workspace Dialogs.........................................................180 =LAYOUT= Dialogs ........................................................181 Print Setup.............................................................. 181 Statistics ................................................................. 182 Footprint Library Selector ........................................ 182 =LAYOUT= Objects........................................................184 Overview................................................................. 184 Arc Object ............................................................... 185 5 Table of Contents Component Object...................................................186 EMPort Object .........................................................187 Group Object ...........................................................189 Line Object ..............................................................190 Pad Object ..............................................................191 Polygon Object ........................................................193 Port Object ..............................................................194 Pour Object .............................................................195 Rectangle Object.....................................................196 Text Object..............................................................197 Viahole Object .........................................................198 =LAYOUT= Properties ................................................... 200 General ...................................................................200 Associations ............................................................203 General Layer..........................................................204 =EMPOWER= Layer................................................206 Fonts.......................................................................210 Schematic Properties ..................................................... 211 Schematic Part Layout Options ...................................... 212 Change Model................................................................ 213 Model Properties............................................................ 214 Graph Properties............................................................ 215 Polar Chart Properties.................................................... 216 Smith Chart Properties ................................................... 217 Table Properties............................................................. 218 Linear Simulation Properties........................................... 219 =EMPOWER= Options................................................... 220 Link to Data File Setup ................................................... 224 Parameter Sweep Properties.......................................... 225 Edit substrate ................................................................. 226 Yield/Opt Settings .......................................................... 227 Statistics Setup .............................................................. 228 Chapter 8: Error Messages...............................................231 General.......................................................................... 231 Touchstone Export......................................................... 238 6 Table of Contents Spice Export ...................................................................241 =EMPOWER= ................................................................242 Chapter 9: Reference Tables ........................................... 255 Loss Tangent..................................................................255 Metal Thickness..............................................................256 Relative Dielectric Constants ..........................................256 Relative Permeability ......................................................257 Resistivity .......................................................................257 Surface Roughness ........................................................258 Chapter 10: S Parameters .................................................. 259 Overview ........................................................................259 Introduction ....................................................................259 Stability ..........................................................................261 Matching ........................................................................263 GMAX and MSG.............................................................264 The Unilateral Case ........................................................265 Gain Circles....................................................................265 Noise Circles ..................................................................266 Smith Chart ....................................................................267 Chapter 11: Device Data..................................................... 271 Overview ........................................................................271 Using a Data File in GENESYS ......................................271 Provided Device Data .....................................................271 Creating New Data Files .................................................272 File Record Keeping .......................................................273 Exporting Data Files .......................................................274 Noise Data in Data Files .................................................274 Chapter 12: References...................................................... 275 GENESYS References ...................................................275 7 Chapter 1: Circuit Elements =SuperStar= Elements The following index shows the builtin =SuperStar= linear elements organized by schematic toolbar. For an alphabetic listing, see the table of contents. The code at the end is the model name which must be used when switching models in =SCHEMAX= or when typing in a netlist. Lumped Toolbar Air-Core Inductor (AIRIND1) Capacitor (CAP) Crystal RLC Model (XTL) Delay Block (Ideal) (DELAY) Dipole Antenna Element (DIPOLE) Inductor (IND) Gain Block (Ideal) (GAIN) Monopole Antenna Element (MONOPOLE) Mutually Coupled Inductors (MUI) Phase Block (Ideal) (PHASE) Resistor (RES) Spiral Inductor (SPIND) Thin Film Capacitor (TFC) Thin Film Resistor (TFR) Three-Port Circulator (CIR3) Toroidal Core Inductor (TORIND) Transformer (Ideal) (TRF) Transformer (Center Tapped Secondary) (TRFCT) Two-Port Isolator (Ideal) (ISOLATOR) Device Toolbar 1 Port (ONE) 2 Port (TWO) 3 Port (THR) 4 Port (FOU) Bipolar Transistor Model (BIP) Current Controlled Current Source (CCC) Current Controlled Voltage Source (CCV) FET Model (FET) Gyrator Model (GYR) N-Ports (5 to 20 Ports) (NPOn) Circuit Elements Operational Amplifier (OPA) PIN Diode (PIN) Voltage Controlled Current Source (VCC) Voltage Controlled Voltage Source (VCV) T-Line Toolbar Coupled Lines (2 Lines) (CPL) Coupled Lines (3 to 10 Lines) (CPNn) Distributed RC Transmission Line (RCLIN) Multi-Mode Lines (=EMPOWER= generated) (MMTLP) Single Line (2 Nodes) (TLE) Single Line (4 Nodes) (TLE4) Single Line With Physical Dimensions (2 Nodes) (TLE) Single Line With Physical Dimensions (4 Nodes) (TLE4) Single Mode Line (=EMPOWER= generated) (SMTLP) Transmission Line (Distortionless TEM) (TLRLDC) Transmission Line (Uniform TEM) (TLRLGC) Transmission Line (Exponential TEM) (TLX) Wire (Rectangular Cross Section) (RIBBON) Wire (Circular Cross Section) (WIRE) Coaxial Toolbar End Effect (CEN) Gap (CGA) Single Line (2 Nodes) (CLI) Single Line (4 Nodes) (CLI4) Step (CST) Microstrip Toolbar Bend (MBN) Coupled Lines (2 Lines) (MCP) Coupled Lines (3 to 10 Lines) (MCNn) Cross (MCR) Curved Line (MCURVE) End Effect (MEN) Gap (MGA) Interdigital Capacitor (MIDCAP) Radial Stub (MRS) Rectangular Inductor (MRIND) Single Line (MLI) Spiral Inductor (MSPIND) Step (MST) Tapered Line (MTAPER) 10 =SuperStar= Elements Tee (MTE) Via-Hole (MVH) Slabline Toolbar Single Line (RLI) Coupled Lines (2 Lines) (RCP) Coupled Lines (3 to 10 Lines) (RCNn) Stripline Toolbar Bend (SBN) Coupled Lines (2 Lines) (SCP) Coupled Lines (3 to 10 Lines) (SCNn) End Effect (SEN) Gap (SGA) Single Line (SLI) Step (SSP) Tee (STE) Waveguide Toolbar Rectangular Waveguide (WLI) Waveguide-to-TEM Adapter (WAD) 11 Circuit Elements ABCD parameters (ABC) There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax : ABC 1 2 0 AR=-.5 AI=.5 BR=1 BI=-.2 CR=.1 CI=.3 DR=.5 & DI=-.6 Parameters: n1 Input node number. n2 Output node number. n3 Ground reference node number. AR Real portion of A. AI Imaginary portion of A. BR Real portion of B. BI Imaginary portion of B. CR Real portion of C. CI Imaginary portion of C. DR Real portion of D. DI Imaginary portion of D. Example: ABC 1 2 0 AR=-.5 AI=.5 BR=1 BI=-.2 CR=.1 CI=.3 & DR=.5 DI=-.6 12 Air core inductor (AIRIND1) Air core inductor (AIRIND1) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: AIRIND1 n1 n2 N= D= L= WD= RHO= [Name=] Parameters: N Number of turns D Diameter of form (mm) L Length (mm) WD Diameter of wire (mm) RHO Resistivity of conductor relative to copper Examples: AIRIND1 1 2 N=7 D=5.08 L=11.43 WD=1.143 RHO=1 Touchstone Translation: AIRIND1 1 2 N= D= L= WD= RHO= Default SPICE Translation: None 13 Circuit Elements Bipolar transistor model (BIP) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: BIP n1 n2 n3 RBE= RCe= Gm= RBB= CBe= CC= [Name=] Parameters: RBE Base-emitter resistance. RCE Collector-emitter resistance. GM Transconductance. RBB Base resistance. CBE Base-emitter capacitance. CC Collector-base capacitance. Example: BIP 1 3 4 RBB=1250 RCE=50000 Gm=-0.05 RBB=250 CBE=15 CC=1 BIP models a bipolar transistor using a voltage controlled current source plus additional components. The BIP code is based on the common emitter hybrid-pi model shown below. Typical parameters for a low power, low frequency, NPN bipolar transistor are: Rbe = 1250 ohms Rce = 50,000 ohms Gm = -0.05 mhos 14 Bipolar transistor model (BIP) Rbb = 250 ohms Cbe = 15 pF Cc = 1 pF Some of the parameters are related to the emitter current, beta and Ft via simple expressions. First, the emitter diffusion resistance, a function of the emitter current, is found. where = 25.7mV at 25 C. Then: Rbe = (1+beta)Re Gm = beta/[(1+beta)Re] CBe=1/[2pi*Ft*Re] Modeling attempts to describe a complex physical process via a simple equivalent electrical circuit. The result is only approximate, and the errors tend to increase with frequency. Measured device data is more accurate. However, modeling is useful at lower frequencies and for special simulation purposes. Touchstone Translation: None Default SPICE Translation: None (User may specify a SPICE subcircuit or library model.) 15 Circuit Elements Capacitor (CAP) Lumped capacitance with optional Q. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: CAP n1 n2 C= [Q=] [Name=] Parameters: Capacitance (pF) Specifies the value of the capacitor in picoFarads. Capacitor Q (optional) Specifies the quality factor of the capacitor, modeled as constant with frequency. This parameter is not required, and defaults to 1 million if not specified. Examples: CAP 1 2 C=22 CAP 3 0 C=470 Q=300 N=C1 Q is modeled as constant with frequency. It can be specified higher or lower than the default value. Touchstone Translation: CAP n1 n2 C= or (if Q is specified) CAPQ n1 n2 C= Q= F=1 MOD=3 Default SPICE Translation: C1_NAME n1 n2 C Warning: Q is not modeled in SPICE. 16 Current controlled current source (CCC) Current controlled current source (CCC) This symbol is available in =SCHEMAX= in the DEVICE toolbar. Netlist syntax: CCC n1 n2 n3 RIN= ROUT= BETA= [Name=] Parameters: RIN Input resistance in ohms. ROUT Output resistance in ohms. BETA Current gain (dimensionless). Examples: CCC 1 2 0 RIN=1E-6 ROUT=1E6 BETA=1 Touchstone Translation: CCCS n1 n2 n3 n3 M=BETA A=0 R1=RIN R2=ROUT F=0 T=0 Default SPICE Translation: NONE 17 Circuit Elements Current controlled voltage source (CCV) This symbol is available in =SCHEMAX= in the DEVICE toolbar. Netlist syntax: CCV n1 n2 n3 RIN= ROUT= TR= [Name=] Parameters: RIN Input resistance in ohms. ROUT Output resistance in ohms. TR Transresistance in ohms. Examples: CCV 1 2 0 RIN=1E-6 ROUT=1E-6 TR=100 Touchstone Translation: CCVS n1 n2 n3 n3 M=TR A=0 R1=RIN R2=ROUT F=0 T=0 Default SPICE Translation: NONE 18 Coaxial open end (CEN) Coaxial open end (CEN) This symbol is available in =SCHEMAX= in the COAX Toolbar. Netlist Syntax: CEN n1 n2 A= B= Spacing= [Name=] Note: This model requires a substrate definition. Parameters: Inner Radius A Center conductor radius. Outer Radius B Outer conductor radius. Spacing to closed end Spacing from the end of the inner conductor to end wall. Example: CEN 1 0 A=100 B=1000 S=50 Range: wavelength > (B-A) > spacing In a netlist, n2 is normally zero (ground). Substrate characteristics and units must be established in a previous SUB call. The coaxial end is modeled as an effective shunt capacitor. The modeled capacitance is within 5% for the specified range. The error increases with increasing spacing, however, the capacitance is also decreasing and is less significant. The model is intended for use with small spacings where the capacitance is significant. Touchstone Translation: None Default SPICE Translation: None 19 Circuit Elements Coaxial center conductor gap (CGA) This symbol is available in =SCHEMAX= in the COAX Toolbar. Netlist Syntax: CGA n1 n2 A= B= Gap= [Name=] Note: This model requires a substrate definition. Parameters: Inner Radius A Center conductor radius. Outer Radius B Outer conductor radius. Gap Gap spacing. Example: CGA 1 2 A=100 B=1000 G=20 Range: 5 > A/B >1.111 0.30 >Gap/B >0.05 The coaxial gap is modeled as a shunt capacitor, series capacitor and shunt capacitor in cascade. The modeled capacitances are within approximately 5% over the parameter range, but degrade rapidly outside the range. Touchstone Translation: None Default SPICE Translation: None 20 Ideal three port circulator (CIR3) Ideal three port circulator (CIR3) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: CIR3 n1 n2 n3 Z= [Name=] Parameters: Z Reference resistance in ohms. Examples: CIR3 1 2 0 Z=50 Touchstone Translation: CIR3 n1 n2 n3 Default SPICE Translation: NONE 21 Circuit Elements Coaxial transmission line (CLI) This symbol is available in =SCHEMAX= in the COAX Toolbar. Netlist Syntax: CLI n1 n2 A= B= Length= [Name=] Note: This model requires a substrate definition. Parameters: Inner Radius A Center conductor radius. Outer Radius B Outer conductor radius. Length Physical line length. Example: CLI 1 0 A=100 B=1000 L=3500 Range: operation frequency is below TE01 cutoff The substrate characteristics and dimensional units must be established in a previous call to SUB. The model is identical to the coaxial line model in =TLINE= from Eagleware. Touchstone Translation: COAX n1 n2 0 0 DI= DO= L= ER= TAND= RHO= Default SPICE Translation: None 22 Four terminal coaxial line (CLI4) Four terminal coaxial line (CLI4) This symbol is available in =SCHEMAX= in the COAX Toolbar. Netlist Syntax: CLI4 n1 n2 n3 n4 A= B= Length= [Name=] Note: This model requires a substrate definition. Parameters: Inner Radius A Center conductor radius. Outer Radius B Outer conductor radius. Length Physical line length. Range: Operation frequency must be below TE01 cutoff Touchstone Translation: COAX n1 n2 n3 n4 DI= DO= L= ER= TAND= RHO= Default SPICE Translation: None 23 Circuit Elements Coupled lines (CPL) Coupled line four-port based on an electrical description. This symbol is available in =SCHEMAX= in the T-Line Toolbar. Netlist Syntax: CPL n1 n2 n3 n4 ZOE= ZOO= Length= KOE= KOO= [AE= AO= Frequency=] [Name=] Parameters: ZOE Even mode impedance. ZOO Odd mode impedance. Length Physical line length. KOE Even mode effective dielectric constant. KOO Odd mode effective dielectric constant Even Mode Loss, AE Even mode loss in dB/meter. This parameter is optional. Odd Mode Loss, AO Odd mode loss in dB/meter. This parameter is optional. Freq. For Loss Frequency at which specified loss applies. This parameter is optional. Example: CPL 1 0 2 0 ZOE=55 ZOO=45 L=50 KOE=1.73 KOO=1.60 The letters OE and OO represent the even and odd modes respectively. The loss model increases as the square root of the sweep frequency. If the losses are not specified the lines are lossless and the frequency should not be specified. Touchstone Translation: CLINP n1 n2 n3 n4 ZE= ZO= L= KE= AE= AO= Default SPICE Translation: None 24 Multiple coupled transmission lines (CPNn) Multiple coupled transmission lines (CPNn) Multiple coupled transmission lines using an electrical model. This symbol is available in =SCHEMAX= in the T-Line Toolbar. Netlist Syntax: CPNx n1 n2...n(x) Zo= K1= K2=...K(0.5x-1)= L= KOE= KOO= [AE= AO= F= N=] Parameters: n1..n(x) node numbers Zo Characteristic impedance of all lines (see formula) K# Coupling coefficients (see formula) L Physical length (mm) KOE Even mode effective dielectric constant KOO Odd mode effective dielectric constant AE Even mode loss (optional) AO Odd mode loss (optional) F Frequency for loss (MHz) (optional) Example: CPN8 1 2 3 4 5 6 7 8 Zo=50 K1=.03 K2=.01 K3=.03 L=200 Koe=1.73 Koo=1.60 The number of nodes is x. The coupling coefficients are k1 through k(0.5x-1). Their definition is: The letters OE and OO represent the even and odd modes respectively. The loss model increases as the square root of the sweep frequency. If the losses are not specified the lines are lossless and the frequency should not be specified. This model is a significant convenience for analyzing combline, interdigital and other multiple coupled line structures. The 25 Circuit Elements multiple coupled line model is based on an exact wire-line equivalent of cascaded coupled pairs of lines (CPL). Touchstone Translation: None Default SPICE Translation: None 26 Coaxial conductor step (CST) Coaxial conductor step (CST) Coaxial step in the inner or outer conductor of coax. This symbol is available in =SCHEMAX= in the COAX Toolbar. Netlist Syntax: CST n1 n2 Option={IN|OU} ANarrow= BNarrow= AWide= BWide= [Name=] Note: This model requires a substrate definition. Parameters: A Narrow Input Center conductor radius (at n1) B Narrow Input Inner radius of outer conductor (at n1) A Wide Output Center conductor radius (at n2) B Wide Output Inner radius of outer conductor (at n2) IN: Step Inner Conductor Choose this option to step the inner conductor. OU: Step Outer Conductor Choose this option to step the outer conductor. Note: GENESYS will work properly if the “narrow” values are greater than the “wide” values. The terms wide and narrow are for identification of nodes on the schematic element only. Example: CST 1 2 O=IN AN=20 BN=100 AW=50 BW=100 Range: For an inner conductor step: For an outer conductor step: 27 Circuit Elements Option IN indicates a step in the inner conductor and OU indicates a step in the outer conductor. The dielectric and conductor characteristics and dimensional units must be established in a previous call to SUB. A step in both conductors is modeled by cascading two steps. The coaxial step is modeled as an effective shunt capacitor. The modeled effective capacitance is within approximately 0.2 pF/BNarrow (meters) for inner conductor steps and 0.4 pF/BNarrow (meters) for outer conductor steps. Touchstone Translation: None Default SPICE Translation: None 28 Ideal delay block (DELAY) Ideal delay block (DELAY) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Note: n3 is normally grounded. Netlist syntax: DELAY n1 n2 n3 T= [Name=] Parameters: T Delay (nanoseconds) Examples: DELAY 1 2 0 T=1 Touchstone Translation: DELAY n1 n2 T= Default SPICE Translation: NONE 29 Circuit Elements Dipole antenna (DIPOLE) Dipole antenna with finite thickness. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: DIPOLE n1 LEN= LD= [Name=] Parameters: LEN Total length of dipole (mm). LD Ratio of total length to diameter (dimensionless). Examples: DIPOLE 1 LEN=150 LD=100 Note: This model obtains the input impedance referenced to input terminals, not to current maximum. Touchstone Translation: DIPOLE n1 n2 L=LEN LD= Default SPICE Translation: NONE 30 FET transistor model (FET) FET transistor model (FET) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist Syntax: FET n1 n2 n3 RI= GD= GM= RG= CGs= CDg= RS= CSd= To= [Name=] Parameters: (See figure below for parameter illustrations) Example: FET 1 2 3 RI=2 GD=200 GM=-0.07 RG=2.5 CGS=.25 CDG=0.10 RS=2 CSD=0.10 TO=1E-6 NAME=ATF101 FET models a junction or insulated-gate field effect transistor using a voltage controlled current source plus additional components. FET is based on a common source, voltage controlled current source model. An example for the ATF-101XX at 2 volts and 20 mA is RI = 2 ohms GD = 200 ohms GM = -0.07 mhos RG = 2.5 ohms CGs = 0.25 pF CDg = 0.10 pF RS = 2 ohms 31 Circuit Elements CSd = 0.10 pF To = 1E-6 nanoseconds The Wolf and Avantek models place the drain-source capacitance in slightly different positions. Also, the Avantek model includes information on chip and bond-wire inductances. The Wolf model includes a shunt R-L network at the input. In critical applications, these differences are readily incorporated in =SuperStar= by externally adding the appropriate components to the FET model. Modeling describes a complex physical process via a simple equivalent electrical circuit. The result is approximate, and the error tends to increase with frequency. Measured device data is more accurate. Models are best for lower frequencies and special purposes. Equations which reduce the model to exact equivalent Y or other parameters for use in a simulation program are quite complex. Authors (including Wolf in his derivation of Y-parameters) often make simplifying assumptions to the equations. This is not the case in =SuperStar=, where the program exactly matches the model schematic. Therefore, you may experience small differences in the response computed by =SuperStar= and other simulation programs. The differences are generally insignificant in relation to errors associated with the modeling process. Touchstone Translation: None Default SPICE Translation: .SUBCKT X$NAME 1 2 3 R_g 1 4 rg C_dg 4 2 cdg pF C_Gs 4 5 cgs pF R_i 5 6 ri R_s 3 6 rs R_d 2 6 rd pF C_sd 2 3 csd pF G_Gm 6 2 5 6 Gm. ENDS X$NAME 32 Four-Port Data (FOU) Four-Port Data (FOU) Creates a four-port by reading data from a disk file. This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist Syntax: FOU n1 n2 n3 n4 n5 Filename= [Name=] Parameters: FILENAME Full path and filename containing data. Example: FOU 1 2 3 4 0 F=MCROSS.S4P The data is stored in standard sequential ASCII files. For example, the format for four-port S-Parameter data is: The data can be all on one line, or, for readability, can be broken into multiple lines as shown above. The frequency of data stored in the data file need not match the frequencies of a run. =SuperStar= will interpolate or extrapolate the data to obtain the parameters at the run frequencies. See the Device Data chapter for more information. Touchstone Translation: S4PA n1 n2 n3 n4 filename(Note: Node n5 must be ground) Default SPICE Translation: None 33 Circuit Elements Ideal gain block (GAIN) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Note: n3 is normally grounded. Netlist syntax: GAIN n1 n2 n3 A= S= F= [Name=] Parameters: A Flat gain for 0=F (dB/octave) F Frequency at which gain slope starts (MHz). Examples: GAIN 1 2 0 A=6 S=6 F=4 Touchstone Translation: GAIN n1 n2 A= S= F= Default SPICE Translation: None 34 Gyrator (GYR) Gyrator (GYR) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist Syntax: GYR n1 n2 n3 n4 Ratio= [Name=] Parameters: Gyrator Ratio Gyrator ratio. This is defined as the ratio of input voltage to output current, or the negative ratio of output voltage to input current. Example: GYR 1 2 3 4 R=6 The gyrator network is connected to nodes as indicated in the diagram below. The gyrator may be considered as back-to-back current controlled voltage sources, where R is the gyrator ratio. S-parameters are: where Touchstone Translation: GYR n1 n2 R= Default SPICE Translation: None 35 Circuit Elements Inductor (IND) Lumped inductance with optional Q. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist Syntax: IND n1 n2 L= [Q=] [Name=] Parameters: Inductance (nH) Specifies the value of the inductor in nanoHenries. Inductor Q (optional) Specifies the quality factor of the inductor, modeled as constant with frequency. This parameter is not required, and defaults to 1 million if not specified. Examples: IND 1 2 L=22 IND 3 0 L=470 Q=300 N=L1 Q is modeled as constant with frequency. It can be specified higher or lower than the default value. Touchstone Translation: IND n1 n2 L= or (if Q is specified) INDQ n1 n2 C= Q= F=1 MOD=3 Default SPICE Translation: L1_NAME n1 n2 L Warning: Q is not modeled in SPICE. 36 Ideal isolator (ISOLATOR) Ideal isolator (ISOLATOR) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Note: n3 is normally grounded. Netlist syntax: ISOLATOR n1 n2 n3 Z= [Name=] Parameters: Z Reference resistance in ohms. Examples: ISOLATOR 1 2 0 Z=50 Touchstone Translation: ISOLATOR n1 n2 Default SPICE Translation: None 37 Circuit Elements Microstrip Bend (MBN) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MBN n1 n2 Option={CH|SQ} Width= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. CH: Chamfered Corner for a chamfered (mitered) corner. SQ: Square Corner for a squared corner. Example: MBN 2 3 O=CH W=80 Range: 15000/H(mm) > Freq(MHz) 6 >W/H >0.2 13 >Er >2 o 90 square and chamfered corners are available. The substrate characteristics and dimensional units must be established in a previous SUB. The bend model is a series L, shunt C, series L tee. The capacitance error is small. The inductance error is greater for W/H > 1. Predicted resonator frequencies are generally within 0.3%. Touchstone Translation: MBEND2 n1 n2 W= (Chamfered) MCORN n1 n2 W= (Square) Default SPICE Translation: None 38 Multiple Coupled Microstrip Lines (MCN) Multiple Coupled Microstrip Lines (MCN) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MCNx n1 n2..n(x) Width= S1= S2=..S(0.5x-1)= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Width of All Strips Width Width of strips (all are equal widths) Sn Edge-to-edge separations (see figure below) Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Physical length of lines. Example: MCN8 1 2 3 4 5 6 7 8 W=100 S1=15 S2=25 S3=15 L=800 Range: See MCP The number of nodes is x. The spacing between the far left and the next line is s1. The spacing between the far right and the preceding line is s(0.5x-1). This model is convenient for analyzing combline, interdigital and other multiple coupled line structures. Multiple coupled microstrip is based on an exact wire-line equivalent of cascaded coupled pairs of microstrip line. Therefore, full-wave based analytical models is utilized. 39 Circuit Elements Touchstone Translation: (Translation is only available for MCN6) MACLIN3 n1 n2 n3 n4 n5 n6 W1= W2= W3= S1= S2= L= Default SPICE Translation: None 40 Two Coupled Microstrip Lines (MCP) Two Coupled Microstrip Lines (MCP) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MCP n1 n2 n3 n4 Width= Spacing= [Height=] Len= [Name=] Note: This model requires a substrate definition. Parameters: Width of Both Strips Width of strips. Edge-to-Edge Spacing Edge-to-edge strip separation Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Physical length of lines. Example: MCP 1 0 2 0 W=80 S=15 L=1000 Range: 30000/Height(mm) > Freq(MHz) 18 > Er > 1 10 > Width/Height > 0.1 10 > Spacing/Height > 0.1 metal thickness < 0.1*Height and < 0.2*Spacing The substrate characteristics and the units of dimensions are established in a previous call to SUB. The accuracy is generally within 1% for the indicated parameter ranges, provided the cover is sufficiently removed. Adequate cover spacings are determined using =TLINE= from Eagleware. Touchstone Translation: MCLIN n1 n2 n3 n4 W= S= L= Default SPICE Translation: None 41 Circuit Elements Microstrip Cross (MCR) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MCR n1 n2 n3 n4 WThru= WCross= [Height=] [Name= ] Note: This model requires a substrate definition. Parameters: Thru Width Width of thru lines (at nodes 1 and 2). Cross Width Width of cross line (at nodes 3 and 4). Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MCR 1 2 3 4 WT=100 WC=400 Range: 15000/Height(mm) > Freq(MHz) 18 > Er > 1 10 > WThru / Height > 0.1 WCross < 10 * Wthru The discontinuity model used for MCR was developed by Eagleware and verified with field simulation. The model includes phase shift effects as well as junction discontinuity effects. The accuracy and limits are similar to the MTE model. 42 Microstrip Cross (MCR) Touchstone Translation: MCROS n1 n3 n2 n4 W1= W2= W3=W1 W4=W2 Default SPICE Translation: None 43 Circuit Elements Microstrip Curved Bend (MCURVE) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist syntax: MCURVE n1 n2 W= ANG= RAD= [Name=] Note: This model requires a substrate definition. Parameters: (See figure below for an illustration of parameters). W Width of microstrip line. ANG Angle of bend in degrees. RAD Radius of bend measured to center of line. Examples: MCURVE 1 2 W=25 ANG=90 RAD=50 Touchstone Translation: MCURVE n1 n2 W= ANG= RAD= Default SPICE Translation: None 44 Microstrip Open End (MEN) Microstrip Open End (MEN) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MEN n1 n2 Width= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MEN 3 0 W=80 Range: 15000/Height(mm) > Frequency(MHz) 50 > Er > 2 Width / Height > 0.2 Node n2 is normally grounded (node 0). The substrate characteristics and dimensional units must be established in a previous. The accuracy is generally within 4% for the indicated parameter ranges, provided that the cover is sufficiently removed. Touchstone Translation: MLEF n1 W= L=0 Default SPICE Translation: None 45 Circuit Elements Microstrip Gap (MGA) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MGA n1 n2 Width= Gap= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Strip Width Width of strip. Gap Spacing between the ends of the strips. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MGA 1 2 W=80 G=8 Range: 15000/Height(mm) > Freq(MHz) 15 > Er > 2.0 2 > Width / Height > 0.5 1 > Gap / Width > 0.1 The substrate characteristics must be established in a previous SUB. The accuracy is generally within 7% for the indicated parameter ranges. The end is modeled as a shunt C, series C, shunt C pi network. Touchstone Translation: MGAP n1 n2 W= S= Default SPICE Translation: None 46 Microstrip Interdigital Capacitor (MIDCAP) Microstrip Interdigital Capacitor (MIDCAP) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist syntax: MIDCAP n1 n2 W= G= GE= L= N= [Name=] Note: This model requires a substrate definition. Parameters: (See the figure below for parameter illustrations.) W Width of each conductor (finger) G Space between conductors (fingers) GE Space at end of conductor (finger) L Length of fingers N Number of fingers Examples: MIDCAP 1 2 W=0.005 G=0.005 GE=0.001 L=0.1 N=5 Touchstone Translation: MIDCAP1 n1 n2 W= G= GE= L= NP=N/2 Default SPICE Translation: None 47 Circuit Elements Microstrip Line (MLI) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MLI n1 n2 Width= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Length of line. Example: MLI 1 2 W=80 L=200 Range: 30000/Height(mm) > Frequency(MHz) 128 > Er > 1 100 > Width/Height > 0.01 metal thickness < Height and < Width The substrate characteristics and dimensional units must be established in a previous call to SUB. The accuracy is generally within 1% for the indicated parameter ranges, provided a cover is sufficiently removed. Adequate cover spacings are determined using =TLINE= from Eagleware. This model is identical to the =TLINE= model and includes dispersion. Touchstone Translation: MLIN n1 n2 W= L= Default SPICE Translation: None 48 Monopole Antenna (MONOPOLE) Monopole Antenna (MONOPOLE) Ideal monopole above ground. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: MONOPOLE n1 LEN= LR= [Name=] Parameters: LEN Length of monopole not including image (mm). LR Length as defined above, LEN, divided by radius (dimensionless). Examples: MONOPOLE 1 L=75 LR=100 Note: This model calculates input impedance at input terminals, not referenced to current maximum. Touchstone Translation: MONOPOLE n1 L= LR= Default SPICE Translation: None 49 Circuit Elements Microstrip Rectangular Inductor (MRIND) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist syntax: MRIND 1 2 L1=20 L2=50 L3=50 W=5 S=5 N=7.16 Note: This model requires a substrate definition. Parameters: (See figure below for parameter illustrations.) Length, 1st inside segment (L1) Length of the first segment from the inside tap point Length, 2nd inside segment (L2) Length of the second segment from the inside tap point Length, 3rd inside segment (L3) Length of the third segment from the inside tap point Strip Width (W) Width of conductor strips. Strip Spacing (S) Space between conductors. Number of Turns (n) Total number of turns. This does not need to be an integer. Examples: MRIND 1 2 L1=0.715 L2=0.715 L3=.9 W=0.02 S=0.02 N=7 50 Microstrip Rectangular Inductor (MRIND) Touchstone Translation: MRIND n1 n2 N=N/4 L1= L2= W= S= Default SPICE Translation: None 51 Circuit Elements Microstrip Radial Stub (MRS) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MRS n1 Radius= Phi= Width= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Radius Radius of stub (R in diagram). Phi Stub width in degrees (j in diagram). Width Width of the stub base (W in diagram). Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MRS 1 2 R=100 Phi=30 W=20 Range: 15000/Height(mm) > Frequency(MHz) The stub is connected parallel to the transmission path. The digram below illustrates the geometry of the radial stub. The ends of the feed lines are referenced to the center of the radial stub. Note that the penetration depth may exceed the width of the microstrip feed line. The width of the stub base and the penetration depth, P, are related by the formula: W = 2 * P * tan(phi/2) 52 Microstrip Radial Stub (MRS) Touchstone Translation: MRSTUB n1 WI= L= ANG= Default SPICE Translation: None 53 Circuit Elements Microstrip Spiral Inductor (MSPIND) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist syntax: MSPIND n1 n2 RI= W= S= N= [Name=] Note: This model requires a substrate definition. Parameters: (See figure below for parameter illustrations.) Inner Radius (RI) Inside radius, measured edge-to-edge of conductors Strip Width (W) Outer radius, measured edge-to-edge of conductors Strip Spacing (S) Width of conductor Number of Turns (N) Number of turns. This does not have to be an integer. Example: MSPIND 1 2 RI=100 W=5 S=5 N=3.3 Lumped PI model consisting of shunt C, series R-L, shunt C all paralleled by a capacitor. Inductance is calculated using the formulas of Remke and Burdick. Capacitance based on Smith. Resistance is d-c or skin-effect resistance, whichever is greater. 