High Ip3, 700 Mhz To 2800 Mhz, Double Balanced,

Transcript

High IP3, 700 MHz to 2800 MHz, Double Balanced, Passive Mixer, IF Amplifier, and Wideband LO Amplifier ADL5811 VPIF IFGM NC IFOP IFON NC IFGD COMM FUNCTIONAL BLOCK DIAGRAM 32 31 30 29 28 27 26 25 24 NC NC 1 RFCT 2 ADL5811 NC 3 23 NC 22 NC RFIN 4 21 LOIP NC 5 20 LOIN NC 6 19 LE SERIAL PORT INTERFACE BIAS GEN NC 7 18 DATA NC 8 13 14 15 16 COMM VLO1 COMM 09912-001 12 VLO2 11 COMM 10 VLO3 17 CLK 9 VLO4 RF frequency: 700 MHz to 2800 MHz continuous LO frequency: 250 MHz to 2800 MHz, high-side or low-side inject IF range: 30 MHz to 450 MHz Power conversion gain of 7.5 dB at 1900 MHz SSB noise figure of 10.7 dB at 1900 MHz Input IP3 of 27.5 dBm at 1900 MHz Input P1dB of 12.7 dBm at 1900 MHz Typical LO drive of 0 dBm Single-ended, 50 Ω RF port Single-ended or balanced LO input port Single-supply operation: 3.6 V to 5.0 V Serial port interface control on all functions Exposed paddle 5 mm × 5 mm, 32-lead LFCSP package COMM FEATURES Figure 1. APPLICATIONS Multiband/multistandard cellular base station receivers Wideband radio link diversity downconverters Multimode cellular extenders and broadband receivers GENERAL DESCRIPTION The ADL5811 uses revolutionary new broadband, square wave limiting, local oscillator (LO) amplifiers to achieve an unprecedented radio frequency (RF) bandwidth of 700 MHz to 2800 MHz. Unlike conventional narrow-band sine wave LO amplifier solutions, this permits the LO to be applied either above or below the RF input over an extremely wide bandwidth. Because energy storage elements are not used, the dc current consumption also decreases with decreasing LO frequency. The ADL5811 uses highly linear, doubly balanced, passive mixer cores along with integrated RF and LO balancing circuits to allow single-ended operation. The ADL5811 incorporates programmable RF baluns, allowing optimal performance over a 700 MHz to 2800 MHz RF input frequency. The balanced passive mixer arrangement provides outstanding LO-to-RF and LO-toIF leakages, excellent RF-to-IF isolation, and excellent intermodulation performance over the full RF bandwidth. The balanced mixer cores also provide extremely high input linearity, allowing the device to be used in demanding wideband applications where in-band blocking signals may otherwise result in the degradation of dynamic range. Blocker noise figure performance is comparable to narrow-band passive mixer designs. High linearity IF buffer amplifiers follow the passive mixer cores, yielding typical power conversion gains of 7.5 dB, and can be used with a wide range of output impedances. For low voltage applications, the ADL5811 is capable of operation at voltages down to 3.6 V with substantially reduced current. Two logic bits are provided to power down (<1.5 mA) the circuit when desired. All features of the ADL5811 are controlled via a 3-wire serial port interface, resulting in optimum performance and minimum external components. The ADL5811 is fabricated using a BiCMOS high performance IC process. The device is available in a 32-lead, 5mm × 5mm, LFCSP package and operates over a −40°C to +85°C temperature range. An evaluation board is also available. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. ADL5811 TABLE OF CONTENTS Features .............................................................................................. 1 RF Subsystem.............................................................................. 