Hardware Description

Transcript

HUAWEI SE2900 Session Border Controller V300R002C10 Hardware Description Issue 01 Date 2016-01-15 HUAWEI TECHNOLOGIES CO., LTD. Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. Trademarks and Permissions and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied. Huawei Technologies Co., Ltd. Address: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China Website: http://www.huawei.com Email: [email protected] Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. i HUAWEI SE2900 Session Border Controller Hardware Description Contents Contents 1 Service Processing Device ........................................................................................................... 1 1.1 Subrack Datasheet ........................................................................................................................................................ 2 1.2 Subrack Classification and Numbering Rules .............................................................................................................. 5 1.3 F8002 DC Subrack ....................................................................................................................................................... 6 1.3.1 PEM ......................................................................................................................................................................... 12 1.3.2 Fan Tray ................................................................................................................................................................... 15 1.4 F8002 AC Subrack ...................................................................................................................................................... 17 1.4.1 AC PSU.................................................................................................................................................................... 24 1.4.2 Fan Tray ................................................................................................................................................................... 28 1.5 F8002 Subrack System Topology Structure ................................................................................................................ 30 1.5.1 CAN Bus.................................................................................................................................................................. 30 1.5.2 Base Topology Structure .......................................................................................................................................... 31 1.5.3 eFabric Topology Structure ...................................................................................................................................... 32 1.6 F8002 Subrack System Monitoring ............................................................................................................................ 33 1.6.1 Power Module Monitoring....................................................................................................................................... 33 1.6.2 Fan Tray Monitoring ................................................................................................................................................ 33 1.7 MXU ........................................................................................................................................................................... 34 1.7.1 MXUA0 ................................................................................................................................................................... 34 1.8 SPU ............................................................................................................................................................................. 45 1.8.1 SPUA0 ..................................................................................................................................................................... 45 1.8.2 SPUA1 ..................................................................................................................................................................... 53 1.8.3 SPUZ0 ..................................................................................................................................................................... 61 1.9 VPU ............................................................................................................................................................................ 69 1.9.1 VPUA0 .................................................................................................................................................................... 69 1.9.2 VPUA1 .................................................................................................................................................................... 77 1.10 Filler Panel ................................................................................................................................................................ 85 2 Other Accessories ........................................................................................................................ 87 2.1 Alarm Box................................................................................................................................................................... 87 2.2 Optical Module ........................................................................................................................................................... 91 2.3 Electrical Module........................................................................................................................................................ 98 3 Cables .......................................................................................................................................... 101 3.1 Power Cables and PGND Cables .............................................................................................................................. 101 Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. ii HUAWEI SE2900 Session Border Controller Hardware Description Contents 3.1.1 Power and PGND Cables to a Subrack .................................................................................................................. 101 3.1.2 Power Cables of the Alarm Box............................................................................................................................. 104 3.2 Signaling Cables ....................................................................................................................................................... 105 3.2.1 Ethernet Cable ....................................................................................................................................................... 105 3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable ............................................................................................................ 108 3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable ...................................................................................................... 109 3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable ........................................................................................................... 110 3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable ..................................................................................................... 112 3.2.6 High-Density Cable ............................................................................................................................................... 113 3.2.7 DB9-RJ45 Serial Cable .......................................................................................................................................... 115 Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. iii HUAWEI SE2900 Session Border Controller Hardware Description 1 1 Service Processing Device Service Processing Device About This Chapter 1.1 Subrack Datasheet 1.2 Subrack Classification and Numbering Rules 1.3 F8002 DC Subrack 1.4 F8002 AC Subrack 1.5 F8002 Subrack System Topology Structure 1.6 F8002 Subrack System Monitoring 1.7 MXU 1.8 SPU 1.9 VPU 1.10 Filler Panel Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.1 Subrack Datasheet Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 2 HUAWEI SE2900 Session Border Controller Hardware Description Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1 Service Processing Device 3 HUAWEI SE2900 Session Border Controller Hardware Description Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1 Service Processing Device 4 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.2 Subrack Classification and Numbering Rules Subrack Numbering Rules  Each subrack has a unique number.  The subracks in a cabinet are numbered in ascending order from bottom to top. The basic subrack is the first subrack from the bottom and is numbered 0.  If there are multiple cabinets, the subracks are numbered in ascending order based on the cabinet numbers. Figure 1-1 illustrates how subracks are numbered. Figure 1-1 Subrack numbering rules Figure 1-1 uses a cabinet configured with more than two subracks as an example. Number subracks based to the subrack numbering rule depending on the actual situation. Subrack Slot Numbering Rules The slots in an subrack are numbered from 1 in ascending order from bottom to top and then from left to right. Figure 1-2 illustrates how the slots are numbered in an F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-2 Slot numbering rules in the F8002 subrack The slot identifiers are labeled inside the subrack. 1.3 F8002 DC Subrack Functions Table 1-1 describes the functions of the F8002 subrack. Table 1-1 F8002 subrack functions Function Description Power supply Two power entry modules (PEMs) are configured in 1+1 redundancy mode. Each PEM supplies DC power to the entire subrack through the backplane. Data transmission The F8002 subrack provides data transmission channels. Heat dissipation Two fan trays are configured to dissipate heat for the subrack. Subrack identification Each F8002 subrack has a unique number. If the subrack number is not set, the subrack number indicators are blinking in sequence. For details about how to set the subrack number, see Hardware-Specific Modifications. Appearance Figure 1-3 shows an F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-3 F8002 subrack (unit: mm) Each F8002 subrack provides six slots for installing the multi-function switch units (MXUs) and service boards. Figure 1-4 shows the slot positions of the F8002 subrack. Figure 1-4 F8002 subrack slot positions The F8002 subrack provides:  Slots 2 and 5 for MXUs.  Slots 1, 3, 4, and 6 for service boards. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device  PEM 1 and PEM 2 for PEMs.  Fan 1 and Fan 2 for fan trays. Figure 1-5 shows the front view of an F8002 subrack in full configuration. Figure 1-5 Front view of an F8002 subrack in full configuration Figure 1-6 shows the rear view of an F8002 subrack. Figure 1-6 Rear view of an F8002 subrack Table 1-2 describes the components of the F8002 subrack. Table 1-2 F8002 subrack components Componen t Quantit y Description MXU 2 The MXUs implement operation, maintenance, and management of the system. Two MXUs are installed in slots 2 and 5 to work in active/standby mode. Service boards 4 The service boards can be installed in slots 1, 3, 4, and 6. The service boards in any two slots can be configured in active/standby mode. PEM 2 Two PEMs are configured in 1+1 redundancy mode. If one Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8 HUAWEI SE2900 Session Border Controller Hardware Description Componen t Quantit y 1 Service Processing Device Description PEM is faulty, the power supply to the subrack is not affected. Fan tray 2 Two fan trays are configured to draw in cool air from the front of the subrack and exhaust warm air from the rear of the subrack. Figure 1-7 shows the air flows. Ground point 2 The F8002 subrack provides two ground points. Electrostatic discharge (ESD) jack 1 If the subrack is used in North America, connect both ground points. If the subrack is used in other regions, only connect one of the ground points. The F8002 subrack provides one ESD jack. Figure 1-7 Heat dissipation in the subrack Figure 1-8 shows the power supply mode of the F8002 subrack. Each PEM supplies power to all slots and fan trays in the subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-8 F8002 subrack power supply mode Logical Structure Figure 1-9 shows the logical structure of the F8002 subrack. Figure 1-9 F8002 subrack logical structure  The MXUs implement subrack management and data exchange in the subrack.  The MXUs work in active/standby mode. Only the active MXU executes management tasks. The MXUs also manage the two fan trays through the RS485 bus and the two PEMs through the Inter-integrated circuit (I2C) bus.  The service data and signaling data from a service board is forwarded in eFabric channels to the MXUs through the backplane. The MXUs then forward the data to another service board.  The management data from a service board is forwarded in Base channels to the MXUs through the backplane. The MXUs then forward the data to another service board.  The power distribution box (PDB) in the subrack provides two DC power supplies to the subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Hardware and Software Compatibility Table 1-3 lists the boards that can be used in F8002 subracks. Table 1-3 Types of boards in the F8002 subrack MXU Type Compatible Service Board Type Compatibility Rule MXU  SPU -  VPU Technical Specifications Table 1-4 lists the technical specifications of the F8002 subrack. Table 1-4 F8002 subrack technical specifications Item Mechanical specificatio ns Power supply Specifications Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x 17.40 in. x 26.57 in.) Weight of an empty subrack 20.8 kg (45.86 lb) Weight of a fully loaded subrack 47.8 kg (105.38 lb) Rated input voltage -48 V DC to -60 V DC Operating voltage -40 V DC to -72 V DC Total power inputs Two Rated input current 60 A/power input Power rating 2400 W (The rated power of each PEM is 2400 W) NOTE An empty subrack is equipped with two fan trays and two PEMs. NOTE A fully loaded subrack is equipped with two fan trays, two PEMs, two MXUA0s, and four SPUA0s. NOTE The subrack is configured with two PEMs in 1+1 redundancy mode. Environme ntal specificatio ns Issue 01 (2016-01-15) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11 HUAWEI SE2900 Session Border Controller Hardware Description Item 1 Service Processing Device Specifications Humidity Altitude  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing)  Storage humidity: 10% RH to 95% RH (non-condensing) -60 m to +4000 m (-196.85 ft to +13123.20 ft) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.3.1 PEM Functions Table 1-5 describes the functions of the power entry module (PEM). Table 1-5 PEM functions Function Description Power supply  Supplies power to devices in the subrack.  