54 Microstrip Spiral Inductor (MSPIND) Touchstone Translation: MSPIND n1 n2 DI= DO= W= S= Default SPICE Translation: NONE 55 Circuit Elements Microstrip Step (MST) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MST n1 n2 Option={AS|SY} NARrow= Wide= [Height=] [NAMe=] Note: This model requires a substrate definition. Parameters: Narrow Width Line width on the n1 side. Wide Width Width on the n2 side. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Substrate Name of substrate. SY: Symmetrical Step Choose this option for a symmetrical step. AS: Asymmetrical Step Choose this option for an asymmetrical step. Example: MST 1 2 O=SY NAR=100 W=300 NAM=STEP Range: 15000/Height(mm) > Frequency(MHz) 10 > Er > 1 3.5 > Narrow / Wide > 0.28 Use SY for a symmetrical step as pictured. Use AS for an asymmetrical step in which only one edge is discontinuous (not pictured). The substrate characteristics and dimensional units must be established in a previous SUB. Note: In optimization, =SuperStar= will automatically adjust if the “narrow” values are greater than the “wide” values. The accuracy is generally within 10% for the indicated parameter ranges. 56 Microstrip Step (MST) The step is modeled as a series L, Shunt C, series L pi network. Touchstone Translation: MSTEP n1 n2 W1= W2= (Symmetrical) None (Asymmetrical) Default SPICE Translation: None 57 Circuit Elements Microstrip Linearly Tapered Line (MTAPER) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist syntax: MTAPER n1 n2 W1= W2= L= [Name=] Note: This model requires a substrate definition. Parameters: (See figure below for parameter illustrations.) W1 Width of line at n1 end W2 Width of line at n2 end L Length of line Examples: MTAPER 1 2 W1=0.835 W2=0.435 L=5 Touchstone Translation: MTAPER n1 n2 W1= W2= L= Default SPICE Translation: None 58 Microstrip Tee Junction (MTE) Microstrip Tee Junction (MTE) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MTE n1 n2 n3 WThru= WStub= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Thru Width Width of thru lines (at nodes 1 and 2). Stub Width Width of stub line (at node 3). Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MTE 1 2 3 WT=100 WS=400 Range: 15000/Height(mm) > Frequency(MHz) 10 > WThru / Height > 0.1 WStub < 10 * WThru 18 > Er > 1 The discontinuity model used for MTE was developed by Eagleware and verified with field simulation. MTE includes phase shift effects as well as junction discontinuity effects. The model is similar to several other proposed models with the advantage that phase and stub reflection are more accurately modeled for a wide range of, height, and width ratios. Touchstone Translation: MTEE n1 n2 n3 W1= W2=W1 W3= Default SPICE Translation: None 59 Circuit Elements Two Mutually Coupled Inductors (MUI) This symbol is available in =SCHEMAX= in the LUMPED Toolbar. Netlist Syntax: MUI n1 n2 n3 n4 L1= L2= K= [Name=] Parameters: L1 Inductance of coil between n1 and n2 in nanohenries. L2 Inductance of coil between n3 and n4 in nanohenries. Coupling, K Coefficient of coupling. Warning: “K” must not equal 1. Example: MUI 1 2 3 4 L1=100 L2=100 K=.999999 A negative value of “K” inverts the phase. MUI is used to model a transformer including finite winding inductance and coupling, providing for a more realistic model. Touchstone Translation: MUC n1 n3 n2 n4 L1= L2= M= Default SPICE Translation: .SUBCKT X$NAME 1 2 3 4 L_IND1 1 2 L1 nH L_IND2 3 4 L2 nH K_MUI L_IND1 L_IND2 k .ENDS X$NAME 60 Microstrip Via Hole (MVH) Microstrip Via Hole (MVH) This symbol is available in =SCHEMAX= in the Microstrip Toolbar. Netlist Syntax: MVH n1 n2 Radius= [Height=] [Thickness=] [Name=] Note: This model requires a substrate definition. Parameters: Radius Via hole outside radius. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Lining Thickness Thickness of via hole lining. This parameter is optional. Example: MVH 1 0 R=30 Range: 15000/Height(mm) > Frequency(MHz) MVH creates a very low impedance to ground, modeled as a series RL. n2 is normally ground (node 0). If the thickness of the via hole lining is not specified, then the SUB conductor thickness is used. Touchstone Translation: VIA n1 n2 D1= D2=D1 H= T= Default SPICE Translation: None 61 Circuit Elements NET Block This element is only available in =SCHEMAX=. It is accessed from the Main =SCHEMAX= Toolbar. It is used to reuse a network within a schematic (e.g. for chaining amplifier stages, filters, etc.), and has the symbol shown below: Parameters: Network to Reuse Specifies the name of an existing network which should be assigned to this NET block. 62 N-Port Data File (NPOn) N-Port Data File (NPOn) Creates an n-port network by reading data from a disk file. This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist Syntax: NPOn n1...n(n+1) Filename= [Name=] Parameters: FILENAME Full path and filename containing data. Example: NPO6 1 2 3 4 5 6 0 F=MCROSS.S6P The data is stored in standard ASCII files. The format for n-port S-Parameter data is: ... . . . ... ... The data can be all on one line, or, for readability, can be broken into multiple lines as shown above. The frequency of data stored in the data file need not match the frequencies of a run. =SuperStar= will interpolate or extrapolate the data to obtain the parameters at the run frequencies. See the Device Data chapter for more information Touchstone Translation: SnPA n1 n2... n(n) filename(Note: Node n(n+1) must be ground) Default SPICE Translation: None 63 Circuit Elements 1-Port Data File (ONE) Creates a one port by reading data from a disk file. This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist Syntax: ONE n1 n2 Filename= [Name=] Parameters: FILENAME Full path and filename containing data. Example: ONE 1 0 F=ANTENNA.S1P The data is stored in standard sequential ASCII files. The format for one-port S-Parameter data is: . . . All magnitudes are linear (not dB), and all angles are in degrees. The frequency of data stored in the data file need not match the frequencies of a run. =SuperStar= will interpolate or extrapolate the data to estimate the parameters at the run frequencies. See the Device Data chapter for more information. Touchstone Translation: S1PA n1 n2 filename (Note: Node n2 must be ground) Default SPICE Translation: None 64 Operational Amplifier (OPA) Operational Amplifier (OPA) This symbol is available in =SCHEMAX= in the LUMPED Toolbar. Netlist Syntax: OPA n1 n2 n3 RIn= ROut= Gdc= Frequency= [Name=] Parameters: Input Resistance Input resistance in ohms. Output Resistance Output resistance in ohms. DC Open Loop Gain Open loop gain (voltage ratio, not in dB) at 0 Hz. Unity Gain Crossover Frequency Open loop unity gain crossover frequency (MHz). This is sometimes called the gain-bandwidth product. Example: OPA 1 2 2 RI=1E6 RO=75 G=50000 F=1 Name=U741 Touchstone Translation: OPA n1 n2 n3 0 0 M=GDC A=0 R1=RI R2=RI R3=RO R4=0 F=F T=0 Default SPICE Translation: .SUBCKT X$NAME 1 2 3 R_In1 1 0 Rin R_In2 2 0 Rin R_Out 4 3 Rout E_VCV 4 0 1 2 Gdc .ENDS X$NAME Warning: Crossover frequency is not modeled in SPICE. 65 Circuit Elements Parallel L-C resonator (PFC) There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax : PFC n1 n2 Frequency= C= [Ql=] [Qc=] [Name=] Parameters: C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: PFC 1 2 F=88 C=100 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. This code generates the same network as PLC. However, the frequency and capacitance are specified instead of the inductance and capacitance. This is useful for two reasons. First, networks with bandpass and bandstop structures are often illbehaved for optimization. As the L or C is changed to adjust the L/C ratio, the frequency is perturbed. The use of this resonator code can dramatically reduce optimization time in many networks, sometimes by as much as an order of magnitude. Secondly, this code is well suited to tuning or optimizing a response while leaving a transmission zero or peak at a desired frequency. 66 Parallel L-C resonator (PFL) Parallel L-C resonator (PFL) There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: PFL n1 n2 Frequency= L= [Ql=] [Qc=] [Name=] Parameters: L Inductance (nH). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: PFL 1 2 F=88 L=100 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. This code generates the same network as PLC. However, the frequency and inductance are specified instead of the inductance and capacitance. This is useful for two reasons. First, networks with bandpass and bandstop structures are often ill-behaved for optimization. As the L or C is changed to adjust the L/C ratio, the frequency is perturbed. The use of this resonator code can dramatically reduce optimization time in many networks, sometimes by as much as an order of magnitude. Secondly, this code is well suited to tuning or optimizing a response while leaving a transmission zero or peak at a desired frequency. 67 Circuit Elements Ideal Phase Shift (PHASE) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Note: n3 is normally grounded. Netlist syntax: PHASE n1 n2 n3 A= S= F= [Name=] Parameters: A Constant phase shift for 0F (degrees/octave) F Frequency for onset of slope (MHz) Examples: PHASE 1 2 0 A=45 S=45 F=5 Note: These elements can be cascaded to obtain arbitrary phase responses. Touchstone Translation: PHASE n1 n2 A= S= F= Default SPICE Translation: None 68 PIN Diode (PIN) PIN Diode (PIN) This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist syntax: PIN n1 n2 CP= LS= RS= CE= CJ= CD= CI= RJ= RI= [Name=] Parameters: (See image below for parameter illustrations) CP Package capacitance (pF) LS Series inductance (nH) RS Series resistance (ohms) CE Gap capacitance (pF) CJ Junction capacitance (pF). CD Diffusion Capacitance (pF). CI Intrinsic layer capacitance (pF). RJ Junction resistance (ohms). RI Intrinsic layer capacitance (pF). Examples: The first set of values CJ=0.17... correspond to a diode in the off state; the second to a diode in the on state. PIN 1 2 CP=0.3 LS=0.3 RS=0.3 CE=0.02 CJ=0.17 CD=0.01 CI=1E6 RJ=1E9 RI=0.01 PIN 1 2 CP=0.3 LS=0.3 RS=0.3 CE=0.02 CJ=10 CD=3 CI=0.25 RJ=0.1 RI=0.5 69 Circuit Elements Touchstone Translation: PIN n1 n2 Default SPICE Translation: None 70 PLC PLC Parallel inductor and capacitor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: PLC n1 n2 L= C= [Ql=] [Qc=] [Name=] Parameters: L Inductance (nH). C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: PLC 1 2 L=100 C=22 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 71 Circuit Elements PRC Parallel resistor capacitor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: PRC n1 n2 R= C= [Qc=] [Name=] Parameters: R Resistance (ohms). C Capacitance (pF). Qc Q of the capacitor (optional, defaults to 1 million). Example: PRC 1 2 R=50 C=22 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 72 PRL PRL Parallel resistor inductor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: PRL n1 n2 R= L= [Ql=] [Name=] Parameters: R Resistance (ohms). L Inductance (nH). Ql Q of the inductor (optional, defaults to 1 million). Example: PRL 1 2 R=50 L=100 Ql=35 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 73 Circuit Elements PRX Parallel resistor inductor capacitor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: PRX n1 n2 R= L= C= [Ql=] [Qc=] [Name=] Parameters: R Resistance (ohms). L Inductance (nH). C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: PRX 1 2 R=50 L=100 C=22 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 74 Distributed RC transmission line (RCLIN) Distributed RC transmission line (RCLIN) This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: RCLIN n1 n2 R= C= L= [Name=] Parameters: R Distributed resistance p.u.l (ohms/mm) C Distributed capacitance p.u.l. (pF/mm) L Length (mm) Examples: RCLIN 1 2 R=0.8 C=0.8 L=12.7 Touchstone Translation: RCLIN n1 n2 R= C= L= Default SPICE Translation: None 75 Circuit Elements Multiple Coupled Rods (slabline) (RCN) This symbol is available in =SCHEMAX= in the SLABLINE Toolbar. Netlist Syntax: RCNx n1 n2...n(x) Dia= S1= S2=...s(0.5x-1)= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Diameter of All Rods Diameter of rods (all are equal diameter). Sn Edge-to-edge separations (see figure below). Substrate Height Ground-to-ground spacing. This parameter is optional. Length Physical length of lines. Example: RCN8 1 2 3 4 5 6 7 8 W=200 S1=55 S2=65 S3=55 L=800 Range: See RCP The number of nodes is x. The edge-to-edge spacing between the far left and the next rod is s1. The spacing between the far right and the preceding rod is s(0.5x-1). This model is a significant convenience for analyzing combline, interdigital and other multiple coupled rod structures. The model is based on an exact wire-line equivalent of cascaded coupled pairs of rods. Touchstone Translation: None Default SPICE Translation: None 76 Coupled Slabline (RCP) Coupled Slabline (RCP) Two coupled round rods centered between flat ground planes. This symbol is available in =SCHEMAX= in the SLABLINE Toolbar. Netlist Syntax: RCP n1 n2 n3 n4 Diameter= Spacing= [H=] L= [Name=] Note: This model requires a substrate definition. Parameters: Diameter of Both Rods Diameter of rods (both are equal diameter). Edge-to-Edge Spacing Edge-to-edge rod separation. Substrate Height Ground-to-ground spacing. This parameter is optional. Length Physical length of lines. Example: RCP 1 0 2 0 D=200 S=300 H=500 L=1200 Range: 0.2 < D/H < 0.8 S/H > 0.1 The dimensional units and substrate characteristics must be defined in a previous SUB. The coupled slabline model is an Eagleware curve fit to accurate numerical solution data. Stracca, et. al., also provide analytical expressions but with errors up to 3%. Eagleware expessions are within 0.25% of the numeric data for D/H from 0.2 to 0.8 and S/H > 0.1. Touchstone Translation: None Default SPICE Translation: None 77 Circuit Elements Resistor (RES) Lumped resistance. This symbol is available in =SCHEMAX= in the LUMPED Toolbar. Netlist Syntax: RES n1 n2 R= [Name=] Parameters: Resistance (ohms) Specifies the value of the resistor in ohms. Examples: RES 1 2 R=22 RES 3 0 R=470 N=R1 Touchstone Translation: RES n1 n2 R= Default SPICE Translation: R1_NAME n1 n2 R 78 Rectangular Wire (RIBBON) Rectangular Wire (RIBBON) Conducting wire of rectangular cross section. This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: RIBBON n1 n2 W= T= L= RH=[Name=] Parameters: W Width of wire (mm). T Thickness of wire (mm). L Length of wire (mm). RH Resistivity of wire relative to copper. Examples: RIBBON 1 2 W=0.0394 T=0.00394 L=0.394 RH=1 Note: Resistance is d-c resistance or skin effect resistance depending upon which is larger. Touchstone Translation: RIBBON n1 n2 W= L= RHO=RH Default SPICE Translation: None 79 Circuit Elements Slabline (RLI) Round rod transmission line centered between flat ground planes. This symbol is available in =SCHEMAX= in the SLABLINE Toolbar. Netlist Syntax: RLI n1 n2 Diameter= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Rod Diameter Rod diameter. Substrate Height Ground-to-ground spacing. This parameter is optional and defaults to the value specified in the substrate. Length Physical length of line. Example: RLI 1 2 D=200 H=500 L=1200 The dimensional units and substrate characteristics must be defined in a previous SUB. Slabline is particularly well suited for applications where a high unloaded Q (low loss) is required. An approximate expression due to Frankel has been widely used since 1942, but this model is a curve fit to more accurate numerical solution data. The impedance is believed to be within a fraction of a percent of the precise value for D/H from 0.10 to 0.90. Touchstone Translation: None Default SPICE Translation: None 80 Stripline Bend (SBN) Stripline Bend (SBN) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SBN n1 n2 Width= Height= Angle= [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Angle Angle of bend in degrees (j in diagram below). Example: SBN 1 2 W=100 A=90 Range: 1.75 > Width/Height > 0.25 Arbitrary corner angles are supported. The substrate characteristics and dimensional units must be established in a previous SUB. The errors from measured data demonstrate excellent agreement and suggest a much wider useful parameter range for o bends of 90 or less. The model is a series L, shunt C, series L tee with added strip lines to simulate the added length of the path. Touchstone Translation: SBEND n1 n2 W= ANG= Default SPICE Translation: None 81 Circuit Elements Multiple Coupled Striplines (SCN) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SCNx n1 n2...n(x) Width= S1= S2=..S(0.5x-1)= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Width of All Strips Width of strips (all widths are equal). Sn Edge-to-edge separations (see figure below). Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Physical length of lines. Example: SCN8 1 2 3 4 5 6 7 8 W=100 S1=15 S2=25 S3=15 L=800 Range: See SCP The number of nodes is x. The spacing between the far left and the next line is s1. The spacing between the far right and the preceding line is s(0.5x-1). This model is a significant convenience for analyzing combline, interdigital and other multiple coupled line structures. The model is based on a wire-line equivalent of cascaded coupled pairs of stripline. Touchstone Translation: None Default SPICE Translation: None 82 Coupled striplines (SCP) Coupled striplines (SCP) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SCP n1 n2 n3 n4 Width= Spacing= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Width of Both Strips Width of strips (both are equal width). Edge-to-Edge Spacing Edge-to-edge separation of the striplines. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Physical length of lines. Example: SCP 1 0 2 0 W=100 S=15 L=800 Range: Width/Height > 0.35 (less restrictive for small metal thickness) 0.1 > metal thickness/Height The substrate characteristics and dimensional units must be established in a previous call to SUB. The model is identical to the model in =TLINE=. Touchstone Translation: SCLIN n1 n2 n3 n4 W= S= L= Default SPICE Translation: None 83 Circuit Elements Stripline Open End (SEN) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SEN n1 n2 Width= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: MEN 5 0 W=100 Range: 2.0 > Width/Height > 0.1 Node n2 is normally ground (node 0). The substrate characteristics and dimensional units must be established in a previous call to SUB. The errors from measured data demonstrate excellent agreement and suggest a much wider useful parameter range. Touchstone Translation: SLEF n1 W= L=0 Default SPICE Translation: None 84 SFC SFC Series L-C resonator. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SFC n1 n2 Frequency= C= [Ql=] [Qc=] [Name=] Parameters: C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: SFC 1 2 F=88 C=22 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. This code generates the same network as SLC. However, the frequency and capacitance are specified instead of the inductance and capacitance. This is useful for two reasons. First, networks with bandpass and bandstop structures are often illbehaved for optimization. As the L or C is changed to adjust the L/C ratio, the frequency is perturbed. The use of this resonator code can dramatically reduce optimization time in many networks, sometimes by as much as an order of magnitude. Secondly, this code is well suited to tuning or optimizing a response while leaving a transmission zero or peak at a desired frequency. 85 Circuit Elements SFL Series L-C resonator. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SFL n1 n2 Frequency= L= [Ql=] [Qc=] [Name=] Parameters: L Inductance (nH). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: SFL 1 2 F=88 L=100 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. This code generates the same network as SLC. However, the frequency and inductance are specified instead of the inductance and capacitance. This is useful for two reasons. First, networks with bandpass and bandstop structures are often ill-behaved for optimization. As the L or C is changed to adjust the L/C ratio, the frequency is perturbed. The use of this resonator code can dramatically reduce optimization time in many networks, sometimes by as much as an order of magnitude. Secondly, this code is well suited to tuning or optimizing a response while leaving a transmission zero or peak at a desired frequency. 86 Stripline gap (SGA) Stripline gap (SGA) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SGA n1 n2 Width= Gap= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Strip Width Width of strip. Gap Spacing between the ends of the strips. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: SGA 1 2 W=100 G=5 The substrate characteristics and dimensional units must be established in a previous call to SUB. Height is the thickness of the substrate (ground-to-ground spacing). Little data is given with respect to the parameter ranges, except that the model accuracy is suspect for high stripline impedance. The gap model is a shunt L, series C, shunt L pi. The model is based on Altschuler and Oliner. Touchstone Translation: None Default SPICE Translation: None 87 Circuit Elements Series inductor and capacitor network (SLC) There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SLC n1 n2 L= C= [Ql=] [Qc=] [Name=] Parameters: L Inductance (nH). C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: SRL 1 2 L=100 C=22 Ql=35 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 88 Stripline (SLI) Stripline (SLI) Single strip transmission line between ground planes. This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SLI n1 n2 Width= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Width Width of strip. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Length Physical length of line. Example: SLI 1 2 W=100 L=1800 Range: Width/Height > 0.35 (less restrictive for small metal thickness) 0.1 > metal thickness/Height The substrate characteristics and the dimensional units must be established in a previous call to SUB. Width is the width of the strip. Height is the thickness of the dielectric substrate (groundto-ground). Length is the physical length of the line. The model is identical to the =TLINE= model. Touchstone Translation: SLIN n1 n2 W= L= Default SPICE Translation: None 89 Circuit Elements SMTLP and MMTLP SMTLP: Single-mode transmission line. MMTLP: Multi-mode transmission lines. Both of these models require mode data created by =EMPOWER=. These symbols are available in =SCHEMAX= in the T-LINE Toolbar. Netlist Syntax: SMTLP n1 n2 Length= Filename= [Name=] MMTLPx n1 n2..n(x) Length= Filename= [Name=] Note: This model requires a substrate definition. Parameters: Length Length of line. File Name Full path and file name containing =EMPOWER= generated mode data. Example: MMTLP4 6 12 1 5 LENGTH=100 FILENAME=PART1.L2 Touchstone Translation: None Default SPICE Translation: None 90 S-parameters (SPA) S-parameters (SPA) There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax : SPA 1 2 0 Z= MAG11= ANG11= MAG21= ANG21= MAG12= ANG12= MAG22= ANG22= Parameters: Z Reference Impedance (Ohms). MAG11 S11 magnitude. ANG11 S11 phase (degrees). MAG21 S21 magnitude. ANG21 S21 phase (degrees). MAG12 S12 magnitude. ANG12 S12 phase (degrees). MAG22 S22 magnitude. ANG22 S22 phase (degrees). Example: SPA 1 2 0 Z=50 MAG11=.2 ANG11=15 MAG21=2 ANG21=90 MAG12=.15 ANG12=-45 MAG22=2 ANG22=90 91 Circuit Elements Spiral Inductor (SPIND) Planar spiral inductor without a ground plane. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: SPIND n1 n2 RI= W= S= N= T= RHO= [Name=] Parameters: (See figure below for parameter illustrations.) Inner Radius (RI) Inner radius, measured edge-to-edge of conductor (mm). Strip Width (W) Outer radius, measured edge-to-edge of conductor (mm). Strip Spacing (S) Spacing between conductors (mm). Number of Turns (N) Total number of turns. This does not have to be an integer. Conductor Thickness (T) Thickness of conductor. Resistivity (RHO) Resistivity of conductor relative to copper. Examples: SPIND 1 2 RI=20 W=5 S=5 N=1.6 T=1 RHO=1 Note: Resistance is based on d-c or skin effect depending upon which is larger. 92 Spiral Inductor (SPIND) Series R-L with inductance (self and mutual) determined by Remke and Burdick formulas. Resistance is d-c resistance or skin-effect resistance, whichever is greater. Touchstone Translation: None Default SPICE Translation: None 93 Circuit Elements SRC Series resistor and capacitor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SRC n1 n2 R= C= [Qc=] [Name=] Parameters: R Resistance (ohms). C Capacitance (pF). Qc Q of the capacitor (optional, defaults to 1 million). Example: SRC 1 2 R=50 L=22 Qc=600 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 94 SRL SRL Series resistor and inductor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SRL n1 n2 R= L= [Ql=] [Name=] Parameters: R Resistance (ohms). L Inductance (nH). Ql Q of the inductor (optional, defaults to 1 million). Example: SRL 1 2 R=50 L=100 Ql=35 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 95 Circuit Elements SRX Series resistor, inductor and capacitor network. There is no symbol for this element in =SCHEMAX=. To create it, you must change the model for another symbol. Netlist Syntax: SRX n1 n2 R= L= C= [Ql=] [Qc=] [Name=] Parameters: R Resistance (ohms). L Inductance (nH). C Capacitance (pF). Ql Q of the inductor (optional, defaults to 1 million). Qc Q of the capacitor (optional, defaults to 1 million). Example: SRX 1 2 R=50 L=100 C=50 Ql=35 Q is modeled as constant with frequency and may be specified higher or lower than the default value. 96 Stripline Step in Width (SSP) Stripline Step in Width (SSP) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Netlist Syntax: SSP n1 n2 NARrow= Wide= [Height=] [NAMe=] Note: This model requires a substrate definition. Parameters: Narrow Width Line width on the n1 side. Wide Width Line width on the n2 side. Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: SSP 1 3 NAR=100 W=300 NAM=STEP Range: 6.6 > Lwidth/Rwidth > 0.15 The substrate characteristics and dimensional units must be established in a previous SUB. NOTE: During optimization, =SuperStar= adjusts if the “narrow” values are greater than the “wide” values. The errors from measured data demonstrate excellent agreement and suggest a wider useful parameter range. The step model is a short stripline, series reactance, and a short negative-length stripline. Touchstone Translation: SSTEP n1 n2 W1= W2= Default SPICE Translation: None 97 Circuit Elements Stripline Tee Junction (STE) This symbol is available in =SCHEMAX= in the STRIPLINE Toolbar. Format: STE n1 n2 n3 WThru= WStub= [Height=] [Name=] Note: This model requires a substrate definition. Parameters: Thru Width Width of thru lines (at nodes 1 and 2). Stub Width Width of stub line (at node 3). Substrate Height Height of substrate. This parameter is optional. If omitted, the height declared in the substrate definition is used. Example: STE 1 2 3 WT=100 WS=200 Range: 10 > WThru / Height > 0.1 WStub < 10 * WThru. STE includes phase shift effects as well as junction discontinuity effects. Touchstone Translation: STEE n1 n2 n3 W1= W2=W1 W3= Default SPICE Translation: None 98 Thin film capacitor (TFC) Thin film capacitor (TFC) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: TFC n1 n2 W= L= T= ER= RHO= TAND= [Name=] Parameters: W Width (mm) L Length (mm) T Thickness of dielectric film (mm) ER Relative dielectric constant of dielectric film (dimensionless) RHO Resistivity relative to copper (dimensionless) TAND Dielectric loss tangent of dielectric film (dimensionless) Examples: TFC 1 2 W=10 L=10 T=0.04 ER=2 RHO=1 TAND=0.0001 Touchstone Translation: TFC n1 n2 W= L= T= ER= RHO= TAND= Default SPICE Translation: None 99 Circuit Elements Thin Film Resistor (TFR) Thin film resistor on dielectric above ground plane. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: TFR n1 n2 W= L= RS=[Name=] Note: This model requires a substrate definition. Parameters: W Width of line L Length of line RS Surface resistivity (ohms/square) Examples: TFR 1 2 W=25 L=100 RS=100 Note: Model makes use of microstrip distributed inductance and capacitance and series resistance per unit length based on RS. Touchstone Translation: TFR n1 n2 W= L= RS= F=0 Default SPICE Translation: None 100 3-Port Data File (THR) 3-Port Data File (THR) Creates a three-port by reading data from a disk file. This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist Syntax: THR n1 n2 n3 n4 Filename= [Name=] Parameters: FILENAME Full path and filename containing data. Example: THR 1 2 3 0 F=OPAMP.S3P The data is stored in standard sequential ASCII files. The format for S-Parameter data is: The data can be all on one line, or, for readability, can be broken into multiple lines as shown above. The frequency of data stored in the data file need not match the frequencies of a run. =SuperStar= will interpolate or extrapolate the data to obtain the parameters at the run frequencies. See the Device Data chapter for more details. Touchstone Translation: S3PA n1 n2 n3 filename Note: Node n4 must be ground Default SPICE Translation: None 101 Circuit Elements Transmission line (TLE) Transmission line described with electrical parameters and optional loss. This symbol is available in =SCHEMAX= in the TLINE Toolbar. Netlist Syntax: TLE n1 n2 Zo= Length= Frequency= [Attenuation=] [Name=] Parameters: Zo Characteristic impedance in ohms. Electrical Length Electrical length at specified frequency in degrees. Frequency for length and loss Frequency for length and loss in MHz. Actual Loss at Freq Actual loss in dB at the specified frequency. This parameter is optional. Example: TLE 1 2 Z=50 L=90 F=1200 The model for loss is proportional to the square root of the frequency. For example, if.24 dB of loss is specified at 1200 1/2 MHz, the loss will be.24 dB (.34 dB) at 2400 MHz. The default value of loss is 0 dB. Zo is the characteristic impedance, in ohms, of the transmission line. Touchstone Translation: TLIN n1 n2 Z= E= F= Default SPICE Translation: T_TLE1 n1 0 n2 0 Z0= F= NL= 102 Four Terminal Transmission Line (TLE4) Four Terminal Transmission Line (TLE4) Four terminal transmission line described with electrical parameters and optional loss. This symbol is available in =SCHEMAX= in the T-LINE Toolbar. Netlist Syntax: TLE4 n1 n2 n3 n4 Zo= Length= Frequency= [Attenuation=] [Name=] Parameters: Zo Characteristic impedance in ohms. Electrical Length Electrical length at specified frequency in degrees. Frequency for length and loss Frequency for length and loss in MHz. Actual Loss at Freq Actual loss in dB at the specified frequency. This parameter is optional. Example: TLE4 1 2 3 0 Z=50 L=90 F=1200 The model for loss is proportional to the square root of the frequency. For example, if.24 dB of loss is specified at 1200 1/2 MHz, the loss will be.24 dB (.34 dB) at 2400 MHz. The default value of loss is 0 dB. Touchstone Translation: TLIN4 n1 n2 n3 n4 Z= E= F= Default SPICE Translation: T_TLE1 n1 n2 n3 n4 Z0= F= NL= 103 Circuit Elements Transmission Line (TLP) Transmission line described with physical parameters and optional loss. This symbol is available in =SCHEMAX= in the TLINE Toolbar. Netlist Syntax: TLP n1 n2 Zo= Length= Keff= [Attenuation= Frequency=] [Name=] Parameters: Zo Characteristic impedance in ohms. Physical Length Physical length in millimeters. Keff Effective dielectric constant. Actual loss at Freq Loss in dB/meter at the specified frequency. This parameter is optional. Frequency for Loss Frequency for loss in MHz. This parameter is optional. Example: TLP 1 2 Z=75 L=200 K=2.2 If the optional loss is specified, the frequency in megahertz for that loss must be specified. The model for loss is proportional to the square root of the frequency. The default value of loss is 0 dB. Touchstone Translation: TLINP n1 n2 Z= L= K= A= F= Default SPICE Translation: T_TLP1 n1 0 n2 0 Z0= TD= 104 Four Terminal Transmission Line (TLP4) Four Terminal Transmission Line (TLP4) Four-terminal transmission line described with physical parameters and optional loss. This symbol is available in =SCHEMAX= in the T-LINE Toolbar. Netlist Syntax: TLP4 n1 n2 n3 n4 Zo= Length= Keff= [Attenuation= Frequency=] [Name=] Parameters: Zo Characteristic impedance in ohms. Physical Length Physical length in millimeters. Keff Effective dielectric constant. Actual loss at Freq Loss in dB/meter at the specified frequency. This parameter is optional. Frequency for Loss Frequency for loss in MHz. This parameter is optional. Example: TLP4 1 2 3 0 Z=75 L=200 K=2.2 If the optional loss is specified, the frequency in megahertz for that loss must be specified. The model for loss is proportional to the square root of the frequency. The default value of loss is 0 dB. Touchstone Translation: TLINP4 n1 n2 n3 n4 Z= L= K= A= F= Default SPICE Translation: T_TLP1 n1 n2 n3 n4 Z0= TD= 105 Circuit Elements Distortionless TEM Transmission Line (TLRLDC) Distortionless TEM transmission line. This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: TLRLDC n1 n2 R= L= C= LEN= [Name=] Parameters: R Resistance p.u.l. (ohms/mm) L Inductance p.u.l (nH/mm) C Capacitance p.u.l (pF/mm) LEN Length (mm) Examples: TLRLDC 1 2 R=0.05 L=0.005 C=0.002 LEN=50 Note: Shunt conductance p.u.l is calculated automatically so that R/L=G/C. Touchstone Translation: None Default SPICE Translation: None 106 Uniform TEM Transmission Line (TLRLGC) Uniform TEM Transmission Line (TLRLGC) This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: TLRLGC n1 n2 R= L= G= C= LEN= [Name=] Parameters: R Series resistance p.u.l. (ohms/mm) L Series inductance p.u.l. (nH/mm) G Shunt conductance p.u.l. (Siemen/mm) C Shunt capacitance p.u.l (pF/mm) Examples: TLRLGC 1 2 R=0.05 L=0.005 G=1.88E-8 C=0.002 LEN=50 Touchstone Translation: None Default SPICE Translation: None 107 Circuit Elements Exponential TEM Transmission Line (TLX) This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: TLX n1 n2 R1= R2= L= K= RPUL GPUL [Name=] Parameters: 1/2 R1 Resistance, (L/C) at n1 end (ohms) 1/2 R2 Resistance, (L/C) at n2 end (ohms) L Length (mm) K Effective dielectric constant (dimensionless) RPUL Series resistance p.u.l. (ohms/mm) GPUL Shunt conductance p.u.l. (Siemen/mm) Examples: TLX 1 2 R1=50 R2=200 L=12.7 K=1 RPUL=0 GPUL=0 Note: The exponential taper is calculated automatically using the values of R1 and R2. Touchstone Translation: None Default SPICE Translation: None 108 Toroidal Core Inductor (TORIND) Toroidal Core Inductor (TORIND) This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: TORIND n1 n2 N= AL= RS= QC= FQ= [Name=] Parameters: (See figure below for a model illustration.) N Number of turns (dimensionless). AL Inductance index used to calculate inductance from number of turns (supplied by manufacturer). RS Total winding resistance (ohms). QC Core quality factor (dimensionless). FQ Reference frequency of QC (MHz). Examples: TORIND 1 2 N=10 AL=10 RS=5 QC=100 FQ=50 Touchstone Translation: CIND2 n1 n2 N= AL= R=RS Q=QC F=FQ Default SPICE Translation: None 109 Circuit Elements Ideal Transformer (TRF) This symbol is available in =SCHEMAX= in the LUMPED Toolbar. Netlist Syntax: TRF n1 n2 n3 n4 Option={TR|IM} Primary= [Secondary=] [Condition=] [Name=] Parameters: Primary # turns on primary (TR) or primary impedance (IM). Secondary # turns on secondary (TR) or sec. impedance (IM). This parameter is optional, and defaults to 1 if not specified. Conditioning Factor Conditioning factor. Certain networks using TRF may require a conditioning factor (typically 0.001 to.1) to avoid math errors. This parameter is optional. TR: Turns Ratio specify a turns ratio. IM: Impedance Ratio specify an impedance ratio. Example: TRF 1 2 0 0 Option=IM P=200 S=50 The turns and impedance are relative. For example, 200 and 50 will have the same result as 4 and 1. If an inverting transformer is desired, primary is negative. An ideal tranformer can illcondition the matrix GENESYS must solve. To fix this problem, some networks using TRF may require a conditioning factor. Touchstone Translation: XFER n1 n2 n3 n4 N= Default SPICE Translation: None 110 Tapped Transformer (TRFCT) Tapped Transformer (TRFCT) Ideal transformer with a center tapped secondary. This symbol is available in =SCHEMAX= in the LUMPED toolbar. Netlist syntax: TRFCT n1 n2 n3 n4 n5 P= S1= S2= [Name=] Parameters: P Number of primary turns(dimensionless). S1 Number of secondary turns for one section (dimensionless). S2 Number of secondary turns for other section (dimensionless). Examples: TRFCT 1 2 0 3 0 P=1 S1=2 S2=2 Note: P, S1, and S2 are used to obtain turns ratios. The absolute values are immaterial. The ratio is all that matters. Touchstone Translation: None Default SPICE Translation: None 111 Circuit Elements Ruthroff transformer (TRFRUTH) Ruthroff transformer modeled as a transmission line (TLE4) with shunt inductance. This symbol is available in =SCHEMAX= in the T-LINE toolbar. Netlist Syntax : TRFRUTH n1 n2 n3 N= AL= Z= L= F=[Name=] Parameters: Number of Turns Total number of turns (dimensionless). Inductance Index Inductance index (nH/turn/turn). This number is used to calculate the equivalent shunt inductance. Transmission Line Zo (Ohms) Characteristic impedance of the transmission line in ohms. Electrical Line Length Electrical length of the transmission line at the specified frequency, in degrees. Frequency for Electrical Length Frequency for the given electrical length, in MHz. Example: TRFRUTH 1 2 3 N=1 AL=1 Z=2 L=45 F=1000 This is an ideal model based on the paper by Ruthroff. The shunt inductance is given by: 2 L = N *AL. Touchstone Translation: XFERRUTH N=N AL=AL Z=Z E=L F=F SPICE Translation: None 112 2-Port Data File (TWO) 2-Port Data File (TWO) Creates a two-port by reading data from a disk file. This symbol is available in =SCHEMAX= in the LUMPED Toolbar and in the DEVICE Toolbar. Netlist Syntax: TWO n1 n2 n3 Filename= [Name=] Parameters: FILENAME Full path and filename containing data. Example: TWO 1 2 0 F=MRF901.615 N=Q1 The data is stored in standard sequential ASCII files. One line of data is a set of data for one frequency. The data is stored in standard sequential ASCII files. One line of data is a set of data for one frequency. In an S-Parameter file, a typical line might be 500 .64 -23 12.5 98 .03 70 .8 -37 In an S-Parameter file, a typical line might be 500 .64 -23 12.5 98.03 70.8 -37 In this case, 500 is the frequency in megahertz. The magnitudes of S11, S21, S12 and S22 are.64, 12.5,.03 and.8, and the phases -23, 98, 70 and -37 degrees, respectively. 