Transcript
Get Smart • Get Efficient • Get to Market Quickly
GET CONNECTED with Future Connectivity Solutions
ISSUE
05
FEATURED TECHNOLOGIES
Bluetooth Cellular NFC Wi-Fi
SUPPLIERS
Taking the world wireless Connectivity Solutions
CSR GainSpan MultiTech NXP Silex STMicroelectronics
TABLE OF CONTENTS
ISSUE 5
BLUETOOTH Csr Audio Rom Platforms Help To Create Highly Differentiated Consumer Products With A Fast Time To Market
CELLULAR Multi-Tech - Programmable Gateway for the Internet of Things
NFC Nxp Semiconductors - NFC Readers and NTAG Solutions
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8
13
WI-FI Gainspan - Iot Solutions Offer Flexibility To Work Optimally With Any Mcu Or Without Mcus
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Silex - SX-PCEGN-BT: Low-Cost Mini-PCIe Combo Wi-Fi Module Features Compatibility With Freescale’s I.MX6 Platform
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STMicroelectronics - SPWF01SX Wi-Fi Modules For Iot Applications
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GET CONNECTED | ISSUE 5
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CSR AUDIO ROM PLATFORMS HELP TO CREATE HIGHLY DIFFERENTIATED CONSUMER PRODUCTS WITH A FAST TIME TO MARKET CSR engineers work with the world’s audio leaders to bring a truly exceptional listening experience to a broad range of consumer devices, including Bluetooth® mono and stereo headsets, Bluetooth mono and stereo speakers, and soundbars. Their all-in-one silicon and software solutions deliver a rich user experience, small form factor options and consistently top independent surveys for best audio performance and clarity. Their technologies – such as aptX® and cVc® - help to differentiate many of the world’s most desirable consumer electronics brands.
Figure 1: CSR8645
Their broad portfolio of ROM devices and associated development kits provide a very flexible and powerful development platform for designing advanced, high-quality, Bluetooth stereo products across the price range of Bluetooth headset and speaker consumer products.
APPLICATIONS
BENEFITS
• Bluetooth Stereo Headsets
• Broad portfolio of devices addressing complete range of feature and price-segments
• Bluetooth Stereo Speakers • Bluetooth Mono Headsets • Bluetooth Mono Speakers
• F ully configurable ROM solution reduces development cost, risk and time to market • F lexible control of I/O and user interface (buttons / LEDs / prompts) enables differentiated user experience • Music CODECs and EQ control deliver optimum audio enjoyment FEATURES • Single chip solution • Superior audio performance • B C61xx ROMs deliver cost-conscious performance for entry-level and low-end • CSR86xx ROMs provide higher-tier user-experience features • Programmable or fully-custom voice prompt control
Figure 2: CSR8620 Block Diagram
Figure 3: CSR8640 Block Diagram
TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH ANTENNAS | NFC
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MONO HEADSET ROMS BC6130 TARGET APPLICATION DESCRIPTION BLUETOOTH VERSION
BC6140
BC6145
CSR8610
CSR8620
Ultra Low Cost
Low Cost mono headset
Low cost mono headset with music
Mid-range 1-mic mono headset with music
Mid-range 2-micmono headset with music
Entry Level Headset
1 Mic NR/EC Headset
1 Mic NR/EC Headset with music
1 Mic cVc
2 Mic cVc
v2.1 + EDR
v3.0
v3.0
v4.0
v4.0
• Bluetooth 2.1 + EDR with secure simple pairing
• Bluetooth 3.0
• Bluetooth V3.0
• Bluetooth 4.0
• Bluetooth 4.0
• Support for proximity pairing
• Wide band speech CODEC
• HFP1.6, A2DP1.2 and AVRCP1.4
• HFP1.6, A2DP1.2 and AVRCP1.4
• Support for proximity pairing
• Enhanced HFP Multipoint
• A2DP mono music streaming
• HD voice (wideband speech)
• HD voice (wideband speech)
• HFP Multipoint
• Programmable audio prompts
• Talk-time extension
• iOS battery status monitor
• iOS battery status monitor
• Smart Apps support (Using GAIA)
• Smart Apps support (Using GAIA)
• Multi-Language custom audio prompts
• Multi-Language custom audio prompts
• Configurable LED drivers
• Configurable LED drivers
• Talk-time Extension
• Talk-time Extension
• 6th generation CVC®
• 6th generation CVC®
• 1-mic Far-end NR / AEC algorithms
• 2-mic Far-end NR / AEC algorithms
• Near-end audio enhancements
• Near-end audio enhancements
• Frequency Enhanced Speech Intelligibility
• Frequency enhanced speech intelligibility (FESI)
• Selectable audio prompts
• Optional Wind Noise Reduction • cVc (Clear Voice Capture) technology for EC / NR • 1-mic solution
KEY FEATURES
• Far End and Near End speech enhancements • Packet Loss & Bit Error Concealment
• Multi-language audio prompt support • Ultra-low power WNR during active and listening states • Frequency Enhanced Speech Intelligibility • Enhanced HFP Multipoint • Other features as per BC6140
• Ultra-low power • Ultra-low power WNR (200μA active; WNR (200μA active; 10μA monitoring) 10μA monitoring
PACKAGE OPTIONS
• 48-pin QFN 7x7mm • 48-pin QFN 7x7mm • 48-pin QFN 7x7mm • 5.5x5.5mm, 68-pin 0.5mm pitch 0.5mm pitch 0.5mm pitch BGA (0.5mm pitch)