20 Applications....................................................................................... 1 LO Subsystem ............................................................................. 21 Functional Block Diagram .............................................................. 1 Applications Information .............................................................. 22 General Description ......................................................................... 1 Basic Connections...................................................................... 22 Revision History ............................................................................... 2 IF Port .......................................................................................... 22 Specifications..................................................................................... 3 Bias Resistor Selection ............................................................... 22 Timing Characteristics ................................................................ 4 VGS Programming .................................................................... 22 Absolute Maximum Ratings............................................................ 5 Low-Pass Filter Programming.................................................. 23 ESD Caution.................................................................................. 5 RF Balun Programming ............................................................ 23 Pin Configuration and Function Descriptions............................. 6 Register Structure ........................................................................... 24 Typical Performance Characteristics ............................................. 7 Evaluation Board ............................................................................ 25 3.6 V Performance...................................................................... 16 Outline Dimensions ....................................................................... 28 Spurious Performance................................................................ 17 Ordering Guide .......................................................................... 28 Circuit Description......................................................................... 20 REVISION HISTORY 7/11—Revision 0: Initial Version Rev. 0 | Page 2 of 28 ADL5811 SPECIFICATIONS VS = 5 V, TA = 25°C, fRF = 1900 MHz, fLO = 1697 MHz, RF power = −10 dBm, LO power = 0 dBm, R1 = 910 Ω, ZO = 50 Ω, optimum SPI settings, unless otherwise noted. Table 1. Parameter RF INPUT INTERFACE Return Loss Input Impedance RF Frequency Range OUTPUT INTERFACE Output Impedance IF Frequency Range DC Bias Voltage 1 LO INTERFACE LO Power Return Loss Input Impedance LO Frequency Range DYNAMIC PERFORMANCE Power Conversion Gain Voltage Conversion Gain SSB Noise Figure SSB Noise Figure Under Blocking Input Third-Order Intercept Input Second-Order Intercept Input 1 dB Compression Point LO-to-IF Output Leakage LO-to-RF Input Leakage RF-to-IF Output Isolation IF/2 Spurious IF/3 Spurious POWER INTERFACE Supply Voltage, VS Quiescent Current Power-Down Current 1 Test Conditions/Comments Min Tunable to >20 dB broadband via serial port Typ Max Unit 2800 dB Ω MHz 15 50 700 Differential impedance, f = 200 MHz 260||1.0 30 Externally generated 450 VS −6 Low-side or high-side LO 250 Including 4:1 IF port transformer and PCB loss ZSOURCE = 50 Ω, differential ZLOAD = 200 Ω differential 5 dBm blocker present ±10 MHz from wanted RF input, LO source filtered