113 Circuit Elements The frequency of data stored in the data file need not match the frequencies of a run. =SuperStar= will interpolate or extrapolate the data to obtain the parameters at the run frequencies. See the Device Data chapter for more details. Touchstone Translation: S2PA n1 n2 n3 filename Default SPICE Translation: None 114 Voltage Controlled Current Source (VCC) Voltage Controlled Current Source (VCC) This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist Syntax: VCC n1 n2 n3 RIn= ROut= Transconductance= [Name=] Parameters: Input Resistance Input resistance in ohms. Output Resistance Output resistance in ohms. Transconductance Transconductance in mhos. Example: VCC 1 3 0 RI=50 RO=1000 T=1 Range: RIn and ROut > 0. Touchstone Translation: VCCS n1 n2 n3 n3 M=T A=0 R1=RIN R2=ROUT F=0 T=0 Default SPICE Translation: .SUBCKT X$NAME 1 2 3 R_In 3 1 Rin R_Out 3 2 Rout G_Gm 3 2 1 3 Gm .ENDS X$NAME 115 Circuit Elements Voltage Controlled Voltage Source (VCV) This symbol is available in =SCHEMAX= in the DEVICE Toolbar. Netlist syntax: VCV n1 n2 n3 RIN= ROUT= MU= [Name=] Parameters: RIN Input resistance (ohms) ROUT Output resistance (ohms) MU Voltage gain (dimensionless) Examples: VCV 1 2 0 RIN=1E6 ROUT=1E-6 MU=1 Touchstone Translation: VCVS n1 n2 n3 n3 M=MU A=0 R1=RIN R2=ROUT F=0 T=0 Default SPICE Translation: None 116 Waveguide-to-TEM Adapter (WAD) Waveguide-to-TEM Adapter (WAD) Rectangular waveguide-to-TEM adapter. This symbol is available in =SCHEMAX= in the WAVE Toolbar. Netlist Syntax: WAD n1 n2 Width= [Height=] Zo= [Name=] Note: This model requires a substrate definition. Parameters: Guide Width Width of waveguide (A). Guide Height Height of waveguide (B). This parameter is optional. TEM Impedance Characteristic impedance of the TEM mode side (coaxial, etc.) of the adapter. Example: WAD 1 2 W=100 H=50 Zo=50 The dimensional units must be established by a SUB call anytime before WAD. Waveguide impedance is frequency dependent. Waveguide-toTEM adapters transform frequency dependent waveguide to constant impedance TEM mode. The WAD code ideally models this transformation. The model is based on Marcuvitz. The guide impedance is the frequency dependent wave impedance of the TE10 mode in rectangular guide. The electrical length is zero. Touchstone Translation: None Default SPICE Translation: None 117 Circuit Elements Length of Conducting Wire (WIRE) Physical length of conducting wire. This symbol is available in =SCHEMAX= in the TLINE toolbar. Netlist syntax: WIRE n1 n2 D= L= RH=[Name=] Parameters: D Diameter of wire (mm) L Length of wire (mm) RH Resistivity relative to copper Examples: WIRE 1 2 D=0.0254 L=0.254 RH=1 Touchstone Translation: WIRE n1 n2 D= L= RHO=RH Default SPICE Translation: None 118 Rectangular Waveguide Line (WLI) Rectangular Waveguide Line (WLI) This symbol is available in =SCHEMAX= in the WAVE Toolbar. Netlist Syntax: WLI n1 n2 Width= [Height=] Length= [Name=] Note: This model requires a substrate definition. Parameters: Guide Width Width of line (A). Guide Height Height of line (B). This parameter is optional. Guide Length Length of line. Example: WLI 1 2 A=100 B=50 L=800 Range: TE10 mode assumed The dimensional units be established by a SUB call prior to WLI. The model is based on Marcuvitz. The characteristic impedance is the wave impedance of the TE10 mode and is dispersive. The electrical length is also frequency dependent. The transmission amplitude, but not transmission phase, is also modeled below cutoff. Touchstone Translation: RWG n1 n2 A= B= L= ER= RHO= Default SPICE Translation: None 119 Circuit Elements Piezoelectric resonator (XTL) This symbol is available in =SCHEMAX= in the LUMPED Toolbar. Netlist Syntax: XTL n1 n2 Rs= Lm= CM= CO= [Name=] Parameters: Series Resistance Series resistance in ohms. Motional Inductance Motional inductance in nanohenries. Motional Capacitance Motional Capacitance in picofarads. Parallel Capacitance Parallel Capacitance in picofarads. Example: XTL 1 2 Rs=26 Lm=4.97e6 Cm=.012741 Co=4.18 Touchstone Translation: SRLC n1 n2 R=Rs L=Lm C=Cm CAP n1 n2 C=Co Default SPICE Translation: .SUBCKT X$NAME 1 2 R_series 1 3 Rs L_motion 3 4 Lm nH C_motion 4 2 Cm pF C_parall 1 2 Co pF .ENDS X$NAME 120 Chapter 2: Measurements Overview GENESYS supports a rich set of output parameters. All parameters can be used for any purpose, including graphing, tabular display, optimization, yield, and post-processing. Linear Measurements The following table shows the available Measurements. Where i and j are shown in the chart, port numbers can be used to specify a port. Some parameters (such as Ai) use only one port, e.g., A1 or VSWR2. Or, on a tabular output, the ports can be omitted (ie, S or Y), and measurements for all ports will be given. Note: The chapter in this manual on S Parameters contains detailed information about many of these parameters. Meas. Description Default Operator Shown on Smith Chart Sij S Parameters DBANG Sij Hij H Parameters* RECT -- Yij Y Parameters RECT -- Zij Z Parameters RECT -- Ii Impedance at port i with network terminations in place RECT Sii Ai Admittance at port i with network terminations in place RECT Sii VSWRi VSWR at port i Linear (real) Sii Eij Voltage gain from port i to port j with network terminations in place. DBANG -- Nij Noise correlation matrix parameters RECT -- GMAX Maximum available gain* dB (real) -- NF Noise figure* dB (real) -- NMEAS Noise measure* Linear (real) -- NFT Effective noise input temperature* Linear (real) -- GOPT Optimal gamma for noise* DBANG GOPT Measurements Meas. Description Default Operator Shown on Smith Chart YOPT Optimal admittance for noise* RECT GOPT ZOPT Optimal impedance for noise* RECT GOPT RN Normalized noise resistance* Linear (real) -- NFMIN Minimum noise figure* dB (real) -- ZMi Simultaneous match impedance at port i* RECT GMi YMi Simultaneous match admittance at port i* RECT GMi GMi Simultaneous match gamma at port i* DBANG GMi K Stability factor* Linear (real) B1 Stability measure* Linear (real) SB1 Input plane stability circle* None (Circle) SB1 Circles None (Circle) SB2 Circles Note: Filled areas are unstable regions. SB2 Output plane stability circle* Note: Filled areas are unstable regions. NCI Constant noise circles* (shown at .25, .5, 1, 1.5, 2, 2.5, 3, and 6 dB less than optimal noise figure) None (Circle) NCI Circles GA Available gain circles** None (Circle) GA Circles GP Power gain circles** None (Circle) GP Circles GU1 Unilateral gain circles at port 1** None (Circle) GU1 Circles GU2 Unilateral gain circles at port 2** None (Circle) GU2 Circles *Can only be used on 2-port networks **Gain circles are only available for 2-port networks. Circles are shown at 0, 1, 2, 3, 4, 5, and 6 dB less than optimal gain. In GA and GP, if K<1, then the 0dB circle is at GMAX, and the inside of this circle is shaded as an unstable region. Note: On a graph or in optimization, measurements which use DBMAG by default show the dB part, measurements which use MAGANG show the magnitude, and measurements which use RECT show the real part. 122 Operators Operators Measurements are combined with operators to change the data format. The general format for combining operators with measurements is: operator[measurement] or operator(measurement) where operator is one of the operators listed in the table below and measurement is one of the measurements listed in the table in the previous section. All measurements have default operators. For instance, on a table, using S21 will display in dB/angle form and Z32 will display in rectangular (real & complex) form. Likewise, on a graph, S21 graphs in dB, while Z32 graphs the real part of Z32. Note: To avoid confusion, measurements used in equations for post-processing must specify an operator. Operator Description Meas. must be Result Is MAGANG[] Linear magnitude and angle in range -180 to 180 Complex Complex* MAGANG360[] Linear magnitude and angle in range 0 to 360 Complex Complex* DBANG[] dB magnitude and angle in range -180 to 180 Complex** Complex* DBANG360[] Linear magnitude and angle in range 0 to 360 Complex** Complex* RECT[] Rectangular (real + imag) Complex Complex MAG[] Linear magnitude Real/Complex Real ANG[] Angle in range -180 to 180 Complex Real ANG360[] Angle in range 0 to 360 Complex Real RE[] Real part of complex measurement Complex Real IM[] Imaginary part of complex measurement Complex Real DB[] dB Magnitude Real/Complex** Real GD[] Group delay Complex Real QL[] Loaded Q Complex Real 123 Measurements *For post-processing equation purposes, the magnitude is in the real part of the result, and the angle is in the complex part of the result. **Only the following parameters can be displayed in dB form: S, GM, E, GOPT, GMAX, NF, NFMIN, and NMEAS. Note that not all operators can be used with all measurements. The "Measurement must be" column above indicates which type of parameter each operator can use. For example, ANG[] (Angle) cannot be used with a real-valued parameter, such as GMAX, so ANG[GMAX] is not allowed. Sample Measurements Meas. Result in graph, Smith chart, optimization, or yield Result on table S22 dB Magnitude of S22 dB Magnitude plus angle of S22 QL[S21] Loaded Q of S21 Loaded Q of S21 MAG[S21] Linear Magnitude of S21 Linear Magnitude of S21 IM[I1] Input reactance at port 1. On a Smith chart, S11 will be displayed, while IM[I1] will be used for the marker readouts. Input reactance at port 1 S --- Shows dB Magnitude plus angle of all S Parameters RECT[S] --- Shows real/imaginary parts of all S Parameters SB1 On Smith or polar chart, shows input plane stability circles Displays center, radius, and stability parameter of input plane stability circles NCI On Smith or polar chart, shows constant noise circles Displays center, and radius of all noise circles (27 numbers per frequency) Using Non-Default Simulation/Data In all dialog boxes which allow entry of measurements, there is a "Default Simulation/Data or Equations" combo box. Any measurement can override this default. The format to override the network is: simulation.design.operator[measurement] where simulation is the name of the Simulation/Data from the Workspace Window, design is the name of the design to use, and operator[measurement] are as described in previous sections. An override is most useful for putting parameters from different networks on the same graph. 124 Using Equation Results (post-processing) Additionally, the workspace can be overridden by using the following format: workspace.simulation.design.operator[measurement] where workspace is the short name of the workspace as given in the Workspace Window. This allows direct comparison of results from different workspaces. Some examples of overrides are: Measurement Meaning Linear1.Filter.DB[S21] Show the dB magnitude of S21 from the Linear1 simulation of the Filter design EM1.Layout1.S11 Show the dB magnitude of S11 from the =EMPOWER= analysis of Layout1 Filter.QL[S21] Shows the loaded Q of the Filter design using the current simulation. Note that the simulation was not overriden, only the network. DB[Linear1.Filter.S21] (wrong) ILLEGAL. The operator must go around the measurement, not the override. Equations.X Shows the global equation variable X, which must contain post-processed results. TUNEBP.Linear1.Filter. DB[S21] Overrides the workspace. Shows the dB magnitude of S21 from the Linear1 simulation of the Filter design from workspace TUNEBP. Data1.A Show all input admittances from a "Link to data file". Note that in this case, the design name is not required. Using Equation Results (post-processing) Anywhere that a measurement is used, post-processed equation variables can be used. The format is: EQUATIONS.variableName where variableName is a variable from the Global equations for that workspace. For example: EQUATIONS.X uses variable X from the global equations. A workspace override can also be used with equations: TUNEBP.EQUATIONS.Y shows variable Y from the global equations of workspace TUNEBP. 125 Chapter 3: Equations Statements Each line in the EQUATIONS window must be in one of 5 formats: assignment, REF, comment, IF, THEN, GOTO, FUNCTION, RETURN, or BASE. The formats are described below. Assignment The assignment line assigns a value to a variable. The assignment statement calculates the value of the expression and then gives the value to the specified variable. Variables are not case sensitive (for example, VAR and var are the same). Accuracy is IEEE double precision (about twelve digits). The format is: Variablename = Expression Examples: X=2 R=4*3/2^4*(9+8) Voltage=(2+R)*Current Assignments can define a value to be a variable, which allows that variable to be tuned, optimized, or included in the Monte Carlo analysis. All variable names must start with an alpha character. The rest of the name may contain letters, numbers and the underscore ("_") character. The tune statement format is: VariableName = ?Value Examples X=?2 Large_R=?3.54e+16 The tune statement must be a single assignment, not an expression. Therefore, the following statement is illegal X=?2+2 (WRONG!) Equations REF This statement creates a reference to an expression. expression must be a simple variable, array element, or post-processed data. This can make your equations faster and easier to write. The format of the reference statement is: REF Variable = expression Example: B=5 REF A=B 'A now points to B C=A+A 'C now equals 10 A=C 'B (and, indirectly, A) now equals 10 D=VECTOR(20) REF A=D[C] 'A points to D[10] A=3.14 'D[10] now equals 3.14. Comment A line is considered a comment if the first character in the line is an apostrophe ('). Any part of a line can be a comment and everything after the apostrophe is ignored. The comment line format is: 'Comment Example 'This line will be ignored. LABEL The label statement identifies a section of the EQUATIONS window for use in GOTO or IF THEN GOTO statements. After the GOTO is executed, the statement following LABEL is the next statement executed. If LABEL is the last statement in the window, the equations end after the GOTO. The format is: LABEL Labelname GOTO This statement causes the EQUATION interpreter to jump in its calculations to the statement following the corresponding LABEL statement. The format of the GOTO statement is: GOTO Labelname 128 Statements IF This statement is perhaps the most powerful one included in GENESYS. This statement causes the following steps to occur. 1. The value of the expression is calculated. Any true comparison results in a value of -1. For example, the expression 1>0 gives a value of -1, while the expression 0>1 gives a value of zero. 2. The value obtained in step one is compared to zero. If the value is not zero, then the interpreter performs the statement specified. The format of the IF statement is: IF expression THEN statement Example: IF Q>1000 THEN GOTO HIGHQ RVal = 100 GOTO DONE LABEL HIGHQ RVal = 500 LABEL DONE Warning: You cannot use IF/THEN with postprocessed variables. Use the IFF and IFTRUE functions instead. Since GENESYS uses approximate calculations (as any computer program must), round-off errors are inevitable. This could cause a problem if you are using equality checks. If this is the case, change IF value = 5 THEN GOTO LABEL to IF ABS(value-5)<0.00001 THEN GOTO LABEL or something similar. If you are using relational operators such as greater than (>) or less than (<), this point does not need to be considered. FUNCTION This statement is used to define functions. Functions take zero or more parameters as input and return exactly one value as output. All variables used within a function are local; that is, 129 Equations variables cannot be shared across functions or with the main equate block. See User Functions for detailed information on this statement. The format of a FUNCTION statement is: FUNCTION name(parm1,parm2...) equations RETURN expression An example function to calculate the inductance that resonates with a capacitor at a given frequency: FUNCTION RESL(C,F) 'L is in nH, C is in pF, F is in MHz FHz=1e6*F CFarads=1e-12*C Omega=2*PI*FHz LHenries=1/(Omega*Omega*CFarads) Return LHenries*1e9 RETURN This statement returns a value from a function and exits the function. Note that this statement does not mark the end the function declaration, and a function with IF/THEN statements can have more than one RETURN statement. The format of the return statement is: RETURN expression BASE This statement defines the beginning index of arrays. The default base is 1, meaning that the first data point in an array is accessed using the number 1. The statement can appear more than once in an EQUATIONS window. A new base statement changes the beginning index of all arrays, whether they were defined before or after the base statement. The form of the statement is: BASE 0 or BASE 1 130 Viewing Variable Values Viewing Variable Values Values calculated in the EQUATE block may be viewed to verify that the equations yield expected results. Right-click on Data Outputs in the Workspace Window and select "Add Variable Viewer". Operators Operator descriptions in precedence order are: Operator Meaning [] Array Index Comments ^ Exponentiation * Multiplication / Division \ Integer Division The quotient is truncated to an integer result. For example, 10\3 is 3 and 3\4 is zero. % Modulo The numbers are divided, and the remainder is returned. For example, 10%3 is 1 and 7.6%2 is 1.6. + Addition - Subtraction = Equality Check > Greater Than < Less Than >=, => Greater Than or Equal <=, =< Less Than or Equal ! Not & And | Or Raises a number to a power. For example, 2^3 is 8, and 3^2 is 9 Left and right values are compared. If the results are equal, the value is 1 (true); otherwise, the value is zero (false). For example, 1+1=2 gives 1 and 1+1=3 gives zero. This symbol is also referred to as "pipes". It is normally located on the back-slash (\) key using Shift. 131 Equations Operator Meaning Comments @ Exclusive Or The result is true if one of the values is true, but not both. "1=3 @ 5=4" is false, and "1=1 @ 5=4" is true. # Equivalence The result is true if both values are true or both values are false. "1=3 # 5=4" is true, and "1=1 # 5=4" is false. $ Implication The result is always true unless the first value is true AND the second value is false. "1=3 $ 1=1", "1=3 $ 1=2", and "1=1 $ 2=2" are all true, while "1=1 $ 2=1" is false. Sample Expressions Expression Value 1+2*3 7 (1+2)*3 9 4^3 64 3*4^3 192 19/4 4.75 19\4 4 19$4 3 1+19%2*2^2 5 5>4 1 (True) 5<4 0 (False) 2*4>1+3 & 4*4<17^2 1 (True) 2*4>1+3 @ 4*4<17^2 0 (False) SIN(180)<.5 1 (True) Built-in Functions CAUTION: Standard trigonometric functions must have an argument in degrees, and inverse standard functions return values in degrees. Hyperbolic trigonometric functions use pure numbers (not degrees). ABS(expression) - absolute value of expression. For complex values, returns magnitude. Alternate form: MAG(expression) ANG(expression) - phase of a complex number, returns between -180 and 180 degrees. 132 Built-in Functions ANG360(expression) - phase of a complex number, returns between 0 and 360 degrees. -1 ARCCOS(expression) - inverse cosine (cos ). Range: Argument must be between -1 and +1. ARCCOSH(expression) - inverse hyperbolic cosine -1 ARCSIN(expression) - inverse sine (sin ). Range: Argument must be between -1 and +1. ARCSINH(expression) - inverse hyperbolic sine -1 ARCTAN(expression) - inverse tangent (tan ). Alternate form: ATN(expression) ARCTANH(expression) - inverse hyperbolic tangent BESSELJ0(expression) - Calculates Bessel function J0 of expression. COMPLEX(real,imag) - returns a complex number real + j imag COS(expression) - cosine COSH(expression) - hyperbolic cosine COUNT(expression) - returns the number of data points contained in post-processed data, or the size of an array. See Arrays or Post Processing later in the equations reference. DB10(expression) - returns 10*log(|expression|) DB20(expression) - returns 20*log(|expression|) EXP(expression) - value of "e" raised to expression FIX(expression) - truncates the expression. Examples: FIX(5.6) is 5 and FIX(-1.4) is -1 FN_E(expression) - Calculates the complete elliptic integral of the second kind. FN_K(expression) - Calculates the complete elliptic integral of the first kind. GET(string) - Gets a measurement from a string variable. Can be useful for constructing a measurement from pieces of text. See Post Processing later in the equations reference. GETINDEPVALUE(expression,index,dim) - returns the independent data point for dimension dim of a post-processed expression. See Post Processing later in the equations reference. 133 Equations Note: If the independent data is frequency, GETINDEPVALUE returns the values in Hz (not MHz). GETVALUE(expression,index) - calculates and returns a value of a post-processed expression. See Post Processing later in the equations reference. GETVALUEAT(expression,indep) - calculates and returns a value of a post-processed expression at a given independent value. Only works on 2 dimensional data (X vs.Y). See Post Processing later in the equations reference. Note: If the independent data is frequency, GETINDEPAT requires values in Hz (not MHz). IFF(condition,trueValue,falseValue) - returns trueValue if condition is true, and falseValue if condition is false. Can be used with any data, including post-processed data. IFTRUE(condition,trueValue) - returns trueValue if condition is true, and zero if condition is false. Can be used with any data, including post-processed data. IMAG(expression) - returns the imaginary part of a complex number. Alternate form: IM(expression) INT(expression) - greatest integer less than or equal to the expression Examples: INT(5.6) is 5 and INT(-1.4) is -2 LOG(expression) - base 10 logarithm LN(expression) - natural logarithm MATRIX(rows, columns) - Returns a 2-dimensional array of size rows x columns. See Arrays later in the equations reference. MIN(expression) - Finds the minimum value of a postprocessed expression. MAX(expression) - Finds the maximum value of a postprocessed expression. REAL(expression) - returns the real part of a complex number. Alternate form: RE(expression) RND - returns a pseudo-random number between zero and one SIN(expression) - sine of the argument 134 Constants SINH(expression) - hyperbolic sine SQR(expression) - square root TAN(expression) - tangent. Range: Argument must not be ±90, ±3*90, etc. TANH(expression) - hyperbolic tangent. Range: Same as TAN(expression) VECTOR(expression) - returns a vector (array) of size expression. See Arrays later in the equations reference. Constants Name Value PI p, 3.14159265 _EPS0 8.854e-12 _ETA0 376.7343 _MU0 1.256637e-6 _VAIR c, 2.997925e8 _LN2 ln(2), 0.6931471805599 _EXP1 e, 2.718281828459 _RTOD Radians to degrees multiplier, 180/pi _DTOR Degrees to radians multiplier, pi/180 Strings String variables can be used in the equate block: A="ABC" B="DEF" C=A+B After this code, C="ABCDEF". Concatenation (+) is the only operator currently defined for string variables, all other operations give undefined results. If you create a model and want it to take a string variable as a parameter, put a ~ (tilde) in front of the parameter name in the Model Properties dialog box to indicate that it is a string. Furthermore, if the parameter starts with the word or is the word "~FILENAME", a browse button will be given to the user in the schematic part dialog box. 135 Equations Arrays (Vectors and Matrices) GENESYS allows you to create vectors and matrices in the equate block. Each element in a vector or matrix can hold any type of data: real, complex, string, swept, or even a nested array. There are two functions which you can use to create arrays in your equations: VECTOR(x) - returns a vector (1-dimensional array) of x real zeros. Elements are accessed using square brackets and are base one (numbering starts at one) by default: A = VECTOR(3) A[1] = 1 A[2] = 5 A[3] = A[1] + A[2] 'A[3] now contains 6. MATRIX(x,y) - returns a matrix (2-dimensional array) of x by y real zeros. Elements are accessed using square brackets and are base one (numbering starts at one) by default: B = MATRIX(2,2) B[1,1] = complex(1,3) B[1,2] = 3 B[2,1] = 3 B[2,2] = complex(1,-3) Note for advanced users: Elements can also be accessed linearly in row-column order, which can be useful in some situations. Thus, the following equations work identically to the equations just given above: B = MATRIX(2,2) B[1] = complex(1,3) B[2] = 3 B[3] = 3 B[4] = complex(1,-3) GENESYS currently contains no special matrix mathematical operators. All operations simply work on each element individually. For example: C=VECTOR(2) C[1]=5 C[2]=-3.4 D=VECTOR(2) D[1]=C[2]+3 'D[1] now equals -0.4 D[2]=COMPLEX(5,6) E=C+D 136 Arrays (Vectors and Matrices) E is now a two-element vector, E[1]=4.6, E[2]=-1.6 + j6. Scalar/matrix combination operators also work. For instance, adding a complex number to a vector adds the complex number to every element of the vector: F=VECTOR(2) F[1]=1 F[2]=2 G=COMPLEX(3,4) H=F+G 'H[1]=4+j4, H[2]=5+j4 Matrices and vectors are safe; out of bounds access is always caught. If an out-of-bounds index is used, the first element is used instead. If the variable being indexed is not an array, its value is used instead. If two matrices of different sizes are added, then the operation is only performed up to the size of the smallest matrix. These operations are performed as if the matrices were vectors; see the example of linearly accessing a matrix as a vector above. All operators and builtin functions will work properly on arrays, so, for example, taking the hyperbolic sine of matrix A using SINH(A) will take the hyperbolic sine of each element of A. Also, arrays can be passed to user models and functions, so you can create a user model that takes a matrix or vector as a parameter. Strings can be used in vectors, and the addition operator will work. For example: J=VECTOR(3) J[1]="One" J[2]="Two" J[3]="Three" K="Element " M=J+K 'M[1]="Element One", M[2]="Element Two", etc. Note: Vectors and matrices are now base one in GENESYS (first element is number one). To use base zero, put the statement "BASE 0" on a blank line at the top of your equations and at the top of any function. To find out how many elements an array has, use the COUNT function: N=VECTOR(71) P=COUNT(N) 'P=71 137 Equations Q=MATRIX(100,75) R=COUNT(Q) 'R=7500 Post Processing One of the more powerful features of the GENESYS equation block is post-processing (sometimes referred to as Output Equations). This allows you to perform calculations on the results of your analysis. These results can then be displayed, optimized, or even used in another design. For example: Gain=Linear1.Filter.DB[S21] AddToGain = ?5 TotalGain = Gain + AddToGain This example takes the gain in dB, DB[S21], of the design "Filter" using the simulation setup in "Linear1" and places the result into the variable "Gain". For a complete explanation of this syntax, see the Measurements section of this manual. Note that Gain now contains swept data, DB[S21] vs. frequency. Next, the variable AddToGain is added to each data point. The variable AddToGain can be tuned or optimized, which will directly affect the value of TotalGain. There are several important things to know about postprocessed data: 138 y Any measurement described in the measurements section of this manual is available for use in postprocessing. y To get simulation data, the expression must contain a period. For example A=DB[S21] will not work, but A=.DB[S21] will. This is most important if you take advantage of the USING statement (see below). y To get simulation data, you must always use a measurement operator. For example, A=Linear1.Filter.S21 will not work, but A=Linear1.Filter.DB[S21] will. y Post-Processed variables can be mixed with "regular" variables as in the example above. y Frequency-dependent post-processed variables can be used in part values. The data will be sampled/interpolated/extracted as necessary, and the resulting part value may be different at each frequency. Post Processing For example, R=50+.1*FREQ can be used to create a frequency-dependent resistor. y Post-Processed variables can be combined. For example, the statement "Difference=Linear1.Filter.DB[S21]Measured.Data.DB[S21]" gives the difference between the measured and the calculated DB[S21]. y For any operator or built-in function, swept data will be linearly interpolated if needed, and the resulting sweep will contain all frequency points from both the measured and the calculated data. In the item above, the difference variable will contain all data points from both the linear analysis and the measured data. y All operators and built-in functions will work on postprocessed data. For example, the statement "SineS=SIN(Linear1.FILTER.ANG[S21])" will take the sine of the phase of S21 at each data point. y If the simulation data is itself a matrix, everything will still work fine. For example, the statement "Difference=Linear1.Filter.RECT[S]Measured.Data.RECT[S]" will take the difference of all sparameters. The Difference variable will now behave like an array (see the previous section), with the addition that all operations will operate at all frequencies. For example, Difference[2,1] returns the difference of S21 at all frequencies. y FREQ is a post-processed variable. For each frequency point, the value is that frequency. All frequencies are in MHz. Exception: In a user model, if the freq variable is used, the model is calculated once per frequency, and FREQ is just a normal number. y Post-processed variables cannot be used in IF-THEN statements. For example, "IF .DB[S21]>5 THEN Gain=Gain+10" is not legal. Instead, you should use the IFF and IFTRUE functions. In this case, you can state "Gain=Gain+IFTRUE(.DB[S21]>5, 10)". This is because the equations are only calculated once (not