• 5.5x5.5mm, 68-pin BGA (0.5mm pitch)
• Pin compatible with BC6140 / BC6145
• WLCSP Package option (0.5mm pitch)
• WLCSP Package option (0.5mm pitch)
• Pin compatible with CSR8620
• Pin compatible with CSR8610
• Pin compatible with BC6130 / BC6145
• Pin compatible with BC6130 / BC6140
TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH ANTENNAS | NFC
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SPEAKER ROMS BLUECORE BC6145 TARGET APPLICATION DESCRIPTION BLUETOOTH VERSION
Mono Music Speakers
CSR8630
Stereo Music Speakers
Ultra low cost Entry level mono mono speaker with speaker, no mic mic
Entry level mono speaker with mic
Entry level stereo speaker, no mic
Entry level stereo speaker with mic
Mid range stereo speaker with mic and aptX
Bluetooth v3.0
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
• Bluetooth V3.0
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Wide band • A2DP1.2 and speech CODEC AVRCP1.0
• HFP1.6, A2DP1.2 • A2DP1.2 and and AVRCP1.4 AVRCP1.4
• HFP1.6, A2DP1.2 and AVRCP1.4
• A2DP mono music streaming
• HD voice (wideband speech)
• Advanced Multi-point (2xA2DP)
• HFP1.6, A2DP1.2 and AVRCP1.4
• Advanced Multipoint (2xHFP, 2xA2DP)
• Wired Audio (Stereo Line-in)
• Wired Audio (Mono Line-in) • Music Enhancements (Multi-band EQ) • Smart Apps support (GAIA)
• Wired Audio (Stereo Line-in)
• Ultra-low power • Multi-Language • Music EnhanceWNR during custom audio ments (Multiactive and prompts band EQ) listening states • Configurable • iOS battery • Frequency LED drivers status monitor Enhanced • Smart Apps Speech support (GAIA) Intelligibility • Multi-Language • Enhanced HFP custom audio Multipoint prompts
• Music Enhancements (Multi-band EQ) • iOS battery status monitor • Smart Apps support (GAIA)
• Wired Audio (Stereo Line-in) • Music Enhancements (Multi-band EQ)
• 6th generation CVC® • 1-mic Far-end NR / AEC algorithms for headset
• 1-mic Far-end NR / AEC algorithms for handsfree • Frequency enhanced speech intelligibility (FESI) • 68-pin QFN, 8x8mm, 0.4mm pitch
• Advanced Multi-point (2xHFP, 2xA2DP)
• HD voice (wideband speech) • Wired Audio (USB and Analogue) • AAC-LC, MP3 and SBC decoders • Leading aptX® CODEC for highquality audio • Multi-band EQ (up to 6 x banks) • Headphone stereo separation (soft 3D)
• iOS battery status • Multi-Language monitor custom audio • Smart Apps prompts support (GAIA) • Configurable • Multi-Language LED drivers custom audio
• 1-mic Far-end NR / AEC algorithms for headset
• 48-pin QFN 7x7mm 0.5mm pitch
• HD voice (wideband speech)
• Multi-Language • iOS battery custom audio status monitor prompts • Smart Apps • Configurable support (GAIA) LED drivers
• 6th generation CVC®
OPTIONS
CSR8645
Stereo Music Speakers
• Configurable LED drivers
PACKAGE
CSR8635
Stereo Music Speakers
• Multi-language audio prompt support
FEATURES
Mono Music Speakers
CSR8615 Mono Music Speakers
• Talk-time extension
KEY
CSR8605
• 6th gen dual-mic cVc® NR / AEC algorithms
• Frequency enhanced speech intelligibility (FESI)
• 2-mic Far-end NR / AEC algorithms
• 68-pin BGA, 5.5x5.5mm, 0.5mm pitch
• 68-pin QFN, 8x8mm, 0.4mm pitch
• 68-pin QFN, 8x8mm, 0.4mm pitch
• 68-pin QFN, 8x8mm, 0.4mm pitch
• Pin compatible with CSR8635 and CSR8630
• Pin compatible with CSR8615 and CSR8635
• Pin compatible with CSR8615 and CSR8630
TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH ANTENNAS | NFC
prompts • Configurable LED drivers
• Frequency enhanced speech intelligibility (FESI)
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STEREO HEADSET ROMS CSR8640
CSR8645
TARGET APPLICATION
Mid-range
Mid-range with aptX high-quality audio
DESCRIPTION
2 Mic Stereo Headsets with cVc
2 Mic Stereo Headsets with cVc and aptX
• • • • • • • • • • • •
Bluetooth 4.1 HFP1.6, A2DP1.2 and AVRCP1.4 HD voice (wideband speech) Wired Audio (USB and Analogue) AAC-LC, MP3 and SBC decoders Multi-band EQ (up to 6 x banks) Headphone stereo separation (soft 3D) iOS battery status monitor Smart Apps support (GAIA) Multi-Language custom audio prompts Configurable LED drivers 6th gen dual-mic cVc® NR / AEC algorithms • 2-mic Far-end NR / AEC algorithms • Frequency enhanced speech intelligibility (FESI)
• • • • • •
• 5.5x5.5mm, 68-pin BGA (0.5mm pitch) • Pin compatible with CSR8645
• 5.5x5.5mm, 68-pin BGA (0.5mm pitch) • Pin compatible with CSR8640
KEY FEATURES
PACKAGE OPTIONS
A complete range of audio development kits is available to enable rapid evaluation and development of Bluetooth ROM applications. The Dev Kits include everything a designer needs to get started quickly and deliver a fully functional product to market in a very quick time. The kit includes an SPI-USB converter to allow software development via USB, a level shifting interface board is also included for communications with the development board. The kit also includes batteries, Bluetooth stub antenna and high-quality headphones as well as a quick-start guide and all necessary cables.