fRF1 = 1900 MHz, fRF2 = 1901 MHz, fLO = 1697 MHz, each RF tone at −10 dBm fRF1 = 1900 MHz, fRF2 = 2000 MHz, fLO = 1697 MHz, each RF tone at −10 dBm Unfiltered IF output −10 dBm input power −10 dBm input power 3.6 Resistor programmable IF current Supply voltage must be applied from external circuit through choke inductors. Rev. 0 | Page 3 of 28 0 13 50 +10 2800 Ω||pF MHz V dBm dB Ω MHz 7.5 13.9 10.7 20.7 dB dB dB dB 27.5 dBm 62 dBm 12.7 −40 −25 26 −73 −75 dBm dBm dBm dB dBc dBc 5 185 1.4 5.5 V mA mA ADL5811 TIMING CHARACTERISTICS Low logic level ≤ 0.4 V, and high logic level ≥ 1.4 V. Table 2. Serial Interface Timing Parameter t1 t2 t3 t4 t5 t6 t7 Limit 20 10 10 25 25 10 20 Unit ns minimum ns minimum ns minimum ns minimum ns minimum ns minimum ns minimum Test Conditions/Comments LE setup time DATA-to-CLK setup time DATA-to-CLK hold time CLK high duration CLK low duration CLK-to-LE setup time LE pulse width Timing Diagram t4 t5 CLK t2 DATA DB23 (MSB) t3 DB22 DB2 (CONTROL BIT C3) DB1 (CONTROL BIT C2) DB0 (LSB) (CONTROL BIT C1) t7 t1 09912-002 t6 LE Figure 2. Timing Diagram Rev. 0 | Page 4 of 28 ADL5811 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Supply Voltage, VPOS CLK, DATA, LE IF Output Bias RF Input Power LO Input Power Internal Power Dissipation θJA (Exposed Paddle Soldered Down) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Rating 5.5 V 5.5 V 6.0 V 20 dBm 13 dBm 1.1 W 25°C/W 150°C −40°C to +85°C −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION Rev. 0 | Page 5 of 28 ADL5811 32 31 30 29 28 27 26 25 VPIF IFGM NC IFOP IFON NC IFGD COMM PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 ADL5811 TOP VIEW (Not to Scale) 24 23 22 21 20 19 18 17 NC NC NC LOIP LOIN LE DATA CLK NOTES 1. NC = NO CONNECT. CAN BE GROUNDED. 2. EXPOSED PAD MUST BE CONNECTED TO GROUND. 09912-003 VLO4 COMM VLO3 COMM VLO2 COMM VLO1 COMM 9 10 11 12 13 14 15 16 NC RFCT NC RFIN NC NC NC NC Figure 3. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 3, 5 to 8, 22 to 24, 27, 30 2 4 9, 11, 13, 15 10, 12, 14, 16, 25 17, 18, 19 20 21 26 28, 29 Mnemonic NC RFCT RFIN VLO4, VLO3, VLO2, VLO1 COMM CLK, DATA, LE LOIN LOIP IFGD IFOP, IFON 31 32 IFGM VPIF EPAD Description No Connect. Can be grounded. RF Balun Center Tap (AC Ground). RF Input. Should be ac-coupled. Positive Supply Voltages for LO Amplifier. Ground. Serial Port Interface Control. Ground Return for LO Input. LO Input. Should be ac-coupled. Supply Return for IF Amplifier. Must be grounded. IF Differential Open-Collector Outputs. Should be pulled up to VCC using external inductors. IF Amplifier Bias Control. Supply Voltage for IF Amplifier. Exposed pad must be connected to ground. Rev. 0 | Page 6 of 28 ADL5811 TYPICAL PERFORMANCE CHARACTERISTICS VS = 5 V, TA = 25°C, fRF = 1900 MHz, fLO = 1697 MHz, RF power = −10 dBm, LO power = 0 dBm, R1 = 910 Ω, ZO = 50 Ω, optimum SPI settings, unless otherwise noted. 220 210 90 TA = –40°C TA = +25°C TA = +85°C 80 TA = –40°C TA = +25°C TA = +85°C 70 190 INPUT IP2 (dBm) SUPPLY CURRENT (mA) 200 180 170 160 60 50 40 150 30 140 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 10 700 09912-004 120 700 RF FREQUENCY (MHz) Figure 7. Input IP2 vs. RF Frequency Figure 4. Supply Current vs. RF Frequency 10 9 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 09912-007 20 130 20 TA = –40°C TA = +25°C TA = +85°C 18 TA = –40°C TA = +25°C TA = +85°C INPUT P1dB (dBm) CONVERSION GAIN (dB) 16 8 7 6 5 14 12 10 8 6 4 4 3 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 0 700 