Supports wide input voltage range.  Detects the installation status and type of PEMs.  Provides the indicators on the panel to indicate PEM status.  Detects the voltage and power of the subrack.  Detects the status of the circuit breakers and surge protection circuits.  Detects the PEM temperature.  Reports voltage, current, and power information in real time.  Implements the electronic label function.  Implements surge protection, short circuit protection, and over-current protection.  Prevents incorrect insertion. Power distribution monitoring Protection Appearance Figure 1-10 shows a PEM. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 12 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-10 PEM Figure 1-11 shows the PEM panel. Figure 1-11 PEM panel 1. STATUS indicator Issue 01 (2016-01-15) 2. Power input terminal RTN(+) 3. Power input terminal protective cover Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4. Handle 13 HUAWEI SE2900 Session Border Controller Hardware Description 5. Captive screw 1 Service Processing Device 6. Circuit breaker 7. Power input terminal NEG(-) 8. Circuit breaker protective cover The circuit breaker is switched on when it is turned up and is switched off when it is turned down. Indicators Table 1-6 describes the STATUS indicator on the PEM panel. Table 1-6 STATUS indicator on the PEM panel Silk Screen Meaning State State Description STATUS Status indicator Off There is no power supply. Green The PEM is operating properly. Red  The power supply is abnormal.  The surge protection circuit is faulty.  The circuit breaker is faulty. Technical Specifications Table 1-7 lists the technical specifications of the PEM. Table 1-7 PEM technical specifications Item Mechanical specificatio ns Voltage and current Environme ntal specificatio Issue 01 (2016-01-15) Specifications Dimensions (H x W x D) 122.5 mm x 65.0 mm x 122.7 mm (4.82 in. x 2.60 in. x 4.83 in.) Weight 1.0 kg (2.20 lb) Input terminal Duplex M6 Rated input voltage -48 V DC to -60 V DC Maximum input voltage -40 V DC to -72 V DC Total power inputs 1 Rated input current 60 A/power input PEM voltage drop ≤ 0.5 V Power rating 2400 W Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Item Specifications ns +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F) Relative humidity ≤ 95% RH Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.3.2 Fan Tray Functions Table 1-8 describes the functions of the fan tray. Table 1-8 Fan tray functions Function Description Heat dissipation The fan trays draw in cool air from the front of the subrack and exhaust warm air from the rear of the subrack. Monitoring Fan monitoring boards are configured for fan trays to:  Provide ports for communicating with the switch boards.  Detect and report the fan operating status and speed values.  Control the health indicators on the fan trays.  Support fan blocking status detection and reports fan alarms.  Support online software upgrades and log uploads.  Monitor and report the fan temperature.  Detect the fan tray installation status. Speed adjustment The fan speed can be automatically or manually adjusted based on the ambient temperature, implementing fan speed adjustment for low-power operating. Hot swap Online replacement is supported. Appearance Figure 1-12 shows a fan tray. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 15 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-12 Fan tray Indicators There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table 1-9 describes the indicator on the panel. Table 1-9 Health indicator on the fan tray Silk Screen Meaning State State Description None Health indicator Off The fan monitoring module is not powered on. Blinking green  Blinking at 0.5 Hz: The fan tray is operating properly, and the communication is normal.  Blinking at 4 Hz: The fan tray is operating properly, but the communication is abnormal. Issue 01 (2016-01-15) Steady orange The fan monitoring module is powered on, but the hardware is abnormal. Blinking red at 0.5 Hz An alarm is generated. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Technical Specifications Table 1-10 lists the technical specifications of the fan tray. Table 1-10 Technical specifications of a fan tray Item Specifications Mechanical specificatio ns Dimensions (H x W x D) 124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x 5.16 in. x 4.91 in.) Weight 1.7 kg (3.75 lb) Electrical specificatio ns Total power inputs Two power inputs are provided by the backplane in the subrack. Maximum power consumption 140 W Typical power consumption 20 W Temperature  Long-term operating temperature: 0°C to 70°C (32°F to 158°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F) Environme ntal specificatio ns Noise 66 dBA 1.4 F8002 AC Subrack Functions Table 1-11 describes the functions of the F8002 subrack. Table 1-11 F8002 subrack functions Function Description Power supply Two AC power supply units (PSUs) are configured in 1+1 redundancy mode. Each AC PSU supplies DC power to the entire subrack through the backplane. Data transmission The F8002 subrack provides data transmission channels. Heat dissipation Two fan trays are configured to dissipate heat for the subrack. Subrack identification Each F8002 subrack has a unique number. If the subrack number is not set, the subrack number indicators are blinking in sequence. For details about how to set the subrack number, see Hardware-Specific Modifications. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Appearance Figure 1-13 shows an F8002 subrack. Figure 1-13 F8002 subrack (unit: mm) Each F8002 subrack provides six front slots and four rear slots. The front slots are installed with the multi-function switch units (MXUs) and service boards. The rear slots are installed with AC PSUs and fan modules. Figure 1-14 shows the slot positions. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-14 F8002 subrack slot positions The F8002 subrack provides:  Slots 2 and 5 for MXUs.  Slots 1, 3, 4, and 6 for service boards.  PSU 1 and PSU 2 for AC PSUs.  Fan 1 and Fan 2 for fan trays. Figure 1-15 shows the front view of an F8002 subrack in full configuration. Figure 1-15 Front view of an F8002 subrack in full configuration Figure 1-16 shows the rear view of an F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 19 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-16 Rear view of an F8002 subrack Table 1-12 describes the components of the F8002 subrack. Table 1-12 F8002 subrack components Componen t Quantit y Description MXU 2 The MXUs implement operation, maintenance, and management of the system. Two MXUs are installed in slots 2 and 5 to work in active/standby mode. Service boards 4 The service boards can be installed in slots 1, 3, 4, and 6. The service boards in any two slots can be configured in active/standby mode. AC PSU 2 Two AC PSUs are configured in 1+1 redundancy mode. If one AC PSU is faulty, the power supply to the subrack is not affected. Fan tray 2 Two fan trays are configured to perform heat dissipation for the components in the subrack. Figure 1-17 shows the air flows. Ground point 2 Electrostatic discharge (ESD) jack 1 Issue 01 (2016-01-15)  Heat dissipation of the subrack: The fans draw in cool air from the front of the subrack and exhaust warm air from the rear of the subrack.  Heat dissipation of the PSUs: The fans draw in cool air from the side panels of the subrack and exhaust warm air from the rear of the subrack. The F8002 subrack provides two ground points. If the subrack is used in North America, connect both the ground points. If the subrack is used in other regions, only connect one of the ground points. The F8002 subrack provides one ESD jack. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 20 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-17 Heat dissipation in the subrack Figure 1-18 shows the power supply mode of the F8002 subrack. Each AC PSU supplies power to all slots and fan trays in the subrack. Figure 1-18 F8002 subrack power supply mode Logical Structure Figure 1-19 shows the logical structure of the F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-19 F8002 subrack logical structure  The MXUs implement subrack management and data exchange in the subrack.  The MXUs work in active/standby mode. Only the active MXU executes management tasks. The MXUs also manage the two fan trays through the RS485 bus and the two AC PSUs through the Inter-integrated circuit (I2C) bus.  The service data and signaling data from a service board is forwarded in eFabric channels to the MXUs through the backplane. The MXUs then forward the data to another service board.  The management data from a service board is forwarded in Base channels to the MXUs through the backplane. The MXUs then forward the data to another service board. Hardware and Software Compatibility Table 1-13 lists the boards that can be used in F8002 subracks. Table 1-13 Types of boards in the F8002 subrack MXU Type Compatible Service Board Type Compatibility Rule MXU  SPU -  VPU Technical Specifications Table 1-14 lists the technical specifications of the F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 22 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Table 1-14 F8002 subrack technical specifications Item Mechanical specificatio ns Power supply Specifications Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x 17.40 in. x 26.57 in.) Weight of an empty subrack 20.8 kg (45.86 lb) Weight of a fully loaded subrack 47.8 kg (105.38 lb) Rated input voltage AC: 200 V to 240 V NOTE An empty subrack is equipped with two fan trays and two AC PSUs. NOTE A fully loaded subrack is equipped with two fan trays, two AC PSUs, two MXUA0s, and four SPUA0s. High-voltage DC: 240 V Maximum input voltage AC: 176 V to 264 V High-voltage DC: 192 V to 288 V Total power inputs Two Rated input current 10 A/power input Power rating 2000 W (The rated power of each AC PSU is 2000 W) NOTE The subrack is configured with two AC PSUs in 1+1 redundancy mode. Environme ntal specificatio ns Temperature Humidity Altitude  Operating temperature: 0°C to 40°C (32°F to 104°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing)  Storage humidity: 10% RH to 95% RH (non-condensing) -60 m to +4000 m (-196.85 ft to +13123.20 ft) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.4.1 AC PSU Functions Table 1-15 describes the functions of the AC power supply unit (PSU). Table 1-15 AC PSU functions Function Description Power supply  Supports AC and high-voltage DC power inputs, and converts AC input power into DC output power.  Supplies DC power to devices in the subrack.  Supports current equalization.  Detects the AC PSU installation status, AC PSU type, and power input.  Provides indicators on the panel to indicate AC PSU status.  Supports queries on input/output voltage and current.  Supports queries on input power and maximum output power.  Supports queries on the electronic label, temperature, and version of the AC PSUs.  Detects the fan fault of the AC PSUs.  Supports input under-voltage and over-voltage protection.  Supports input overcurrent and short circuit protection.  Supports output overvoltage protection.  Supports output short circuit current restriction protection.  Supports overheat protection.  Prevents incorrect insertion. Power distribution monitoring Protection Appearance Figure 1-20 shows a AC PSU. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-20 AC PSU Figure 1-21 shows the AC PSU panel. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-21 AC PSU panel 1. STATUS indicator 2. Fan 3. Handle 4. Cable tie holder 5. Power cable clip slot 6. Power input port 7. Captive screw - Indicators Table 1-16 describes the STATUS indicator on the AC PSU panel. Table 1-16 STATUS indicator on the AC PSU panel Silk Screen Meaning State State Description STATUS Status indicator Off There is no power supply. Steady green The AC PSU is operating properly. Blinking green at 0.5 Hz The AC PSU is in hibernation mode and is supplying no power. Blinking green at 4 Hz The AC PSU software is being loaded. Steady red  The input voltage is not within the normal range.  The output voltage is not within the Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 26 HUAWEI SE2900 Session Border Controller Hardware Description Silk Screen Meaning 1 Service Processing Device State State Description normal range.  An output overcurrent or short circuit fault is occurring.  The AC PSU temperature reaches the threshold.  A AC PSU fan is faulty  The storage devices are faulty. Technical Specifications Table 1-17 lists the technical specifications of the AC PSU. Table 1-17 AC PSU technical specifications Item Specifications Mechanical specificatio ns Dimensions (H x W x D) 120.0 mm x 79.0 mm x 122.0 mm (4.72 in. x 3.11 in. x 4.80 in.) Weight 1.36 kg (3.00 lb) Voltage and current Rated input voltage AC: 200 V to 240 V High-voltage DC: 240 V Maximum input voltage AC: 176 V to 264 V High-voltage DC: 192 V to 288 V Environme ntal specificatio ns Issue 01 (2016-01-15) Rated input current 10 A Operating frequency AC: 50 Hz/60 Hz Power input One Power rating 2000 W Temperature  Operating temperature: 0°C to 40°C (32°F to 104°F)  Storage temperature: -40°C to +85°C (-40°F to +185°F) Humidity 5% RH to 95% RH (non-condensing) Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 27 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.4.2 Fan Tray Functions Table 1-18 describes the functions of the fan tray. Table 1-18 Fan tray functions Function Description Heat dissipation The fan trays draw in cool air from the front of the subrack and exhaust warm air from the rear of the subrack. Monitoring Fan monitoring boards are configured for fan trays to:  Provide ports for communicating with the switch boards.  