• • • • • • • • •
Bluetooth 4.1 HFP1.6, A2DP1.2 and AVRCP1.4 HD voice (wideband speech) Wired Audio (USB and Analogue) AAC-LC, MP3 and SBC decoders Leading aptX® CODEC for highquality audio Multi-band EQ (up to 6 x banks) Headphone stereo separation (soft 3D) iOS battery status monitor Smart Apps support (GAIA) Multi-Language custom audio prompts Configurable LED drivers 6th gen dual-mic cVc® NR / AEC algorithms 2-mic Far-end NR / AEC algorithms Frequency enhanced speech intelligibility (FESI)
DEVELOPMENT KIT SELECTOR TABLE TARGET DEVICE DESCRIPTION DEV KIT PART NUMBER BC6130 BC6130 QFN Dev Kit DK-BC-6130-1A BC6140
BC6140 QFN Dev Kit
DK-BC-6140-1A
BC6145
BC6145 QFN Dev Kit
DK-BC-6145-10037-1A
CSR8605
CSR8605 QFN Dev Kit
DK-8605-10141-1A
CSR8610
CSR8610 BGA Dev Kit
DK-8610-10083-1A
CSR8615
CSR8615 QFN Dev Kit
DK-8615-10161-1A
CSR8620
CSR8620 BGA Dev Kit
DK-8620-10065-1A
CSR8630
CSR8630 QFN Dev Kit
DK-8630-10153-1A
CSR8635
CSR8635 QFN Dev Kit
DK-8635-10163-1A
CSR8640
CSR8640 BGA Dev Kit
DK-8640-10061-2A
CSR8645
CSR8645 BGA Dev Kit
DK-8645-10064-1A
TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH ANTENNAS | NFC
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CSR8645™Development Kit Contents:
Figure 4: CSR8645 Software Development Board
Figure 5: Wired Headset Adaptor Board
Figure 6: SPI-USB Converter and Interface Board
Figure 7: Cables, headphones and Quick Start guide
TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH ANTENNAS | NFC
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PROGRAMMABLE GATEWAY FOR THE INTERNET OF THINGS MultiTech’s new IoT platform includes programmable gateways, long-range RF modules, accessory cards, and a remotely hosted application marketplace with comprehensive device management. MultiConnect® Conduit™ is the industry’s most configurable, manageable, and scalable cellular communications gateway for industrial IoT applications. Network engineers can remotely configure and optimize their Conduit performance through DeviceHQ™, the world’s first IoT Application Store and Device Management platform. Conduit features two accessory cards slots that enable users to plug in MultiConnect® mCard™ accessory cards supporting their preferred wired or wireless interface to connect a wide range of assets locally to the gateway. Available options include a LoRaWAN mCard capable of supporting thousands of MultiConnect® mDot™ long-range RF modules connected to remote sensors or appliances. Backhaul options include Ethernet or carrier approved and certified 4G-LTE, 3G & 2G options. Figure 1: MultiTech’s new IoT platform BENEFITS • Incredible asset management range - up to 10 miles line of sight, 1 to 3 miles into buildings • Backhaul options include 4G-LTE, 3G & 2G cellular or Ethernet for cost-effective global deployment • Integration support with a variety of partner and private Cloud Platforms • 2-way communication over any certified cellular network for cost effective global deployments • Create differentiated services for your customers via MultiTech’s Application Store • Developer documentation and support available at www.multitech.net
Both IBM’s Node-RED, a graphical, drag and drop interface and mLinux™ Open Embedded/Yocto 1.6 are supported to provide IT professionals, integrators and developers alike, their choice of development environments. Opening the complex world of IoT application development to a wider user group to monitor and control assets, utilize the distributed intelligence available in the Conduit gateway to provide analytics on incoming data and provide more actionable outgoing data.