RF FREQUENCY (MHz) Figure 8. Input P1dB vs. RF Frequency Figure 5. Power Conversion Gain vs. RF Frequency 45 40 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 09912-008 2 09912-005 2 700 16 TA = –40°C TA = +25°C TA = +85°C 15 TA = –40°C TA = +25°C TA = +85°C 14 NOISE FIGURE (dB) 30 25 20 13 12 11 10 9 8 15 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 6 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 9. SSB Noise Figure vs. RF Frequency Figure 6. Input IP3 vs. RF Frequency Rev. 0 | Page 7 of 28 09912-009 10 700 7 09912-006 INPUT IP3 (dBm) 35 ADL5811 RF = 1900MHz 225 70 205 65 INPUT IP2 (dBm) 215 195 185 175 55 50 45 155 40 145 35 0 10 20 30 40 50 60 70 80 TEMPERATURE (°C) 30 –40 –30 –20 –10 RF = 1900MHz 10 20 30 40 50 60 70 80 Figure 13. Input IP2 vs. Temperature 20 VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 9.5 0 TEMPERATURE (°C) Figure 10. Supply Current vs. Temperature 10.0 VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 60 165 135 –40 –30 –20 –10 RF = 1900MHz 75 09912-010 SUPPLY CURRENT (mA) 80 VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 09912-013 235 RF = 1900MHz VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 18 16 8.5 INPUT P1dB (dBm) CONVERSION GAIN (dB) 9.0 8.0 7.5 7.0 6.5 14 12 10 8 6.0 0 10 20 30 40 50 60 70 80 TEMPERATURE (°C) 4 –40 –30 –20 –10 09912-011 5.0 –40 –30 –20 –10 RF = 1900MHz 20 30 40 50 60 70 80 Figure 14. Input P1dB vs. Temperature 15 VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 33 10 TEMPERATURE (°C) Figure 11. Power Conversion Gain vs. Temperature 35 0 09912-014 6 5.5 RF = 1900MHz VPOS = 4.75V VPOS = 5.00V VPOS = 5.25V 14 SSB NOISE FIGURE (dB) 31 27 25 23 21 13 12 11 10 19 15 –40 –30 –20 –10 0 10 20 30 40 50 TEMPERATURE (°C) 60 70 80 8 –40 –30 –20 –10 0 10 20 30 40 50 60 TEMPERATURE (°C) Figure 12. Input IP3 vs. Temperature Figure 15. SSB Noise Figure vs. Temperature Rev. 0 | Page 8 of 28 70 80 09912-015 9 17 09912-012 INPUT IP3 (dBm) 29 ADL5811 200 195 TA = 25°C 70 190 185 180 175 50 40 30 170 20 165 10 160 30 80 130 180 230 280 330 380 430 IF FREQUENCY (MHz) 0 30 RF = 900MHz RF = 1900MHz RF = 2500MHz 80 18 8 7 6 430 RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C 12 10 8 130 180 230 280 330 380 430 IF FREQUENCY (MHz) 2 30 09912-017 80 180 230 280 330 380 430 Figure 20. Input P1dB vs. IF Frequency 20 RF = 900MHz RF = 1900MHz RF = 2500MHz 39 130 IF FREQUENCY (MHz) Figure 17. Power Conversion Gain vs. IF Frequency TA = 25°C 80 09912-020 4 4 30 RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C 18 SSB NOISE FIGURE (dB) 28 27 26 25 24 23 16 14 12 10 8 30 80 130 180 230 280 330 IF FREQUENCY (MHz) 380 430 4 30 80 130 180 230 280 330 380 IF FREQUENCY (MHz) Figure 21. SSB Noise Figure vs. IF Frequency Figure 18. Input IP3 vs. IF Frequency Rev. 0 | Page 9 of 28 430 09912-021 6 09912-018 INPUT IP3 (dBm) 380 6 5 22 330 14 9 30 280 16 INPUT P1dB (dBm) CONVERSION GAIN (dB) 10 230 Figure 19. Input IP2 vs. IF Frequency RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C 180 IF FREQUENCY (MHz) Figure 16. Supply Current vs. IF Frequency 11 130 09912-019 INPUT IP2 (dBm) 60 09912-016 SUPPLY CURRENT (mA) 80 RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C ADL5811 10 9 7 6 14 12 10 5 8 4 6 –4 –2 0 2 4 6 8 10 LO POWER (dBm) 4 –6 –45 –50 29 –55 IF/2 SPURIOUS (dBc) INPUT IP3 (dBm) –40 31 27 25 23 21 4 6 8 10 LO POWER (dBm) –90 700 09912-023 2 60 –65 IF/3 SPURIOUS (dBc) –60 50 40 30 –4 –2 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 TA = –40°C