at each frequency). y All calculations are deferred until requested. This means that when any of the statements shown above are encountered, the required calculation is simply noted. Later, when the data is needed, the calculation is 139 Equations performed. What does this mean to most users? Simply that post-processed calculations are very fast, do not require a lot of memory overhead, and only calculate when necessary. y The USING statement is a big convenience if you are writing many expressions. With it, you only need to specify the simulation/data and design once. The USING statement applies for all measurements specified after it, and it does not carry over into functions. For example: USING Linear1.FILTER Gain=.DB[S21] InputReflection=.DB[S11] OutputReflection=.DB[S22] Delay=.GD[S21] Note: You must specify the period before the measurement. This tells GENESYS that you are getting post-processed data. If you leave out the period, you will get errors like "Unknown Variable S11". Several functions in GENESYS are for use with post-processed calculations: Note: These are advanced functions which are not required my most users. If you are not sure if you need to use them, then you probably don't. COUNT(expression) - For post-processed data, this function will return the number of data points in the swept data. For example, if Linear1 is a linear simulation with 101 frequency points, then COUNT(Linear1.Sch.DB[S21]) is 101. This function is most useful if you want to loop post-processed data points with IF/THEN/GOTO Statements. GET(string) - Gets a measurement from a string variable. The statements A=.DB[S21] and A=GET("DB[S21]") are identical. This statement exists so that you can pass a string containing the name of a measurement into a function, allowing the function to get the data. GETINDEPVALUE(expression,index,dim) - returns the independent data point for dimension dim of a post-processed expression. Expression is the post-processed data, index is the 140 Logical Operators point number, and dim is the independent dimension number to use. For normal frequency sweeps, dim should be 1. For parameter sweeps with multiple independent sweeps, you must use dim to specify whether you want to get frequency (dim=1) or the parameter (dim=2, or higher for nested parameter sweeps). Note: If the independent data is frequency, GETINDEPVALUE returns the values in Hz (not MHz). GETVALUE(expression,index) - calculates and returns a value of a post-processed expression. This allows you to get the value of an expression at a particular data point (index). This function is most useful in combination with the COUNT function for looping over values. Most users should not use this function, preferring the GETVALUEAT function instead. Note that this function causes immediate calculation of the value, and the value it returns is not swept; it is the actual value of a particular data point (real or imaginary). Advanced note: If the independent data is multi-dimensional, then index can contain an array specifying the index for each dimension. GETVALUEAT(expression,indep) - calculates and returns a value of a post-processed expression at a given independent value. For example, this allows you to get the value of an expression at a particular frequency, such as Q=GETVALUEAT(.QL[S21],1e9) which gets the loaded Q of S21 at 1 GHz. If no data has been calculated at 1 GHz, the data will be interpolated or extrapolated as needed. While this function is somewhat slower than GETVALUE, it is much easier to use because you do not have to know the index of the point you want. Note that this function causes immediate calculation of the value, and the value it returns is not swept; it is the actual value of a particular data point (real or imaginary). Advanced note: This function only works on 2 dimensional data (X vs.Y). Note: If the independent data is frequency, GETVALUEAT requires values in Hz (not MHz). Logical Operators The NOT, AND, OR, Exclusive-OR, EQV and IMP operators are called logical operators. They can be used to combine relational 141 Equations tests, such as "A<5 & B>6". They can also be used in binary math as described below. Note: The information below is for advanced users and assumes that you are familiar with basic concepts of binary arithmetic and logical operators. Whenever a logical operation (such as &, |, and @) is performed, the values used are first converted to 32-bit signed integers (truncated). The operation is performed, and then the numbers are converted back to floating point format. This causes logical operators to work as expected when combined with relational operators: true is given a value of -1, which corresponds to all ones in binary notation; false is 0, which corresponds to all zeroes. So, when a logical operation is performed after a relational test, the value is either -1 (true) or 0 (false). This is the rationale for having the IF THEN GOTO Statement branch on a nonzero value. Relational operators act as expected on binary numbers, although there are no facilities included for conversion between binary and decimal format. So, the value of 5&4 is 4, the value of 128|64 is 192, and the value of 15 @ 7 is 8. The not operator (!) changes each 0 in the binary representation to a 1, and changes each 1 to a 0. Here are logical operator truth tables: A B !A A&B A|B A@B A#B A$B 0 0 1 0 0 0 1 1 0 1 1 0 1 1 0 1 1 0 0 0 1 1 0 0 1 1 0 1 1 0 1 1 User Functions Functions can be created in GENESYS. Their format is: FUNCTION name(parm1,parm2...) equations RETURN expression Functions take zero or more parameters as input and return exactly one value as output. All variables used within a function are local; that is, variables cannot be shared across functions or with the main equate block. An example function to calculate the inductance that resonates with a capacitor at a given frequency: 142 Calling Your FORTRAN/C/C++ DLLs FUNCTION RESL(C,F) 'L is in nH, C is in pF, F is in MHz FHz=1e6*F CFarads=1e-12*C Omega=2*PI*FHz LHenries=1/(Omega*Omega*CFarads) Return LHenries*1e9 An example which uses this function is: L=RESL(100,50) 'Find L to resonate 100pF at 50 MHz. You could also type RESL(100,50) into a part in =SCHEMAX=. Functions should go at the end of the global equations in your workspace. If you have functions you want to save permanently, save your workspace in the \EAGLE\MODEL directory. (Multiple functions can be placed in one file.) The functions will then be automatically loaded when GENESYS is started. For advanced uses, you can pass variables by reference, which means that the function can directly modify the variables passed in. To pass a variable by reference, put the word BYREF in front of the name. For example: FUNCTION DOUBLE(BYREF X,BYREF Y) X=X*2 Y=Y*2 RETURN 0 Calling this function doubles the variables passed in. For example: A=5 B=6 IGNORE=DOUBLE(A,B) 'After this call, A=10 and B=12. Notice that all functions must return a value, even if you will ignore it as in this case. Calling Your FORTRAN/C/C++ DLLs GENESYS has the capability to call programs you have written. The techniques for doing this are beyond the scope of this manual. If you are interested in this capability, contact Eagleware, and we will be happy to provide you with an application note with instructions. 143 Chapter 4: Units Global Units The units used in GENESYS are: Quantity Units Resistance ohms Inductance nH (nanohenries) Capacitance pF (picofarads) Conductance mhos (1/ohms or Siemens) Frequency MHz (megahertz) Delay ns (nanoseconds) Angle Degrees Physical Length, Width, Height mm (millimeters), or based on substrate Note that physical length is unique: y For parts which do not use a substrate, the units are millimeters. y For parts which use a substrate, the units are specified with the substrate. For layout dimensions, the units are specified in the Dimensions tab of the Layout Properties box with each layout. Chapter 5: Menus File Menu New - Closes the current netlist or schematic, and creates a new circuit or schematic. New from Template... - Creates a new document from a template. If GENESYS is installed to C:\EAGLE, then the templates are stored in the C:\EAGLE\TEMPLATE directory. Open... - Opens a workspace or 6.5 circuit file. Import 6.x Model Library - Imports a model library that was created in GENESYS Version 6.5B or earlier. Close Workspace - Closes the current workspace. Save - Saves the current workspace. If the current file has not been previously saved, GENESYS prompts for a file name. Save As... - Allows the current workspace to be saved into a new file. Save - Saves all loaded workspaces. Menus Page (Print) Setup - Allows selection of printer and settings. Print - Prints the current window. Print Preview - Shows a preview of what the print command will print. Print/Export as Bitmap: Entire Screen - Prints the entire screen, including any applications outside the GENESYS window. Print/Export as Bitmap: Active Window - Prints only the active window/dialog box. Export: S-Parameters - Exports a device data file from a simulation. Export: SPICE File - Exports a SPICE file from the current schematic. Export: Touchstone File - Exports a Touchstone file from the current schematic. Export: =EMPOWER= Data Files - Exports all internal files for an =EMPOWER= simulation. Export: DXF File - Exports a DXF File from the current layout. Export: Gerber File - Exports a Gerber File from the current layout. Available formats are Gerber 274-D and 274-X. Export: HPGL File - Exports a HPGL File from the current layout. Export: ASCII Drill List - Exports an ASCII (Text) X-Y drill hole list from the current layout. Export: Excellon (Gerber) Drill List - Exports an Excellon drill hole list from the current layout. Send as Email... - Sends the current workspace as an email attachment using your email program. 1...2...3...4 - Opens a recently used workspace file. Exit - Exits GENESYS 148 Edit Menu Edit Menu Undo - Reverses previous editing. Multi-level undo is available in =SCHEMAX= and =LAYOUT=. Redo - Puts back changes which were previously reversed with Undo. Cut - Copies the current selection then deletes the selected object(s). Copy - Copies the current selection but does not delete the selected object(s). Paste - Pastes the last copied object(s) into the current schematic or netlist. Delete - Deletes the current selection. Select All - Selects the entire layout or schematic. Duplicate - Duplicates the currently selected object(s). This is equivalent to a copy and paste sequence. Mirror - Flips the current selected component about its horizontal or vertical axis. Rotate - Rotates the selected component by the “Part Constrain Angle” specified in the Global Schematic Options dialog. Parameters - Displays the part dialog for the selected component. Parms, All Parts - Displays the part dialog for all components sequentially, in order of placement. 149 Menus View Menu Toolbar - Shows/Hides the main toolbar Status Bar - Shows/Hides the status bar at the bottom of the main GENESYS window Tune Window - Shows/Hides the Tune Window which lists variable values Workspace Window - Shows/Hides the Workspace Window Errors Window - Shows/Hides the Status Advisor (Info/Warning/Errors) Window Zoom: Maximum - Zooms to fit all objects or traces. Zoom: Page - Zooms to fit the page. Zoom: In - Zooms in on the center of the window Zoom: Out - Zooms out from the center of the window. Zoom: Rectangle - Allows you to draw a rectangle to zoom in on.. 150 Workspace Menu Workspace Menu Designs... - Shows the Design Manager Dialog. Simulations/Data... - Shows the Simulation/Data Manager Dialog. Outputs... - Shows the Output Manager Dialog. Equations... - Shows the Global Equation editor window. Substrates... - Shows the Substrates Manager Dialog. Optimizations... - Shows the Optimization Manager Dialog. Yield... - Shows the Yield Manager Dialog. Notes... - Shows the Notes editor window. 151 Menus Actions Menu Revert to Dashed Traces - Returns all tuned variables to their original values, sending the response back to the solid traces. Update Dashed Traces - Sets the tuned variable original values to be the current values and removes the dashed traces from the graphs. Optimize: Automatic - Chooses automatic optimization mode selection. In this mode, GENESYS chooses whether to use pattern or gradient search based on the error function behavior. Optimize: Pattern Search - Chooses pattern search optimization. GENESYS prompts for the initial step size when this option is selected. This type of search is most effective in the final stages of optimization. Optimize: Gradient - Chooses gradient search optimization. This type of search is most effective in the early stages of optimization. Setup Monte Carlo - Sets options and specifications for Monte Carlo and other statistical analysis. Monte Carlo - Starts Monte Carlo sensitivity analysis. Write Monte Carlo Report - Writes a text report for the last Monte Carlo analysis. Sensitivity - Starts single component sensitivity analysis. Yield Optimization - Starts yield optimization Design Centering - Starts design centering optimization 152 Tools Menu Tools Menu User Toolbars - Not currently available. Instead, place an existing symbol on your schematic and change its model. Footprint Editor: New Footprint... - Creates a new =LAYOUT= component footprint. Footprint Editor: Load Footprint... - Edits an existing =LAYOUT= component footprint. Footprint Editor: Merge Footprint... - Merges an existing =LAYOUT= component footprint into the current footprint editor window. Footprint Editor: Save Footprint... - Saves the footprint in the active footprint editor. Footprint Editor: Modify Footprint Library... - Allows renaming or deletion of footprints in footprint libraries. 153 Menus Schematic Menu Make Tunable - Forces all components to be tunable/optimizable by adding question marks to the first value of each component. This only adds question marks to part values with a numerical value. In other words, if a variable is used for a particular value, it will not be made tunable. Properties - Shows the the Schematic Properties dialog box. Renumber Nodes - Renumbers all nodes. This is primarily useful before exporting a SPICE file. 154 Layout Menu Layout Menu Connect Selected Parts - Moves selected components together along rubber band connections. Especially useful for connecting parts from =M/FILTER=. To connect an entire circuit (e.g. for =EMPOWER= simulation), select Select All from the Edit menu (see above), then select this option. Note: This option moves parts together; it does not create connection lines. Switch/Move Parts - Switches footprints for the two selected components. Place Footprint Port - Places a footprint port (not to be confused with an EM Port) on the layout. Set Origin - Allows the origin (used to calculate relative coordinates) to be set to another position on the page. The default position is the lower-left corner of the page and is shown with a small green cross. The origin setting affects all coordinate entry and readout throughout =LAYOUT=. Center Selected On Page - Centers the selected object(s) within the page boundary. To center an entire circuit (e.g. for =EMPOWER= simulation), select Select All from the Edit menu (see above), then select this option. Properties - Shows the Layout Properties dialog box. Statistics - Shows rubber band connection statistics. Save Layout As Footprint - Saves the current layout into the component footprint library. Caution: The footprint can only be used on layouts with identical layer setups. 155 Menus Synthesis Menu =A/FILTER= - Runs the active filter designer. =EQUALIZE= - Runs the group delay equalizer designer. =FILTER= - Runs the LC filter designer. =MATCH= - Runs the matching network designer. =M/FILTER= - Runs the microwave filter designer. =OSCILLATOR= - Runs the oscillator designer. =PLL= - Runs the Phase Locked Loop designer =TLINE= - Runs the transmission line calculator. 156 Window Menu Window Menu Tile Horizontal - Tiles open windows above each other. Tile Vertical - Tiles open windows beside each other. Cascade - Arranges open windows in an overlapping style. Next Editor - Toggles between editor windows (schematics, layouts, equation editors). Show All Output Windows - Opens all output windows (graphs, tables, variable viewers). 1...2... - Activates the selected window. 157 Chapter 6: Toolbars Main GENESYS Toolbar 1. Create a new workspace. Same as New from the File Menu. 2. Open an existing Workspace File. Same as Open from the File Menu. 3. Save the current workspace. Same as Save from the File Menu. 4. Cut. Same as Cut from the Edit Menu. 5. Copy. Same as Copy from the Edit Menu. 6. Paste. Same as Paste from the Edit Menu. 7. Undo (=SCHEMAX= and =LAYOUT). Same as Undo from the Edit Menu. 8. Redo (=SCHEMAX= and =LAYOUT). Same as Redo from the Edit Menu. 9. Print. Same as Print from the File Menu. 10. About. Same as About from the Help Menu. 11. Maximize. Same as Zoom/Maximum from the View Menu. 12. Zoom to Page. Same as Zoom/Page from the View Menu. 13. Zoom In. Same as Zoom/In from the View Menu. 14. Zoom Out. Same as Zoom/Out from the View Menu. 15. Zoom to a rectangle. Same as Zoom/Rectangle from the View Menu. 16. Update calculations. 17. Status advisor button. Same as Errors Window from the View Menu. This button is color coded: Grey=no Toolbars errors/warnings/info, Green=info messages available, Yellow=warning messages, Red=error messages, Black=serious errors. Main Graph Toolbar 1. Update Dashed Traces. Same as selecting Update Dashed Traces from the Actions Menu. Main Layout Toolbar 1. Arrow - Clears the current object selection. 2. Line - Selects the line drawing tool. 3. Rectangle - Selects the rectangle drawing tool. 4. Arc - Selects the arc drawing tool. 5. Poly - Selects the polygon drawing tool. 6. Port - Selects the EMport placement tool. (In the footprint editor, this places a footprint port. 7. Comp - Selects the component placement tool. 8. Text - Selects the text placement tool. 9. Via - Selects the viahole placement tool. 10. Pad - Selects the pad placement tool. 11. Layer Selection - Selects the layer for the selected part or for the part being constructed. 12. Width Selection - Selects the line width for the selected part or for the part being constructed. Other Options - Selects options for the current part, such as rounded/square ends, pour, etc. 160 Main =SCHEMAX= Toolbar Main =SCHEMAX= Toolbar 1. Draws a straight wire connection. Draws a 90° wire connection. 2. Draws a network input. 3. Draws a network output. 4. Draws text on a schematic 5. True ground. 6. Signal ground (DC voltage source in SPICE). This element is modeled as an AC ground, and has the same effect as grounding the connected node. 7. NET block. Used for re-using a schematic within another schematic. 8. Opens or closes the Lumped toolbar. Contains lumped elements. 9. Opens or closes the Device toolbar. Contains models component models (diode, op-amp, etc.) 10. Opens or closes the T-Line toolbar. Contains ideal transmission line models. 11. Opens or closes the Coax toolbar. Contains physical coaxial line models. 12. Opens or closes the Microstrip toolbar. Contains physical microstrip line and discontinuity models. 13. Opens or closes the Slabline toolbar. Contains physical slabline models. 14. Opens or closes the Stripline toolbar. Contains physical stripline line and discontinuity models. 15. Opens or closes the Waveguide toolbar. Contains rectangular waveguide and waveguide-to-TEM adapter models. 161 Toolbars Lumped Toolbar This bar is shown whenever the Lumped button is selected on the =SCHEMAX= tool bar. 1. Lumped resistor (RES) 2. Lumped capacitor with Q (CAP) 3. Lumped inductor with Q (IND) 4. Physical inductors. Available models are: a. Air core inductor (AIRIND1) b. Spiral inductor (SPIND) c. Toroidal inductor (TORIND) 5. Ideal elements. Available models are: a. Three-port circulator (CIR3) b. Delay (DELAY) c. Gain (GAIN) d. Isolator (ISOLATOR) e. Phase block (PHASE) 6. Antenna elements. Available models are: a. Dipole (DIPOLE) b. Monopole (MONOPOLE) 7. Two mutually coupled inductors (MUI) 8. Thin film capacitor (TFC) 9. Thin film resistor (TFR) 10. Ideal transformer (TRF) 11. Ideal center-tapped transformer (TRFCT) 12. Crystal (piezoelectric resonator) (XTL) 162 Device Toolbar Device Toolbar This bar is shown whenever the Device button is selected on the =SCHEMAX= tool bar. 1. One port data file (ONE) 2. Two port data file (TWO) 3. Three port data file (THR) 4. Four port data file (FOU) 5. Multi port data file (NPO) Note: Buttons 1 through 5 are used to import measured data for use in simulation. Buttons 6 and 9 are used to model transistors, and require parameter specification. To use manufacturer's transistor data, select Button 2 above. 6. Bipolar transistor model (BIP) 7. Current controlled current source (CCC) 8. Current controlled voltage source (CCV) 9. Field Effect Transistor model (FET) 10. Gyrator (GYR) 11. PIN diode (PIN) 12. Operational Amplifier (OPA) 13. Voltage controlled current source (VCC) 14. Voltage controlled voltage source (VCV) 163 Toolbars T-Line Toolbar This bar is shown whenever the T-Line button is selected on the =SCHEMAX= tool bar. 1. Ideal electrical transmission line (TLE) 2. Four-terminal ideal electrical transmission line (TLE4) 3. Ideal transmission line with physical parameters (TLP) 4. Four-terminal ideal transmission line with physical parameters (TLP4) 5. Two ideal coupled transmission lines (CPL) 6. Multiple ideal coupled transmission lines (CPN) 7. Single-Mode =EMPOWER= line (SMTLP) 8. Multi-Mode =EMPOWER= line (MMTLP) 9. Ribbon wire (rectangular conductor with length) (RIBBON) 10. Distributed RC transmission line elements. Available models are: a. Distributed RC transmission line (RCLIN) b. Distortionless distributed RC TEM transmission line (TLRLDC) c. Uniform distributed RC TEM transmission line (TLRLGC) d. Exponential distributed RC TEM transmission line (TLX) 11. Ruthroff transmission line transformer (TRFRUTH) 12. Round wire (WIRE) 164 Coax Toolbar Coax Toolbar This bar is shown whenever the Coax button is selected on the =SCHEMAX= tool bar. 1. Single coaxial line (CLI) Four-terminal coaxial line (CLI4) 2. Coaxial open end effect (CEN) 3. Coaxial gap (CGA) 4. Coaxial step in conductor width (CST) Microstrip Toolbar This bar is shown whenever the Microstrip button is selected on the =SCHEMAX= tool bar. 1. Single microstrip line (MLI) 2. Two coupled microstrip lines (MCP) 3. Multiple coupled microstrip lines (MCN) 4. Microstrip right angle bend (MBN) 5. Microstrip cross (MCR) 6. Curved microstrip line (MCURVE) 7. Microstrip open end effect (MEN) 8. Gap in microstrip (MGA) 9. Microstrip interdigital capacitor (MIDCAP) 10. Microstrip rectangular inductor (MRIND) 11. Microstrip spiral inductor (MSPIND) 165 Toolbars 12. Microstrip radial stub (MRS) 13. Microstrip step in width (MST) 14. Microstrip tapered line (MTAPER) 15. Microstrip tee (MTE) 16. Microstrip via-hole (MVH) Slabline Toolbar This bar is shown whenever the Slabline button is selected on the =SCHEMAX= tool bar. 1. Single slabline (RLI) 2. Two coupled slablines (RCP) 3. Multiple coupled slablines (RCN) Stripline Toolbar This bar is shown whenever the Stripline button is selected on the =SCHEMAX= tool bar. 1. Single stripline (SLI) 2. Two coupled striplines (SCP) 3. Multiple coupled striplines (SCN) 4. Bend in stripline (SBN) 5. Stripline end effect (SEN) 6. Gap in stripline (SGA) 7. Stripline step in width (SSP) 8. Stripline tee (STE) 166 Waveguide Toolbar Waveguide Toolbar This bar is shown whenever the Wave button is selected on the =SCHEMAX= tool bar. 1. Rectangular waveguide-to-TEM adapter (WAD) 2. Rectangular waveguide (WLI) 167 Chapter 7: Dialog Boxes GENESYS Global Options General Options Exponential Notation Above - All numbers with absolute value greater than or equal to this value will display in exponential 8 notation, such as 3.4e8 (3.4x10 ) Exponential Notation Above - All numbers with absolute value less than this value will display in exponential notation, such as -6 1.5e-6 (1.5x10 ) Digits right of decimal - Controls the number of digits to display with the number. Specifying 3 will result in numbers like 1.539e6, 3.423e8, 0.045, and 13453.421. Drop Trailing Zeros - If checked, any trailing zeros after the decimal point are dropped. For example, 1.340 changes to 1.34. If this box is not checked, numbers will generally line up better on tables. Dialog Boxes Use Engineering Notation - Shows exponents using powers of 3 only. This results in numbers like 1.539e-6, 342.3e6, 0.045, and 13453.421. Allow Multiple Open Workspaces - If checked, GENESYS allows you to open more than one workspace file (*.WSP) simultaneously. Automatically show Errors/Warnings - If checked, GENESYS will automatically display the error window when new errors are generated. If not checked, you must click the error button (the exclamation point on the tool bar) manually when it turns red, yellow, green, or black. Show Optimization Targets On Graphs - Shows optimization goals on graphs, Smith charts, and polar charts as dashed lines when checked. Use default toolbar settings on startup - If you need to restore your toolbars to the original setup: Check this box, restart GENESYS,and uncheck the box again. Show Yield Targets On Graphs - Shows yield goals on graphs, Smith charts, and polar charts as dashed lines when checked. Auto-Replace Tuned Values - If checked, any tuned or optimized values are replaced automatically. If unchecked, you will be asked whether or not to replace values. Disable All Simulations - Checking this box disables any updates from occurring, allowing you to load a file which is large or corrupted without GENESYS attempting to run any simulations or to update any data output windows. Show Data Points on New Graphs - If this box is not selected, then data points (generally small circles, triangles, or squares) are not shown on any new graphs, Smith charts, or polar charts you create. You can change this property on existing graphs using the "Other Properties" button on the graph properties dialog. Restore Defaults - Replaces all settings on the dialog box with their default values. 170 GENESYS Global Options =SCHEMAX= Global Options Zoom In (Radio Button) - Sets the right or center mouse button function. If this button is selected, clicking the mouse button on the schematic will zoom in on the mouse pointer location. Zoom Out (Radio Button) - Sets the right or center mouse button function. If this button is selected, clicking the mouse button on the schematic will zoom out from the mouse pointer location. Show Part Dialog Box (Radio Button) - Sets the right or center mouse button function. If this button is selected, clicking the mouse button on a schematic object will open the dialog box for that component. Part Constrain Angle - Specifies the rotation snap angle for schematic parts. Junction Circle Size - Sets the drawing size for node circles on the schematic. Automatically display part dialog.... (Checkbox) Automatically displays the component’s associated dialog whenever a component is placed on the schematic page. 171 Dialog Boxes Show grid (Checkbox) - Displays the schematic background grid. Show node zones (Checkbox) - Shows node circles on each component. Use long parts by default (Checkbox) - Short parts are usually created by holding SHIFT while placing a component on the schematic. If this option is selected, short parts are always placed, unless SHIFT is held down. Allow multiple parts to be placed... (Checkbox) - Forces =SCHEMAX= to remain in the part placement mode until ESCAPE is pressed, or another action is selected. Show node numbers (Checkbox) - Shows node numbers on the schematic at each component connection. Show SPICE Details in Part Dialogs - If you will be exporting a spice file, be sure to check this dialog box so that you can see and override spice translations in the Schematic dialogs. 172 Export Dialogs Export Dialogs DXF Setup Selecting Export/DXF File from the File menu brings up the following dialog. Scale - Scales the layout objects by the indicated factor. The default is 1 (actual size). Tolerance - Curves are drawn as a series of line segments. This number specifies the maximum deviation from the actual curve for these segments. Smaller numbers give better approximations (smoother curves), but can cause mathematical underflows (and possibly erroneous DXF objects) if below about 1 mil. Resolve To Polygons -Resolves crossed polygons into a single entity. For example, orthogonal crossed lines could be resolved into a single polygon in the shape of a cross.. Show Drill Holes - Turns on or off the display of drill holes in the DXF file. Drillhole Layer - Specifies the layer on which to show drill holes. This number is only used if Show Drill Holes is selected (see above). 173 Dialog Boxes Gerber Gerber Setup To write a gerber file for the current layout: 1. Select Export/Gerber File in the File menu. Give the new file a name in the dialog that appears, and click OK. 2. After naming the new file, the following dialog appears. Select the desired window options, and click OK. Tolerance - Curves are drawn as a series of line segments. This number specifies the maximum deviation from the actual curve for these segments. Smaller numbers give better approximations, but can cause mathematical underflows (and possibly erroneous Gerber objects) if below about 1 mil. Polygon Fill Min Aperture Diameter - The minimum diameter or width a polygon must have before it is filled. Resolve To Polygons - Resolves crossed polygons into a single entity. For example, orthogonal crossed lines could be resolved into a single polygon in the shape of a cross. Use 274-X Format - Turns on (or off) the 274-X format gerber file. This format has the aperture list inside the gerber file, and can use advanced aperture commands. 174 Export Dialogs Output Aperture List - Causes =LAYOUT= to write an aperture list. This is only valid for non-274-X formats, since the aperture list is embedded for 274-X files. Polygon Fill - Specifies the polygon fill algorithm to be used: SmartScan - Attempts to minimize file size, but does not work for all possiblities Raster Scan - Uses a very reliable algorithm which creates relatively large files Mix - Automatically switches between SmartScan and Raster Scan Units in File- Specifies the units to use inside the gerber file. The available options are millimeters and mils. Generate Custom Apertures - Allows you to specify apertures for =LAYOUT= to use within the gerber file. Selecting this checkbox makes the “Edit Default.APL” button available (see below). Why use custom apertures? Edit DEFAULT.APL Button - Opens the Custom Aperture List dialog. You can edit the list and add your own custom apertures. Number Format - Specifies the type of numbering used within the gerber file. Available options are: Omit Leading Zeros - Uses trailing zeros to fill remaining placeholders if not enough non-zero digits exist. Omit Trailing Zeros - Uses leading zeros to fill remaining placeholders if not enough non-zero digits exist. Number of Leading Digits - Specifies the number of digits before the decimal to use within the gerber file. Number of Trailing Digits - Specifies the number of digits after the decimal to use within the gerber file. Editing an Aperture List Why use custom apertures? If Generate Custom Apertures is selected in the Gerber Setup dialog, the “Edit DEFAULT.APL” button becomes available. Clicking this button brings up the following dialog. The dialog objects are described below. You can also click on the following image for specific information. 175 Dialog Boxes Dcode - Specifies the D-code identifier to use for each aperture in the aperture list. Type - Identifies the type of aperture used. Available types are: UNUSED - This aperture is not placed in the aperture list. ROUND - Specifies a round (circular) aperture. RECT - Specifies a square or rectangular aperture. Width/Diam - Specifies the width for rectangular apertures, or the diameter for round apertures. Height - Specifies the height for rectangular apertures. This number is not used for round apertures. Save - Saves the current aperture file. Save As - Saves the current aperture table into a new file. Load - Loads an aperture file. Custom Apertures -- When Should You Use Them? Custom apertures are apertures created by =LAYOUT= specifically for each Gerber file. The User Aperture List is a list of apertures defined by customers for specific needs. 176 Export Dialogs Generally, user apertures should only be used if your company has a standard set of apertures that Gerber exports must conform to. Otherwise, custom apertures should be used. =LAYOUT= has a built in optimization routine that selects the best list of apertures for efficient polygon fills and flashes. These custom apertures result in the smallest possible Gerber files, whereas a user list can give very inefficient, incorrect, and large files. 