APPLICATIONS Low Power Wide Area (LPWA) • Smart City – metering and submetering, parking, security and fire alarms • Smart Agriculture – environmental sensors • Building Management
FEATURES – MULTICONNECT® CONDUIT™ • Easy, fast, flexible and unrestricted application development via Open Linux, Java Script or Node-RED environments • Integration support with a variety of partner and private Cloud Platforms • Create differentiated services for your customers via MultiTech’s Application Store
TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH |ANTENNAS CELLULAR | NFC
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What’s in the MultiConnect Conduit Box? MTCDT-H5-210L-xx and MTCDTH5-210A-xx models include: Power supply with US, EU and UK power blades, Ethernet cable, USB cable, and cellular antenna. MTCDT-210L-xx and MTCDT-210Axx models include: Power supply with US, EU and UK power blades, Ethernet cable, and USB cable. Developer Kit and Accessories MultiTech’s MultiConnect® mDot™ Developer’s Kit is designed to work with all versions of mDot RF modules. The kit includes a development board, SMA antenna and USB cable (mDot sold separately). Ordering Part Number: MTUDK2-ST-MDOT
FEATURES – MULTICONNECT® MDOT™ • FCC/CE end-certified with ARM® mbed libraries for developers • 2-way duplex communication enables ideal for emergency or mission critical applications • Multiple I/O interfaces for most any “Thing” • LoRaWAN 1.0 Compliant data rates 293 bps – 20 Kbps+, FSK up to 300 Kbps
FEATURES – MULTICONNECT® MCARD™ • Manages diverse infrastructures through a wide range of interfaces and communication protocols including, Multi-Function Serial, GPIO and LoRa™ technologies. Wi-Fi, Bluetooth and GNSS coming soon! • Incredible performance - manages thousands of MultiConnect mDots connected to field assets, remote sensors and appliances • Two mCard slots increases operational capability without incurring extra gateway costs
FEATURES – DEVICEHQ™ • • • •
“Zero Touch” asset deployment reduces costs, complexity and time No truck-rolls via remote performance management and asset updates Update firmware and custom applications remotely Browse and download a wide variety of custom applications tailored to your business needs
Figure 2: MTUDK2-ST-MDOT
TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH |ANTENNAS CELLULAR | NFC
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PART SPECIFICATIONS MODEL
MTCDT-LXXX
MTCDT-H5
Technical Specifications Performance
LTE 3GPP Release 9 (100 Mbps peak downlink/50 Mbps peak uplink) AT&T/T-Mobile: HSPA+ 21/GPRS fallback Europe: HSPA+ 42/GPRS fallback Verizon: No fallback
HSPA+
Frequency Bands (MHz)
AT&T/T-Mobile: 4G: 700(B17)/850(B5)/AWS1700(B4)/1900(B2) 3G: 850(B5)/1900(B2) 2G: 850/1900
3G: 850/900/AWS1700/1900/2100 2G: 850/900/1800/1900
Europe: 4G: 800(B20)/1800(B3)/2600(B7) 3G: 850(B5)/900(B8)/2100(B1) 2G: 900/1800 Verizon: 700(B13)/AWS1700(B4) Processor & Memory
ARM9 processor with 32-bit ARM & 16-bit Thumb Instruction sets • 400 MHz • 16K Instruction Cache • 256 MB Flash Memory • 16K Data Cache • 128X16M DDR RAM
Packet Data
Up to 100 Mbps downlink, Up to 50 Mbps uplink
Radio Frequency
FSK, GFSK, MSK, GMSK, OOK and LoRa – a proprietary Digital Spread Spectrum technique
Storage Input Voltage
21 Mbps downlink, 5.76 Mbps uplink Micro SD 9V to 32VDC
Connectors Ethernet
1 RJ-45 Ethernet 10/100 port
USB
2 USB Ports: USB Host (Type-A), USB Device (Micro-B)
Serial
1 Debug Serial: USB Micro-B
Antenna SIM
Female SMA, 2 dBi detachable antennas (Qty 2) SIM/USIM
Physical Description Dimensions (LxWxH)
6.35” x 4.23” x 1.69” (161.3 mm x 107.4 mm x 42.8 mm)
Weight
1.01 lbs (16.2 oz) with two H5 accessory cards installed
Chassis Type
Metal
Environmental Operating Temperature
-30° to +70°C
Storage Temperature
-40° to +85°C
Humidity
20% to 90% Relative Humidity, non-condensing
Certifications EMC Compliance
US: FCC Part 15 Class B, EU: EN55022 Class B, EN 55024, Canada: ICES-003
Radio Compliance
FCC Part 22, 24, 27
Safety Network Approvals Quality
UL 60950-1 2nd Ed., cUL 60950-1 2nd Ed., IEC 60950-1 2nd Ed. PTCRB, GCF certified module, AT&T, T-Mobile, Verizon, Sprint. Pending: Rogers, Bell, Telus MIL-STD-810G: High Temp, Low Temp, Random Vibration. SAE J1455: Transit Drop & Handling Drop, Random Vibration, Swept-Since Vibration. IEC68-2-1: Cold Temp. IEC68-2-2: Dry Heat