TA = +25°C TA = +85°C –70 –75 –80 –85 RF = 900MHz RF = 1900MHz RF = 2500MHz 0 2 4 6 LO POWER (dBm) 8 10 09912-024 INPUT IP2 (dBm) –55 70 10 –6 TA = –40°C TA = +25°C TA = +85°C Figure 26. IF/2 Spurious vs. RF Frequency, RF Power = −10 dBm TA = 25°C 20 10 RF FREQUENCY (MHz) Figure 23. Input IP3 vs. LO Power 80 8 –75 –85 0 6 –70 –80 –2 4 –65 17 –4 2 –60 19 15 –6 0 Figure 25. Input P1dB vs. LO Power RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C –2 LO POWER (dBm) Figure 22. Power Conversion Gain vs. LO Power 33 –4 09912-026 3 –6 09912-025 INPUT P1dB (dBm) 16 8 35 RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C 18 09912-022 CONVERSION GAIN (dB) 20 RF = 900MHz RF = 1900MHz RF = 2500MHz TA = 25°C –90 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 27. IF/3 Spurious vs. RF Frequency, RF Power = −10 dBm Figure 24. Input IP2 vs. LO Power Rev. 0 | Page 10 of 28 09912-027 11 ADL5811 RESISTANCE (Ω) PERCENTAGE (%) 80 60 40 20 7.3 7.5 7.7 7.9 CONVERSION GAIN (dB) 300 6 200 4 100 2 0 30 80 130 180 230 280 330 380 430 0 IF FREQUENCY (MHz) Figure 31. IF Output Impedance (R Parallel C Equivalent) 0 MEAN: 27.5 SD: 0.36% TA = +25°C –5 RF PORT RETURN LOSS (dB) 80 PERCENTAGE (%) 10 8 Figure 28. Conversion Gain Distribution 100 RF = 900MHz RF = 1900MHz RF = 2500MHz 400 09912-028 0 7.1 TA = 25°C CAPACITANCE (pF) 500 MEAN: 7.5 SD: 0.12% 09912-031 100 60 40 20 –10 –15 –20 –25 –30 25.5 27.5 29.5 31.5 INPUT IP3 (dBm) –40 700 09912-029 0 23.5 RF FREQUENCY (MHz) Figure 32. RF Port Return Loss, Fixed IF vs. RF Frequency Figure 29. Input IP3 Distribution 100 0 MEAN: 11.68 SD: 0.36% TA = 25°C –3 LO RETURN LOSS (dB) 80 60 40 20 –6 –9 –12 –15 –18 0 10.5 11.0 11.5 12.0 INPUT P1dB (dBm) 12.5 –24 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) Figure 33. LO Return Loss Figure 30. Input P1dB Distribution Rev. 0 | Page 11 of 28 09912-033 –21 09912-030 PERCENTAGE (%) 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 09912-032 –35 ADL5811 –30 –40 –50 –60 –20 –30 –40 –50 –10 TA = –40°C TA = +25°C TA = +85°C –30 –40 –50 –60 –30 –40 –50 –60 LO FREQUENCY (MHz) –80 500 900 1100 1300 1500 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) Figure 38. 3XLO Leakage vs. LO Frequency Figure 35. LO-to-IF Leakage vs. LO Frequency –10 700 14 TA = –40°C TA = +25°C TA = +85°C 16 TA = +25°C 15 13 14 CONVERSION GAIN (dB) –30 –40 –50 –60 11 NOISE FIGURE 12 9 11 8 10 9 7 GAIN 6 5 –80 500 4 700 700 900 1100 1300 1500 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) Figure 36. LO-to-RF Leakage vs. LO Frequency 13 10 –70 09912-036 LO-TO-RF LEAKAGE (dBm) 12 –20 VGS = 0 VGS = 1 VGS = 2 VGS = 3 SSB NOISE FIGURE (dB) 900 1100 1300 1500 1700 1900 2100 2300 2500 09912-035 700 09912-038 –70 –70 0 TA = 25°C 3LO-TO-IF 3LO-TO-RF –20 3XLO LEAKAGE (dBm) LO-TO-IF LEAKAGE (dBm) Figure 37. 2XLO Leakage vs. LO Frequency –20 –80 500 900 1100 1300 1500 1700 1900 2100 2300 2500 LO FREQUENCY (MHz) Figure 34. RF-to-IF Isolation vs. RF Frequency –10 700 09912-037 –70 500 09912-034 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 0 TA = 25°C –60 –70 –80 700 2LO-TO-IF 2LO-TO-RF –10 –20 2XLO LEAKAGE (dBm) RF-TO-IF ISOLATION (dB) –10 0 TA = –40°C TA = +25°C TA = +85°C 8 VGS = 4 VGS = 5 VGS = 6 VGS = 7 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 7 09912-0139 0 Figure 39. Power Conversion Gain and SSB Noise Figure vs. RF Frequency for All VGS Settings Rev. 0 | Page 12 of 28 ADL5811 INPUT IP3 27 240 24 220 RF = 900MHz RF = 1900MHz RF = 2500MHz 21 20 18 15 15 10 12 5 9 120 6 100 