177 Dialog Boxes HPGL Setup To write a HPGL file for the current layout: 1. Select Export/HPGL File in the File menu. Give the new file a name in the dialog that appears, and click OK. 2. After naming the new file, the following dialog appears. Select the desired window options, and click OK. Scale - Scales the layout objects by the indicated factor. The default is 1 (actual size). Tolerance - Curves are drawn as a series of line segments. This number specifies the maximum deviation from the actual curve for these segments. Smaller numbers give better approximations, but can cause mathematical underflows (and possibly erroneous HPGL objects) if below about 1 mil. Resolve To Polygons - Resolves crossed polygons into a single entity. For example, orthogonal crossed lines could be resolved into a single polygon in the shape of a cross. This option should be used for Rubylithe transfers. Multi-Page Output - Selects whether to plot all layers on one page, or use one page for each layer. Show Drill Holes - Turns on or off the display of drill holes in the HPGL file. 178 Export Dialogs SPICE Preferences To write a SPICE file for the current layout: y Select Export: Spice File in the File menu. Give the new file a name in the dialog that appears, and click OK. y After naming the new file, the following dialog appears. Select the desired options, and click OK. Target Version - Lists the available target SPICE platforms. Terminations - These options determine how the source and load terminations are handled in the SPICE netlist. The options are: Standard - Uses standard source and load terminations. None - Does not use any terminations. The source is connected directly the circuit input with no internal resistance. Closed Loop - The input and output of the =SCHEMAX= circuit are connected to create a closed loop. This is useful for start time analysis of oscillators. Grounded Input - The =SCHEMAX= input is grounded, and the output is driven by a source. SPICE Command Text - The text entered in this box will be appended to the SPICE text whenever a netlist is exported. Any subcircuits or post-processing calls should be entered here. 179 Dialog Boxes Workspace Dialogs These dialogs allow management of designs, simulations, data outputs, substrates, optimization targets, and yield targets in an easy to use form. All actions on these dialog boxes can also be performed by right-clicking in the Workspace Window. Workspace - If multiple workspaces are loaded, you can specify which workspace to manage. List - Lists all items of the appropriate type (design, substrate, etc.) in the workspace. Properties - Shows the properties of the highlighted item. This is identical to right-clicking on the item in the workspace window and selecting Properties. Delete - Removes the highlighted item from the workspace. This is identical to pressing Delete when the item is highlighted in the workspace window. New - Allows creation of a new item of the appropriate type (design, etc.) in the workspace. This is identical to right-clicking on the header in the workspace window. Rename - Renames the highlighted item. This is identical to right-clicking on the item in the workspace window and selecting Rename. Open - Opens the highlighted item in the main GENESYS window. This is identical to double-clicking on the item in the workspace window. 180 =LAYOUT= Dialogs =LAYOUT= Dialogs Print Setup Scale - Scales the layout objects by the indicated factor. The default is 1 (actual size). Print Quality - Curves are drawn as a series of line segments. Higher resolution gives better approximations, but can slow plots with a lot of curves. Three options are available for the plot resolution: Resolve To Polygons - Resolves crossed polygons into a single entity. For example, orthogonal crossed lines could be resolved into a single polygon in the shape of a cross. Outlines Only - Plots only the outer edge of =LAYOUT= objects. This is useful for test plotting, when lines and pads don’t need to be filled. Multi-Page Output - Plots each layer onto a different page. Show Drill Holes - Turns on or off the display of drill holes in the DXF file. 181 Dialog Boxes Statistics Rubber bands indicate the connections that the schematic requires. Number of Unresolved Rubber Bands - The number of connections that still need to be made. Total Number of Rubber Bands - Total number of connections that the schematic requires. Percent of Rubber Bands Resolved - Percentage of connections that have been resolved. Footprint Library Selector Select Library - This box shows a list of the library files (*.LIB) located in the LIB directory under your EAGLE directory. Selecting shows the footprints that have been 182 =LAYOUT= Dialogs selected and are still in memory. Whenever a new footprint is loaded, it is kept in memory until the program is exited. Available Footprints - This box shows a list of the footprints stored in the selected library file. Preview Window - Shows the footprint selected in the Available Footprints box. 183 Dialog Boxes =LAYOUT= Objects Overview The objects available in =LAYOUT= are: Arc Component Group Line Pad Polygon Port Pour Text Viahole 184 =LAYOUT= Objects Arc Object Line Width - The width of the line used to draw the arc. Rounded Ends - Toggles whether the arc has rounded or squared ends. Layer - The layer that the arc is assigned to. Center - The center of the cirlce that the arc belongs to. Radius - The radius of the circle that the arc belongs to. Start Angle - The starting angle of the arc, measured from the positive x-axis. End Angle - The ending angle of the arc, measured from the positive x-axis. 185 Dialog Boxes Component Object A component is a footprint that has been created in the Footprint Editor and added to a footprint library. The Component object dialog box is shown below. Angle - The angle in degrees at which to draw the component. This angle is measured in from the positive x-axis. Location - The location of the first pin on the footprint. DES - This prompt is taken from the text in the footprint that contains the “@” character. The number of prompts here is solely determined by the number of text objects in the footprint. The text entered in this box replaces the original footprint text. File - The library file that the footprint is stored in. Footprint - The name of the footprint within the library file. Change Footprint - Allows another footprint to be chosen. Reset Defaults - Resets the footprint and all the prompt text to the original values. Hide Silk Layers - Turns off the generation of all silk layers from this component. 186 =LAYOUT= Objects EMPort Object An EMPort is used to specify the location of ports within an =EMPOWER= file. All circuits must contain at least one EMPort to allow data to be taken from the =EMPOWER= simulation. The number of ports is equal to the number of ports in the =EMPOWER= network to be analyzed. They are placed in the layout using the EMPort button and can be Normal deembedded external ports (gray), external ports with No Deembedding (white), or internal ports (white). External ports are discussed in detail in Chapter 4, and Lumped Elements and Internal Ports are discussed in Chapter 6. The EMPort object dialog box is shown below. The dialog objects are described below. Draw Size - This has no effect on the simulation. It controls the size that the port number appears on screen and on printouts. Ref Plane Shift - This parameter is only available if “Port Type” is set to “Normal” (see below). On most complete circuits, this value can be left at zero. A positive Reference Plane shift causes the deembedding to add extra line length to the circuit; A negative value is more common and causes the reference planes to move inside the box. See Example 8 in Chapter 9 for an example of a patch antenna simulation and Example 3 which use a reference plane shift. The reference plane is shown as an arrow on the layout. Additionally, when the EMPort is selected, Handles appear on the reference plane, allowing it to be moved with the mouse. 187 Dialog Boxes Port Number - When =EMPOWER= is run, the port numbers specified here correspond to the port numbers in the resulting data. These port numbers must be sequential (numbers cannot be skipped), and Normal ports must always have lower numbers than non-deembedded and internal ports. =LAYOUT= assigns a new port number automatically when an EMPort is placed, and the port number is displayed on the layout at the port. Width & Length - When placing an external port on the end of a strip-type transmission line, you should normally leave these at zero so that =LAYOUT= sizes the port automatically. If you want to override the size, or for slot-type or internal ports, you can specify width and length here. Note: Width and length are measured relative to the line direction, so these parameters can appear to be reversed. Length is the length in the direction of propagation (along the line), and width is the width of the strip. Layer - Specifies the metal layer on which the port is placed. Location - Specifies the edge of the port for external ports and the center of the port for internal ports. Line Direction - Gives the direction of the line at the port. In the default mode, the nearest wall determines the direction of the line. This value rarely needs to be overridden. Current Dir - Specifies the direction of current flow within the port. Figure 4-3 shows the default current direction for external ports on strip-type structures such as microstrip and stripline. Figure 4-4 shows the default current direction for external ports on slot-type structures such as coplanar waveguide. For internal ports, the default current direction is “Along Z.” This value also rarely needs to overridden. Port Type - Specifies the basic type of port: Normal ports are external ports which are deembedded and may be multi-mode. They are shown in gray on the layout. No Deembed ports are external ports which are not deembedded and cannot be multi-mode. They are shown in white on the layout. Internal ports are also not deembedded and cannot be multi-mode. They are shown in white on the layout. 188 =LAYOUT= Objects Group Object When several objects are selected and the group button is selected on the toolbar (or G is pressed), the objects are grouped. Whenever any element of the group is selected, the entire group is selected. To break apart the elements once they have been grouped: 1. Select the group by clicking on any of the group elements. 2. Click the ungroup button on the main toolbar or press U. The Group object dialog box is shown below. Element List - Shows the elements included in the group object. Edit Button - Opens the dialog box for the element selected in the above list. 189 Dialog Boxes Line Object The object dialog box is shown below. The dialog objects are described below. You can also click on the following image for specific information. Line Width - Specifies the width of the line being edited. Rounded Ends - Toggles whether the line is squared or rounded on the ends. Orthogonal Mode - Toggles whether the line should use a straight path from Start to End, or a right angle (90 ) path. Orthogonal Angle - The angle of the start line from the positive x-axis. This value only has an effect if Orthogonal Mode is selected. Layer - The layer that the line will be assigned to. Start - The start point of the line. End - The end point of the line. 190 =LAYOUT= Objects Pad Object Location - The location of the pad center in rectangular coordinates. Pad Shape Round - Designates a round pad surrounding the via on the start and end layers. Square/Rect - Designates a square or rectangular pad surrounding the via on the start and end layers. Wagon Wheel - Designates a donut-shaped pad with spokes surrounding the via on the start and end layers. This is often used for thermal relief when soldering connections. Pad Diameter - The diameter of the pad, using the current units. This prompt appears when Round is selected as the pad shape. Pad Width - The width of the pad, using the current units. This prompt appears when Round is selected as the pad shape. Pad Height - The height of the pad, using the current units. This prompt appears when Square/Rect is selected as the pad shape. Inner Diameter - The inside diameter of the wagon wheel’s outer ring using the current units. This prompt appears when Wagon Wheel is selected as the pad shape. Spoke Width - The width of the wagon wheel’s spokes using the current units. This is also used as the thickness of the outer ring. This prompt appears when Wagon Wheel is selected as the pad shape. Angle - The angle of the pad in degrees, measured from the positive x-axis. This is used for square or rectangular pads. Layer - The layer that the pad is on. 191 Dialog Boxes User Ground - Toggles whether the pads are connected to ground. Whenever a ground-plane pour is made on the same layer as these pads, the pour will not keep away. Don’t Create Mask - Toggles whether to create a solder mask for the pads associated with this via. 192 =LAYOUT= Objects Polygon Object The object dialog box is shown below. The dialog objects are described below. You can also click on the following image for specific information. Layer - The layer that the polygon is on. 193 Dialog Boxes Port Object A port is used to indicate where the nodesshould be on a footprint. Ports should be placed on a footprint everywhere a connection will be made. Draw Size - The size to draw the port, using the current units. Port Number - The port number within the selected device. For example, an op-amp has three ports. The first is the inverting input, the second is the non-inverting input, an the third is the output. Device - The device number within the component that the port belongs to. For example, a quad op-amp package would have four devices, each with three ports (2 input, 1 output). Layer - The layer that the port is assigned to. This allows objects onthe same layer to snap to the port node. Location - The location in rectangular coordinates of the port, relative to the lower left of the display page. 194 =LAYOUT= Objects Pour Object A pour is a polygon which has been poured (by selecting the polygon and clicking the pour toolbar button) around other objects on the same layer. Keep Away - The distance that the pour should keep away from other objects on the same layer. Tolerance - The maximum error when approximating curves or creating the pour # Segments - The number of segments that the pour should be broken into. This can help to conserve memory in complex pours. Layer - The layer that the pour is on. Ground Plane - Designates this pour as a ground plane. This forces the pour to contact all objects on the same layer that have been designated as user grounds. 195 Dialog Boxes Rectangle Object Start - The lower-left corner of the rectangle. End - The upper-right corner of the rectangle. Layer - The layer that the line will be on. Angle - The rotation angle of the rectangle from the positive xaxis in degrees (counter-clockwise is positive). The rectangle is rotated about the geometric center. The start and end coordinates are before the rotation. 196 =LAYOUT= Objects Text Object Text - The text to be displayed. Angle - The angle to show the text, measured in degrees from the positive x-axis. Layer - The layer that the text belongs to. Location - The location of the text, in rectangular coordinates. Font - The font to use for this text. Size - The size of this text. This box is only available if Use Default Size is not selected. Use Default Size - Toggles whether to use the default size for this text. See Layout Properties for setting the default text size. X Justification, Y Justification - Controls the text alignment with respect to the specified location. This is most useful for keeping text centered or aligned when creating a footprint which will have different text when the footprint is used. 197 Dialog Boxes Viahole Object Drill Diameter - The diameter of the drill hole. Location - The location of the drill hole in rectangular coordinates. Pad Shape Round - Designates a round pad surrounding the via on the start and end layers. Square/Rect - Designates a square or rectangular pad surrounding the via on the start and end layers. Wagon Wheel - Designates a donut-shaped pad with spokes surrounding the via on the start and end layers. This is often used for thermal relief when soldering connections. Pad Diameter - The diameter of the pad, using the current units. This prompt appears when Round is selected as the pad shape. Pad Height - The height of the pad, using the current units. This prompt appears when Square/Rect is selected as the pad shape. Angle - The angle of the pad in degrees, measured from the positive x-axis. This is used for square or rectangular pads. Use Default Layers - Allows the start and end layers for the viahole to be modified when checked. When not checked, the defaults specified in the Layout Properties dialog are used. Start Layer - This determines the start layer for the drill hole. This is only available if Use Default Layers is not checked. End Layer - This determines the end layer for the drill hole. This is only available if Use Default Layers is not checked. 198 =LAYOUT= Objects User Ground - Toggles whether the pads are connected to ground. Whenever a ground-plane pour is made on the same layer as these pads, the pour will not avoid contact. Don’t Create Mask - Toggles whether to create a solder mask for the pads associated with this via. 199 Dialog Boxes =LAYOUT= Properties General Designs to Include - This grid shows all available designs to place on the layout. If a box is checked, the layout will contain footprints and rubber band lines corresponding to the parts in that design. These footprints and rubber-bands will automatically update as needed. Units - The available units for dimensioning objects on the layout. If you enter a number for a custom unit, simply use a constant multiplier for converting the unit to millimeters. Some common numbers are: mm 1 mils .0254 meters 1000 inches 25.4 Object Dimensions - Default sizes for most commonly used objects. These numbers define the default dimensions line and pad widths, and the drill diameter for viaholes. 200 =LAYOUT= Properties Box Settings - Determines how the “page” is displayed on the layout screen. You can use the page as a board edge indicator, for use in placing the footprints. This box also corresponds to the =EMPOWER= box. The following options are available: Widths - The available widths for lines and arcs. The widths shown here are available in the Line Width combo box on the main =LAYOUT= screen. Remove - Removes the selected width from the Widths box (see above). Add New - Adds a new width to the available list in the Widths box (see above). Grid Spacing - The on-screen vertical and horizontal grid spacing, using the selected units. Parts are placed on this grid by default, so this number determines the “resolution” for part placements. Grid Spacing X, Grid Spacing Y - These control the cell size for the =EMPOWER= run as well as the grid snap feature in =LAYOUT=. When using the “=EMPOWER= Grid Style,” there will be =LAYOUT= snap points between each grid line which allow lines to be centered between two grid points if necessary. They are often referred to as dx and dy and should be small with respect to a wavelength at the maximum frequency to be analyzed, preferably less than l/20 and always less than l/10. These parameters correspond directly to the DELTA statement in the TPL file. Show =EMPOWER= Grid - Turning on this checkbox forces =LAYOUT= to display the rectangular =EMPOWER= grid. It also allows different grid spacings in the X and Y dimensions. It is strongly recommended to turn this checkbox on whenever you are creating a layout for =EMPOWER=. Box Width (X) - The desired page width, using the units selected in the Units box. Box Height (Y) - The desired page height, using the units selected in the Units box. Origin - The origin for mouse cursor measurements. The onscreen coordinates display information relative to this origin. The absolute origin is at the lower left of the page. To specify a new origin, enter coordinates relative to the absolute origin, using the selected units. For example, if your page is 100 x 200 mils and you want the origin at the upper left, you would enter 0, 100. 201 Dialog Boxes Show Box (Checkbox) - Shows or hides the page boundary. Show Grid Dots (Checkbox) - Shows or hides the part placement grid. Drawing Options - The following options are available: Port Size - The size (using the current units) for drawing ports. Rot. Snap Angle - The incremental angle (in degrees) used for rotating objects. This can be any number, but should be positive and < 360. Multi Place Parts (Checkbox) - Turns on or off multiple placement. In the main =LAYOUT= window, you click an object button (such as the Line button), to place an object on the layout. Normally, the object button must be selected every time the object is to be placed. The Multi Place Parts option allows you to place as many parts as you like by selecting the object button only once. Press Escape when done placing parts. Default Viahole Layers - The Start Layer and End Layer combo boxes control the default layers for the viaholes. These layers can be overridden individually for each viahole if necessary. Currently, viaholes in =EMPOWER= can only go from the metal layer through one substrate layer to either the top or bottom cover. 202 =LAYOUT= Properties Associations Element Type - The category of parts for which footprints are loaded. Default Footprint - The footprint which is selected for the corresponding category (given in the Name column). Library - The name of the library containing the footprint for the corresponding category (given in the Name column). Change Button - Allows you to select a new footprint for the corresponding category (given in the Name column). Current Table - The file name of the current footprint association table. Save Table As Button - Saves the current table into a new file. Load Table Button - Loads a different footprint association table from a file. 203 Dialog Boxes General Layer Name - The name assigned to each layer. This name is used throughout the program to identify the layer. Although you can type anything for the layer name, you should limit the length to about 12 characters, since combo boxes within the program are not wide enough to display lengthy names. Type - Identifies the layer type. Available options are: None - This layer is considered blank (it’s not used). Silk - Silk screen is used for labeling on the final board. It is often white or yellow for easy identification. Mask (Solder Mask) - This is a negative layer - objects on this layer indicate an absence of solder mask. This layer is automatically generated from pads and viaholes. Metal - All conductive traces and pads go on a metal layer. Substrate - Separates metal layers, and is used to indicate board dimensions. Any cuts in the board (screw holes, etc.) go on a substrate layer. Assembly - Indicates exact positions for component placement. It is used as a diagram for placing components at the production stage, and does not actually get used during board creation. Paste - Indicates where solder paste should be placed. 204 =LAYOUT= Properties Color - Shows the selected color for each layer. Click the button for any layer to select another color. Hide - When selected, the corresponding layer is not shown in the layout. Mirror - When selected, the corresponding layer is mirrored (shown reversed) in the layout. This is useful for bottom layers, which would be reversed when viewing the top layer. Plot - Selects whether to plot the corresponding layer. Etch Factor - Adds an etch factor to the corresponding layer, using the units selected on the General tab. Load From Layer File - Loads a new layer configuration from a file. Save To Layer File - Saves the current layer configuration to a new file. Insert Layer - Inserts a new layer at the current cursor position. Delete Layer - Deletes the layer at the current cursor position. 205 Dialog Boxes =EMPOWER= Layer This table lists the layers that can be used in the =EMPOWER= simulation. The topmost and bottommost layers are the top and bottom cover, and the air separation layers. All other layers listed here have been defined in the =LAYOUT= settings. Following is a list of the =EMPOWER= layers and their respective settings. 206 =LAYOUT= Properties Use - If this box is cleared, the corresponding layer will not be included in the =EMPOWER= simulation. Other entries in this table are different for each type of layer. To find help on each column, see the section below for the type of layer: Top/Bottom Cover, Air Above/Below, Metal, or Substrate layers. Top Cover & Bottom Cover - Describes the top and bottom covers (ground planes) of the circuit. Types include: y Lossless: The cover is ideal metal. y Physical: The cover is lossy. These losses are described by Rho (resistivity relative to copper), Thickness, and Surface Roughness. y Electrical: The cover is lossy and is described by an impedance or file. See the description below under metal for more information. y Semi-Infinite Waveguide: There is no cover, and the problem is simulated as if the box walls and uppermost substrate/air layer extend up or down forever (an infinite tube). y Magnetic Wall: The cover is an ideal magnetic wall. This setting is only used in advanced applications. y Substrates: Choosing a substrate causes the cover to get the rho, thickness, and roughness parameters from that substrate definition. We recommend using this setting whenever possible so that parameters do not need to be duplicated between substrates and layouts. Air Above & Air Below - The presence of air at the top of the box (as in microstrip) or the bottom of the box (as in suspended microstrip) is so common that special entries have been provided for these cases. Checking the box to turn these layers on is the equivalent of adding a substrate layer with Er=1, Ur=1, and Height (in units specified in the Dimensions tab) as specified. Caution: When setting up a new circuit, be sure to check the height of the air above, as it is often the only parameter on this tab which must be changed, and is therefore easily forgotten. Metal Layers - All metal layers from the General Layer Tab are also shown in the =EMPOWER= Layer tab. These layers are 207 Dialog Boxes used for metal and other conductive material such as resistive film. The following types are available: 1. Lossless: The layer is ideal metal. 2. Physical Desc: The layer is lossy. These losses are described by Rho (resistivity relative to copper), Thickness, and Surface Roughness. 3. Electrical Desc: The layer is lossy and is described by an impedance or file. This type is commonly used for resistive films and superconductors. If the entry in this box is a number, it specifies the impedance of the material in ohms per square. If the entry in this box is a filename, it specifies the name of a one-port data file which contains impedance data versus frequency. This data file will be interpolated/extrapolated as necessary. See the Device Data chapter for a description of oneport data files. 4. Substrates: Choosing a substrate causes the layer to get the rho, thickness, and roughness parameters from that substrate definition. We recommend using this setting whenever possible so that parameters do not need to be duplicated between substrates and layouts. CAUTION: Unless thick metal is selected, thickness is only used for calculation of losses. It is not otherwise used, and all strips are calculated as if they are infinitely thin. Metal layers have three additional settings available: Slot Type - Check this box to simulate the non-losslessmetal areas (as opposed to the metal areas) in =EMPOWER=. Use this for ground-planes and other layers which are primarily metal. Do not use this for lossy layers. See your =EMPOWER= manual for details. Current Direction - Specifies which direction the current flows in this layer. The default is along X and Y. "X Only" and "Y Only" can be used to save times on long stretches of uniform lines. "Z Up", "Z Down", "XYZ Up", and "XYZ Down" allow the creation of thick metal going up/down to the next level or cover. Thick Metal - Checking this box forces =EMPOWER= to model the metal including thickness. =EMPOWER= does this by putting two metal layers close together, duplicating the traces on each, and connecting them with z-directed 208 =LAYOUT= Properties currents. If thick metal is used, then Current Direction is ignored. Element Z-Ports - This setting specifies the default direction for automatically created element ports, either to the level above or to the level below. Generally, you should choose the electrically shortest path for this direction. Substrate Layers - All substrate layers from the General Layer Tab are also shown in the =EMPOWER= Layer tab. These layers are used for substrate and other continuous materials such as absorbers inside the top cover. An unlimited number of substrate/media layers can be used. The following types are available: 2. Physical w/Tand: The layer is lossy. These losses are described by Height (in units specified in the Dimensions tab), Er (relative dielectric constant), Ur (relative permittivity constant, normally 1), and Tand (Loss Tangent). 3. Physical w/Sigma: The layer is lossy. These losses are described by Height (in units specified in the Dimensions tab), Er (relative dielectric constant), Ur (relative permittivity constant, normally 1), and Sigma (Bulk Conductivity). 4. Substrates: Choosing a Substrate causes the cover to get the height, Er, Ur, and Tand parameters from that substrate definition. We recommend using this setting whenever possible so that parameters do not need to be duplicated between schematics and layouts. CAUTION: For true stripline (triplate), be sure to check the “Use 1/2 Height” checkbox if you are using a substrate from =SCHEMAX=. This forces =EMPOWER= to use 1/2 of the =SCHEMAX= substrate height for each substrate (above and below) so that the total height for both media layers is correct. 209 Dialog Boxes Fonts Choose New Default Font - Lists the available fonts. The default font is automatically selected when the dialog is opened. To choose a new default font, simply select another font in this box. All text already placed on the layout will be updated to incorporate the new font. Old Default - The old default font. If you haven’t selected a new font since opening the dialog, this font stays selected in the Choose New Font box. This font will remain the default style if you select Cancel on the dialog, even if you have selected another. Default Size - This is the default size for text placed on the layout. Changing this number will update any text already on the layout that has the Use Default Size box checked in its properties box. 210 Schematic Properties Schematic Properties Page Width - Specifies the width of the displayed page in =SCHEMAX=. The “page” is displayed as a red square on the main screen. Page Height - Specifies the height of the displayed page in =SCHEMAX=. Standard Part Length - Specifies the length of components in =SCHEMAX=. The length is given in the current units (see Units below). Grid Density - Specifies the grid density for the schematic. The density is given as number of grid points per Standard Part Length. Units - Specifies the units that the above dimensions are given in. 211 Dialog Boxes Schematic Part Layout Options If you do not want a schematic part to appear in =LAYOUT=: 2. Open the schematic part’s dialog box (double-click on the part). 3. Click the Layout button. The dialog box shown below appears. 4. Choose the desired option, and click the OK button. Tip: Often in RF circuits, you want to model packaging and/or component parasitics. This is done by placing lumped elements in series or parallel with the actual component. However, you don’t want these parts to appear on the layout. For capacitors, simply choose “Replace part with open”. For inductors and resistors, choose “Replace part with short”. 212 Change Model Change Model Selecting the Model button from any =SCHEMAX= part dialog displays the dialog box shown below. Switching symbol models allows custom-created models to use the standard schematic symbols in =SCHEMAX=. For example, an interdigitated capacitor in stripline could use the normal capacitor symbol. In this case, you would: 1. Place a lumped capacitor in the schematic. 2. Display the capacitor’s part dialog (select the part and press F4). 3. Click the model button. The model dialog shown above appears. 4. Select the interdigital stripline model from the list and click OK. 213 Dialog Boxes Model Properties Parameter - These entries are the parameter variables that can be used in model equations. When referring to these parameters in a model, they must appear precisely as entered here, with the exception of upper/lower case (they are not case-sensitive). Description - Human-readable description of each parameter. This description is shown in =SCHEMAX= part dialog boxes. Units - Describes what type of units that each parameter uses. Layout Association - Defines which association table entry to use for this model. This defines the default footprint which will be used for this model when it is on a layout. 214 Graph Properties Graph Properties Default Simulation/Data or Equations - Defines the default source for the measurements described below. Measurement - Lists which measurements to graph. See the Measurements chapter in this manual for more details. Y-Axis - Specifies whether to use the left or right vertical axis to display values. Hide - Selecting "Yes" removes this measurement from the graph. Selecting "No" causes the measurement to reappear. Color - Selects the line and marker color for this measurement. Left Y Axis, Right Y axis, X Axis - Entries in these sections control the scale to be shown. If Auto-Scale is selected, then GENESYS will rescale the graphs whenever the solid traces are updated. Other Properties - Shows the advanced properties dialog for the graph. This dialog contains settings normally not needed by most users. This dialog allows modification of line weights, markers, and other features. 215 Dialog Boxes Polar Chart Properties Default Simulation/Data or Equations - Defines the default source for the measurements described below. Measurement - Lists which measurements to graph. See the Measurements chapter in this manual for more details. Scale - Specifies which scale to display values. This is the equivalent of having two y-axes on a graph, allowing two different scales to be used for displaying values. Hide - Selecting "Yes" removes this measurement from the graph. Selecting "No" causes the measurement to reappear. Color - Selects the line and marker color for this measurement. Upper Scale, Lower Scale - Entries in these sections control the scale to be shown. If Linear is selected, then the numbers shown here and on the polar chart are in linear magnitude form. If dB is selected, then the numbers shown are in dB form. Other Properties - Shows the advanced properties dialog for the graph. This dialog contains settings normally not needed by most users. This dialog allows modification of line weights, markers, and other features. 