Detect and report the fan operating status and speed values.  Control the health indicators on the fan trays.  Support fan blocking status detection and reports fan alarms.  Support online software upgrades and log uploads.  Monitor and report the fan temperature.  Detect the fan tray installation status. Speed adjustment The fan speed can be automatically or manually adjusted based on the ambient temperature, implementing fan speed adjustment for low-power operating. Hot swap Online replacement is supported. Appearance Figure 1-22 shows a fan tray. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 28 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-22 Fan tray Indicators There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table 1-19 describes the indicator on the panel. Table 1-19 Health indicator on the fan tray Silk Screen Meaning State State Description None Health indicator Off The fan monitoring module is not powered on. Blinking green  Blinking at 0.5 Hz: The fan tray is operating properly, and the communication is normal.  Blinking at 4 Hz: The fan tray is operating properly, but the communication is abnormal. Issue 01 (2016-01-15) Steady orange The fan monitoring module is powered on, but the hardware is abnormal. Blinking red at 0.5 Hz An alarm is generated. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 29 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Technical Specifications Table 1-20 lists the technical specifications of the fan tray. Table 1-20 Technical specifications of a fan tray Item Specifications Mechanical specificatio ns Dimensions (H x W x D) 124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x 5.16 in. x 4.91 in.) Weight 1.7 kg (3.75 lb) Electrical specificatio ns Total power inputs Two power inputs are provided by the backplane in the subrack. Maximum power consumption 140 W Typical power consumption 20 W Temperature  Long-term operating temperature: 0°C to 70°C (32°F to 158°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F) Environme ntal specificatio ns Noise 66 dBA 1.5 F8002 Subrack System Topology Structure 1.5.1 CAN Bus Functions The controller area network (CAN) bus performs board power management and transmits subrack information between the MXUs and service boards. Figure 1-23 shows the CAN bus connections. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 30 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-23 CAN bus connections Topology The bus topology is used for CAN bus connections. The CAN bus works as follows:  The MXUs are the management units, and the service boards are the managed units in the subrack. The management and managed units communicate with each other.  Each board is connected to the CAN bus through two independent channels. If one channel is unavailable, the other channel is used to ensure uninterrupted communication. 1.5.2 Base Topology Structure Functions The Base plane serves as the management and control plane in the subrack. It provides channels for loading software and transmitting alarms and maintenance information. Figure 1-24 shows the Base plane connections. Figure 1-24 Base plane connections Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 31 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Topology The dual-star topology is used for Base plane connections. The Base plane works as follows:  The Base plane connects to each service board slot through the backplane.  The Base plane connects to the MXUs in other subracks through the Base port on the panel to implement cascading.  The Base channel between the two MXUs enhances communication reliability. Service processing is not affected if one Base channel becomes unavailable for any service board. 1.5.3 eFabric Topology Structure Functions The enhanced Fabric (eFabric) plane transmits service data in the system. Figure 1-25 shows the eFabric plane connections. Figure 1-25 eFabric plane connections Topology The dual-star topology is used for eFabric plane connections. The eFabric plane works as follows:  All service boards are connected to the MXUs through the eFabric plane. The MXUs exchange the service data for service boards.  The eFabric channel between the two MXUs enhances communication reliability. Service processing is not affected if one eFabric channel becomes unavailable for any service board. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 32 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.6 F8002 Subrack System Monitoring 1.6.1 Power Module Monitoring The multi-function switch unit (MXU) communicates with the baseboard management controller (BMC) in the power module over the Inter-Integrated Circuit (I2C) to deliver monitoring commands and report messages. When detecting an irregular voltage or current, the BMC in the power module reports an alarm to the MXU. The MXU then forwards the alarm to the upper-layer network management system (NMS). Figure 1-26 shows the structure of the power module monitoring system in the F8002 subrack. Figure 1-26 Structure of the power module monitoring system in the F8002 subrack The BMCs in power modules communicate with the shelf management modules (SMMs) in MXUs to implement monitoring of the following information about power modules:  Power module installation status, type and version  Electronic label  Surge protection  Circuit breaker status  Power input  Input/output voltage and current  System power  Temperature  Fan fault of the power modules 1.6.2 Fan Tray Monitoring The F8002 subrack has built-in fan trays. The fan monitoring module monitors the fan running status and adjusts the fan speed based on the subrack temperature. The shelf management modules (SMMs) in the multi-function switch units (MXUs) manage and monitor the fan trays through the RS485 bus. Figure 1-27 shows the structure of the fan tray monitoring system in the F8002 subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 33 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-27 Structure of the fan tray monitoring system in the F8002 subrack The fan tray monitoring system carries out the following functions:  Monitors the fan stall state.  Generates temperature alarms.  Queries the fan speed.  Controls the fan speed.  Detects the fan tray installation status.  Detects the fan tray slot numbers. 1.7 MXU The multi-function switch units (MXUs) exchange service plane data and provide ports for eFabric interface cascading. 1.7.1 MXUA0 Functions Table 1-21 describes the functions of the MXUA0. Table 1-21 Functions Function Description Operation and maintenance The general processing card (GPC) on the MXUA0 implements subrack configuration and maintenance, monitors the system status, and performs performance measurement. Issue 01 (2016-01-15)  Supports one Intel® Core™ quad-core I7-3615QE processor with low power consumption.  Provides two double data rate 3 (DDR3) memory channels, each for installing one 8 GB unbuffered dual in-line memory module (UDIMM). The board Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 34 HUAWEI SE2900 Session Border Controller Hardware Description Function 1 Service Processing Device Description offers a maximum memory capacity of 16 GB. Switching and management Network switching Device manageme nt  Supports 1333 MHz or 1600 MHz UDIMMs.  Supports error checking and correction (ECC). The MXUA0 implements intra-subrack switching and inter-subrack expansion on the Base plane and eFabric plane.  The panel provides two external 1GE Base ports and two 40GE eFabric ports.  The Base plane provides one 1GE channel for each service slot.  The eFabric plane provides 80 Gbit/s bandwidth for each service slot.  There are Base and eFabric plane interconnect channels between MXUA0s. The SMM provides the following device management functions:   Board management − Detects the board temperature, voltage, and power, implements power control, manages board hot swap and reset, and monitors the operating and health status. − Supports out-of-band and remote management. Subrack management − Performs power supply monitoring, fan management, and power distribution management. − Communicates with the baseboard management controllers (BMCs) on service boards to manage and control the service boards. Storage Supports one 600 GB 2.5-inch SAS disk. Hot swap The boards are hot-swappable. Appearance The MXUA0s are half-width boards and can be installed in front slots 2 and 5 in the F8002 subrack. Figure 1-28 shows an MXUA0. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 35 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-28 Appearance (unit: mm) Figure 1-29 shows the hardware structure of the MXUA0. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 36 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-29 Hardware structure Table 1-22 describes the components of the MXUA0. Table 1-22 Components N o. Compon ent Quantity Description 1 Hard disk 1 One 2.5-inch, 600 GB SAS hard disk is configured before delivery. 2 Dual in-line memory module (DIMM) 1 One 8 GB DIMM is used to provide 8 GB memory. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 37 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device N o. Compon ent Quantity Description 3 Cover 1 The metal cover is used to protect the board components and guide air flows. Figure 1-30 shows the MXUA0 panel. Figure 1-30 Panel 1. LAN0 2. LAN1 3. RS232 4. RS485 5. eFabric LAN0 6. eFabric LAN1 7. Subrack number indicators 8. Base LAN0 9. Base LAN1 10. HLY indicator 11. ACT indicator 12. Ejector levers 13. OFL indicator/button 14. DIP button 15. eFabric LAN0/LAN1 indicators 16. HD-ALM indicator 17. LAN1 LINK indicator 18. LAN1 ACT indicator 19. LAN0 LINK indicator 20. LAN0 ACT indicator Interfaces Figure 1-31 shows the panel ports on the MXUA0. Table 1-23 describes the panel ports. Figure 1-31 Panel ports Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 38 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Table 1-23 Panel port description Silk Screen Meaning Port Type Standard LAN0/LAN1 O&M network port RJ45 10/100/1000BASET RS232 System commissioning serial port RJ45 RS232 RS485 port Power distribution monitoring serial port RJ45 RS485 port eFabric LAN0/LAN1 Cascading port for the eFabric plane Quad Small Form-factor Pluggable Plus (QSFP+) 40GBASE-SR4 Base LAN0/LAN1 Cascading port of the Base plane RJ45 10/100/1000BASET Indicators Figure 1-32 shows the indicators and buttons on the MXUA0. Table 1-24 describes the indicators and buttons. Figure 1-32 Indicators and buttons Table 1-24 Description of indicators and buttons Silk Scre en Meani ng HLY Health indicat or Issue 01 (2016-01-15) State State Description Off The board is not powered on. Steady green The board is operating properly. Blinking red An alarm is generated. The blinking frequency indicates the alarm severity: Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 39 HUAWEI SE2900 Session Border Controller Hardware Description Silk Scre en ACT HDALM Meani ng State  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off The SMM is in standby mode. Green The SMM is in active mode. Hard disk fault indicat or Off The hard disk is operating properly. Red The hard disk is faulty. Off The GPC is operating properly. Blinking blue The GPC is sending a request for power-on or power-off, or the GPC is being powered on or off. Steady blue The GPC is powered off. You can remove the board at the time. OFL Offline button Button/ Indicat ors for setting a subrack number  To power on the GPC, hold down this button for more than 0.5 seconds.  To safely power off the GPC, hold down this button for 6 seconds until the OFL indicator is blinking blue. When the OFL indicator is blinking blue, the GPC is in the graceful power-off state. When the OFL indicator is steady blue, the GPC is powered off.  To forcibly power off the GPC, hold down this button for 6 seconds when the GPC is in the graceful power-off state. - Off Issue 01 (2016-01-15) State Description Active/ Standb y indicat or Offline indicat or DIP indic ator/ Subr ack numb er indic ators 1 Service Processing Device Blinking green at 2 Hz An indicator in the off state stands for the binary digit 0. If indicators L to H are blinking at 2 Hz in sequence, the indicators are in test mode. The indicators are in test mode when:  The DIP button is pressed.  The subrack number is not obtained after the board is powered on or reset. Blinking green at 4 Hz If indicators H to L are blinking at 4 Hz, the subrack number 0 is being set. After the subrack number is set to 0, the indicators turn off. Blinking green at 1 Hz If indicators H to L are blinking at 1 Hz, the subrack number is being set to a number between 1 and 7. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 40 HUAWEI SE2900 Session Border Controller Hardware Description Silk Scre en Meani ng State 1 Service Processing Device State Description An indicator in the on state stands for the binary digit 1. To set the subrack number, hold down the DIP button for 6 seconds until the indicators enter the setting mode, press the DIP button to set the subrack number, and then hold down the DIP button for 6 seconds to complete the setting. Steady green Binary numbers 000 to 111 indicate subrack numbers 0 to 7 respectively. NOTE  The subrack number can be set only on the active SMM. The standby SMM only supports indicator test mode.  If you do not press the DIP button within 30 seconds after the indicators enter the setting mode, the indicators exit the setting mode without saving the settings.  Each time you press the DIP button, the subrack number increases by 1. The subrack number restarts from 0 after it passes 7. Networ k port indicat or Off The port is not sending or receiving data. Blinking yellow The port is sending or receiving data. Networ k port indicat or Green The link is connected. LIN K Off The link is faulty or disconnected. Off The link is faulty or disconnected. eFabr ic LAN 0/LA N1 Indicat or of the cascadi ng port of the eFabric plane Steady green The link is connected. Blinking green The port is sending or receiving data. Green off The link is faulty or disconnected. Base LAN 0/LA N1 Indicat or of the cascadi ng port of the Base plane Steady green The link is connected. Yellow off The port is not sending or receiving data. Blinking yellow The port is sending or receiving data. ACT In the cascading environment, if the MXUA0 GPC in the slave subrack is isolated, the GPC is powered off, the OFL indicator is off, and the OFL button is unavailable. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 41 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Logical Structure Figure 1-33 shows the logical structure of the MXUA0. Figure 1-33 Logical structure The MXUA0 panel provides the following ports:  Two GE ports  One serial port for system commissioning  One serial port for PDB monitoring  Two ports for eFabric plane cascading  Two ports for Base plane cascading The GPC implements configuration and maintenance, monitors system status, and collects performance statistics. It also provides two GE ports for O&M. The SMM monitors the MXUA0 and the BMCs on service boards, and performs subrack management. Fabric LAN implements the eFabric network switching. Base LAN implements the Base network switching. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 42 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device The power module supplies power to the components on the MXUA0. Hardware and Software Compatibility Table 1-25 lists hardware and software compatibility of the MXUA0. Table 1-25 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule MXUA0 MXUA0 Only a board of the same model can be used to replace the MXUA0. You do not need to manually upgrade software. Technical Specifications  Network switching performance specifications Table 1-26 lists the network switching performance specifications of the MXUA0. Table 1-26 Network switching performance specifications Item Specificatio ns Description Number of Base plane ports 11  Four GE ports connected to the service boards in the subrack through the backplane  One GE port connected to the GPC of the MXU  One GE port connected to the GPC of the other MXU in the subrack through the backplane  One GE port connected to the CPU of the MXU  One GE port connected to the CPU of the other MXU in the subrack through the backplane  Two GE ports provided on the front panel for Base plane cascading  One 10GE port for interconnection with the Base plane of the other MXU, implementing Base plane redundancy. This port is disabled by default.  Sixteen 20GE ports connected to the four service boards in the subrack through the backplane (a maximum of four 20GE ports for each service board)  Two 40 GE ports connected to the eFabric plane of the other MXU, implementing eFabric plane redundancy. Of the two ports, one is reserved for future use and another is disabled by default.  Two 40GE ports on the front panel for eFabric plane cascading Number of eFabric plane ports Issue 01 (2016-01-15) 20 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 43 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Item Specificatio ns Description Port rate GE/10GE line speed for the Base plane The Base plane supports full line-speed switching. 20GE/40GE line speed for the eFabric plane Switching capability  The cascading ports support 10/100/1000 BASE-T auto-negotiation.  The service ports support 1000 BASE-X.  The interconnection ports support 10G XAUI. The eFabric plane supports full line-speed switching.  The cascading ports support 40G QSFP+.  The service ports support 20G DXAUI.  The interconnection ports support 40G XLG. 44 Gbit/s for the Base plane Full duplex mode 480 Gbit/s for the eFabric plane Full duplex mode Number of MAC addresses 32768 The ports support automatic learning of MAC addresses. The MAC address table can contain a maximum of 32,768 MAC addresses. Number of VLANs 4094 The VLANs comply with the 802.1Q standard. Port binding 8 Port binding complies with the 802.3AD standard. A maximum of eight ports with the same rate can be bound.  Technical Specifications Table 1-27 lists the technical specifications of the MXUA0. Table 1-27 Technical specifications Item Mechanical specifications Electrical specifications Issue 01 (2016-01-15) Specifications Dimensions (H x W x D) 35.1 mm x 205.0 mm x 531.0 mm (1.38 in. x 8.07 in. x 20.91 in.) Weight 3.7 kg (8.16 lb) Maximum power consumption 146 W Typical power consumption 125 W Power supply Two redundant -48 V DC inputs (provided by the backplane) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 44 HUAWEI SE2900 Session Border Controller Hardware Description Item 1 Service Processing Device Specifications Environmental specifications Temperature Humidity  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h)  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.8 SPU The service processing units (SPUs) implement service processing and board management. 1.8.1 SPUA0 Functions Table 1-28 describes functions of the SPUA0. Table 1-28 Functions Function Description Service processing  Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.  Provides four double data rate 3 (DDR3) memory channels, each for installing one 16 GB registered dual in-line memory module (RDIMM). The board offers with the maximum memory capacity of 64 GB.  Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.  Supports error checking and correction (ECC).  Provides two 1GE Base ports for communicating with Base planes of multi-function switch units (MXUs) through the backplane.  Provides two 20GE Fabric ports for communicating with Fabric planes of MXUs through the backplane.  Provides two 20GE Update interfaces for communicating with the switching planes through the backplane.  Provides four enhanced small form-factor pluggable (SFP+) ports Interfacing Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 45 HUAWEI SE2900 Session Border Controller Hardware Description Function 1 Service Processing Device Description and four SFP ports on the panel. Management Hot swap Provides an independently powered baseboard management controller (BMC). The BMC connects to the SMM through the Network Controller Sideband Interface (NC-SI) bus. The BMC provides the following functions:  Manages the field replaceable unit (FRU) information, sensor data records (SDRs), and system event logs (SELs).  Detects the board temperature and voltage, reports alarms, and controls the power-on, power-off, hot swap, and reset operations of the board.  Supports serial port redirection.  Loads board software online. The boards are hot-swappable. Appearance The SPUA0s are half-width boards and installed in the front service board slots of the subrack. Figure 1-34 shows an SPUA0. Figure 1-34 Appearance (unit: mm) Figure 1-35 shows the hardware structure of the SPUA0. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 46 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-35 Hardware structure Table 1-29 describes the components of the SPUA0. Table 1-29 Components No. Compone nt Quantity Description 1 BMC 1 The BMC, a processing module independent from the CPU, implements board management and Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 47 HUAWEI SE2900 Session Border Controller Hardware Description No. Compone nt 1 Service Processing Device Quantity Description provides system interfaces, General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus. 2 CPU 1 The board uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU. 3 Heat sink 1 The heat sink is used to cool the CPU. 4 Cover 1 The metal cover is used to protect the components on the board and guide air flows. 5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB memory. NOTE The RDIMMs are installed close to CPU0. The three RDIMMs are installed in sockets J45, J46, and J7, as shown in Figure 1-35. 6 Solid-state drive (SSD) 1 The SSD stores the operating system (OS) and field programmable gate array (FPGA) files. Figure 1-36 shows the board panel. Figure 1-36 Panel 1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator 5. HLY indicator 6. Ejector levers 7. OFL indicator/button - Interfaces Figure 1-37 shows the panel ports on the board. Table 1-30 describes the panel ports. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 48 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-37 Panel ports Table 1-30 Port description Silkscreen Meaning Type Standard port 0 10GE or 1GE optical port or electrical port SFP+ 10G BASE-R port 1 10GE or 1GE optical port port 2 10GE or 1GE optical port or electrical port port 3 10GE or 1GE optical port port 4 1GE optical port or electrical port port 5 1GE optical port port 6 1GE optical port or electrical port port 7 1GE optical port NOTE The ports can be set to the auto-negotiation or forced mode. SFP 1000 BASE-T NOTE The ports can be set to the auto-negotiation or forced mode. Indicators Figure 1-38 shows the indicators and buttons on the board. Table 1-31 describes the indicators and buttons. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 49 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-38 Indicators and buttons Table 1-31 Description of indicators and buttons Silk Screen HLY Meanin g State State Description Off The board is not powered on. Steady green The board is operating properly. Health indicator An alarm is generated. The blinking frequency indicates the alarm severity: Blinki ng red  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off UID Location indicator Offline indicator Steady green Blinki ng green The indicator is used to locate a device to be operated. You can customize the function of this indicator. Off The board is operating properly. Blinki ng blue The board is sending a request for power-on or power-off, or the board is being powered on or off. Steady blue The board is powered off. You can remove the board at the time. OFL Offline button Issue 01 (2016-01-15) -  To power on the board, hold down this button for more than 0.5 seconds.  To safely power off the board, hold down this button for 6 seconds until the OFL indicator is blinking blue. When the OFL indicator is blinking blue, the board is in the graceful power-off state. When the OFL indicator is steady blue, the board is powered off. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 50 HUAWEI SE2900 Session Border Controller Hardware Description Silk Screen Meanin g 1 Service Processing Device State State Description  0 to 7 Optical port indicator s To forcibly power off the board, hold down this button for 6 seconds when the board is in the graceful power-off state. Green off The link is faulty or disconnected. Steady green The link is normal. Yello w off The port is not sending or receiving data. Blinki ng yellow The port is sending or receiving data. Logical Structure Figure 1-39 shows the logical structure of the board. Figure 1-39 Logical structure The modules of the board provide the following functions:  Issue 01 (2016-01-15) The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 51 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device  The processing module forwards service data and implements data encryption and decryption.  The EF module on the backplane side provides the Update , Base, and Fabric channels to communicate with the switch modules.  The BMC module implements board management and interacts with the backplane through the CAN bus.  The power module supplies power to the function modules of the board. Hardware and Software Compatibility Table 1-32 lists hardware and software compatibility of the SPUA0. Table 1-32 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule SPUA0 SPUA0 Only a board of the same model can be used to replace the SPUA0. You do not need to manually upgrade software. Technical Specifications Table 1-33 lists the technical specifications of the SPUA0. Table 1-33 Technical specifications Item Specifications Mechanical specifications Electrical specifications Environmental specifications Issue 01 (2016-01-15) Dimensions (H x W x D) 45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07 in. x 20.91 in.) Weight 5.0 kg (11.03 lb) Maximum power consumption 190 W Typical power consumption 175 W Power supply Two -48 V DC power supplies (provided by the backplane) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 52 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Item Specifications Humidity  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.8.2 SPUA1 Functions Table 1-34 describes functions of the SPUA1. Table 1-34 Functions Function Description Service processing  Uses two Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPUs.  Supports two QuickPath Interconnect (QPI) ports, with the maximum data transmission rate of 8.0 GT/s.  Provides eight double data rate 3 (DDR3) memory channels, each for installing one 16 GB registered dual in-line memory module (RDIMM). The board offers with the maximum memory capacity of 128 GB.  Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.  Supports error checking and correction (ECC).  Provides two 1GE Base ports for communicating with Base planes of multi-function switch units (MXUs) through the backplane.  Provides two 20GE Fabric ports for communicating with Fabric planes of MXUs through the backplane.  Provides two 20GE Update ports to the backplane for communicating with the switching planes.  Provides four enhanced small form-factor pluggable (SFP+) ports and four SFP ports on the panel. Interfacing Management Issue 01 (2016-01-15) Provides an independently powered baseboard management controller (BMC). The BMC connects to the SMM through the Network Controller Sideband Interface (NC-SI) bus. The BMC provides the following functions:  Manages the field replaceable unit (FRU) information, sensor data records (SDRs), and system event logs (SELs).  Detects the board temperature and voltage, reports alarms, and controls the power-on, power-off, hot swap, and reset operations of the board. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 53 HUAWEI SE2900 Session Border Controller Hardware Description Function Hot swap 1 Service Processing Device Description  Supports serial port redirection.  Loads board software online. The boards are hot-swappable. Appearance The SPUA1s are half-width boards and installed in the front service board slots of the subrack. Figure 1-40 shows an SPUA1. Figure 1-40 Appearance (unit: mm) Figure 1-41 shows the hardware structure of the SPUA1. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 54 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-41 Hardware structure Table 1-35 describes the components of the SPUA1. Table 1-35 Components No. Compone nt Quantity Description 1 BMC 1 The BMC, a processing module independent from the CPUs, implements board management and Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 55 HUAWEI SE2900 Session Border Controller Hardware Description No. Compone nt 1 Service Processing Device Quantity Description provides system interfaces, General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus. 2 Encryption and decryption daughter board 1 This board performs data encryption and decryption. 3 CPU 2 Intel ® Xeon® full-power, 8-core Sandy Bridge-EP CPU 4 Heat sink 1 The heat sink is used to cool CPUs. Two CPUs share one heat sink. 5 Cover 1 The metal cover is used to protect the components on the board and guide air flows. 6 RDIMM 6 Six 16 GB RDIMMs are used to provide 96 GB memory. NOTE The RDIMMs are installed close to the CPUs. The six RDIMMs are installed in sockets J45, J46, J47, J48, J7 and J8, as shown in Figure 1-41. 7 Solid-state drive (SSD) 1 The SSD stores the operating system (OS) and field programmable gate array (FPGA) files. Figure 1-42 shows the board panel. Figure 1-42 Panel 1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator 5. HLY indicator 6. Ejector levers 7. OFL indicator/button - Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 56 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Interfaces Figure 1-43 shows the panel ports on the board. Table 1-36 describes the panel ports. Figure 1-43 Panel ports Table 1-36 Port description Silkscreen Meaning Type Standard port 0 10GE or 1GE optical port or electrical port SFP+ 10G BASE-R port 1 10GE or 1GE optical port port 2 10GE or 1GE optical port or electrical port port 3 10GE or 1GE optical port port 4 1GE optical port or electrical port port 5 1GE optical port port 6 1GE optical port or electrical port port 7 1GE optical port NOTE The ports can be set to the auto-negotiation or forced mode. SFP 1000 BASE-T NOTE The ports can be set to the auto-negotiation or forced mode. Indicators Figure 1-44 shows the indicators and buttons on the board. Table 1-37 describes the indicators and buttons. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 57 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-44 Indicators and buttons Table 1-37 Description of indicators and buttons Silk Screen HLY Meanin g State State Description Off The board is not powered on. Steady green The board is operating properly. Health indicator An alarm is generated. The blinking frequency indicates the alarm severity: Blinki ng red  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off UID Location indicator Offline indicator Steady green Blinki ng green The indicator is used to locate a device to be operated. You can customize the function of this indicator. Off The board is operating properly. Blinki ng blue The board is sending a request for power-on or power-off, or the board is being powered on or off. Steady blue The board is powered off. You can remove the board at the time. OFL Offline button Issue 01 (2016-01-15) -  To power on the board, hold down this button for more than 0.5 seconds.  To safely power off the board, hold down this button for 6 seconds until the OFL indicator is blinking blue. When the OFL indicator is blinking blue, the board is in the graceful power-off state. When the OFL indicator is steady blue, the board is powered off. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 58 HUAWEI SE2900 Session Border Controller Hardware Description Silk Screen Meanin g 1 Service Processing Device State State Description  0 to 7 Optical port indicator s To forcibly power off the board, hold down this button for 6 seconds when the board is in the graceful power-off state. Green off The link is faulty or disconnected. Steady green The link is normal. Yello w off The port is not sending or receiving data. Blinki ng yellow The port is sending or receiving data. Logical Structure Figure 1-45 shows the logical structure of the board. Figure 1-45 Logical structure The modules of the board provide the following functions:  Issue 01 (2016-01-15) The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 59 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device  The processing module forwards service data and implements data encryption and decryption.  The EF module on the backplane side provides the Update , Base, and Fabric channels to communicate with the switch modules.  The BMC module implements board management and interacts with the backplane through the CAN bus.  The power module supplies power to the function modules of the board. Hardware and Software Compatibility Table 1-38 lists hardware and software compatibility of the SPUA1. Table 1-38 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule SPUA1 SPUA1 Only a board of the same model can be used to replace the SPUA1. You do not need to manually upgrade software. Technical Specifications Table 1-39 lists the technical specifications of the SPUA1. Table 1-39 Technical specifications Item Specifications Mechanical specifications Electrical specifications Environmental specifications Dimensions (H x W x D) 45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07 in. x 20.91 in.) Weight 5.0 kg (11.03 lb) Maximum power 275 W Typical power 240 W Power supply Two -48 V DC power supplies (provided by the backplane) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h)  Long-term operating humidity: 5% RH to 85% Humidity Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 60 HUAWEI SE2900 Session Border Controller Hardware Description Item 1 Service Processing Device Specifications RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.8.3 SPUZ0 Functions Table 1-40 describes functions of the SPUZ0. Table 1-40 Functions Function Description Service processing  Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.  Provides four double data rate 3 (DDR3) memory channels, each for installing one 16 GB registered dual in-line memory module (RDIMM). The board offers with the maximum memory capacity of 64 GB.  Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.  Supports error checking and correction (ECC).  Provides two 1GE Base ports for communicating with Base planes of multi-function switch units (MXUs) through the backplane.  Provides two 20GE Fabric ports for communicating with Fabric planes of MXUs through the backplane.  Provides two 20GE Update interfaces for communicating with the switching planes through the backplane.  Provides four enhanced small form-factor pluggable (SFP+) ports and four SFP ports on the panel. Interfacing Management Hot swap Issue 01 (2016-01-15) Provides an independently powered baseboard management controller (BMC). The BMC connects to the SMM through the Network Controller Sideband Interface (NC-SI) bus. The BMC provides the following functions:  Manages the field replaceable unit (FRU) information, sensor data records (SDRs), and system event logs (SELs).  Detects the board temperature and voltage, reports alarms, and controls the power-on, power-off, hot swap, and reset operations of the board.  Supports serial port redirection.  Loads board software online. The boards are hot-swappable. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 61 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Appearance The SPUZ0s are half-width boards and installed in the front service board slots of the subrack. Figure 1-46 shows an SPUZ0. Figure 1-46 Appearance (unit: mm) Figure 1-47 shows the hardware structure of the SPUZ0. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 62 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-47 Hardware structure Table 1-41 describes the components of the SPUZ0. Table 1-41 Components No. Compone nt Quantity Description 1 BMC 1 The BMC, a processing module independent from the CPU, implements board management and Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 63 HUAWEI SE2900 Session Border Controller Hardware Description No. Compone nt 1 Service Processing Device Quantity Description provides system interfaces, General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus. 2 CPU 1 The board uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU. 3 Heat sink 1 The heat sink is used to cool the CPU. 4 Cover 1 The metal cover is used to protect the components on the board and guide air flows. 5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB memory. NOTE The RDIMMs are installed close to CPU0. The three RDIMMs are installed in sockets J45, J46, and J7, as shown in Figure 1-47. 6 Solid-state drive (SSD) 1 The SSD stores the operating system (OS) and field programmable gate array (FPGA) files. Figure 1-48 shows the board panel. Figure 1-48 Panel 1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator 5. HLY indicator 6. Ejector levers 7. OFL indicator/button - Interfaces Figure 1-49 shows the panel ports on the board. Table 1-42 describes the panel ports. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 64 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-49 Panel ports Table 1-42 Port description Silkscreen Meaning Type Standard port 0 10GE or 1GE optical port or electrical port SFP+ 10G BASE-R port 1 10GE or 1GE optical port port 2 10GE or 1GE optical port or electrical port port 3 10GE or 1GE optical port port 4 1GE optical port or electrical port port 5 1GE optical port port 6 1GE optical port or electrical port port 7 1GE optical port NOTE The ports can be set to the auto-negotiation or forced mode. SFP 1000 BASE-T NOTE The ports can be set to the auto-negotiation or forced mode. Indicators Figure 1-50 shows the indicators and buttons on the board. Table 1-43 describes the indicators and buttons. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 65 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-50 Indicators and buttons Table 1-43 Description of indicators and buttons Silk Screen HLY Meanin g State State Description Off The board is not powered on. Steady green The board is operating properly. Health indicator An alarm is generated. The blinking frequency indicates the alarm severity: Blinki ng red  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off UID Location indicator Offline indicator Steady green Blinki ng green The indicator is used to locate a device to be operated. You can customize the function of this indicator. Off The board is operating properly. Blinki ng blue The board is sending a request for power-on or power-off, or the board is being powered on or off. Steady blue The board is powered off. You can remove the board at the time. OFL Offline button Issue 01 (2016-01-15) -  To power on the board, hold down this button for more than 0.5 seconds.  To safely power off the board, hold down this button for 6 seconds until the OFL indicator is blinking blue. When the OFL indicator is blinking blue, the board is in the graceful power-off state. When the OFL indicator is steady blue, the board is powered off. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 66 HUAWEI SE2900 Session Border Controller Hardware Description Silk Screen Meanin g 1 Service Processing Device State State Description  0 to 7 Optical port indicator s To forcibly power off the board, hold down this button for 6 seconds when the board is in the graceful power-off state. Green off The link is faulty or disconnected. Steady green The link is normal. Yello w off The port is not sending or receiving data. Blinki ng yellow The port is sending or receiving data. Logical Structure Figure 1-51 shows the logical structure of the SPUZ0. Figure 1-51 Logical structure The modules of the board provide the following functions:  Issue 01 (2016-01-15) The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 67 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device  The processing module forwards service data and implements data encryption and decryption.  The EF module on the backplane side provides the Update , Base, and Fabric channels to communicate with the switch modules.  The BMC module implements board management and interacts with the backplane through the CAN bus.  The power module supplies power to the function modules of the board. Hardware and Software Compatibility Table 1-44 lists hardware and software compatibility of the SPUZ0. Table 1-44 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule SPUZ0 SPUZ0 Only a board of the same model can be used to replace the SPUZ0 board. You do not need to manually upgrade software. Technical Specifications Table 1-45 lists the technical specifications of the SPUZ0. Table 1-45 Technical specifications Item Specifications Mechanical specifications Electrical specifications Environmental specifications Issue 01 (2016-01-15) Dimensions (H x W x D) 45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07 in. x 20.91 in.) Weight 5.0 kg (11.03 lb) Maximum power consumption 190 W Typical power consumption 175 W Power supply Two -48 V DC power supplies (provided by the backplane) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 68 HUAWEI SE2900 Session Border Controller Hardware Description Item 1 Service Processing Device Specifications Humidity  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. 1.9 VPU The voice and video process unit (VPU) processes media data, including voice and video data. 1.9.1 VPUA0 Functions Table 1-46 describes the functions of the VPUA0. Table 1-46 Functions Function Description Processing function  Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.  Provides two double data rate 3 (DDR3) memory channels, each for installing one 16 GB registered dual in-line memory module (RDIMM). The board offers The maximum memory capacity is 32 GB.  Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.  Supports error checking and correction (ECC).  Provides two 1GE Base ports for communicating with Base planes of multi-function switch units (MXUs) through the backplane.  Provides two 20GE Fabric ports for communicating with Fabric planes of MXUs through the backplane.  Provides two 10GE enhanced small form-factor pluggable (SFP+) optical ports and two GE SFP optical or electrical ports. These four ports are reserved. Ports Management function Issue 01 (2016-01-15) Provides an independently powered baseboard management controller (BMC). The BMC connects to the SMM through the Network Controller Sideband Interface (NC-SI) bus. The BMC provides the following functions:  Manages the field replaceable unit (FRU) information, sensor data records (SDRs), and system event logs (SELs).  