*See the datasheet and developer guide for additional information at http://fcs.futureelectronics.com/
TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH |ANTENNAS CELLULAR | NFC
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PART SELECTOR TABLE - MULTICONNECT® CONDUIT™ PART NUMBER
DESCRIPTION
MTCDT-H5-210L-US-EU-GB
HSPA+ mLinux Programmable Gateway w/US/EU/UK Accessory Kit
MTCDT-H5-210A-US-EU-GB
HSPA+ Application Enablement Gateway w/US/EU/UK Accessory Kit
MTCDT-210L-US-EU-GB
mLinux Programmable Gateway w/US/EU/UK Accessory Kit
MTCDT-210A-US-EU-GB
Application Enablement Gateway w/US/EU/UK Accessory Kit
PART SELECTOR TABLE - MULTICONNECT® MDOT™ PART NUMBER
DESCRIPTION
MTDOT-915-X1-SMA-50
915 MHz XBee LoRa SMA (50 Pk)
MTDOT-915-X1-SMA-1
915 MHz XBee LoRa SMA (1 Pk)
MTDOT-915-X1P-SMA-1
915 MHz XBee LoRa SMA w/Programming Header (1 Pk)
MTDOT-915-X1-UFL-50
915 MHz XBee LoRa UFL (50 Pk)
MTDOT-915-X1-UFL-1
915 MHz XBee LoRa UFL (1 Pk)
MTDOT-915-M1-UFL-100
915 MHz SMT LoRa UFL (100 Pk)
MTDOT-915-M1-UFL-1
915 MHz SMT LoRa UFL (1 Pk)
MTDOT-915-M1-TRC-100
915 MHz SMT LoRa RF Pad (100 Pk)
MTDOT-915-M1-TRC-1
915 MHz SMT LoRa RF Pad (1 Pk)
MTDOT-868-X1-SMA-50
868 MHz XBee LoRa SMA (50 Pk)
MTDOT-868-X1-SMA-1
868 MHz XBee LoRa SMA (1 Pk)
MTDOT-868-X1P-SMA-1
868 MHz XBee LoRa SMA w/Programming Header (1 Pk)
MTDOT-868-X1-UFL-50
868 MHz XBee LoRa UFL (50 Pk)
MTDOT-868-X1-UFL-1
868 MHz XBee LoRa UFL (1 Pk)
MTDOT-868-M1-UFL-1
868 MHz SMT LoRa UFL (1 Pk)
MTDOT-868-M1-UFL-100
868 MHz SMT LoRa UFL (100 Pk)
MTDOT-868-M1-TRC-100
868 MHz SMT LoRa RF Pad (100 Pk)
MTDOT-868-M1-TRC-1
868 MHz SMT LoRa RF Pad (1 Pk)
TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH |ANTENNAS CELLULAR | NFC
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PART SELECTOR TABLE - MULTICONNECT® MCARD™ PART NUMBER
DESCRIPTION
MTAC-GPIO
GPIO Accessory Card, GPIO Cable Sold Separately
MTAC-LORA-868
868 MHz LoRa Accessory Card, Antenna Sold Separately
MTAC-LORA-915
915 MHz LoRa Accessory Card, Antenna Sold Separately
MTAC-MFSER-DCE
Multi-Function Serial Accessory Card - DCE Interface
MTAC-MFSER-DTE
Multi-Function Serial Accessory Card - DTE Interface
PART SELECTOR TABLE - ANTENNAS AND CABLES PART NUMBER
DESCRIPTION
AN868-915-1HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (1 Pk)
AN868-915-10HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (10 Pk)
AN868-915-50HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (50 Pk)
CARSMA-UFL-1
Reverse SMA-to-UFL Coax RF Cable, 6” – global (1 Pk)
CARSMA-UFL-10
Reverse SMA-to-UFL Coax RF Cable, 6” – global (10 Pk)
CARSMA-UFL-50
Reverse SMA-to-UFL Coax RF Cable, 6” – global (50 Pk)
CA-USB-A-MICRO-B-3
USB Cable Type A to Type B Micro (3 ft)
CA-MTAC-GPIO
GPIO Cable for MTAC-GPIO (2.5 ft)
TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY || BLUETOOTH |ANTENNAS CELLULAR | NFC
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NXP SEMICONDUCTORS - NFC READERS AND NTAG SOLUTIONS NXP presents an impressive range of NFC products in its portfolio and includes: NFC Frontend Solutions, NFC Controller Solutions and NTAG I2C. NFC frontend solutions are reader IC’s that require the use of an external microcontroller or host processor. They are the cost effective way to add NFC to a system. They work flawlessly with the firmware in NXP’s NFC reader libraries, and are the best choice when memory size, low power, and cost optimization are a first priority. Figure 1: NFC Controller Solution, PN7120
NFC Controller solutions combine an NFC radio frontend with an advanced 32-bit microcontroller. The controller solution is made for compact systems. NXP’s product portfolio include solutions with integrated firmware for an easy, standardized interface, or a freely programmable microcontroller with the ability to load entire, fully-custom applications. NXP not only offers reader IC’s, but NFC tag IC’s as well. The NTAG family provides both, a passive RF and I2C interface. The NTAG family complies with the NFC Forum. Some tags have additional interfaces like field detection, energy harvesting or I²C serial interface to connect to your embedded system. NTAG I²C products are an excellent choice for applications that require consumer interactive marketing and embedded electronics.