216 Smith Chart Properties Smith Chart Properties Default Simulation/Data or Equations - Defines the default source for the measurements described below. Measurement - Lists which measurements to graph. See the Measurements chapter in this manual for more details. Hide - Selecting "Yes" removes this measurement from the graph. Selecting "No" causes the measurement to reappear. Color - Selects the line and marker color for this measurement. Grid Density - Controls the number of resistance/reactance arcs shown on the chart background. Auto will use Fine for large charts, Course for small charts, and Fine for printouts. Grid Types - Selects whether to show the impedance chart, admittance chart, or both. Zoom - Numbers greater than 100% enlarge the chart (Zoom in on center), while smaller numbers shrink the chart (Zoom out). Other Properties - Shows the advanced properties dialog for the graph. This dialog contains settings normally not needed by most users. This dialog allows modification of line weights, markers, and other features. 217 Dialog Boxes Table Properties Default Simulation/Data or Equations - Defines the default source for the measurements described below. Measurement - Lists which measurements to graph. See the Measurements chapter in this manual for more details. 218 Linear Simulation Properties Linear Simulation Properties Type of Sweep Linear: Number of Points - Allows specification of start freq, stop freq, and number of points Log: Points/Decade - Allows specification of start freq, stop freq, and number of points Linear: Step Size - Allows specification of start freq, stop freq, and space between points. List of Frequencies - Allows the explicit specification of analysis frequencies. These points are entered into the List of Freqs box separated by spaces. 219 Dialog Boxes =EMPOWER= Options Layout to Simulate - Allows you to select which layout in the current workspace to simulate. Since workspaces can have multiple layouts and multiple =EMPOWER= simulations, you can simulate many different layouts within the same workspace. Port Impedance - When =EMPOWER= S-Parameter data is plotted on a graph, it will be normalized to this impedance. Different impedances can be used for each port by separating impedances with commas. A 1-Port Device Data File can be used in place of any impedance file to specify frequency dependent or complex port impedances. Generalized - When this box is checked, the impedance for each line as calculated by =EMPOWER= are used for their terminating impedance. See your =EMPOWER= manual for details on Generalized S-Parameters. Electromagnetic Simulation Frequencies - Specifies the frequencies at which to run =EMPOWER=. If you have lumped 220 =EMPOWER= Options elements in your simulation, you can often turn down the number of frequencies here and increase the number of frequencies in the Co-simulation sweep specified below. Start Freq (MHz) - Specifies the minimum frequency to analyze. Stop Freq (MHz) - Specifies the maximum frequency to analyze. Number of Points - Specifies the number of frequency points to analyze. Points are distributed linearly between the low and high freq specified above. Max Critical Freq (MHz) - Specifies the highest important frequency that will be analyzed on any run of this circuit. See the “Maximum Critical Frequency” header in Chapter 3 (Tips) and the “MAXFRQ” entry in Chapter 11 (TPL File Format) of your =EMPOWER= manual for more details. Automatically save workspace after calc - This checkbox is handy for overnight runs to help protect against a power outage. Note that checking this box will force the entire workspace to be saved after each run. Generate Viewer Data (Slower) - Checking this box causes =EMPOWER= to generate a *.EMV file that can be loaded in the =EMPOWER= current/voltage viewer program. Selecting this box will increase the amount of time required to solve the problem. See Chapter 7 of your =EMPOWER= manual for more information on the viewer. Port number to excite - This option is available if “Generate viewer data” above is checked. It specifies which EMport to excite for viewer data. By default, mode one is excited, but if the input is multi-mode, then you can add the option -Imj to excite mode j instead. Mode number to excite - This option is available if “Generate viewer data” above is checked. It specifies which mode to excite for viewer data. Generally, mode one is excited, but if the input is multi-mode, then you can add excite any mode number up to the number of modes at that input. Turn off physical losses (Faster) - If checked, =EMPOWER= will ignore any losses specified in the =EMPOWER= Layer tab. This option is very useful to speed up any preliminary runs. Only check errors, topology, and memory (do not simulate) Useful to make sure you have the simulation and layout setup properly before a long =EMPOWER= run. 221 Dialog Boxes Co-Simulation Sweep - Specifies the frequencies at which to run simulate the lumped elements + =EMPOWER= data combination. If you have no lumped elements in your simulation, you should normally check the "Use EM Simulation Frequencies" box. For circuits with lumped elements, you can often save much time by using fewer points in the electromagnetic simulation frequencies above, allowing the co-simulation to interpolate the =EMPOWER= data before the lumped elements are added. Setup Layout Port Modes - Brings up the multi-mode setup dialog box as described in Chapter 5 (Decomposition) of your =EMPOWER= manual. If this button has exclamation points on it, then multi-mode lines are active. Thinning out (slider) - Control the amount of thinning. The default thinning out amount is 5. Setting the slider to zero turns off thinning. See your =EMPOWER= manual for details on thinning. Thin out electrical lossy surfaces - If checked, lossy metal described using electrical parameters will also be thinned. Since the thinning out model assumes that most current flows on the edges of the lines, this option will be somewhat less accurate for resistive films (where current flows more evenly throughout the material). In these cases, you should probably also check the Solid thinning option shown below. Solid Thinning out (slower) - If checked, slower solid thinning out model is used. This model restores capacitance lost due to thinning out and can be most useful for when large sections of metal have been thinned out. Use planar ports for one-port elements - This box should almost always be checked. When not checked, =EMPOWER= uses z-directed ports at each terminal for all devices. When it is checked, =EMPOWER= uses in-line ports for elements like resistors and capacitors (two-terminal, one-port devices). The only time this can cause a problem is when you have a line running "under" an element (for example, running a line between the two terminals on a resistor, in the same metal layer as the resistor pads). Add extra details to listing file - If checked, extra information which can be used to double-check your setup is inserted into the listing file. See Chapter 10 of your =EMPOWER= manual for more details. Show detailed progress messages - Turning this option off suppresses almost all output in the =EMPOWER= log. (The 222 =EMPOWER= Options listing file is not affected.) Turning it off can dramatically speed up very small runs. Command Line - Any options shown in Chapter 10 of your =EMPOWER= manual which are not covered above can be entered here. One common example is the -On option which controls the size of the box for line analysis. 223 Dialog Boxes Link to Data File Setup Filename - Specifies the file containing the Device Data to load. Browse - Opens a File Open Dialog box so that you can locate the desired data file. Number of ports - Specifies the number of ports the data file has. 224 Parameter Sweep Properties Parameter Sweep Properties Simulation to Sweep - Chooses which simulation to use for the parameter sweep. The selected simulation will be recalculated for each different value of the variable chosen below. Variable to Sweep - Specifies which variable gets changed to create the sweep. All variables which appear in the tune window (marked with '?') are available to be swept. Type of Sweep Linear: Number of Points - Allows specification of start value, stop value, and number of points Log: Points/Decade - Allows specification of start value, stop value, and number of points Linear: Step Size - Allows specification of start value, stop value, and space between points. List of Values - Allows the explicit specification of variable values. These points are entered into the List of Points box separated by spaces. 225 Dialog Boxes Edit substrate Substrate Name - The name of the current substrate. This is the name used when the substrate is saved to the library. Dielectric Const - The dielectric constant relative to free space. Loss Tangent - The substrate loss tangent. Resistivity - The metal resistivity, relative to copper. Metal Thickness - The metal thickness, using the units specified in the Units box. Roughness - The metal roughness (surface variation), using the units specified in the Units box. Units - The desired units for the dimensions specified above. Any number given here is a conversion factor from millimeters. For example, if you want meters, enter 1000. Height - The substrate height, using the units specified in the Units box. Load From Library - This loads a presaved substrate from the library. Save To Library - This saves the current substrate information into the library file. 226 Yield/Opt Settings Yield/Opt Settings Default Simulation/Data or Equations - Defines the default source for the measurements described below. Measurement - Lists which measurements to graph. See the Measurements chapter in this manual for more details. Op - Specifies the operator to use for comparison, either =, <, >, or % (flatten). Target - The desired value of the measurement Min, Max - Enter frequency (independent value) range over which apply this measurement target. In the box above, all targets apply between 2100 and 2900 MHz. Optimize Now - Allows you to start optimization from within any Optimization Target dialog box. 227 Dialog Boxes Statistics Setup Choosing Setup Variables in the Actions menu displays the following dialog box. Variable - Shows all the tunable variables which will be included in the analysis. Distribution - the random number probability distribution for each variable. Selecting Normal gives a bell-shaped (Gaussian) probability curve, whereas Uniform gives equal probability within the specified percentage range. Select Constant if you do not want a variable to vary during Monte Carlo. With a uniform distribution, components are adjusted above and below nominal, with equal probabilities for any value. A normal distribution results when a large number of independent events produce additive effects. The distribution curve is bell shaped around the nominal value. The sum of several tossed dice follows a normal distribution for repeated tries. A continuous normal distribution is approximated in GENESYS as the sum of ten independent events, each with 65,536 equally probable outcomes. The user specifies the one sigma deviation. Approximately 68.3% of component values fall within the one sigma limit. Approximately 99.7% of component values fall within three sigma limits. A significant number of values exceed one sigma deviation. Components outside three sigma limits are relatively rare. 228 Statistics Setup % Sigma - Specifies one standard deviation (as a percentage of the nominal component value). This applies if Normal Distribution is selected. % Up - Specifies the percentage tolerance above the nominal value for the selected variable. This applies if Uniform Distribution is selected. % Down - Specifies the percentage tolerance below the nominal value for the selected variable. Make all the same as the first variable - Sets all variable tolerances and types to the same value. Number of Samples - Specifies the number of random sample runs for each Monte Carlo analysis. Random Number Seed - Specifies a seed for the random number generator. Random numbers used for component distribution are derived from the specified seed. Enter an integer seed between -2000000 and +2000000. Runs with the same seed, circuit file and sample size are identical. This provides the user with both the ability to repeat a specific run or to create a virtually unlimited number of different runs of a specified sample size. 229 Chapter 8: Error Messages This chapter has four sections: General, Touchstone Export, SPICE Export, and =EMPOWER= Messages. General A fatal internal =SCHEMAX= error has occurred If this error occurs, please contact Eagleware. A node number was expected where __ was found, line This error occurs on a component line. Check the line number and change the indicated string to a node number in the editor. Ambiguous keyword __ on line __ You have abbreviated the title of a component value to an ambiguous name, such as NA for NARROW or NAME. __ can only be used with 2-port data at __. Some output parameters, such as circles and noise, are only valid for two port data. Cannot find S or Y-parameter device data file __. Check filename. The name may need a full path such as C:\EAGLE\EXAMPLES\MRF901.615 or C:\SDATA\MOTOROLA\2NXXXX\2N6618A.A03 The S- or Y-parameter file specified on a TWO code line was not found. Check the filename. Check that the file exists in the default or specified directory. The filename may need to include a pathname. Data in file __ does not cover the analysis frequency range. The data has been extrapolated. The data file does not contain data at low or high enough frequencies. The extrapolation may not be valid for the given device. Different names found on input and output of network If both the input and the output of a network are named, the names must be exactly the same. Choose one name and delete the other one. Error in format (#) line of S-parameter data file. The line beginning with "#" of the specified S-parameter data file is invalid. Check this line in the S-parameter file. Error Messages FUNCTIONs nested too deeply (__ levels maximum). Current function is __. Check to see that you have not used a recursive function (a function that calls itself). FUNCTION Parameter __ is declared twice at __ The FUNCTION declaration has two or more parameters with the same name. FUNCTION _ is declared twice (first declaration was at ) The same FUNCTION name has been reused. G and H Parameter files can only be used for loading twoport data in data file __. G and H parameters are undefined for other numbers of ports (eg, 1 or 3). Incorrect form for IF-THEN statement at __ An IF-THEN statement in the EQUATE block had an incorrect format. Incorrect function at (__) at __ =SuperStar= is expecting a function such as SIN(x) or COS(x). The indicated function is not valid. Incorrect function call __ at __ The syntax is invalid or the function name is unknown. Incorrect number of parameters sent to FUNCTION __ The number of parameters used does not match the number of parameters in the FUNCTION declaration. Incorrect number of parameters sent to MODEL __ at __ The number of parameters used does not match the number of parameters in the MODEL definition. Incorrect number of noise parameters on a line in data file __. Each frequency must include an additional four parameters The data file does not contain complete noise data on the specified line. See Chapter 5 for more information. Incorrect number of parameters at __. Check to see that the parameters are as expected. Incorrect number of RX parameters on a line in data file __. Each frequency must include two additional parameters. The data file does not include complete RX data on the specified line. See Chapter 5 for more information. 232 General Incorrect number of S-Parameters in data file __. Each frequency must include the correct number of parameters with spaces between each as the delimiter. Each line in an S- or Y-parameter data file must have nine numbers. One for the frequency in megahertz and eight for the magnitudes and angles. See Chapter 5 for details. Invalid DEFnP line for MODEL at __ The DEFnP name should match the model name. Also, check the number of nodes, it should match the DEFnP . Invalid EQUATE statement at __ There is a syntax error in the EQUATE statement. Invalid FUNCTION declaration at __ There is a syntax error in the FUNCTION declaration. Invalid GOTO statement at __ There is a syntax error in the GOTO statement. Invalid LABEL statement at __ There is a syntax error in the LABEL statement. Invalid MODEL declaration at __ There is a syntax error in the MODEL declaration. Invalid number (__) found at __ This error occurs in the equation block. =SuperStar= is looking for a number that is not present. Invalid operator (__) at __ Only valid operators may be used, such as "+", "-", "*", etc. Invalid or unknown parameter name (__) at __. Check to see that the parameter name is valid. Invalid port number used (__) in network __. Port numbers must be a single digit between 1 and 9. Invalid use of DEFnP at __. Valid Examples: DEF2P 1 5 NAME, DEF4P 1 4 3 5 COUPLER The DEF2P code must contain two nodes and a name for the network. Check the indicated line. Invalid use of not operator (~) at __ The not operator is a unary operator and must precede the value to operate on. Label __ has already been defined at __ A Label can only be used once. 233 Error Messages Libraries nested too deeply (__ levels maximum). Current filename is __. Check to see that you have not used a file that loads itself. Maximum node number is 9999 at __. Only use node numbers between 0 (ground) and 9999. MODEL __ is declared twice (first declaration was at __) The model name specified has already been defined. MODEL declarations must end with a DEFnP line at __ All models must declare the equivalent circuit followed by a DEFnP line. MODEL declarations must only have one DEFnP line, and no text may follow the DEFnP line at __ A possible cause of this is forgetting to put a block label MODEL Parameter __ is declared twice at __ The MODEL declaration has two or more parameters with the same name. Models should contain exactly one network. This schematic contains __ networks. Each model definition can only contain one model and may not contain sub-networks. Multiple port #__'s found in network __ There may be multiple networks on a schematic, but there may be only one of each port # in a network. Networks contain circular references. Cannot write file. Your schematic has two or more networks that are referring to each other. You must redesign the schematic so that circular references no longer occur. No format line (#) found in data file __. We are assuming this data file to be in MHz, __ Parameter, __, %lg ohm. Please add a format line to the data file. All data files must have a format line. No name given for a NET block. Name all NET blocks with the name of the referenced network. The NET block contains an invalid network name. No name given for a network. This name must be specified in the input. Each network must have a name on either the input or output, specified through the input or output dialog boxes. After placing the INP on the circuit, you are automatically asked for a name. 234 General No samples met yield criteria. Either Restart with slower setting or use Monte Carlo Setup to either change component tolerances or increase the number of samples. Yield optimization must find at least one sample which meets the yield criteria. No noise data found in file __. We have assumed the data to be passive. If you intend to use a device for noise analysis, you should ensure that the data file contains noise data. No values are marked for optimization. No values are marked for tuning. Values to tune or optimize must be preceded by a "?". __ only contains __-port data so __ cannot be displayed For instance, S32 cannot be displayed for a 2-port. Operator __[] can only be used with circles. Operator __[] can only be used with complex quantities. Operator __[] can only be used with gain circles. Operator __[] can only be used with noise circles. Operator __[] can only be used with stability circles. The given operator can only be used with the given type. For example, RAD can only be used with circles (to find the radius). Optimization frequencies do not cover any analysis points at __. (Requested __ to __, but nearest points are __ and __.) The frequency range requested for optimization is within the sweep range, but the discrete points do not lie on the sweep points. Port #__ connected directly to ground in network __ Ports cannot be connected directly to ground. Port #__ is missing in network __. Each network must use port numbers sequentially. Use the IN and OUT buttons to place them on your schematic. Substrate names beginning with Default cannot be saved to the library. Rename the substrate and resave it. The subtrate has Default in its name. Default is reserved for the default substrate in =SCHEMAX=. Although the default substrate can be chosen, no substrate can be named default. Too few parameters in part __ More parameters must be specified for the indicated part. Too few parameters on __ More parameters must be specified on the indicated line. 235 Error Messages Too many parameters on __ There are too many parameters on the indicated line. Too many pins for model __ used in part __. The element used in =SCHEMAX= for a model has too many pins (terminals). Two or more format (#) lines found in data file __. Data files can only contain one format line. Undefined substrate __ used in part __ You must specify the substrate you want to use in the dialog box for each part. Use the Substrate menu to add a substrate or edit an already existing substrate. Undefined variable __ or incorrect mathematical function A variable was used in the CIRCUIT or EQUATE blocks which hasn't been assigned a value. Undefined variable __ or incorrect mathematical function during MODEL expansion at __ An undefined variable was found inside a MODEL declaration. Edit the model to fix the problem. __: Unknown label in equation block A label was specified by a GOTO which was not defined. Unknown variable or invalid number __ at __ Check the spelling for a variable, or make sure that the letter O is not used for a zero (0). Unmatched parentheses at __ Unmatched opening or closing parentheses were found. Unnamed NET block found in network __. Name all NET blocks with the name of the referenced network. Name all NET blocks with existing network names. Unrecognized keyword (__) on line __ The command indicated is not a =SuperStar= keyword. Warning: Part connected between grounds has no effect. There is a part that has ground on both ends. Note that a voltage source is considered an RF ground. Unknown Operator __[]. The specified operator is not correct. See Operator reference. Measurement "__" does not contain an operator, such as DB[] (e.g., DB[S21]). An operator must be specified for all measurements in equation blocks 236 General For example, Change Linear1.Sch1.S11 to Linear1.Sch1.DB[S11]. There are no global equations in this workspace. Select Equations from the Workspace menu to create equations. Measurement "__" cannot be used without global equations. You have requested to graph or optimize equation data, but none was found. Equate variable "__" does not swept (x vs. y) data. Normal numbers and matrices cannot be used as measurements. Create a Variable Viewer output to see the values of variables. Analysis/Data "__" does not contain "__". Measurement "__" cannot be created. Analysis/Data "__" contains multiple members. You must specify which data within the analysis to use. Measurement "__" cannot be created. Workspace "__" does not contain Analysis/Data "__". Measurement "__" cannot be created. Workspace "__" not found. Measurement "__" cannot be created. Workspace/Analysis/Data "__" not found. Measurement "__" cannot be created. Workspace "__" contains multiple Analysis/Data items. You must specify analysis/data to use. Measurement "__" cannot be created. See the measurements chapter in the reference manual for details on creating measurements. Too many periods in measurement "__". See the measurements chapter in the reference manual for details on creating measurements. The default context for equation based measurements must be "Equations". Context "__" is invalid. See the measurements chapter in the reference manual for details on creating measurements. This file was saved in a newer version of GENESYS and may not be compatible with this version. You should not attempt to load files from a newer verion of GENESYS, such as 7.0, into an older version, such as 6.5. 237 Error Messages Touchstone Export Error in Touchstone Validation parameter (TCHVALID). This error should not occur. Error in Touchstone Parameter Translation (TCHPARM). This error should not occur. If units other than MM are used, CPL/TLP parts must not use a variable or a tuned value for length. The indicated part has a variable or tuned length, but the current substrate uses units other than 1. Warning: In Touchstone, attenuation in CPL/CLINP is not frequency dependent. Touchstone's attenuation is constant with frequency, and may vary from =SuperStar='s frequency dependent model. Warning: In Touchstone, attenuation parameters are required in CPL/CLINP. Using 1E-9 for AE and AO. The indicated part is missing attenuation parameters. The value shown has been substituted during translation. Warning: In Touchstone, frequency and attenuation parameters are required in TLE/TLINP. Using 1E-9 for A and 1000 for F in part __. Either frequency or attenuation was left out of the indicated part. The values shown have been substituted. Incomplete or missing parameter on line __ of text portion of schematic. The line does not have a complete parameter list. Invalid output types (__). The indicated output selection is not supported. Missing frequency in FREQ block. The FREQ block is missing a parameter. Check the output request line for missing parameters. Missing frequency in OPT block. The OPT block is missing a parameter. Check the optimization requests for missing parameters. Missing parameter in part __. The part is missing a required value for translation. Missing parameter in substrate __ used in part __. The indicated substrate is missing a required parameter for translation of the indicated part. 238 Touchstone Export Warning: MST asymmetrical does not have a Touchstone equivalent in part __. Using symmetrical. Self explanatory. Warning: MVH radius cannot be tuneable in part __. A tuneable radius is not allowed for translation. Warning: Only one unit type per circuit is allowed. Conflicting units were found on different substrate declarations. Units must be consistent throughout the circuit for translation. Required parameter (_) was not given in part _ of type _. A parameter was not given which is Touchstone requires. There is no schematic to translate! The schematic is empty Touchstone does not support __ in part __. The indicated part is not supported for translation. Touchstone does not support E12 for optimization. E12 has been selected for optimization, but cannot be translated. Touchstone does not support E12 for output. E12 has been requested, but cannot be translated. Warning: Touchstone does not support full nodal noise analysis. Noise figure data was requested, but is not available for complete circuit simulation (Available for devices only). Touchstone does not support IF, GOTO, and LABEL from the =SuperStar= EQUATE block. Conditionals were found in the EQUATE block, but are not supported for translation. Warning: Touchstone does not support Polar charts (POL), using Smith charts instead. POL in the WINDOW blocks has been translated to SMH. Warning: Touchstone does not support the flatten operator (%). The delay flatten operator is not supported in Touchstone. Warning: Touchstone does not support Zo. In Touchstone, these elements use the terminating impedance of the network as Zo. Warning: Touchstone does not support thickness. Use care: The resulting simulation may not be accurate. 239 Error Messages Touchstone only supports a transformer secondary of one in part __. The indicated transformer must use a secondary of 1. Divide each side by the secondary number to adjust, if no variables are used. Warning: __ - Touchstone only supports one frequency range per circuit file. More than one frequency range has been specified, but only the first will be used. Touchstone only supports one set of terminations per 2-port name. Window __ is used more than once with different terminations. The indicated window has been used before with different terminations. This is not allowed in Touchstone. Touchstone only supports the TR (turns ratio) transformer option in part __. The indicated transformer has impedance ratio selected, but must use turns ratio for translation. Warning: Touchstone parts PRC, PRL, PRLC, SRC, SRL, and SRLC do not support Q in part __. The element has been translated using ideal L's and C's. Touchstone requires nodes 3 and 4 of GYR (gyrator) to be grounded in part __. The indicated nodes must be connected directly to ground. Touchstone requires the third node of NET parts to be grounded in part __. The third node of the indicated network block must be connected directly to ground. Touchstone requires the last node to be grounded in THR, FOU, and NPO in part __. The indicated node must be connected directly to ground. Touchstone substrate model for __ requires a height The part requires a height, but none was specified. Touchstone translations don't support postprocessing. Combined responses are not translatable. Touchstone uses only specific units. Valid values are: 0.001(UM), 0.0254(MIL), 1.0(MM), 10(CM), 25.4(IN), and 1000(M). Check the default substrate. One of the substrates contained in the circuit does not use one of the above units. 240 Spice Export Touchstone's BIP and FET models are not compatible with =SuperStar=. Use TWO instead. The models used by Touchstone do not coincide with the =SuperStar= transistor models. Use S-Parameter devices instead, or edit the translated file and use a Touchstone model. Warning: Touchstone's TLIN model does not use an attenuation model in part __. The indicated part has an attenuation specified, but Touchstone's model will not include it. __ - Unknown frequency code. The indicated line contains an error. Unrecognized DSP option __. The indicated paramter is not supported for display, and cannot be translated. Unrecognized GPH option __. The indicated option is not supported for output selection. Validation error (__) in part __ of type __. The part cannot be translated accurately to Touchstone due to the condition shown. Variables cannot be used in place of frequency in FREQ block. A variable, or non-number has been used where a number should have been in the FREQ block. Variables or tunable elements may not be used within the MUI model in part __. The indicated part contains variables or tunable values, and cannot be translated. Spice Export Warning: Cannot find subcircuit __ referenced by __ in circuit __. An undefined network name was referenced in the indicated circuit. Equations with operators (such as '+' or '-') can't be exported to Spice. The first illegal line is __. Edit the text and replace it with a simple assignment such as X=5. The indicated line contains an illegal equation. Error writing file __. The indicated file was not written due to a file error. 241 Error Messages Invalid filename, cannot write Spice file. The filename chosen is not valid, and can't be written to. Invalid subcircuit reference at nodes __. The indicated nodes are connected to an undefined or unnamed subcircuit. Warning: OpAmp subckt X$__ is a only a simplified approximation; Crossover frequency is not modeled. The indicated op-amp does not model frequency-dependent gain. Primary Circuit (_) not found. Check Spice Preferences. An undefined network name was given for the primary circuit translation. Selected SPICE version(__) does not support __ parts. The SPICE target version does not support the part. SPICE does not support __ parts. SPICE does not support the indicated parts. Spice does not support ideal TRF's. Part __ should be replaced by an MUI. The indicated part is not an ideal transformer. Instead, use mutually coupled inductors (MUI). There is no schematic to translate! Export was selected, but there is no schematic loaded. User defined device __ at nodes __ is missing user parameters. The indicated device is missing parameters. =EMPOWER= All PADs will be normalized to ___ Ohms to generate viewer data. Terminations for internal ports are not defined in =EMPOWER= unless the normalization impedance is entered directly in the -NI option. The terminations are necessary only to compute data for visualization. The internal inputs will be terminated by the impedance specified in this message (1 Ohm) to generate the viewer data files *.EMV and (or) *.PLX. Bad frequency range (___ to ___) at ___ The frequencies F0 and F1 from the EMFRQ line should be positive, and F0 must be less than or equal to F1. 