Detects the board temperature and voltage, reports alarms, and Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 69 HUAWEI SE2900 Session Border Controller Hardware Description Function 1 Service Processing Device Description controls the power-on, power-off, hot swap, and reset operations of the board. Hot swap  Supports serial port redirection.  Loads board software online.  Provides a loading interface for board testing. The boards are hot-swappable. Appearance The VPUA0s are half-width boards and installed in the front service board slots of the subrack. Figure 1-52 shows a VPUA0. Figure 1-52 Appearance (unit: mm) Figure 1-53 shows the hardware structure of the VPUA0. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 70 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-53 Hardware structure Table 1-47 describes the components of the VPUA0. Table 1-47 Components No. Compone nt Quantity Description 1 Solid-state drive (SSD) 1 The SSD stores the operating system (OS) and field programmable gate array (FPGA) files. 2 Baseboard managemen t controller (BMC) 1 The BMC, a processing module independent of the CPU, implements board management and provides interfaces and buses, such as system interfaces, General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus. 3 CPU 1 The board uses one Intel® Xeon® full-power, 6-core Ivy Bridge-EN CPU. 4 Heat sink 1 The heat sink is used to cool the CPU. 5 Cover 1 The metal cover is used to protect the components Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 71 HUAWEI SE2900 Session Border Controller Hardware Description No. Compone nt 1 Service Processing Device Quantity Description on the board and guide air flows. 6 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB memory. 7 Digital signal processing (DSP) daughter board 1 The DSP daughter board processes voice and video data. Figure 1-54 shows the board panel. Figure 1-54 Panel 1. SFP+ optical port 2. Optical port indicators 3. SFP port 4. UID indicator 5. HLY indicator 6. Ejector levers 7. OFL indicator/button 8. SFP port 9. SFP+ optical port Interfaces Figure 1-55 shows the panel ports on the board. Table 1-48 describes the panel ports. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 72 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-55 Panel ports Table 1-48 Panel port description Silk Screen Meaning Port Type Standard PORT (0 and 1) 10GE media port SFP+ 10G BASE-R PORT (2 and 3) 1GE signaling/Network File Server (NFS) interface SFP 1000 BASE-X Indicators Figure 1-56 shows the indicators and buttons on the board. Table 1-49 describes the indicators and buttons. Figure 1-56 Indicators and buttons Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 73 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Table 1-49 Description of indicators and buttons Silk Screen HLY Meanin g State State Description Off The board is not powered on. Steady green The board is operating properly. Health indicator An alarm is generated. The blinking frequency indicates the alarm severity: Blinki ng red  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off UID Location indicator Offline indicator Steady green Blinki ng green The indicator is used to locate a device to be operated. You can customize the function of this indicator. Off The board is operating properly. Blinki ng blue The board is sending a request for power-on or power-off, or the board is being powered on or off. Steady blue The board is powered off. The board can be removed at the time.  To power off the board, hold down this button for 6 seconds until the indicator is blinking blue. When the OFL indicator is blinking blue, the board is in the graceful power-off state. When the OFL indicator is steady blue, the board is powered off.  To forcibly power off the board, hold down this button for 6 seconds when the board is in the graceful power-off state.  To power on the board, hold down this button for more than 0.5 seconds. OFL Offline button 0 to 3 Issue 01 (2016-01-15) Optical port indicator s - Off The link is disconnected or faulty. Steady green The link is connected. Off The port is not sending or receiving data. Blinki ng yellow The port is sending or receiving data. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 74 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Logical Structure Figure 1-57 shows the logical structure of the board. Figure 1-57 Logical structure The modules of the board provide the following functions:  The service interface converter implements conversion between optical data service interfaces and media data service interfaces or data service interfaces on the backplane.  The configuration and control planes configure conversion module chips on the service interface and exchange control plane information with the switch modules.  The DSP daughter board processes the media data, such as the voice and video data.  The BMC module implements board management and interacts with the backplane through the CAN bus.  The power module supplies power to the function modules of the board. Hardware and Software Compatibility Table 1-50 lists hardware and software compatibility of the VPUA0. Table 1-50 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule VPUA0 VPUA0 Only a board of the same Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 75 HUAWEI SE2900 Session Border Controller Hardware Description Board Model 1 Service Processing Device Spare Parts Model Compatibility Rule model can be used to replace the VPUA0. You do not need to manually upgrade software. Technical Specifications Table 1-51 lists the technical specifications of the VPUA0. Table 1-51 Technical specifications Item Specifications Mechanical specifications Electrical specifications Environmental specifications Dimensions (H x W x D) 45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07 in. x 20.91 in.) Weight 4.0 kg (8.82 lb) Maximum power consumption 200 W Typical power consumption 185 W Power supply Two -48 V DC power supplies (provided by the backplane) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h)  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Humidity Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 76 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.9.2 VPUA1 Functions Table 1-52 describes the functions of the VPUA1. Table 1-52 Functions Function Description Processing function  Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.  Provides two double data rate 3 (DDR3) memory channels, each for installing one 16 GB registered dual in-line memory module (RDIMM). The board offers The maximum memory capacity is 32 GB.  Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.  Supports error checking and correction (ECC).  Provides two 1GE Base ports for communicating with Base planes of multi-function switch units (MXUs) through the backplane.  Provides two 20GE Fabric ports for communicating with Fabric planes of MXUs through the backplane.  Provides two 10GE enhanced small form-factor pluggable (SFP+) optical ports and two GE SFP optical or electrical ports. These four ports are reserved. Ports Management function Hot swap Provides an independently powered baseboard management controller (BMC). The BMC connects to the SMM through the Network Controller Sideband Interface (NC-SI) bus. The BMC provides the following functions:  Manages the field replaceable unit (FRU) information, sensor data records (SDRs), and system event logs (SELs).  Detects the board temperature and voltage, reports alarms, and controls the power-on, power-off, hot swap, and reset operations of the board.  Supports serial port redirection.  Loads board software online.  Provides a loading interface for board testing. The boards are hot-swappable. Appearance The VPUA1s are half-width boards and installed in the front service board slots of the subrack. Figure 1-58 shows a VPUA1 board. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 77 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-58 Appearance (unit: mm) Figure 1-59 shows the hardware structure of the VPUA1. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 78 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-59 Hardware structure Table 1-53 describes the components of the VPUA1. Table 1-53 Components No. Compone nt Quantity Description 1 Digital signal processing (DSP) daughter board 2 The DSP daughter board processes voice and video data. 2 Solid-state drive (SSD) 1 The SSD stores the operating system (OS) and field programmable gate array (FPGA) files. 3 BMC 1 The BMC, a processing module independent of the CPU, implements board management and provides interfaces and buses, such as system interfaces, General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 79 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device No. Compone nt Quantity Description 4 CPU 1 The board uses one Intel® Xeon® full-power, 6-core Ivy Bridge-EN CPU. 5 Heat sink 1 The heat sink is used to cool the CPU. 6 Cover 1 The metal cover is used to protect the components on the board and guide air flows. 7 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB memory. Figure 1-60 shows the board panel. Figure 1-60 Panel 1. SFP+ optical port 2. Optical port indicators 3. SFP port 4. UID indicator 5. HLY indicator 6. Ejector levers 7. OFL indicator/button 8. SFP port 9. SFP+ optical port Interfaces Figure 1-61 shows the panel ports on the board. Table 1-54 describes the panel ports. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 80 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Figure 1-61 Panel ports Table 1-54 Panel port description Silk Screen Meaning Port Type Standard PORT (0 and 1) 10GE media port SFP+ 10G BASE-R PORT (2 and 3) 1GE signaling/Network File Server (NFS) interface SFP 1000 BASE-X Indicators Figure 1-62 shows the indicators and buttons on the board. Table 1-55 describes the indicators and buttons. Figure 1-62 Indicators and buttons Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 81 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Table 1-55 Description of indicators and buttons Silk Screen HLY Meanin g State State Description Off The board is not powered on. Steady green The board is operating properly. Health indicator An alarm is generated. The blinking frequency indicates the alarm severity: Blinki ng red  Blinking at 0.5 Hz: indicates a minor alarm.  Blinking at 1 Hz: indicates a major alarm.  Blinking at 4 Hz: indicates a critical alarm. Off UID Location indicator Offline indicator Steady green Blinki ng green The indicator is used to locate a device to be operated. You can customize the function of this indicator. Off The board is operating properly. Blinki ng blue The board is sending a request for power-on or power-off, or the board is being powered on or off. Steady blue The board is powered off. The board can be removed at the time.  To power off the board, hold down this button for 6 seconds until the indicator is blinking blue. When the OFL indicator is blinking blue, the board is in the graceful power-off state. When the OFL indicator is steady blue, the board is powered off.  To forcibly power off the board, hold down this button for 6 seconds when the board is in the graceful power-off state.  To power on the board, hold down this button for more than 0.5 seconds. OFL Offline button 0 to 3 Issue 01 (2016-01-15) Optical port indicator s - Off The link is disconnected or faulty. Steady green The link is connected. Off The port is not sending or receiving data. Blinki ng yellow The port is sending or receiving data. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 82 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device Logical Structure Figure 1-63 shows the logical structure of the board. Figure 1-63 Logical structure The modules of the board provide the following functions:  The service interface converter implements conversion between optical data service interfaces and media data service interfaces or data service interfaces on the backplane.  The configuration and control planes configure conversion module chips on the service interface and exchange control plane information with the switch modules.  The two DSP daughter boards process the media data, such as the voice and video data.  The BMC module implements board management and interacts with the backplane through the CAN bus.  The PSU supplies power to the function modules of the board. Hardware and Software Compatibility Table 1-56 lists hardware and software compatibility of the VPUA1. Table 1-56 Hardware and software compatibility Board Model Spare Parts Model Compatibility Rule VPUA1 VPUA1 Only a board of the same Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 83 HUAWEI SE2900 Session Border Controller Hardware Description Board Model 1 Service Processing Device Spare Parts Model Compatibility Rule model can be used to replace the VPUA1. You do not need to manually upgrade software. Technical Specifications Table 1-57 lists the technical specifications of the VPUA1. Table 1-57 Technical specifications Item Specifications Mechanical specifications Electrical specifications Environmental specifications Dimensions (H x W x D) 45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07 in. x 20.91 in.) Weight 5.5 kg (12.13 lb) Maximum power consumption 310 W Typical power consumption 290 W Power supply Two -48 V DC power supplies (provided by the backplane) Temperature  Long-term operating temperature: 0°C to 45°C (32°F to 113°F)  Short-term operating temperature: -5°C to +55°C (23°F to 131°F)  Storage temperature: -40°C to +70°C (-40°F to +158°F)  Temperature change rate: 15°C/h (27°F/h)  Long-term operating humidity: 5% RH to 85% RH (non-condensing)  Short-term operating humidity: 5% RH to 95% RH (non-condensing) Humidity Short term means that the consecutive working period is not more than 96 hours and that the cumulative working period over a year is not more than 15 days. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 84 HUAWEI SE2900 Session Border Controller Hardware Description 1 Service Processing Device 1.10 Filler Panel Functions Filler panels are installed in vacant slots to prevent dust and air from entering the subrack. Appearance Filler panels can be classified into:  Filler panels for half-width service boards Figure 1-64 shows a filler panel installed in the vacant slot for a half-width service board. Figure 1-64 Filler panel for a half-width service board (unit: mm) Interfaces Filler panels provide no port. Indicators There is no indicator on filler panels. Technical Specifications Table 1-58 lists the technical specifications of filler panels for half-width service boards. Table 1-58 Technical specifications of filler panels for half-width service boards Item Mechanical specifications Issue 01 (2016-01-15) Specifications Dimensions (H x W x D) 45.2 mm x 215.0 mm x 120.0 mm (1.78 in. x 8.46 in. x 4.72 in.) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 85 HUAWEI SE2900 Session Border Controller Hardware Description Item Specifications Weight Issue 01 (2016-01-15) 1 Service Processing Device 0.6 kg (1.32 lb) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 86 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories 2 Other Accessories About This Chapter 2.1 Alarm Box 2.2 Optical Module 2.3 Electrical Module 2.1 Alarm Box Functions The alarm box is used to receive alarm information and provide audio and visual alarms. The universal alarm box adopts a box structure. It features advanced technology, appropriate layout, and high operability, serviceability, and security. The alarm box is generally mounted on the wall in the maintenance and monitoring room. Exterior The front panel of the alarm box provides the following components: alarm sound indicator, alarm severity indicator, serial interface communication status indicator, speaker, alarm confirm button, alarm sound turnoff button, and alarm sound turnoff indicator. Figure 2-1 shows the front panel of the alarm box. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 87 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-1 Front panel of the alarm box 1. Critical alarm indicator 2. Major alarm indicator 3. Minor alarm indicator 4. Warning alarm indicator 5. Speaker 6. Alarm confirm button 7. Serial communication status indicator 8. Alarm sound turnoff button 9. Alarm sound turnoff indicator Interfaces The side panel of the alarm box provides the following components: AC power connector, power switch, remote speaker interface, indicator test button, and lock. Figure 2-2 shows the side panel of the alarm box. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 88 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-2 Side panel of the alarm box 1. Lock 2. Indicator test button 3. Remote speaker interface 4. Power switch 5. AC power socket 6. Communication interface 7. -48 V power input interface - - Indicators You can use the indicator test button to test all the indicators. On pressing the button, all the indicators, such as the alarm indicators, alarm sound indicators, and serial interface communication indicator, are turned on. To turn off the indicators, press the button again. Except the critical alarm, the alarm sound of the major, minor, and warning alarms cannot be turned on or off by using the alarm sound turnoff button. There are four alarm sound turnoff indicators on the alarm box. They are EMERGENCY, IMPORTANT, ORDINARY, PROMPTING, corresponding to the critical alarm, major alarm, minor alarm, and warning alarm respectively. The status of the alarm indicator is as follows:  If an indicator is on, it indicates that the alarm sound of the corresponding severity is turned off. The alarm box does not generate alarm sound if an alarm of the corresponding severity is reported.  If an indicator is off, it indicates that the alarm sound of the corresponding severity is turned on. The alarm box generates alarm sound if an alarm of the corresponding severity is reported. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 89 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories As the alarm sound of the critical alarm cannot be turned off, the critical alarm indicator is always off. You can turn off the alarm sound for the alarms of different levels by pressing the alarm sound turnoff button. This function, however, does not affect the state of the alarm severity indicator. Table 2-1 describes the methods used to stop the alarm sound. Table 2-1 Methods used to stop the alarm sound State of the Alarm Sound Turnoff Indicator Pressing the Alarm Sound Turnoff Button Alarm Sound The four indicators are always off. No operation is required. The alarm sound is enabled for all alarms. The alarm sound turnoff indicator for the warning alarm is on and other indicators are off. Press the alarm sound turnoff button once. The alarm sound for the warning alarms is disabled. The alarm sound turnoff indicators for the warning alarm and minor alarms are on and other indicators are off. Press the alarm sound turnoff button twice. The alarm sound for the warning and minor alarms is disabled. The alarm sound turnoff indicators for the warning, minor, major alarms are on and that for the critical alarm is off. Press the alarm sound turnoff button for three consecutive times. The alarm sound for the warning, minor, and major alarms is disabled. The four indicators are always off. Press the alarm sound turnoff button for four consecutive times. The alarm sound for all alarms is enabled. Technical Specifications Table 2-2 lists the technical specifications of the alarm box. Table 2-2 Technical specifications of the alarm box Categor y Item Specifications Mechanic al specificat ions Dimensions (W x H x D) 412 mm x 282 mm x 90 mm (16.22 in. x 11.10 in. x 3.54 in.) Weight 2.0 kg (4.41 lb) Environ mental paramete rs Working environment Indoor Temperature 0°C to 45°C (32°F to 113°F) Relative humidity 10% RH to 95% RH Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 90 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Categor y Item Specifications System configura tion paramete rs Power supply DC: -48 V to -60 V/0.5 A AC: 100 V/50 Hz/0.3 A to 240 V/50 Hz/0.3 A RS422 communication distance 100 m (328.08 ft) RS232 communication distance 80 m (262.46 ft) Maximum number of communication interfaces 5 Maximum remote alarm confirm distance 30 m (98.42 ft) Maximum distance of the remote speaker (1W active speaker) 30 m (98.42 ft) 2.2 Optical Module Functions An optical module provides optical-to-electrical and electrical-to-optical conversion functions. It is connected to an optical fiber to transmit signals. Appearance Optical modules can be classified into the following types by encapsulation type: small form-factor pluggable (SFP), enhanced SFP (eSFP), small form-factor pluggable plus (SFP+), 10-GB small form-factor pluggable transceiver (XFP), and quad small form-factor pluggable plus (QSFP+). The optical module appearance varies according to the encapsulation type. Figure 2-3 shows an SFP/SFP+ optical module. Figure 2-4 shows a QSFP+ optical module. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 91 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-3 SFP/SFP+ optical module Figure 2-4 QSFP+ optical module Figure 2-5 shows the structure of an optical module. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 92 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-5 Optical module structure 1. Dust-proof cap 2. Transmit port 3. Spring 4. Label 5. Connector 6. Shell 7. Receive port 8. Handle - Optical modules of the same encapsulation type may differ in the transmission rate, transmission distance, and operating wavelength.  The transmission rate can be 1.25 Gbit/s, 10.3125 Gbit/s, or 41.25 Gbit/s.  The operating wavelength can be 850 nm, 1310 nm, or 1550 nm.  The transmission distance can be 550 m, 15 km, 40 km, 80 km, or 120 km. The transmission distance of an optical module depends on the operating wavelength. Table 2-3 lists the mapping between the operating wavelength and the transmission distance. Table 2-3 Mapping between the operating wavelength and the transmission distance Operating Wavelength Transmission Distance 850 nm ≤ 500 m 1310 nm ≤ 40 km 1550 nm > 40 km or even to 120 km without any relay The label on an optical module specifies its transmission rate, operating wavelength, transmission distance, transmission mode, and encapsulation type. Figure 2-6 shows the label on an optical module. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 93 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-6 Label on an optical module Technical Specifications Table 2-4 shows the technical specifications of optical modules. Table 2-4 Technical specifications of optical modules Model Trans missio n Rate (Gbit/s ) Trans missi on Dista nce (km) Transm ission Mode Optical Fiber Type Optical Port Parameters Enc aps ulat ion Ty pe Operatin g Tempera ture OMXD3 0008 41.25 ≤ 0.15 Multimo de   Operating wavelength : 850 nm QS FP+ 0°C–70°C (32°F–15 8°F)  Transmit optical power: –7.3 dBm to –1.0 dBm  Extinction ratio: ≥ 3.0 dB  Receiver sensitivity: ≤ -9.5 dBm  Overload optical power: 2.4 dBm  Operating wavelength eSF P –20°C to +85°C  eSFP-85 0nm-100 Issue 01 (2016-01-15) 2.125 (multira ≤ 0.50 Multimo de  Optica l conne ctor type: MPO Optica l fiber type: multi mode Optica l Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 94 HUAWEI SE2900 Session Border Controller Hardware Description Model Trans missio n Rate (Gbit/s ) 0Base-S x/FC200 MM te) Trans missi on Dista nce (km) 2 Other Accessories Transm ission Mode Optical Fiber Type conne ctor type: LC  eSFP-13 10nm-10 00BaseLx SM 1.25 ≤ 10.00 Singlemode   eSFP-13 10nm-10 00BaseVx Issue 01 (2016-01-15) 1.25 ≤ 40.00 Singlemode  Optica l fiber type: multi mode Optica l conne ctor type: LC Optica l fiber type: single -mode Optica l conne ctor type: LC Optical Port Parameters Enc aps ulat ion Ty pe : 850 nm  Transmit optical power: –9.5 dBm to –2.5 dBm  Extinction ratio: ≥ 9.0 dB  Receiver sensitivity: ≤ -17.0 dBm  Overload optical power: 0 dBm  Operating wavelength : 1310 nm  Transmit optical power: –9.0 dBm to –3.0 dBm  Extinction ratio: ≥ 9.0 dB  Receiver sensitivity: ≤ -20.0 dBm  Overload optical power: -3.0 dBm  Operating wavelength : 1310 nm  Transmit optical power: Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Operatin g Tempera ture (–4°F to +185°F) eSF P 0°C–70°C (32°F–15 8°F) eSF P 0°C–70°C (32°F–15 8°F) 95 HUAWEI SE2900 Session Border Controller Hardware Description Model Trans missio n Rate (Gbit/s ) Trans missi on Dista nce (km) 2 Other Accessories Transm ission Mode Optical Fiber Type  eSFP-15 50nm-10 00BaseZx/FC10 0 1.25 ≤ 80.00 Singlemode   OMXD3 0001 10.00 ≤ 0.30 Multimo de   Issue 01 (2016-01-15) Optica l fiber type: single -mode Optica l conne ctor type: LC Optica l fiber type: single -mode Optica l conne ctor type: LC Optica l fiber type: multi mode Optical Port Parameters Enc aps ulat ion Ty pe Operatin g Tempera ture eSF P 0°C–70°C (32°F–15 8°F) SFP + 0°C–70°C (32°F–15 8°F) –5.0 dBm to 0 dBm  Extinction ratio: ≥ 9.0 dB  Receiver sensitivity: ≤ -23.0 dBm  Overload optical power: -3.0 dBm  Operating wavelength : 1550 nm  Transmit optical power: –2.0 dBm to +5.0 dBm  Extinction ratio: ≥ 9.0 dB  Receiver sensitivity: ≤ -23.0 dBm  Overload optical power: -3.0 dBm  Operating wavelength : 850 nm  Transmit optical power: –7.3 dBm to –1.0 dBm  Extinction ratio: ≥ 3.0 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 96 HUAWEI SE2900 Session Border Controller Hardware Description Model Trans missio n Rate (Gbit/s ) Trans missi on Dista nce (km) 2 Other Accessories Transm ission Mode Optical Fiber Type Optical Port Parameters Enc aps ulat ion Ty pe Operatin g Tempera ture SFP + 0°C–70°C (32°F–15 8°F) SFP + 0°C–70°C (32°F–15 8°F) dB OSX001 001 10.00 ≤ 10.00 Singlemode   OSX080 N00 9.9530– 10.3125 ≤ 80.00 Singlemode   Issue 01 (2016-01-15) Optica l conne ctor type: LC Optica l fiber type: single -mode Optica l conne ctor type: LC Optica l fiber type: single -mode  Receiver sensitivity: ≤ -9.9 dBm  Overload optical power: -1.0 dBm  Operating wavelength : 1310 nm  Transmit optical power: –8.2 dBm to +0.5 dBm  Extinction ratio: ≥ 3.5 dB  Receiver sensitivity: ≤ -12.6 dBm  Overload optical power: 0.5 dBm  Operating wavelength : 1550 nm  Transmit optical power: 0 dBm to 4 dBm  Extinction ratio: ≥ 9 dB  Receiver sensitivity: ≤ -24 dBm  Overload Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 97 HUAWEI SE2900 Session Border Controller Hardware Description Model Trans missio n Rate (Gbit/s ) Trans missi on Dista nce (km) 2 Other Accessories Transm ission Mode Optical Fiber Type Optical Port Parameters Enc aps ulat ion Ty pe Operatin g Tempera ture SFP + 0°C–70°C (32°F–15 8°F) optical power: -7 dBm OSX040 N00 9.95–11 .10 ≤ 40.00 Singlemode   Optica l conne ctor type: LC Optica l fiber type: single -mode  Operating wavelength : 1550 nm  Transmit optical power: –4.7 dBm to +4 dBm  Extinction ratio: ≥ 3 dB  Receiver sensitivity: ≤ -14.1 dBm  Overload optical power: 0.5 dBm 2.3 Electrical Module Functions An electrical module provides optical-to-electrical and electrical-to-optical conversion functions. It is connected to an Ethernet cable to transmit signals. Appearance Figure 2-7 shows an electrical module. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 98 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories Figure 2-7 Electrical module Figure 2-8 shows the structure of an electrical module. Figure 2-8 Electrical module structure 1. Handle Issue 01 (2016-01-15) 2. Spring Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3. Label 99 HUAWEI SE2900 Session Border Controller Hardware Description 2 Other Accessories 4. Connector 5. Shell 6. Port An electrical module uses an RJ45 port, and is connected to an Ethernet cable to support the maximum transmission distance of 100 m. Technical Specifications Table 2-5 describes the technical specifications of an electrical module. Table 2-5 Technical specifications of an electrical module Model Transmissi on Rate (Mbit/s) Transmis sion Distance (km) Port Type Encap sulati on Operating Temperature SFP-1000Bas eT 10–1000, auto-negotia tion ≤ 0.1 RJ45 electrical port SFP 0°C–70°C (32°F–158°F) Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 100 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables 3 Cables About This Chapter 3.1 Power Cables and PGND Cables 3.2 Signaling Cables 3.1 Power Cables and PGND Cables 3.1.1 Power and PGND Cables to a Subrack Functions  A power cable connects the power input terminal on a subrack to the power output terminal on the power distribution box (PDB) to supply power to the subrack.  