Figure 2: NFC Controller Board, PN7120
FEATURES/SPECS NFC Frontend Solutions: • Multi-protocol support e.g. ISO/IEC 14443 A & B, ISO/IEC 15693, FeliCa, ISO/NFC 18092, NFC-IP1 peer-topeer (Passive Initiator Mode) • Data rates of up to 848 kbit/s • Support of all smart card standards as well as NFC devices and NFC tags • Easy to design in through dedicated development boards and SW libraries • Cost-effective solution, pay for the features required in your design • Software tools: NFC Reader Library for easy creation of software stack and application
NFC Controller Solutions: • Broad product portfolio, from readers with integrated and customizable firmware • Multi-protocol support e.g. ISO/IEC 14443 A & B, ISO/IEC 15693, FeliCa, ISO/NFC 18092, NFC-IP1 peer-topeer (Passive Initiator Mode) • Data rates of up to 848 kbit/s • Support of all smart card standards as well as NFC devices and NFC tags • Easy to design in through dedicated development boards and SW libraries • Software tools: Downloadable Linux drivers validated with Raspberry Pi and Linux kernel
TECHNOLOGY | NFC
NTAG I2C: • RF interface NFC Forum Type 2 Tag compliant • Configurable field detection • Energy harvesting functionality to power external devices • NDEF message storage between 888 bytes -1904 bytes • Mapping of SRAM inside the user memory buffer allows dynamic update of NDEF message content • Pass through mode allows fast download and upload of data from RF to I2C and vice versa without limiting the EEPROM • Data rates of up to 106 kbit/s • Software tools: NTAG I2C support with Android App, downloadable source code, LPC microcontroller firmware
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Figure 3: NFC Frontend solution, PN512
Figure 4: NFC Controller solution, PN7120
Figure 5: NTAG I2C chip
APPLICATIONS NFC Frontend and Controller Solutions: • Payments • Access control • Secure identification, • Gaming • Social interaction • Advertising NTAG I2C: • Goods and device authentication • Smart manufacturing • Advanced device pairing • Connection handover • Maintenance • Gaming • Home automation • Consumer electronics • Printers • Smart meters • Home appliances
Figure 6: Block diagram for NFC Frontend Solution; PN512
TECHNOLOGY | NFC
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Figure 7: Block Diagram for NFC Controller solution; PN7120
Figure 8: Block Diagram for NTAG I2C Solution
TECHNOLOGY | NFC
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PART SELECTOR TABLE PART NUMBER
DESCRIPTION
DEVELOPMENT KIT
NFC FRONTENDS DELIVERING FULL NFC FORUM COMPLIANCE PN512
Full NFC Forum-compliant frontend
PNEV512B, PNEV512R
HIGH PERFORMANCE NFC FRONTENDS CLRC663 MFRC631
High-performance multi-protocol NFC frontend High-performance ISO/IEC 14443 A/B frontend
MFRC630
High-performance MIFARE frontend
SLRC610
High-performance ISO/IEC 15693 frontend
CLEV663, CLEV663B
STANDARD- PERFORMANCE NFC FRONTENDS MFRC523
Standard 3 V ISO/IEC 14443 A/B frontend
MFRC522
Standard 3 V MIFARE frontend NFC CONTROLLER SOLUTIONS
PN7120 PR601
Full NFC Forum-compliant controller w/ integrated FW and NCI interface High-performance multi-protocol NFC controller w/ customizable Firmware
OM5577/PN7120S PREV601M
NTAG SOLUTIONS NTAG I2C 2k NTAG I2C 1k NTAG 216F NTAG 213F
Passive NFC tag with I2C interface, 1904 bytes Passive NFC tag with I2C interface, 888 bytes Passive NFC tag with field-detection output signal, 888 bytes Passive NFC tag with field-detection output signal, 144 bytes
TECHNOLOGY | NFC
NTAG I2C Demo Kit OM5569/NT312D NTAG I2C Demo Kit OM5569/NT312D
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Figure 9: NTAG I2C Demo Kit
Figure 10: NTAG I2C Demo App, available on the Google Playstore
NXP offers a simple development resource for NFC connected tag chips, NTAG I²C Demo Kit. Designed to simulate an NTAG I2C tag chip in an embedded electronics system, the kit allows users to demonstrate basic principles of dual interface. The kit enables users to not only investigate the capabilities of the NTAG I2C chip through the various demonstrations, but also develop and test their own applications. The kit is centered on a LPC 812 microcontroller with a temperature sensor, I2C serial bus connector and JTAG debug connector. Combined together, they demonstrate dual interface communication (I2C/NFC), monitor energy harvesting and provide a localized application development environment. The kit includes a main board, a class 5 antenna board and is supported by an Android app that is available on the Google Playstore free of charge.
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GAINSPAN IOT SOLUTIONS OFFER FLEXIBILITY TO WORK OPTIMALLY WITH ANY MCU OR WITHOUT MCUS GainSpan delivers the most complete, flexible and powerful connectivity solutions for the IoT market. One of the keys to these capabilities is the company’s suite of software running on its Wi-Fi Chip—embedded, Serialto-Wi-Fi (S2W) and IP-to-Wi-Fi (IP2W)—which gives customers the flexibility to work optimally with any MCU or without MCUs. Whether your design is a simple “hostless” smartplug or a Gateway or device with a complex display, GainSpan provides a very quick path to development and market at every MCU performance level.