242 =EMPOWER= Both physical and electrical parameters specified at ___. Physical parameters will be used. Either physical (RHO, TMET, ROUGH) or electrical (Z) parameters of a surface can be used to describe the physical properties of a a top or bottom wall in the package block or a surface in the geometry block, but not both. Cannot normalize impedance matrix. Normalization failure due to uncertain or zero value of an external port normalization impedance. Check the geometry of the problem, delete relevant de-embedding data files (*.RGF or *.Ln) and rerun. Cannot transform immitance matrix to S-matrix. The normalized impedance or admittance matrix of the problem is singular. This happen for some particular circuits and as an aftereffect of a resonance occurring in the structure. A chance of the last event is very low, so change slightly frequencies or introduce physical losses in the structure and if the problem persists check the normalization coefficients and the geometry. Contact support group. Occurred: ___. An unexplainable problem occurred in the specified program block. It could be a warning or a fatal error. Check the geometry, delete all output and auxiliary files related to the problem and rerun. If it did not help, send Eagleware the schematic or TPL file and all relevant input data files. Dielectric constant of media layer number __ (___) is invalid. Must be > 1, and < __. The relative permittivity of a media layer must be real value greater then or equal to 1 and less then the indicated value. Different order of the inputs regions. A multiconductor or multimode line segment should have modally connected ports at the opposite sides of the segment numbered sequentially starting from one side of the box. It is valid if the line analysis mode is directly specified (EMLINE), otherwise the structure with wrong numeration will be treated as a discontinuity with different inputs at the opposite sides of the segment. Duplicate PORT/PAD node number found at ___. All inputs must be enumerated sequentially and have distinct numbers. END_PACKAGE not found. The package block of the TPL file must be terminated by the END_PACKAGE line. 243 Error Messages Error: Normal =EMPOWER= ports (shown in gray) must have lower numbers than nondeembedded ports or pads (white). For example, you should switch the port numbers on =EMPOWER= ports __ and __. All inputs must be enumerated sequentially and have distinct numbers. Also, the inputs to be de-embedded must be enumerated first. Fatal Error: Can not open file: ___ A generic message for all kinds of files. The most common case: the specified TPL file (input data file) does not exist in the specified directory. This message may also arise if the program can not open exchange files (*.SS,*.Rn), an admittance matrix file (*.Y) or a de-embedding data file (*.RGF or *.Ln). A crash of the program in a previous run could cause it. Try to fix corrupted files before further runs. Fatal Error: Can not open output file: ___ A listing file open error. The listing file might be corrupted for some reason, or your hard drive might be full Fatal Error: Can not read from file: ___ An error when reading a de-embedding file (*.RGF or *.Ln) or an admittance matrix file (*.Y). Delete the file and rerun =EMPOWER=. Fatal Error: Can not set position in file: ___ An error when reading or writing a de-embedding file (*.RGF or *.Ln) or an admittance matrix file (*.Y). Delete them and rerun =EMPOWER=. Fatal Error: Can not write to file: ___ An error when writing a de-embedding file (*.RGF or *.Ln) or an admittance matrix file (*.Y). Delete the specified file and rerun =EMPOWER=. Also, check hard drive space. Fatal error: Not enough memory. The problem does not fit to the total available RAM of the computer. Check out all messages of the memory estimation program in the listing file (MEMORY section) and try to figure it out how to reduce the problem (see the Tips Chapter). If everything is as expected you can use the -VM option to let the program use the virtual memory more freely, however, adding more RAM is a better solution. The program only allows the use of virtual memory in a rational way and this message occurs only if some computationally intensive parts of the simulation require substantial hard disk space to be completed. 244 =EMPOWER= Fatal Error: Out of memory during parsing of input file. An error occurred related to allocation of memory during processing of the TPL file. Fatal Error: Wrong file label: ___ The program tried to treat a wrong file as a descriptor file (*.Y) or a de-embedding file (*.RGF or *.Ln). The descriptor file should begin with the label YMT, and the de-embedding file always starts with the RGF. Check it out, remove the relative files and rerun. Fatal Error: Wrong file version: ___ Can occur when running a new version of =EMPOWER= with some files prepared using a previous version of the program (or vice versa). It happens only if the format of the file has been changed and are not compatible. Few topology definitions for layer number __. Each signal layer geometry block must have a distinctive number corresponding to the signal layer in the package block. (Multilevel signal layer version only, should not occur yet as of the printing of this manual.) File name too long. The total length of a file name (including path) must be less then 256 characters. First Polygon point (X1,Y1) must be specified at ___ Polygonal region vertexes must be enumerated and entered sequentially starting from (X1,Y1). Height of media layer number __ (___) is invalid. Must be > __, and < __. An acceptable media layer thickness or height value is constrained by the values indicated in the message. The actual value and limits are given in meters. Illegal description of layer number __. The signal or metal layers (the LAYER keyword) must be numbered starting from 1 and entered sequentially in the package block. Illegal dimension of package along __ axis( ___ ). The shielding box dimensions along X- and Y-axis defined in the SIZE line must be real positive numbers greater then zero. Illegal keyword (___) in description of ___ wall at ___ The top and bottom wall TYPE parameter can assume values METAL, MAGNETIC or OPEN. 245 Error Messages Illegal number of parameters at ___ The frequency sweep line EMFRQ must have three parameters: F0, F1 and COUNT. In line mode, only rectangles and ports may be used. A structure can be treated as a line segment if it contains only external inputs (PORT) and rectangular metallized regions (RECT). Inappropriate line length (___ mm) for analysis at ___ MHz. Decrease length and try again. The structure in the line analysis mode does not behave as a line segment due to some irregularities or singularities inside. Thus, the line parameters and de-embedding data could not be calculated. Change the line segment length if you are trying to analyze a line. If this happens during automatic de-embedding, change the default lengths of the line segments using the command line option -On (n>1). Information: Bottom and top coordinates are reversed on some elements. Coordinates X1, Y1 in the RECT descriptor should correspond to the left bottom corner and X2,Y2 should correspond to the right top corner of a rectangular region. Information: Left and right coordinates are reversed on some elements. Coordinates X1, Y1 in the RECT descriptor should correspond to the left bottom corner and X2,Y2 should correspond to the right top corner of a rectangular region. Input __, mode __ will be excited instead of specified input __, mode __. Either the port or mode number specified in the options -In and Im to excite an incident eigenwave do not correspond to a port or mode of the actual structure. The program will set a default incident wave. Input number __ doesn't touch side wall. The external ports should touch a sidewall. The proximity is controlled by the input position parameter TOLERANCE. Input number __ has regions with different lengths. All surface current regions of the modally coupled external port should have equal lengths along the line to be excited. Invalid current/voltage direction parameter (___) at ___ The current direction parameter (CD) can assume values X, Y or 246 =EMPOWER= Z for inputs, or X, Y, Z, XY, XZ, YZ, or XYZ for rectangular and polygonal regions. Invalid DELTA (grid size) along ___ axis (___). Must be >__ and < __. The grid cell sizes along X- and Y-axis must be within the indicated limits. Invalid layer type (___) at ___ The layer type can assume value CURRENT (strip-type metal) or VOLTAGE (slot-type metal). Invalid line direction parameter (___) at ___ The line direction parameter (LD) can take on value X or Y for a line oriented along corresponding coordinate axis. Invalid or missing SIZE and DELTA in package. The shielding box size (SIZE) and the grid cell size (DELTA) descriptors are mandatory in the package sub-block. Line segment too long to extract non-propagating mode: f=___ MHz: aras=___, arbs=___. Since a non-propagating eigenwave in the structure decays too much on the length of the line segment, it is impossible to evaluate parameters of the mode and de-embedding data. It could be the consequence of a wrong definition of the input regions and approaching line metallization. Line should have two inputs at opposite sides of the box. The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. There must be two external inputs in the structure to be treated as a line segment. Missing DEFnP line at end of input file. The CIRCUIT block should end with the DEFnP line. Missing frequency sweep. The PACKAGE section must specify a frequency sweep. The frequency sweep must be defined in the EMFRQ line of the package block. Network ___ is missing port number __. Each number used in the DEFnP line must have a corresponding port. The DEFnP line must contain a table of numbers of all external and internal ports, where n is the total number of ports. The inputs must be enumerated in the order that you want them to be referenced in the data files (external first). 247 Error Messages No EM ports were found. Please add EM ports and re-output the TPL file. The structure to be analyzed must have at least one external or internal port. No substrate (MEDIA) layers were defined. The structure to be analyzed must have at least two media layers (the MEDIA keyword) and one signal or metallization layer (the LAYER keyword) between them in the package section. Check the =EMPOWER= Layer settings in the =LAYOUT= Preferences dialog. Number of grid points along axes is too large. Carefully check the package SIZE and DELTA. ((SIZEX/dx)+1)*((SIZEY/dy)+1) should not be >__. Either the shielding box is too large or grid cell is too small to map the problem on the grid. Only two inputs should be used in line analysis mode (not __). The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. If the inputs near one box side are modally coupled, they should be enumerated properly and put in parentheses in the DEFnP line. Opposite inputs in line analysis mode have different lengths. The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. All surface current regions must have equal dimensions along the line in the line analysis mode. Opposite inputs in line analysis mode have different number of modes. The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. The number of input regions must be equal at the opposite sides of the line segment in the line analysis mode. Opposite inputs in line analysis mode have different regions or incorrect order of regions. The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. The input regions at the opposite sides of the box must be enumerated sequentially starting from the same sidewall and the whole structure must have a reflection symmetry. A small deviation of an port position could cause different mapping on the grid and finally give a difference in region positions. 248 =EMPOWER= Opposite inputs in line analysis mode have different shift regarding to sidewalls. The structure to be analyzed in the line analysis mode (EMLINE) does not meet the line segment requirements. The input regions at the opposite sides of the box must be enumerated sequentially starting from the same sidewall and the whole structure must have a reflection symmetry. A small deviation of an port position could cause different mapping on the grid and finally give a difference in region positions. Package dimension along ___ axis is not an integer multiple of the grid size (__!=__x__). The box size along X- or Y-axis must be equal to an integer number of the grid cell size along corresponding axis. PACKAGE must be defined before ___ can be used at ___ The package block is mandatory and must precede to the geometry definition block. See general description of the CIRCUIT block. PAD nodes cannot be multi-mode at ___. Only the external inputs or PORTs can be modally coupled and put in the parentheses in the DEFnP line. The internal inputs or PADs are always just places to connect a lumped element or an energy source. PAD number __ does not appear on the grid. After mapping on the grid each input region must be represented by at least one pair of the grid terminals. If a PAD region either is smaller then the grid cell and not positioned properly on the grid or is out of the shielding box, it will not appear on the grid and the error occurs. The number indicated in the message corresponds to the order number of the PAD in the DEFnP line (count modally coupled inputs as one). Permeability of media layer number __ (___) is invalid. Must be >1, and < __. The relative permeability coefficient of a media layer must be a real value greater than or equal to 1 and less than the indicated value. PORT nodes must come before PAD nodes in the DEFnP statement at ___. The DEFnP line must contain all external (PORT) and internal (PAD) port numbers and the external ports must be enumerated before the internal ones. n in the DEFnP is the total number of inputs. 249 Error Messages Port number __ is too small and does not appear on the grid. A port region must be either commensurable with the grid cell or positioned properly in accordance with the grid definition to be mapped as at least one pair of the grid terminals. Otherwise it does not appear on the grid and the circuit cannot be simulated. The number indicated in the message corresponds to the order number of the PORT in the DEFnP line (count modally coupled inputs as one). PORT/PAD node __ used at ___ is not in the DEFnP line. All inputs in the structure must be enumerated in the DEFnP line (the external inputs first). The indicated input number is the actual number specified in the corresponding PORT/PAD line. Ports overlap (__ terminals). Input regions can not intercross each other. The overlapping could happen if some input regions are not commensurable with the grid cell and/or they are incorrectly positioned on the grid. Regions (rectangles and ports) in line analysis mode are described incorrectly. All rectangular regions defining metallization patterns in the line analysis mode must have dimensions along the line segment greater or equal to the box size along the line minus double size of the input region along the line. Additionally, if the dimensions are the minimum possible, the rectangles have to be positioned symmetrically about a plane situated a half way between the opposite inputs. In other words, the metal rectangular regions must be long enough to connect input regions at the opposite sides of the box in the line analysis mode. Resonance in the structure at frequency ___ MHz. Change frequency or add losses. A box mode resonance in the structure. Possible ways to fix it are: changing frequency point, changing box dimensions, and adding physical losses. Singular inverting matrix. Input data may be incorrect, or there may be a resonance in the structure. A box mode resonance in the structure. Possible ways to fix it are: changing frequency point, changing box dimensions, and adding physical losses. Structure has no inputs. The structure to be analyzed must have at least one external (PORT) or internal (PAD) port. 250 =EMPOWER= The package was not defined. You must include MEDIA and LAYER descriptions. The structure to be analyzed must have at least two media layers (the MEDIA keyword) and one signal layer (the LAYER keyword) between them defined in the package sub-block. Check the =EMPOWER= Layer settings in the =LAYOUT= Preferences dialog. There must be a substrate (MEDIA) layer above the topmost metal LAYER. There must be at least one media layer (the MEDIA keyword) between the signal or metallization layer (the LAYER keyword) and and the top cover of the shielding box. Check the =EMPOWER= Layer settings in the =LAYOUT= Preferences dialog. There must be a substrate (MEDIA) layer below the bottommost metal LAYER. There must be at least one media layer (the MEDIA keyword) between the signal or metallization layer (the LAYER keyword) and the bottom cover of the shielding box. Check the =EMPOWER= Layer settings in the =LAYOUT= Preferences dialog. There was not a substrate layer above the topmost used metal layer (___). You should add a substrate (possibly air, Er=1) above this layer. There must be at least one media layer between the metal or signal layer and the top cover of the shielding box. Check the =EMPOWER= Layer table settings in the =LAYOUT= Preferences dialog. There was not a substrate layer below the bottommost used metal layer (___). You should add a substrate (possibly air, Er=1) below this layer. There must be at least one media layer between the metal or signal layer and the bottom cover of the shielding box. Check the =EMPOWER= Layer table settings in the =LAYOUT= Preferences dialog. Too few points in POLYGON at ___. There must be at least 3. A polygonal region (POLYGON) must have at least three vertices. Too many modes for port at ___. The max number __. The number of regions (PORTs) in the modally coupled external input is limited to the indicated number. 251 Error Messages Too short line segment for analysis. There must be at least two grid cells between inputs at the opposite sides of a line segment in the line analysis mode. Either increase the box size or decrease the grid cell size along the line segment. Topology for layer number __ is not defined. Each signal or metal layer defined in the package sub-block must have corresponding geometry definition section (begins with LAYER N=... in the geometry block). Unexpected topology of layer __. Define reference in PACKAGE block. Each geometry definition section (begins with LAYER N=... in the geometry block) must be described first as a signal or metal layer (the LAYER keyword) in the package sub-block. Otherwise, the position of the layer is uncertain along z-axis. Warning: High impedance analysis error at ___ MHz (R1=___ R2=___). An unusually large computational error was detected during a line segment analysis. A possible cause is a box resonance in the structure. A likely aftereffect is some additional error in the calculated generalized scattering matrix. Warning: High Y-matrix calculation error at ___ MHz. The structure in the line analysis mode does not behave as a line segment due to some stray coupling between the opposite input ports. Consequences are unpredictable. Thus, check calculated line parameters and de-embedding data. If they does not look right, either change the line segment length if you try to analyze a line or change default lengths of line segments using the command line option -On (n>1) if it happened during the automatic de-embedding. Warning: Losses in line analysis mode will be omitted. A line segment in the line analysis mode (EMLINE) must be lossless. To estimate an eigenwave attenuation, analyze the segment as a discontinuity and then get the attenuation by dividing the eigenwave transformation coefficient by the segment length. Warning: May be high errors in mode characteristics.f=___ MHz: term1=___, term2=___. When analyzing the line segment, either high error in calculated evanescent mode parameters or some propagating mode turned into non-propagating due to stray couplings between the opposite input regions. Try to change either the line segment 252 =EMPOWER= length (the option -On, n>1 for the automatic de-embedding) or shape and position of the input surface current regions. Warning: One frequency point specified, but start and end are different at ___. Using start frequency. It is assumed that the start (F0) and end (F1) frequencies are equivalent if only one frequency point (COUNT) is specified in the EMFRQ line. Warning: Reduction of terminals are not available in this version. The reduction coefficient (N or M) different from 1 is specified for a rectangular (RECT) or polygonal (POLYGON) region. Currently, these parameters are not available and should be set to one. Warning: Too little wavelength to mesh size ratio along ___ axis (___). The program tracks the minimum wavelength to grid cell size ratio. It is assumed that the results of EM analysis are accurate if this value is not less than 20. The wavelength here corresponds to the TEM wave in the media with maximal relative permittivity and permeability at the specified maximal critical frequency (MAXFRQ). Ignore this message in preliminary solutions or if the structure contains some media layers with large permittivity or permeability and would not have muc h affect on the solution. Warning: Z-directed currents flow through an overly thick media layer. Via-holes and Z-directed internal inputs are assumed to have a uniform current across the entire media layer. This approximation has little consequence unless the thickness of the media layer exceeds l/10 to l/20. The threshold for this message is l/10. You may proceed with the simulation but if good grounding through via holes or accurate via hole simulation is critical in your circuit then a thinner substrate is recommended. Thick substrates also lead to excessive radiation from a circuit. Z-directed currents can not go to open or magnetic wall. Via-holes and Z-directed internal inputs can be connected only between the signal or metal layer and the metal top or bottom cover of the shielding box. Check the type of the box covers and the destination layer for Z-directed currents. Zero frequency points specified at ___. The number of frequencies (COUNT) specified for frequency sweep in the EMFRQ line should be a positive integer number greater than or equal to one. 253 Chapter 9: Reference Tables Loss Tangent The dielectric loss tangents of some common materials are: Material tanD at 100 MHz tanD at 10 GHz Air 0.0 0.0 Polyolefin, irradiated 3E-4 3E-4 PTFE 2E-4 RT/Duroid 5880, PTFE microglass 5E-4 9E-4 PTFE, glass microfiber 5E-4 9E-4 PTFE, woven quartz 6E-4 6E-4 PTFE, woven glass 1.5E-3 2E-3 Polystyrene, cross linked 2E-4 7E-4 Polystyrene, glass microfiber 4E-4 2E-3 Quartz, fused 2E-4 6E-5 G10 Epoxy glass 8E-3 No Data 1.5E-4 Pyrex glass 3E-3 7E-3 Alumina, 99.5% 1E-4 1E-4 RT/Duroid 6010.5, PTFE ceramic 2E-3 2.3E-3 The dielectric loss tangents for some materials commonly used in coaxial cables are: Reference Tables Material tanD at 100 MHz tanD at 3 GHz Air 0.0 0.0 PTFE 2E-4 15E-4 PolyEthylene, DE-3401 2E-4 3.1E-4 Polyolefin, irradiated 3E-4 3E-4 Polystyrene 1E-4 3.3E-4 Polyvinal formal (Formvar) 1.3E-2 1.1E-2 Nylon 2E-2 1.2E-2 Quartz, fused 2E-4 6E-5 Pyrex Glass 3E-3 5.4E-3 Water, distilled 5E-3 1.6E-1 Note: This data is for solid materials. Foamed materials have lower loss tangents. These data are approximate. Consult manufacturer for critical applications. Metal Thickness The thickness of the conductor metallization for planar structures. The algorithms for microstrip are most accurate for thin metallization, but both loss and Zo are corrected for thickness. For stripline, the algorithms are more accurate to thicker metallization. Thickness to 0.1*b or to the width is permissible. Commonly used thicknesses: Metallization Type Thickness (mm) Thickness (mils) ½ ounce copper 0.018 0.71 1 ounce copper 0.036 1.42 2 ounce copper 0.072 2.83 Relative Dielectric Constants Er is the substrate or dielectric constant, relative to free space. Following are constants of some common materials: 256 Relative Permeability Material Dielectric Constant Air 1.0 Alumina, 99.5% 10 G10/FR4 Epoxy glass 4.8 (varies) PolyEthylene, DE-3401 2.26 Polyhexamethyleneadipamide (Nylon) 2.9 Polyolefin, irradiated 2.32 Polystyrene 2.53 Polystyrene, cross linked 2.53 Polystyrene, glassed cross linked 2.62 PolyTetraFluoroEthylene 2.10 Polyvinal formal (Formvar) 2.8 PTFE, glass microfiber 2.35 PTFE 2.10 PTFE, woven glass 2.55 PTFE, woven quartz 2.47 Pyrex glass 4.84 Quartz, fused 3.8 RT/Duroid 2.20 RT/Duroid, PTFE ceramic filled 10.5 Water, distilled 77 Note: Foamed materials have lower dielectric constants. These data are approximate; consult manufacturer for critical applications. Relative Permeability MUr is the substrate permeability, relative to free space. Most line types do not allow substrates or dielectrics with magnetic properties. Resistivity The line’s metalization resistivity relative to copper. Some common values are: 257 Reference Tables Material Resistivity Relative to Copper Copper, annealed (1.7e-8 ohm meters) 1.00 Copper, hard drawn 1.03 Silver 0.95 Gold 1.42 Aluminum 1.64 Tungsten 3.25 Zinc 3.4 Brass 3.9 Cadmium 4.4 Nickel 5.05 Phosphor-bronze 5.45 Platinum 6.16 Stainless Steel, 18-8 52.8 See Also: Surface Roughness Loss Tangent Surface Roughness Conductor losses increase with larger values of surface roughness. Approximate values for copper PWB surface roughness: Electrodeposited Copper Sr value (mm) Sr value (mils) ½ ounce 0.0019 0.075 1 ounce 0.0024 0.094 2 ounce 0.0029 0.114 Rolled Copper Sr value (mm) Sr value (mils) ½ ounce 0.0014 0.055 1 ounce 0.0014 0.055 2 ounce 0.0014 0.055 258 Chapter 10: S Parameters Overview The purpose of this chapter is to summarize network analysis concepts and to define some of the parameters plotted by =SuperStar=. Networks are considered as "black boxes". Because the networks are assumed to be linear and time invariant, the characteristics of the networks are uniquely defined by a set of linear equations relating port voltages and currents. A number of network parameter types have been developed for this purpose, including H, Y, Z, S, ABCD, and others. These parameters may be used to compute and display network responses and to compute quantities useful for circuit design such as Gmax (maximum gain) and gain circles. Each parameter type has advantages and disadvantages. Carson [1] and Altman [2] provide additional information. Introduction S-parameters have earned a prominent position in RF circuit design, analysis, and measurement. Parameters used earlier in RF design, such as Y-parameters, require opens or shorts on ports during measurement. This is a nearly impossible constraint for high-frequency broadband measurements. Scattering parameters [3, 4] (S-parameters) are defined and measured with the ports terminated in a characteristic reference impedance. Modern network analyzers are well suited for measuring Sparameters. Because the networks being analyzed are often employed by insertion in a transmission medium with a common characteristic reference impedance, S-parameters have the additional advantage that they relate directly to commonly specified performance parameters such as insertion gain and return loss. Two-port S-parameters are defined by considering a set of voltage traveling waves. When a voltage wave from a source is incident on a network, a portion of the voltage wave is transmitted through the network, and a portion is reflected back toward the source. Incident and reflected voltage waves may also be present at the output of the network. New variables are S Parameters defined by dividing the voltage waves by the square root of the reference impedance. The square of the magnitude of these new variables may be viewed as traveling power waves. 2 |a1| = incident power wave at the network input 2 |b1| = reflected power wave at the network input 2 |a2| = incident power wave at the network output 2 |b2| = reflected power wave at the network output These new variables and the network S-parameters are related by the expressions: b1 = a1S11 + a2S12 b2 = a1S21 + a2S22 S11 = b1/a1, a2 = 0 S12 = b1/a2, a1 = 0 S21 = b2/a1, a2 = 0 S22 = b2/a2, a1 = 0 Terminating the network with a load equal to the reference impedance forces a2 = 0. Under these conditions S11 = b1/a1 S21 = b2/a1 S11 is then the network input reflection coefficient and S21 is the gain or loss of the network. Terminating the network at the input with a load equal to the reference impedance and driving the network from the output port forces a1 = 0. Under these conditions S22 = b2/a2 S12 = b1/a2 S22 is then the network output reflection coefficient and S12 is the reverse gain or loss of the network. Linear S-parameters are unitless. Since they are based on voltage waves, they are converted to decibel format by multiplying the log of the linear ratio by 20. It is not always obvious whether an author is refering to linear or decibel parameters. To avoid this confusion, the book Oscillator Design and Computer Simulation and Versions 5.4 and earlier of =SuperStar= use C for linear S-parameters and S for the decibel form. This is somewhat unconventional. Version 6.0 and later of 260 Stability GENESYS also supports the convention MAG[S21] which is linear and DB[S21] which is the decibel form. With reflection parameters, the linear form is often refered to as a relection coefficient and the decibel form as return loss. S11(dB)=input reflection gain=20 log S11 S22 (dB)=output reflection gain=20 log S22 S21(dB)=forward gain=20log S21 S12(dB)=reverse gain=20log S12 S21 and S12 are the forward and return gain (or loss) when the network is terminated with the reference impedance. The gain when matching networks are inserted at the input, output, or both is described later. S11 and S22 coefficients are less than 1 for passive networks with positive resistance. Therefore, the input and output reflection gains, S11 and S22, are negative decibel numbers. Throughout Eagleware material, the decibel forms S11 and S22 are referred to as return losses, in agreement with standard industry convention. To be mathematically correct, they have been left as negative numbers. As such, the rigorous convention would be to call them return gain. Input VSWR (VSWR1) and S11 are related by VSWR1 = ( 1 + |S11| ) / ( 1 - |S11| ) The output VSWR is related to S22 by an analogous equation. A circle of constant radius centered on the Smith chart is a circle of constant VSWR. The complex input impedance is related to the input reflection coefficients by the expression: I1 = Zo ( 1 + S11 ) / ( 1 - S11 ) The output impedance is similarly related to S22. Stability Because S12 of devices is not zero, a signal path exists from the output to the input. This feedback path creates an opportunity for oscillation. The stability factor, K, is 2 2 2 K = ( 1 - |S11| - |S22| + |D| ) / (2 |S12| |S21|) where D = S11S22 - S12S21 261 S Parameters From a practical standpoint when K>1, S11<1, and S22<1, the two-port is unconditionally stable. These are often stated as sufficient to insure stability. Theoretically, K>1 is insufficient to insure stability, and an additional condition should be satisfied. One such parameter is B1 which should be greater than zero. 2 2 2 B1 = |S11| - |S22| - |D| > 0 Stability circles may be used for a more detailed analysis. The load impedances of a network which ensure that S11<1 are identified by a circle of radius R centered at C on a Smith chart. The output plane stability circle is * * 2 2 Cout = (S22 - DS11 ) / (|S22| - |D| ), Rout = | S12S21 / (|S22| 2 - |D| ) | 2 This circle is the locus of loads for which S11 = 1. The region inside or outside the circle may be the stable region. The input plane stability circle equations are the same as the output plane equations, with 1 and 2 in the subscripts interchanged. Shown in the figure below are the input plane stability circles on the left and the output plane stability circles on the right for the Avantek AT10135 GaAsFET. The shaded regions are potentially unstable. At the input, the stability circle with marker 1 indicates sources with a small resistive component and inductive reactance of about 200 ohms are unstable. Circles 2 and 3 are also unstable with low resistance and certain inductive source impedances. At the output plane on the right, at 500 MHz, a wide range of inductive loads is potentially unstable. When designing an amplifier the first step is to examine the stability circles of the device without the matching circuit present. The grounding which will be present at the emitter or source 262 Matching should be included in the analysis. This stability data is used to 1) add stabilizing components such as shunt input and output resistors for bipolars or inductance in the source path for GaAsFETs and to 2) select an input and output matching network topology which properly terminates the device (at low and high frequencies) for stability. In the example above, matching networks with a small series capacitor adjacent to the device would insure capacitive loads at low frequencies, thus enhancing stability. This is probably sufficient for the input. However, considering that device Sparameter data is approximate and since the output plane of this device is more threatening, it would be prudent to stabilize this device in addition to using series capacitors. Note: Stability should be checked not only at the amplifier operating frequencies, but also over the entire frequency range for which SParameter data is available. Matching One definition of network gain is the transducer power gain, Gt: Transducer power gain is the power delivered to the load divided by the power available from the source. Gt = P(delivered-to-load) / P(available-from-source) Other gain definitions include the power gain, Gp, and the available power gain, Ga. Gp = P(delivered-to-load) / P(input-to-network) Ga = P(available-from-network) / P(available-fromsource) The S-parameter data for the network is measured with a source and load equal to the reference impedance. If the network is not terminated in the reference impedance, Gt can be computed from the reflection coefficients of the terminations on the network and the S-parameters of the network. At this point we have multiple sets of reflection coefficients: those of the terminations and S11 and S22 of the network. To avoid confusion the termination reflection coefficients are given a different symbol, G. The transducer power gain with the network inserted in a system with arbitrary source and load reflection coefficients is [4]: 263 S Parameters 2 2 2 Gt = ( |S21| (1 - |Rs| )(1 - |RL| ) ) / |(1 - S11RS)(1 - S22RL) 2 - S21S12RLRS| where RS = reflection coefficient of the source RL = reflection coefficient of the load If and are both zero, then Gt=S21 or Gt(dB)=20log S21=S21(dB) Therefore, when a network is installed in a system with source and loads equal to the reference impedance, S21 is the network transducer power gain in decibels. Because S11 and S22 of a network are not in general zero, a portion of the available source power is reflected from the network input and is dissipated in the source. The insertion of a lossless matching network at the input (and/or output) of the network could increase the gain of the overall system if reflections toward the source were reduced. Shown below is a two-port network with lossless matching networks inserted between the network and the source and load. GMAX and MSG When the input and output networks are simultaneously designed for maximum gain, there is no reflection at the source or load. The maximum transducer power gain, Gmax, is given by 2 Gmax = ( |S21| / |S12| ) * (K - sqrt(K - 1)) The maximum stable gain, MSG, is defined as Gmax with K=1. Therefore MSG = |S21| / |S12| A GENESYS plot of GMAX shows Gmax when K>1 and MSG when K<1. Again, acheiving this maximum gain requires that the input network is designed such that RS is the complex conjugate of S11 and RL is the complex conjugate of S22. GENESYS returns the required reflection coefficients, impedance and admittance for the input and output networks as GM1, GM2, ZM1, ZM2, YM1 and YM2, respectively. 