A PGND cable connects the ground point on a subrack to the ground point on a mounting bar of the cabinet for proper grounding.  Power cable Appearance − Power cable with OT terminals Both ends of a power cable are OT terminals. The blue cable is connected to the NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure 3-1 shows power cables with OT terminals. Figure 3-1 Power cables with OT terminals − Issue 01 (2016-01-15) Power cable with dual-hole JG terminals Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 101 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Both ends of a power cable are dual-hole JG terminals. The blue cable is connected to the NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure 3-2 shows power cables with dual-hole JG terminals. Figure 3-2 Power cable with dual-hole JG terminals − AC power cable Most countires have their own AC power cables, including China, Europe, and North America.The delivered AC power cables must comply with local standards. The following uses China AC power cables as an example. AC power cables include the AC power cable using the C13 straight female (SF) and the PI straight male (SM) and the AC power cable using the C13 angled female (AF) and the C14 SM. The two types of power cables differ in the power port. Figure 3-3 shows an AC power cable using the C13 SF and PI SM. Figure 3-4 shows an AC power cable using the C13 AF and C14 SM. Figure 3-3 AC power cable using the C13 SF and PI SM Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 102 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-4 AC power cable using the C13 AF and C14 SM  PGND cable − PGND cable with OT terminals Each subrack is configured with one PGND cable. The cable is yellow and green. Both ends of the PGND cable are OT terminals. Figure 3-5 shows a PGND cable with OT terminals. Figure 3-5 PGND cable with OT terminals − PGND cable with dual-hole JG terminals Each subrack is configured with one PGND cable. The cable is yellow and green. Both ends of the PGND cable are dual-hole JG terminals. Figure 3-6 shows a PGND cable with dual-hole JG terminals. Figure 3-6 PGND cable with dual-hole JG terminals The subrack used in North America uses power cables with dual-hole JG terminals and PGND cables with dual-hole JG terminals. Technical Specifications Table 3-1 lists the technical specifications of the power and PGND cables for a subrack. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 103 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Table 3-1 Technical specifications of the power and PGND cables for a subrack Item Specifications Power cable Power cable with OT terminals or dual-hole JG terminals: 10 mm2 (8 AWG) AC power cable  AC power cable using the C13 SF and PI SM: China, 250 V/10 A, 1 mm2, 10°C to 70°C, and C13 SF and PI SM  AC power cable using the C13 AF and C14 SM: China/Europe, 250 V/10 A, 1 mm2, -20°C to +105°C, and C13 AF and C14 SM 16 mm2 (6 AWG) PGND cable 3.1.2 Power Cables of the Alarm Box Functions The power cables are used for supplying power to the alarm box. Table 3-2 lists the configuration of the power cables. Table 3-2 Configuration of the power cables Power Supply Quantit y Remarks AC power supply 1 The cable is configured only if system down notification is required for the alarm box. If the length of the cable is not sufficient, connector boards must be added. The boards are provided by carriers. If carriers do not provide the connector boards, the quantity of the required boards must be provided in the survey report. DC power supply 1 DC power cable is recommended. An alarm box requires only one power cable. The length of the cable cannot exceed 100 m (328.08 ft). Exterior None. Technical Specifications Table 3-3 lists the technical specifications of the power cables of alarm boxes. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 104 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Table 3-3 Technical specifications of the power cables of alarm boxes Name Specifications AC power cable  Voltage: 220 V/250 V  Length: 6 m (19.68 ft) (The length varies according to the actual situation.)  Gauge: 3 x 0.75 mm2 (3 x 0.001 in.2)  Color: black DC power cable One end of the DC power cable is a 4-pin connector, and the other end is two 1-pin connectors.  Voltage: -48 V  Length: 30 m (98.42 ft) (The length varies according to the actual situation.)  Gauge: 0.8 mm2 (0.001 in.2)  Color: black 3.2 Signaling Cables 3.2.1 Ethernet Cable Functions Ethernet cables are used for cascading devices or for communication between devices and the network. Through Ethernet cables, devices can be locally serviced and remotely accessed over the network. Ethernet cables transmit 100 Mbit/s or 1000 Mbit/s signals. Appearance An Ethernet cable is a straight-through. It is made of Category 5 enhanced shielded or unshielded twisted pair cables and RJ45 connectors at both ends. Figure 3-7 shows the appearance of an Ethernet cable. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 105 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-7 Ethernet cable appearance Figure 3-8 shows the structure of an Ethernet cable. Figure 3-8 Ethernet cable structure Pinouts Figure 3-9 shows the pins at both ends of a straight-through cable. Table 3-4 describes the pins. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 106 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-9 Pins at both ends of a straight-through cable Table 3-4 Pins at both ends of a straight-through cable X1 X2 Pin Color Pinouts 1 1 White and orange 2 2 Orange A pair of twisted pair cables 3 3 White and green 6 6 Green 5 5 White and blue 4 4 Blue 7 7 White and brown 8 8 Brown A pair of twisted pair cables A pair of twisted pair cables A pair of twisted pair cables Technical Specifications Table 3-5 lists the technical specifications of the Ethernet cable. Table 3-5 Technical specifications of the Ethernet cable Item Specifications Connectors X1 and X2 RJ45 Number of pins 8 pins Diameter of the inner conductor 0.51 mm (0.02 in.) Wire gauge of the inner conductor 24 AWG Number of cores 8 Outer jacket flame retardant 28 Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 107 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables 3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable Function The LC/PC-LC/PC-multi-mode optical cables are used to connect service boards and network elements (NEs). Appearance The LC/PC-LC/PC-multi-mode optical cable is orange, as shown in Figure 3-10. Users can choose single-mode or multi-mode optical cables based on site requirements. Figure 3-10 LC/PC-LC/PC-multi-mode optical cable An LC/PC connector is used at both ends of an LC/PC-LC/PC multi-mode optical cable. Figure 3-11 shows an LC/PC connector. Figure 3-11 LC/PC connector Technical Specifications The LC/PC-LC/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357. Table 3-6 lists the technical specifications of the LC/PC-LC/PC-multi-mode optical cable. Table 3-6 Technical specifications of the LC/PC-LC/PC-multi-mode optical cable Item Specifications Cable type Optical jumper Transfer mode Multi-mode Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 108 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Item Specifications Number and type of optical connector I LC/PC Number and type of optical connector II LC/PC Diameter of the optical fiber core 62.5/125 um Outer diameter of an optical cable 2.0 mm (0.08 in.) Service life 500 times 3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable Functions The DLC/PC-DLC/PC-multi-mode optical cables are used to connect LAN switches or disk arrays to other network devices. Exterior Figure 3-12 shows the exterior of a DLC/PC-DLC/PC-multi-mode optical cable. Figure 3-12 Exterior of a DLC/PC-DLC/PC-multi-mode optical cable Both ends of a DLC/PC-DLC/PC-multi-mode optical fiber are DLC/PC connectors. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 109 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Technical Specifications The DLC/PC-DLC/PC-multi-mode optical cables comply with the ITU G651 and GB/T 12357 standards. Table 3-7 lists the technical specifications of the DLC/PC-DLC/PC-multi-mode optical cables. Table 3-7 Technical specifications of the DLC/PC-DLC/PC-multi-mode optical cables Item Specifications Category Patch cord Cable model A1b Transmission mode Multi-mode Number and type of optical connector I DLC/PC Number and type of optical connector II DLC/PC Diameter of the optical fiber core 62.5/125um Outer diameter of an optical fiber 2.0 mm (0.08 in.) Optical fiber length 5.0 m (16.40 ft.) Service life (times) 500 Net weight 0.048 kg (0.106 lb) Lowest operating environment temperature -20 degC Highest operating environment temperature 70 degC 3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable Function The LC/PC-LC/PC-single-mode optical cables are used to connect service boards and network elements (NEs). Appearance The LC/PC-LC/PC-single-mode optical cable is yellow, as shown in Figure 3-13. Users can choose single-mode or multi-mode optical cables based on site requirements. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 110 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-13 LC/PC-LC/PC-single-mode optical cable An LC/PC connector is used at both ends of an LC/PC-LC/PC-single-mode optical cable. Figure 3-14 shows an LC/PC connector. Figure 3-14 LC/PC connector Technical Specifications The LC/PC-LC/PC-single-mode optical cables comply with ITU G.652 and GB/T 9771.1. Table 3-8 lists the technical specifications of the LC/PC-LC/PC-single-mode optical cable. Table 3-8 Technical specifications of the LC/PC-LC/PC-single-mode optical cable Item Specifications Cable type Optical jumper Transfer mode Single-mode Number and type of optical connector I LC/PC Number and type of optical connector II LC/PC Diameter of the optical fiber core 9/125 um Outer diameter of an optical cable 2.0 mm (0.08 in.) Service life 500 times Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 111 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables 3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable Function The MPO/PC-MPO/PC-multi-mode optical cables are used to connect the optical ports on two devices for data communications. The MPO/PC-MPO/PC-multi-mode optical cables transmit 41.25 Gbit/s signals. Appearance The MPO/PC-MPO/PC-multi-mode optical cable is cyan, as shown in Figure 3-15. Figure 3-15 MPO/PC-MPO/PC-multi-mode optical cable An MPO/PC connector is used at both ends of an MPO/PC-MPO/PC-multi-mode optical cable. Figure 3-16 shows an MPO/PC connector. Figure 3-16 MPO/PC connector Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 112 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Technical Specifications The MPO/PC-MPO/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357. Table 3-9 lists the technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable. Table 3-9 Technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable Item Specifications Cable type Optical cable component Transfer mode Multi-mode Number and type of optical connector I MPO/PC Number and type of optical connector II MPO/PC Diameter of the optical fiber core 50 um/125 um Number of optical fiber cores 8 Outer diameter of an optical cable 3.5 mm (0.14 in.) Optical cable length 2 m (78.74 in.), 30 m (1181.1 in.) or 100 m (3937 in.) Service life 200 times 3.2.6 High-Density Cable Functions A high-density cable is connected to a high-density port at one end, and provides one VGA port, three USB ports, and one serial port at the other end for data transmission. Appearance Figure 3-17 shows a black high-density cable. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 113 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-17 High-density cable Technical Specifications Figure 3-18 shows the pins at both ends of a high-density cable. Table 3-10 lists the technical specifications of the high-density cable. Figure 3-18 Pins at both ends of a high-density cable (unit: mm) Table 3-10 Technical specifications of the high-density cable Item Specifications X1 Cable connector, MDR, 26-pin, male, cable solder type, for OEM X2 Cable connector, D connector, 15-pin, female connector, cable solder type, three Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 114 HUAWEI SE2900 Session Border Controller Hardware Description Item 3 Cables Specifications rows, for OEM X3 USB2.0 connector, double line, 8-pin, female connector X4 Network interface connector, 8-bit 8-pin, shielded, model socket/top plugging type, with fixed pin/pin tail length 3.43 mm X5 USB2.0 connector, single line, 4-pin, female connector W1-2 Twisted-pair cable, 100 ohms, SEYVP, 0.48 mm, 26 AWG, 4 pairs, black W3-4 Twisted-pair cable, 100 ohms, SEYVP, 0.48 mm, 26 AWG, 2 pairs, black 3.2.7 DB9-RJ45 Serial Cable Functions The DB9-RJ45 serial cable is used for data transmission. It has a DB9 connector at one end and an RJ45 connector at the other end. The DB9 connector connects to the serial port of a client, and the RJ45 connector connects to the serial port of a device. Appearance Figure 3-19 shows the appearance of a DB9-RJ45 serial cable. Figure 3-19 DB9-RJ45 serial cable appearance Figure 3-20 shows the structure of a DB9-RJ45 serial cable. Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 115 HUAWEI SE2900 Session Border Controller Hardware Description 3 Cables Figure 3-20 DB9-RJ45 serial cable structure Pinouts Table 3-11 lists the pins at both ends of a DB9-RJ45 serial cable. Table 3-11 Pins at both ends of a DB9-RJ45 serial cable Wire No. Start Pin End Pin Signal W X1.2 X2.3 TX X1.3 X2.6 RX X1.5 X2.5 GND Technical Specifications Table 3-12 lists the technical specifications of the DB9-RJ45 serial cable. Table 3-12 Technical specifications of the DB9-RJ45 serial cable Item Specifications Connector type Cable Connector-04040838-D Connector-9PIN-Female Connector-Cable Welding Type Network Interface Connector-Single Row-Single Interface-8PIN-8bit-Shielded-Crystal Connector Cable model Symmetric twisted pair cable Characteristic impedance 100 ohms Diameter of the inner conductor 0.32 mm (0.01 in.) Wire gauge of the inner conductor 28 AWG Color Gray Issue 01 (2016-01-15) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 116