Figure 1: GS2011MIZ-shield 802.11 b/g/n Shield Compatible with Arduino form factor APPLICATIONS Hostless: • Smartplug • Sensor node • Weight scale Small Host: • Doorbells • Video surveillance cameras • Appliances Big Host: • Thermostats • Gateways
BENEFITS • Quick and easy way to add Wi-Fi connectivity to billions of devices • Flexible solutions optimized to accommodate varying MCU capabilities • Quick path to development and market
Today, GainSpan offers three development options—a hostless (no MCU) solution and two hosted solutions. One hosted solution, which uses S2W, is designed for projects with 8- or 16-bit MCUs or low-cost 32-bit platforms such as the Renesas RL78 or RX family and equivalent from other MCU vendors. The other hosted solution, using IP2W, is designed for high-end and Linux platforms such as the RZ family from Renesas, but could also be used with the higher end RX family of products. For hostless solutions, the full networking stack and customer application run on the GS2000. GainSpan embedded software provides all the building blocks needed for low power IoT devices from sensors to battery-powered video cameras. It allows customers to develop custom applications on the GS2000 SoC, through a comprehensive yet simple set of APIs. For S2W hosted solutions, the full networking stack and services including HTTP(s)/Web server, XML parser and Bonjour, are running on the GS2000 and hence offloading the host microcontroller. All that is required are simple AT commands – for configuration and data communications as well as for scanning and reporting SSID’s, power management and over the air firmware upgrade. For IP2W hosted solutions, the networking stack (e.g., the Micrium stack or the native Linux networking stack) runs on the host processor. GainSpan’s software provides a quick and easy way to add Wi-Fi capability to billions of devices, turning them into connected devices. FEATURES Multiple modes of operation: • Station • Limited AP • Wi-Fi Direct • Limited AP Concurrent Mode • Wi-Fi Direct Concurrent Mode
Easy provisioning modes: • AP Mode • Secure Group Provisioning • iOS7 Provisioning • Concurrent Provisioning
Cloud connectivity
Drivers/tools available for multiple MCUs
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GAINSPAN EVALUATION BOARDS TO INTERFACE WITH DIFFERENT MCU DEVELOPMENT KITS PART NUMBER
DESCRIPTION
GS2100MIP-EVB3-S2W
Evaluation Board with an 802.11 b/g/n GS2100MIP Wi-Fi module
GS2011MIES-EVB3-S2W
Evaluation Board with an 802.11 b/g/n GS2011MIES Wi-Fi module
WAB-GW-GS2011MIZ
802.11b/g/n Wi-Fi Adapter Board with PMOD connector and Application Header Interface to interface to MCU using UART or SPI
SD-GW-GS2100MIP
SD Card providing 802.11b/g/n Wi-Fi connectivity through SDIO
GS2100MIP-Shield GS2011MIZ-Shield
802.11 b/g/n Wi-Fi shield compatible with Arduino form factor, with GS2100MIP module. UART AND SPI interfaces. 802.11 b/g/n Wi-Fi shield compatible with Arduino form factor with GS2011MIZ module. UART AND SPI interfaces.
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SX-PCEGN-BT:
LOW-COST MINI-PCIe COMBO WI-FI MODULE FEATURES COMPATIBILITY WITH FREESCALE’S I.MX6 PLATFORM SX-PCEGN-BT, is an 802.11 b/g/n Wi-Fi plus Bluetooth combo PCIe solution based on Qualcomm Atheros’s proven technology. It features the AR9485 chipset for Wi-Fi and AR3012 for Bluetooth 4.0. The SX-PCEGN-BT, like other Silex PCIe offerings, is a viable wireless connectivity option for various platforms including the Freescale i.MX6.
Figure 1: SX-PCEGN-BT
The SX-PCEGN-BT is Silex’s entry-level PCIe solution that offers Bluetooth for users looking to add a Bluetooth connectivity option to their device using a PCIe radio. Its low cost and Freescale compatibility combined with Silex’s unmatched local support make it an ideal solution for customers who want to integrate high-performance Wi-Fi into their device.
Figure 2: Performance vs. Cost Chart
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Figure 3: SX-PCEGN-BT Major Component and System Interface
APPLICATIONS
SPECIFICATIONS
The SX-PCEGN-BT is designed to meet the demanding performance requirements of critical embedded applications. Applications include:
Product Name
SX-PCEGN-BT
Radio Chipset
Atheros® AR9485 (Wi-Fi) Atheros® AR3012 (Bluetooth)
Radio Specifications
802.11 b/g/n + BT4.0
• • • • • •
Security
64-bit, 128-bit, 152-bit WEP Encryption 802.1x Authentication AES-CCM & TKIP Encryption
Operation mode
Infrastructure & Ad-hoc mode
Wireless Interface
PCIe
Operating Voltage
3.3 V
Operating Temperature
-10 to 60 °C Ambient
Current Consumption
Average Tx: 295mA Max Tx: 410mA
Dimensions
26.65 x 29.85 x 3.37 mm
Medical devices Security Systems Industrial Digital Signs Set-Top/ Net-Top Box Embedded Industrial applications • Tablet PC • Handheld devices • Thin Client devices and many more.
802.11b: 1, 2, 5.5, 11Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps Transfer data rate 802.11n: 20MHz - 72.2 Mbps 40MHz -150 Mbps
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BENEFITS
FEATURES
• Low Cost • 802.11n 1x1 • Wi-Fi + Bluetooth Combo Module • Works and tested with the Freescale i.MX6 platform. • Works well with the open source driver • Modular certifications for FCC and Telec
• Supports up to 150 Mbps data rate • Compliant with IEEE802.11 b/g/n standards • Compliant with IEEE 802.11b, 802.11d, 802.11e and 802.11g standards and the 802.11i specification • Includes signal-sustain technology (SST) rate-over-range enhancements such as low-density parity check (LDPC) and maximum likelihood demodulation (MLD) • Supports all mandatory IEEE 802.11n features as well as several optional features such as HT40, half-guard interval in HT40 and Rx space-time block coding (STBC) • Supports low-power sleep modes and wake-on-wireless (WoW) LAN • Features the Atheros AR3012 Bluetooth 4.0 + HS chipset and Bluetooth Class 1 Radio • USB 2.0 device interface supports standard HCI USB • RoHS compliant
PART SELECTOR TABLE PART NUMBER SX-PCEGN-BT SX-PCEGN-BT-SP
DESCRIPTION The SX-PCEGN-BT is based on Qualcomm Atheros AR9485 and AR3012 radio chip. It is a wireless PCIe 802.11bgn 1x1 plus Bluetooth 4.0 solution. The SX-PCEGN-BT is based on Qualcomm Atheros AR9485 and AR3012 radio chip. It is a 802.11bgn 1x1 plus Bluetooth 4.0 solution. Sample Pack. No Antennas included.