264 The Unilateral Case The Unilateral Case Historically, to simplify the complex equation for Gt in the previous section on matching, S12 was set to zero. At higher frequencies, where the device S12 is typically larger, this assumption is less valid. The assumption simplifies manual and graphical design but is unnecessary in modern computerassisted design. The assumption also allows factoring the above equation into terms that provide insight into the design process. If S12 =0, then 2 2 2 Gtu = ( |S21| (1 - |Rs| )(1 - |RL| ) ) / |(1 - S11RS)(1 2 S22RL)| where Gtu=unilateral transducer power gain When both ports of the network are conjugately matched, and S12 = 0, 2 2 2 Gtu = |S21| / ( (1 - |S11| )(1 - |S22| ) ) The first and third terms indicate the gain increase achievable by matching the input and output, respectively. If S11 or S22 approach 1, substantial gain improvement is achieved by matching. Matching not only increases the network gain, but reduces reflections from the network. When network gain flatness across a frequency band is more desirable than minimum reflections, the lossless matching networks are designed to provide a better match at frequencies where the two-port gain is lower. By careful design of amplifier matching networks, it is possible to achieve a gain response flat within fractions of a decibel over a bandwidth of an octave or more. Gain Circles When the device is complex conjugately matched, the transducer gain is Gmax and if the device is terminated with the same resistance used to measure the device S-parameters the transducer gain is S21. The gain with arbitrary terminations can be visualized on the Smith chart using gain circles. =SuperStar= plots three forms of gain circles: transducer gain unilateral circles, GU1 for the input network and GU2 for the 265 S Parameters output network, power gain output network circles, GP, and available gain input network circles, GA. Shown below are the input and output unilateral transducer gain circles, GU1 and GU2, of the Avantek AT10135 GaAsFET transistor. =SuperStar= circles are plotted at the frequency of the first marker, in this case 2500 MHz. Marker 1 is plotted at the center of the smallest circle, the point of maximum gain. The gain at the circumference of each circle of increasing radius is 1 dB lower than the previous inside circle. The arc which is orthogonal to the gain circles is the locus of smallest circle center points from the lowest to highest sweep frequency. Tuning the first marker frequency moves the center of the circles along this arc. Notice that a complex conjugate match at the input improves the gain by over 3 dB in relation to an unmatched 50 ohm source impedance. However, matching the output provides less than 1 dB gain improvement. An examination of the device S-parameter data at 2500 MHz reveals that the output is originally closer matched to 50 ohms and it is not surprising that a matching network would be less beneficial. Noise Circles To achieve the best available noise figure from a device the correct impedance must be presented to the device. The impedance resulting in the best noise performance is in general 266 Smith Chart neither equal to 50 ohms or the impedance which results in minimum reflection at the source. The Avantek AT10135 GaAsFET transistor S-parameter data given earlier includes noise data. This data is comprised of four numbers for each frequency. These numbers are NFopt(dB), the optimum noise figure when correctly terminated, Gopt magnitude and angle, the terminating impedance at the device input which acheives NFopt and Rn/Zo, a sensitivity factor which effects the radius of the noise circles. Noise circles plotted by =SuperStar= for the AT10135 at 2500 MHz are given below. Circles of increasing radius plotted by GENESYS represent noise figure degredations of 0.25, 0.5, 1, 1.5, 2, 2.5, 3 and 6 dB. In this case, direct termination of the device with a 50 ohm source results in a degredation of the noise figure of 1 dB. The arc orthogonal to the circles is the locus of Gopt versus frequency. Smith Chart In 1939, Philip H. Smith published an article describing a circular chart useful for graphing and solving problems associated with transmission systems [36]. Although the characteristics of transmission systems are defined by simple equations, prior to the advent of scientific calculators and computers, evaluation of these equations was best accomplished using graphical techniques. The Smith chart gained wide acceptance during the development of the microwave industry. It has been applied to the solution of a wide variety of transmission system problems, many of which are described in a book by Philip Smith [37]. The 267 S Parameters Smith chart as displayed by GENESYS is shown in below. Labels for normalized real and reactive components are added. The design of broadband transmission systems using the Smith chart involves graphic constructions on the chart repeated for selected frequencies throughout the range of interest. Although the process was a vast improvement over the use of a slide rule, it is tedious. Modern interactive computer programs with highspeed tuning and optimization procedures are much more efficient. However, the Smith chart remains an important tool for instructional use and as a display overlay for computergenerated data. The Smith chart provides remarkable insight into transmission system behavior. The standard unity-radius impedance Smith chart maps all positive resistances with any reactance from - to + onto a circular chart. The magnitude of the linear form of S11 or S22 is the length of a vector from the center of the chart, with 0 length being a perfect match to the reference impedance and 1 being total reflection at the circumference of the chart. The underlying grids of the Smith chart are circles of a given resistance and arcs of impedance. The reflection coefficient radius of the standard Smith chart is unity. Compressed Smith charts with a radius greater than 1 and expanded charts with a radius less than 1 are available. 268 Smith Chart High impedances are located on the right portion of the chart, low impedances on the left portion, inductive reactance in the upper half, and capacitive reactance in the lower half. Real impedances are on a line from the left to right, and purely reactive impedances are on the circumference. The angle of the reflection coefficient is measured with respect to the real axis, o with zero degrees to the right of the center, 90 straight up, and o 90 straight down. The impedance of a load as viewed through an increasing length of lossless transmission line, or through a fixed length with increasing frequency, rotates in a clockwise direction with constant radius when the line impedance equals the reference impedance. If the line and reference impedances are not equal, the center of rotation is not about the center of the chart. One complete rotation occurs when the electrical length of the line o increases by 180 . Transmission line loss causes the reflection coefficient to spiral inward. The length of a vector from the center to a given point on the Smith chart is the magnitude of the reflection coefficient. The angle of that vector with respect to the real axis to the right is the phase angle of the reflection coefficient. Several common definitions are used to represent the length of this vector. They are referred to as radially scaled parameters because they relate to a radial distance from the center towards the outside circle of the chart. 269 Chapter 11: Device Data Overview Within GENESYS are a wide range of element models. Also, the model and equation features provide for user creation of models. However, it is often necessary or desirable to characterize a device used in GENESYS by measured or externally computed data. This function is provided for by the use of the ONE, TWO, THR, FOU, and NPO elements which read S, Y, G, H, or Zparameter data. Because =SuperStar= is a linear simulator, and because circuits are assumed time-invariant (element values are not a function of time), sub-components are uniquely defined by a set of port parameter sets, such as two-port S-parameter data. Although ONE, TWO, THR, FOU, and NPO are typically used for active devices, they may be used for any devices for which you can compute or measure data. For example, they could be used to characterize an antenna, a circuit with specified group delay data, or measured data for a broadband transformer or a pad. Using a Data File in GENESYS Data files can be used in GENESYS in two different ways: y y By adding a Link to a Data File in a simulation. This allows measurements to refer directly to the data file without the need to create a design. By using ONE, TWO, THR, FOU, or NPO elements in a circuit file or schematic. In both cases, you must know in advance how many ports the device data represents. For transistors, this is almost always 2. Provided Device Data GENESYS includes over 25,000 data files for many different device types. Device data was provided directly by the manufacturers in electronic format. Device Data Note: Eagleware could not test every file that was provided. Through random sampling, we edited errors found in some files. It is the user’s responsibility to test each file for accuracy. Creating New Data Files You may easily add other devices to the library using the editor in =SuperStar= to simply type the data into a file with the name of your choice. From the =SuperStar= Menu, select File/New and choose Text. Type in the data, and when you have finished, select File/Save. The file format is standard ASCII. The first line in the file after any initial comments is a format specifier in the form: # units type format R impedance where: units is either Hz, kHz, MHz, or GHz type is the type of the data file, either S, Y, G, H, or Z format is DB for dB/angle data, MA for linear magnitude/angle data, or RI for real/imaginary data impedance is the reference impedance in ohms, commonly 50 or 75 One of the most common format specifiers is: # MHZ S MA R 50 This indicates that the data is in S parameter form normalized to 50 ohms. The data is given in linear polar format (magnitude & angle). The frequencies are in megahertz. The data follows after the format specifier. A typical line for this two-port file is: 500 .64 -23 12.5 98 .03 70 .8 -37 In this case, 500 is the frequency in megahertz. The magnitudes of S11, S21, S12 and S22 are .64, 12.5, .03 and .8, respectively. The phases are -23, 98, 70 and -37 degrees, respectively. Alternatively, Y-parameter data may be used. The format specifier could be: # GHZ Y RI R 1 272 File Record Keeping This would indicate rectangular, unnormalized Y parameter data with frequencies in GHz. A typical line is: 30 0 3E-4 9E-3 -8E-3 2E-5 0 -1E-4 1E-3 In this case, the frequency in gigahertz is 30. The real values of Y11, Y21, Y12 and Y22 are 0, 9E-3, 2E-5 and -1E-4 mhos, respectively. The imaginary values are 3E-4, -8E-3, 0 and 1E-3 mhos, respectively. A sample S-parameter data file is shown below. The only portion of the file required for GENESYS is the segment in the middle with frequencies and S-parameter data. Lines in the data file beginning with "!" are comments and are ignored. The noise data at the end of the file is used for noise figure analysis. (Noise is discussed in a later section.) ! AT41435 S AND NOISE PARAMETERS ! Vce=8V Ic=10mA ! LAST UPDATED 06-1-89 # GHZ S MA R 50 !FREQ S11 S21 S12 S22 0.1 .80 -32 24.99 157 .011 82 .93 -12 0.5 .50 -110 1 2.30 108 .033 52 .61 -28 1.0 .40 -152 6.73 85 .049 56 .51 -30 1.5 .38 176 4.63 71 .063 59 .48 -32 2.0 .39 166 3.54 60 .080 58 .46 -37 2.5 .41 156 2.91 53 .095 61 44 -40 3.0 .44 145 2.47 43 .115 61 .43 -48 3.5 .46 137 2.15 33 .133 58 .43 -58 4.0 .46 127 1.91 23 .153 53 .45 -68 4.5 .47 116 1.72 13 .178 50 .46 -75 5.0 .49 104 1.58 3 .201 47 .48 -82 6.0 .59 81 1.34 -17 .247 36 .43 -101 !FREQ Fopt GAMMA OPT RN/Zo 0.1 1.2 .12 3 0.17 0.5 1.2 .10 14 0.17 1.0 1.3 .05 28 0.17 2.0 1.7 .30 -154 0.16 4.0 3.0 .54 -118 0.35 File Record Keeping Most device files provided with GENESYS are S-parameter files in the usual device configuration, typically common emitter or common source. Devices you add to the library may use the ground terminal of your choice. However, if you always keep data in a consistent format, record keeping chores are greatly minimized. 273 Device Data Exporting Data Files "Export/S-Parameters" in the File menu writes S-parameter data from any simulation or data source. This output data file has exactly the same format as S-parameter files used to import data. This allows the user to analyze, tune and optimize subnetworks which are then stored as S-parameter data files for use later in other circuit files. The S-parameter data file written by GENESYS has one line of data for each simulation frequency. If there are two or more available simulations or designs in the circuit file, GENESYS displays a dialog box to allow you to select the simulation or design to use. Note: To avoid confusion, we recommend you use the .OUT extension for naming all your output data files. Noise Data in Data Files Some of the data files provided with GENESYS also include noise data used for noise figure analysis. This data includes the optimum noise figure (NFopt), the complex source impedance to present to the device to achieve the optimum noise figure (Gopt), and the effective noise resistance (Rn). Example data can be seen in the data file previously shown in Creating New Data Files. The best noise figure in a circuit is achieved when the device is presented with an optimum source impedance. The optimum input network to achieve this objective does not in general result in an excellent return loss match. Balanced amplifiers and isolators are sometimes used to achieve both the optimum noise figure and a good match. Losses in the input network, feedback networks around the transistor, emitter feedback and multiple stages all effect the noise figure of the circuit. All of these effects are accurately simulated in GENESYS using the noise correlation matrix technique [5,6]. 274 Chapter 12: References GENESYS References [1] Ralph S. Carson, High-Frequency Amplifiers, John Wiley & Sons, New York, 1982. [2] Jerome L. Altman, Microwave Circuits, D. Van Nostrand, Princeton, NJ, 1964. [3] Application Note 95, S-Parameters-Circuit Analysis and Design, Hewlett-Packard, Palo Alto, CA, September 1968. [4] Application Note 154, S-Parameter Design, Hewlett-Packard, Palo Alto, CA, April 1972. [5] V. Rizzoli and A. Lipparini, "Computer-Aided Noise Analysis of Linear Multiport Networks of Arbitrary Topology," IEEE Trans. MTT-33, No. 12, December 1985. [6] H. Hillbrand and P. Russer, "An Efficient Method for Computer Aided Nose Analysis of Linear Amplifier Networks," IEEE Trans. Circuits Syst., Vol. CAS-23, April 1976. [7] H.A. Watson, ed., Microwave Semiconductor Devices and Their Circuit Applications, McGraw-Hill, New York, 1969, pp. 271-278. [8] Lloyd P. Hunter, ed., Handbook of Semiconductor Electronics, 3rd edition, McGraw-Hill, New York, 1970, pp. 11-3 to 11-19. [9] H.E. Green, "The Numerical Solution of Transmission Line Problems," Advances in Microwaves, Vol. 2, Academic Press, New York, 1967, pp. 327-393. [10] K.C. Gupta, et al., Computer-Aided Design of Microwave Circuits, Artech House, Dedham, Massachusetts, 1981, pp. 131134. [11] P.I. Somlo, "The Computation of Coaxial Line Step Capacitances," IEEE Trans. MTT, Vol MTT-15, January 1967, pp. 48-53. [12] W. Alan Davis, Microwave Semiconductior Circuit Design, Van Nostrand Reinhold, New York, 1984, pp. 118-119. References [13] P. Wolf, "Microwave Properties of Schottky-barrier Fieldeffect Transistors," IBM Journal of Research and Development, March 1970, pp. 125-141. [14] "Device Modeling," Avantek Microwave Semiconductors: GaAs and Silicon Products, Avantek, Santa Clara, 1989, pp. 812 to 8-13. [15] M. Kirshning, et al., "Measurement and Computer-Aided Modeling of Microstrip Discontinuities by an Improved Resonator Method," MTT-S Digest, 1983, pp. 495-497. [16] M. Kirshning, et al., "Accurate Wide-Range Design Equations for the Frequency Dependent Characteristics of Parallel Coupled Microstrip Lines," IEEE MTT-32, 1984, pp. 8390. Errata, MTT-33, 1985, p. 288. [17] Rolf H. Jansen, "High-Speed Computation of Single and Coupled Microstrip Parameters Including Dispersion, High-Order Modes, Loss and Finite Strip Thickness," MTT-26, 1978, pp. 7581. [18] M.V. Schneider, "Microstrip Lines for Microwave Integrated Circuits," The Bell System Technical Journal, May-June 1969, pp. 1421-1444. [19] E.O. Hammerstad, "Equations for Microstrip Circuit Design," Proc. 5th European Microwave Conference, Hamberg, 1975, pp. 268-272. [20] P. Benedek and P. Silvester, "Equivalent Capacitance for Microstrip Gaps and Steps," IEEE MTT-20, November, 1972, pp. 729-733. [21] R. Jansen and M. Kirschning, "Arguments and an Accurate Model for the Power-Current Formulation of Microstrip Characteristics Impedance," AEU, Band 37, 1983, Heft 3/4, pp. 108-112. [22] Harold A. Weeler, "Transmission-Line Properties of a Strip on a Dielectric Sheet on a Plane," IEEE MTT-25, 1977, pp. 631647. [23] H. Atwater, "Microstrip Reactive Circuit Elements," IEEE MTT-31, June 1983, pp. 488-491. [24] J.P. Vinding, "Radial Line Stubs as Elements in Stripline Circuits," NEREM Rec., pp. 108-109, 1967. 276 GENESYS References [25] A. Farrar and A.T. Adams, "Matrix Methods for Microstrip Change in Width and Cross-Junctions," IEEE MTT-20, August 1972, pp. 497-504. [26] A. Gopinath, "Equivalent Circuit Parameters of Microstrip Change in Width and Cross-Junctions," IEEE MTT-24, March 1976, pp. 142-144. [27] M.E. Goldfarb and R.A. Pucel, "Modeling Via Hole Grounds in Microstrip," IEEE Microwave and Guided Wave Letters, Vol. 1 No. 6, June 1991, pp. 135-137. [28] G.B. Stracca, G. Macchiarella and M. Politi, "Numerical Analysis of Various Configurations of Slab Lines," MTT-34, No. 3, March 1986, p. 359-363. [29] H.M. Altschuler and A.A. Oliner, "Discontinuities in the Center Conductor of Symmetric Strip Transmission Line" IRE MTT-8, May 1960, pp. 328-339. [30] Seymour B. Cohn, "Shielded Coupled-Strip Transmission Line," MTT-3, 1955, pp. 29-38. [31] S.B. Cohn, "Characteristic Impedance of Shielded Strip Transmission Line," MTT-2, 1954, pp. 52-55/ [32] H.A. Wheeler, "Transmission Line Properties of a Stripline Between Parallel Planes," MTT-26, 1978, pp. 866-876. [33] I.J. Bahl and R.Garg, "A Designer's Guide to Stripline Circuits," Microwaves, Jan. 1978, pp. 90-96. [34] Private phone conversation between R.W. Rhea and I.J. Bahl, October 1987. [35] N. Marcuvitz, Waveguide Handbook, Peter Peregrinus Ltd., London, 1986. [36] Phillip H. Smith, "Transmission Line Calculator," Electronics, Vol. 12, Jamuary 1994, p. 29. [37] Phillip H. Smith, Electronic Applications of the Smith Chart, 2nd edition, Noble Publishing, Atlanta, 1995. [38] Guillermo Gonzales, Microwave Transistor Amplifiers: Analysis and Design, 2nd edition, Prentice-Hall, New York, 1997. [39] H.C. Miller, "Inductance Formula for a Single-Layer Circular Coil," Proc. IEEE, Vol. 75, pp. 256,257, 1987. [40] R.G. Medhurst, "H.F. Resistance and Self-Capacitance of Single-Layer Solenoids," Wireless Engineer, pp. 80-92, 1947. 277 References [41] C.A. Balanis, Antenna Theory: Analysis & Design, John Wiley & Sons, New York, 1982, pp. 292-295. [42] A. Weisshaar and V.K. Tripathi, "Perturbation Analysis and Modeling of Curved Microstrip Bends," IEEE MTT, Vol. 38(10), 1990, pp. 1449-1454. [43] S.S. Gevorgian, et.al., "CAD Models for Multilayered Substrate Interdigital Capacitors," IEEE MTT-44, 1996, pp. 896904. [44] F.W. Grover, Inductance Calculations, Dover Publications, Inc., New York, 1962. [45] J.I. Smith, "The Even- and Odd-Mode Capacitance Parameters for Coupled Lines in Suspended Substrate," IEEE MTT-19, 1971, pp. 424-431. [46] R.L. Remke and G.A. Burdick, "Spiral Inductors for Hybrid and Microwave Applications," Proc. 24th Electron Components Conf., 1974, pp. 152-161. [47] C.R. Burrows, "The Exponential Transmission Line," Bell System Technical Journal, Vol. 37, 1938, pp. 555-573. [48] R.E. Collin, Field Theory of Guided Waves, McGraw-Hill, New York, 1960, pp. 185-195. [49] H.M. Greenhouse, "Design of Planar Rectangular Microelectronic Inductors," IEEE Trans. Parts, Hybrids, and Packaging, PHP-10(2), June 1974, pp. 101-109. [50] B.C. Wadell, Transmission Line Design Handbook, Artech House, Boston, 1991. [51] C.L. Ruthroff, "Some Broad-Band Transformers," Proc. IRE, Vol. 47, 1959, pp. 1337-1342. [52] D.M. Krafcsik and D.E. Dawson, "A Closed-Form Expression for Representing the Distributed Nature of the Spiral Inductor," 1986 Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1986, pp. 87-92. 278 Index 1 1-Port Data File, 64 2 2-port, 121 2-Port Data File, 113 3 3-Port Data File, 101 9 90 Degree Line, 161 A ABC, 12 ABCD, 12, 259 ABS, 132 AC, 161 Actions Menu, 152 Adding, 271 Link, 271 Admittance, 121, 217, 264 Air Above, 206 Air Below, 206 Air core inductor, 13 AIRIND1, 13 Allow Multiple Open Workspaces, 169 ANG, 123, 132 ANG360, 123, 132 Angle, 123 Aperture List, 174, 175 Editing, 175 Arc Object, 185 ARCCOS, 132 ARCCOSH, 132 ARCSIN, 132 ARCSINH, 132 ARCTAN, 132 ARCTANH, 132 Array Index, 131 Arrays, 131, 132, 136, 138 ASCII, 63, 113 ASCII Drill List, 147 Assembly, 204 Associations, 203 Asymmetrical, 56 ATN, 132 Auto-Replace Tuned Values, 169 Available Footprints, 182 B B1, 121, 261 Balanced amplifiers, 274 BASE, 127 Bends, 81 BESSELJ0, 132 BIP, 14 Bipolar transistor model, 14 Bitmap, 147 Bond-wire inductances, 31 Bottom Cover, 200, 206 Box Height, 200 Box Settings, 200 Box Width, 200 Built-in Functions, 132, 138 Bulk Conductivity, 206 BYREF, 142 C Calling C/C++ Programs, 143 CAP, 16 Capacitors, 16 CCC, 17 CCV, 18 CEN, 19 Center Selected On Page, 155 CGA, 20 Chamfered, 38 Change Footprint, 186 CIR3, 21 Circles, 121, 124, 259, 261, 266, 267 Index CLI, 22 CLI4, 23 Close Workspace, 147 Closed Loop, 179 Coax Toolbar, 165 Coaxial center conductor gap, 20 Coaxial conductor step, 27 Coaxial End, 19 Combline, 25, 39, 76, 82 COMPLEX, 132 Component Object, 186 Components, 211 Concatenation, 135 Conducting Wire, 118 Connect Selected Parts, 155 Connections, 182 Constants, 121, 135 Copper, 257 Copy, 149 COS, 132 COSH, 132 Co-simulation, 220 COUNT, 132, 136, 138 Coupled lines, 24 Coupled Microstrip Lines, 41 Coupled Slabline, 77 Coupled striplines, 83 CPL, 24, 25 CPN, 25 Create Mask, 191 Creating, 33, 63, 101, 113, 272 four-port, 33 New Data Files, 272 n-port, 63 three-port, 101 two-port, 113 CST, 27 Current controlled current source, 17 Current controlled voltage source, 18 Current Dir, 187 Custom Aperture List dialog, 174 Custom Apertures, 176 Cut, 149 280 D Data File, 224, 271, 274 DB, 121, 123, 272 DB Magnitude, 124 DB/angle, 272 DB10, 132 DB20, 132 DBANG, 121, 123 DBANG360, 123 DBMAG, 121 DC, 161 D-code identifier, 175 Decomposition, 220 Default Footprint, 203 Default Operator, 121, 123 Default Simulation/Data, 124, 215, 216, 217, 218, 227 Default Viahole Layers, 200 DELAY, 29 Delete Layer, 204 Device Toolbar, 163 Dielectric, 255 Dielectric Const, 226 Dielectric Constant, 256 Dim, 138 Dimensions, 226 DIPOLE, 30 Dipole antenna, 30 Disable All Simulations, 169 Dispersion, 48 Distortionless TEM Transmission Line, 106 Distributed RC, 164 Distributed RC Transmission Line, 75 Distribution, 228 DLLs, 143 Draw Size, 187, 194 Drill Diameter, 198 Drill List, 147 Drop Trailing Zeros, 169 DTOR, 135 Duplicate, 149 DXF File, 147 DXF Setup, 173 Index E Edit Menu, 149 Edit substrate, 226 Element Z-Ports, 206 Elements, 9 EMport, 160, 220 EMPort Object, 187 EPS0, 135 Equality Check, 131 Equations, 123, 124, 125, 131, 132, 136, 138, 142, 218, 227 Equivalence, 131 Errors Window, 150, 159 ETA0, 135 Etch Factor, 204 Excellon, 147 Exclusive-OR, 141 EXP, 132 EXP1, 135 Exponential Notation Above, 169 Exponential TEM Transmission Line, 108 Exponentiation, 131 Export/DXF File, 173 Export/Gerber File, 174 Export/HPGL File, 178 Exporting, 147, 154, 274 ASCII, 147 Data Files, 274 Excellon, 147 SPICE file, 154 Touchstone file, 147 Expression, 132 Extrapolate, 33, 63, 64, 101, 113, 138 F FET transistor model, 31 FIX, 132 FN_E, 132 FN_K, 132 Font, 197 Fonts, 210 Footprint Editor, 153, 186 Footprint Library Selector, 182 Footprints, 153, 194, 200, 203 FOU, 33, 271 Four Terminal coaxial line, 23 Four-Port Data, 33 FREQ, 138 Frequencies, 219 FUNCTION, 127, 142 G GA, 263, 265 GA Circles, 121 GAIN, 34 Gain Circles, 121, 259, 265 Gap, 87 Gaussian, 228 GD, 123 General Layer, 204, 206 General Layer Tab, 206 General Options, 169 Generalized S-Parameters, 220 Generate Custom Apertures, 174, 175 Generate Viewer Data, 220 Gerber, 147, 174, 176 Gerber File, 147, 176 Gerber Setup dialog, 175 GET, 132 GETINDEPVALUE, 132, 138 GETVALUE, 132, 138 GETVALUEAT, 132, 138 Global Options, 171 Global Units, 145 GM, 123 GM1, 264 GM2, 264 GMAX, 121, 123, 259, 264, 265 GMi, 121 GOPT, 121, 123, 274 GOTO, 127 GP, 263, 265 GP Circles, 121 Graph Properties, 215 281 Index Graph Toolbar, 160 Greater Than, 131 Grid, 200, 211 Grid Density, 211, 217 Grid Spacing, 200 Grid Spacing Y, 200 Grid Style, 200 Ground Plane, 195, 206 Grounded Input, 179 Ground-plane, 191, 198, 206 Group Object, 189 Gt, 263 GU1, 265 GU1 Circles, 121 GU2, 265 GU2 Circles, 121 GYR, 35 Gyrator, 35 H H Parameters, 121 Height, 145, 226 Hide Silk Layers, 186 Higher resolution, 181 HPGL file, 147, 178 Hyperbolic, 132 I Ideal delay block, 29 Ideal gain block, 34 Ideal isolator, 37 Ideal monopole, 49 Ideal Phase Shift, 68 Ideal Transformer, 110, 111 IF, 127 IF THEN GOTO Statement, 127, 141 IFF, 132, 138 IF-THEN statements, 138 IFTRUE, 132, 138 IM, 123, 132 IMAG, 132 IMP, 141 Impedances, 121, 264, 267 Implication, 131 Import 6.x Model Library, 147 282 IND, 36 Inductor, 36 Inner Diameter, 191 Input VSWR, 259 Insert Layer, 204 INT, 132 Integer Division, 131 Interdigital, 25, 39, 76, 82 Interdigital Capacitor, 47 Internal Ports, 187 Interpolate, 33, 63, 64, 101, 113, 138, 220 ISOLATOR, 37 J Junction Circle Size, 171 K Keep Away, 195 L LABEL, 127 Layout Menu, 155 Layout Toolbar, 160 Leading Digits, 174 Less Than, 131, 132 Line button, 200 Line Direction, 187 Line Object, 190 Line Width, 160, 190, 200 Linear Magnitude, 124 Linear Measurements, 121 Linear Simulation Properties, 219 Linear S-parameters, 259 Link, 224, 271 LN, 132 LN2, 135 Load Footprint, 153 Load From Layer File, 204 Load From Library, 226 Loaded Q, 123, 124 LOG, 132 Logical Operators, 141 Loss Tangent, 206, 226, 255 Index Lumped capacitance, 16 Lumped resistance, 78 Lumped Toolbar, 162 M MA, 272 MAG, 123, 132 MAGANG, 121, 123 MAGANG360, 123 Magnetic Wall, 206 Main GENESYS Toolbar, 159 Make Tunable, 154 Marcuvitz, 117 Matrices, 136 MATRIX, 132 MAX, 132 Max Critical Freq, 220 MBN, 38 MCN, 39 MCP, 41 MCR, 42 MCURVE, 44 Measurements, 121, 123, 124, 125, 132, 138, 215, 216, 218, 227, 259 Measuring, 259 S-parameters, 259 MEN, 45 Merge Footprint, 153 Metal, 206 Metal Thickness, 226, 256 Metalization resistivity, 257 MGA, 46 Microstrip, 206 Microstrip Bend, 38 Microstrip Cross, 42 Microstrip Curved Bend, 44 Microstrip Gap, 46 Microstrip Interdigital Capacitor, 47 Microstrip Line, 48 Microstrip Linearly Tapered Line, 58 Microstrip Open End, 45 Microstrip Radial Stub, 52 Microstrip Rectangular Inductor, 50 Microstrip Spiral Inductor, 54 Microstrip Step, 56 Microstrip Tee Junction, 59 Microstrip Toolbar, 165 Microstrip Via Hole, 61 MIDCAP, 47 Min Max, 227 MIN, 132 Mirror, 149 MLI, 48 MMTLP, 90 Model, 9 Model Properties, 214 Modify Footprint Library, 153 MONOPOLE, 49 Monopole Antenna, 49 Monte Carlo, 152, 228 MRIND, 50 MRS, 52 MSG, 264 MSPIND, 54 MST, 56 MTAPER, 58 MTE, 59 MU0, 135 MUI, 60 Multi Place Parts, 200 Multi-dimensional, 138 Multi-mode, 90, 187, 220 Multi-Page Output, 178, 181 Multiple coupled, 25 Multiple Coupled Microstrip Lines, 39 Multiple Coupled Rods, 76 Multiple Coupled Striplines, 82 Multiplication, 131 Multiplier, 135 MUr, 257 Mutually Coupled Inductors, 60 MVH, 61 N NCI, 124 NCI Circles, 121 283 Index NET, 62 NET Block, 62 Netlist, 9 New Data Files, 272 Creating, 272 New Footprint, 153 NF, 121, 123 NFMIN, 121, 123 NFopt, 274 NFT, 121 NMEAS, 121, 123 Noise Circles, 121, 124, 266 Noise correlation, 121, 274 Noise Data, 274 Non-deembedded, 187 Normal Distribution, 228 Normalized, 220, 272 NOT, 141 NPO, 271 NPOn, 63 N-Port Data File, 63 Number Format, 174 O Object Dimensions, 200 Omit Leading Zeros, 174 Omit Trailing Zeros, 174 ONE, 64, 271 One-port, 206 One-port S-Parameter, 64 OPA, 65 Operational amplifiers, 65 Operations, 138 Operator descriptions, 131 Operators, 123, 124, 131, 135, 136, 141, 227 Optimal admittance, 121 Optimization, 121, 124, 152, 227 Optimization Target dialog, 227 Optimization Targets, 180, 227 Optimization Targets On Graphs, 169 OR, 141 Origin, 155, 200 284 Orthogonal Mode, 190 Oscillator Design, 259 Out-of-bounds, 136 Output Aperture List, 174 Output Equations, 138 P Pad Diameter, 191 Pad Height, 191 Pad Object, 191 Pad Shape, 191, 198 Pad Width, 191 Page Height, 211 Page Width, 211 Parallel L-C resonator, 66, 67 Parameter Sweep Properties, 225 Parameters, 121 Parasitics, 212 Part Constrain Angle, 149, 171 Paste, 149 Percentage, 228 Permeability, 257 Permittivity, 206 PFC, 66 PFL, 67 PHASE, 68 Physical Desc, 206 PI, 135 Piezoelectric resonator, 120 PIN, 69 Place Footprint Port, 155 PLC, 71 Polar Chart Properties, 216 Polygon Fill Min Aperture Diameter, 174 Polygon Object, 193 Port Impedance, 220 Port Number, 194 Port Object, 194 Port Size, 200 Post-processing, 121, 123, 124, 125, 132, 138 Pour Object, 195 PRC, 72 Precedence, 131 Index Print Preview, 147 Print Quality, 181 Print Setup, 181 PRL, 73 Probability, 228 Probability distribution, 228 Provided Device Data, 271 PRX, 74 Q QL, 123 R Radians multiplier, 135 Random Number Seed, 228 Raster Scan, 174 RCLIN, 75 RCN, 76 RCP, 77 RE, 123, 132 REAL, 132 Record Keeping, 273 RECT, 121, 123 Rectangle Object, 196 Rectangular, 191 Rectangular Waveguide Line, 119 Rectangular waveguide-toTEM, 117 Rectangular Wire, 79 Redo, 149, 159 REF, 127 Reference Plane, 187 Reflection Coefficient, 259, 263, 264, 267 Relational, 141 Relative Dielectric Constants, 206, 256 Relative Permeability, 257 Renumber Nodes, 154 RES, 78 Reset Defaults, 186 Resistance, 121 Resistivity, 206, 226, 257 Resistor, 78 Resolution, 181 RETURN, 127, 142 RI, 272 RIBBON, 79 RLI, 80 RN, 121, 274 RND, 132 Rotate, 149 Roughness, 206, 226 Round, 191 Rounded Ends, 185, 190 Rounded/square, 160 RTOD, 135 Rubber Bands, 182, 200 Rubber-bands, 200 Ruthroff transformer, 112 S S Parameters, 121, 124 Sample Expressions, 132 Sample Measurements, 124 Samples, 228 Save, 147 Save Footprint, 153 Save Layout As Footprint, 155 SB1 Circles, 121 SB2 Circles, 121 SBN, 81 Scalar/matrix combination, 136 Schematic Menu, 154 Schematic Part Layout Options, 212 Schematic Properties, 211 SCN, 82 SCP, 83 Select All, 149 Semi-Infinite Waveguide, 206 SEN, 84 Sensitivity, 152, 266 Sensitivity Analysis, 152 Series inductor, 88 Series L-C, 85, 86 Setup Variables, 228 SFC, 85 SFL, 86 SGA, 87 285 Index Show =EMPOWER=, 200 Show Box, 200 Show Data Points on New Graphs, 169 Show Drill Holes, 173, 178, 181 Show grid, 171 Show Grid Dots, 200 Show SPICE Details, 171 Show Yield Targets On Graphs, 169 Sigma, 206, 228 Silk, 186, 204 Simulation, 124 Simulation/Data, 124 SIN, 132 Single-mode, 90 SINH, 132 Slabline, 76, 80 Slabline Toolbar, 166 SLC, 86, 88 SLI, 89 SmartScan, 174 Smith Chart, 121, 124, 267 Smith Chart Properties, 217 SMTLP, 90 Snap Angle, 171, 200 Soldering, 191, 198 Solid Thinning, 220 SPA, 91 S-parameter, 91, 101, 147, 261, 263, 272, 273, 274 S-Parameter file, 113 SPICE, 161, 179 SPICE file, 154 SPIND, 92 Spiral Inductor, 92 SQR, 132 Square/Rect, 191 SRC, 94 SRL, 95 SRX, 96 SSP, 97 Stability, 121, 124, 261 Standard Part Length, 211 Statistics, 155, 182 Statistics Setup, 228 Status Advisor, 150, 159 286 Status Bar, 150 STE, 98 Strings, 132, 135, 136 Stripline, 82, 89, 206 Stripline Bend, 81 Stripline gap, 87 Stripline Open End, 84 Stripline Step, 97 Stripline Tee Junction, 98 Stripline Toolbar, 166 Striplines, 83 Substrate, 145, 256, 257 Substrate Name, 226 Substrate/air, 206 Subtraction, 131 Superconductors, 206 Surface Roughness, 206 Sweep, 219, 225 Symmetrical, 56 Synthesis Menu, 156 T Table Properties, 218 TAN, 132 TanD, 255 TANH, 132 Tapped Transformer, 111 Targets, 227 Temperature, 121 Terminations, 121, 263 Text Object, 197 TFC, 99 TFR, 100 Thicknesses, 206, 256 Thin film capacitor, 99 Thin Film Resistor, 100 THR, 101, 271 Three Port circulator, 21 Three-port, 101 TLE, 102 TLE4, 103 T-Line Toolbar, 164 TLP, 104 TLP4, 105 TLRLDC, 106 TLRLGC, 107 TLX, 108 Index Tolerance, 173, 174, 178, 195 Tolerances, 228 Tools Menu, 153 Top Cover, 206 TORIND, 109 Toroidal Core Inductor, 109 Touchstone File, 147 TPL file, 200, 220 Tranformer, 110 Transducer, 263, 264 Transformers, 60 Transistor, 14, 31, 163, 266, 271, 274 Transmission Line, 22, 90, 102, 103, 104, 105, 164, 267 TRF, 110 TRFCT, 111 TRFRUTH, 112 Tune Window, 150 TWO, 113, 271 Two-port, 113, 259, 261, 263, 265 Two-port file, 272 Two-port S-parameters, 259, 271 Using Equation Results, 125 Using Non-Default Simulation/Data, 124 V VAIR, 135 Variable Values, 131 Variables, 132, 135, 136, 228 VCC, 115 VCV, 116 VECTOR, 132 Vectors, 136 Viahole, 160, 198 Viahole Object, 198 Viaholes, 200, 204 layers, 200 View Menu, 150 View Variables, 131 Viewer, 220 Voltage Controlled Current Source, 115 Voltage Controlled Voltage Source, 116 VSWR, 121, 259 U Undo, 149, 159 Uniform Distribution, 228 Uniform TEM Transmission Line, 107 Unilateral, 121 Unilateral Case, 265 Units, 145, 174, 200, 211, 226 Unnormalized Y, 272 Unresolved Rubber Bands, 182 Update Dashed Traces, 152, 160 Use 274-X Format, 174 Use Default Layers, 198 Use Default Size, 197, 210 Use Engineering Notation, 169 User Functions, 142 User Ground, 191, 195, 198 USING, 138 W Wagon Wheel, 191, 198 Waveguide, 117 Waveguide Toolbar, 167 Waveguide-to-TEM Adapter, 117 Widths, 160, 200 WIRE, 118 WLI, 119 Workspace Dialogs, 180 Workspace Menu, 151 Workspace Window, 150 X XTL, 120 Y Y Parameters, 121 287 Index Y-Axis, 215 Yield, 124, 152 Yield Optimization, 152 Yield Targets, 180 Yield/Opt Settings, 227 YM1, 264 YM2, 264 YMi, 121 YOPT, 121 Y-parameters, 259, 272 288 Z Z Parameters, 121 ZM1, 264 ZM2, 264 ZMi, 121 Zo, 259 Zoom, 150, 217 ZOPT, 121

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