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STMICROELECTRONICS SPWF01SX WI-FI MODULES FOR IOT APPLICATIONS The SPWF01SA and the SPWF01SC intelligent Wi-Fi modules represent a plug and play and standalone 802.11 b/g/n solution for easy integration of wireless Internet connectivity features into existing or new products. Configured around a single-chip 802.11 transceiver with integrated PA and an STM32 microcontroller with an extensive GPIO suite, the modules also incorporate timing clocks and voltage regulators. Two different options exist based on the integrated Flash memory.
The SPWF01Sx.1y orderable parts integrate 1.5 MB of Flash, while The SPWF01Sx.2y orderable parts integrate 512 kB of Flash. The module is available either configured with an embedded micro 2.45 GHz ISM band antenna (SPWF01SA), or with a U.FL connector for external antenna connection (SPWF01SC). With low power consumption and small form factor, the modules are ideal for fixed and mobile wireless applications, as well as challenging batteryoperated applications.
Figure 1: SPWF01SA & SPWF01SC
The SPWF01Sx.y1 orderable parts are released with an integrated full featured TCP/IP protocol stack with added web server and additional application service capabilities. The SW package also includes an AT command layer interface for user-friendly access to the stack functionalities via the UART serial port.
APPLICATIONS • Smart appliances • Industrial control and data acquisition • Home automation and security systems • Wireless sensors • Cable replacement • Medical equipment • Machine-to-machine communication Figure 2: Block Diagram
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BENEFITS KEY FACTORS
KEY BENEFITS
Mass Market Positioning
An affordable solution for all volumes
802.11 b/g/n integrated radio
Easy integration in WLAN systems
Full integrated device
Reduces Development Times for Time To Market
Integrated antenna or u.fl connector
No RF knowledge is required for integration
CE, FCC, IC RF certified
Reduces Certification costs of the target application
No need of a driver or external protocol stack
Extended usability with any host processor
Micro-sized form factor
SMD-like component to fit miniaturized devices
Integrated TCP/IP and Application Layer Functions
Allows an easy integration at the application level
Industrial Temperature Range
Allows integration in many different industrial applications
FEATURES/SPECS • 2.4 GHz IEEE 802.11 b/g/n transceiver • STM32 ARM Cortex-M3, with 64 KB RAM and • 512KB Flash memory • 1MByte Extended Flash for FW update • Firmware “Over The Air” Update (only on SPWF01Sx.1y) • Integrated TCP/IP protocol stack • 8 Simultaneous TCP or UDP clients and 1 Socket server • 1 TLS/SSL Socket client supporting up to TLS 1.2, including common encryption algorithms: AES (128,256), hash (MD5, SHA-1, SHA-256) and public key algorithms (RSA, ECC). • Web Server supporting dynamic web pages • RESTful API’s to get & post cloud content • WEP/WPA/WPA2 Personal Security • System Modes: Station, IBSS, and miniAP • miniAP easily provisioned (SSID, PWD) • Fast Wi-Fi reconnect after reset • TX Power • 18.3 dBm @ 1 Mbps DSSS • 13.7 dBm @ 5 4Mbps OFDM
• RX Sensitivity • -96.0 dBm @ 1 Mbps DSSS • -74.5 dBm @ 54 Mbps OFDM • 16 configurable GPIOs available • UART interface to host system • Advanced low-power modes • Stand-by with RTC: 43 μA • Sleep connected (DTIM=1): 15 mA • RX Traffic: 105 mA Typical • TX Traffic: 243 mA Typical @ 10 dBm • Simple AT command set host interface through UART • Small form factor: 26.92 x 15.24 x 2.35 mm • Single voltage supply (3.3 V typical) • Multiple antenna options: • Integrated antenna (SPWF01SA.xy versions) • Integrated U.FL connector (SPWF01SC.xy versions) • Industrial temperature range: -40 °C to 85 °C • FCC/CE/IC certified • RoHS compliant • Surface mount PCB module
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Figure 3: Block Diagram PART SELECTOR TABLE PART NUMBER
DESCRIPTION
PRODUCTION STATUS
SPWF01SA.11
Extended Flash, Integrated Antenna, AT Full Stack
Full Production
SPWF01SC.11
Extended Flash, Integrated U.Fl. connector, AT Full Stack
Full Production
SPWF01SA.21
Integrated Antenna, AT Full Stack
Full Production
SPWF01SC.21
Integrated U.Fl. connector, AT Full Stack
Full Production
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Figure 4: STEVAL-PCC018V1
STEVAL-PCC018V1 + STEVAL-IDW001V1 • Used as a dongle via the USB connector • Requires to install the USB Driver • A llows the use of Teratem or equivalent application to use the AT commands
STEVAL-IDW001V1 + STM32F0DISCOVERY • Do not require any driver on the STM32 • Application Examples included in the kit
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