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 INPUT P1dB 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 INPUT P1dB (dBm) 25 0 700 RF FREQUENCY (MHz) 200 180 160 140 IF BIAS RESISTOR VALUE (Ω) Figure 40. Input IP3 and Input P1dB vs. RF Frequency for All VGS Settings 30 RF = 900MHz RF = 1900MHz RF = 2500MHz 25 20 15 10 5 TA = +25°C –25 –20 –15 –10 –5 0 5 BLOCKER POWER (dBm) Figure 41. SSB Noise Figure vs. 10 MHz Offset Blocker Level 10 09912-141 0 –30 Figure 42. Supply Current vs. IF Bias Resistor Value CONVERSION GAIN AND SSB NOISE FIGURE (dB) 35 SSB NOISE FIGURE (dB) TA = 25°C 09912-042 TA = +25°C VGS = 6 VGS = 7 20 18 TA = 25°C INPUT IP3 32 28 24 16 14 RF = 900MHz RF = 1900MHz RF = 2500MHz NOISE FIGURE 20 12 16 10 12 8 GAIN 6 INPUT IP3 (dBm) VGS = 4 VGS = 5 09912-140 INPUT IP3 (dBm) 30 VGS = 2 VGS = 3 8 4 4 0 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 IF BIAS RESISTOR VALUE (Ω) Figure 43. Power Conversion Gain, SSB Noise Figure, and Input IP3 vs. IF Bias Resistor Value Rev. 0 | Page 13 of 28 09912-043 VGS = 0 VGS = 1 SUPPLY CURRENT (mA) 35 ADL5811 17 16 15 7 6 5 4 12 11 2 9 RF FREQUENCY (MHz) 8 700 RF FREQUENCY (MHz) 30 TA = +25°C 15 14 28 27 26 25 13 9 7 RF FREQUENCY (MHz) TA = +25°C 11 23 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 0 1 2 3 4 5 6 7 10 8 22 700 RFB = RFB = RFB = RFB = RFB = RFB = RFB = RFB = 12 24 09912-045 INPUT IP3 (dBm) 29 0 1 2 3 4 5 6 7 SSB NOISE FIGURE (dB) 31 16 RFB = RFB = RFB = RFB = RFB = RFB = RFB = RFB = 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 Figure 46. Input P1dB vs. RF Frequency for All RFB Settings Figure 44. Conversion Gain vs. RF Frequency for All RFB Settings 32 TA = +25°C 13 10 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 0 1 2 3 4 5 6 7 14 3 1 700 RFB = RFB = RFB = RFB = RFB = RFB = RFB = RFB = 09912-046 8 18 TA = +25°C 09912-044 CONVERSION GAIN (dB) 9 0 1 2 3 4 5 6 7 6 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 47. SSB Noise Figure vs. RF Frequency for All RFB Settings Figure 45. Input IP3 vs. RF Frequency for All RFB Settings Rev. 0 | Page 14 of 28 09912-047 10 RFB = RFB = RFB = RFB = RFB = RFB = RFB = RFB = INPUT P1dB (dBm) 11 ADL5811 12 LPF LPF LPF LPF 21 TA = +25°C 19 RFB0 6 RFB7 4 2 TA = +25°C RFB0 15 13 11 RFB7 RF FREQUENCY (MHz) 5 700 09912-048 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 50. Input P1dB vs. RF Frequency for All LPF Settings at RFB7 and RFB0 Figure 48. Conversion Gain vs. RF Frequency for All LPF Settings at RFB7 and RFB0 20 TA = +25°C 33 18 RFB0 31 SSB NOISE FIGURE (dB) 27 25 23 RFB7 21 TA = +25°C RFB0 14 12 10 8 RFB7 =0 =1 =2 =3 4 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 49. Input IP3 vs. RF Frequency for All LPF Settings at RFB7 and RFB0 Rev. 0 | Page 15 of 28 2 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 51. SSB Noise Figure vs. RF Frequency for All LPF Settings at RFB7 and RFB0 09912-051 15 700 =0 =1 =2 =3 6 LPF LPF LPF LPF 09912-049 17 LPF LPF LPF LPF 16 29 19 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 09912-050 7 –2 700 INPUT IP3 (dBm) =0 =1 =2 =3 9 0 35 LPF LPF LPF LPF 17 8 INPUT P1dB (dBm) CONVERSION GAIN (dB) 10 =0 =1 =2 =3 ADL5811 3.6 V PERFORMANCE VS = 3.6 V, TA = 25°C, fRF = 1900 MHz, fLO = 1697 MHz, RF power = −10 dBm, LO power = 0 dBm, R1 = 800 Ω, ZO = 50 Ω, optimum SPI settings, unless otherwise noted. 150 140 TA = –40°C TA = +25°C TA = +85°C 70 60 120 110 100 50 40 30 90 20 80 10 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 0 700 RF FREQUENCY (MHz) Figure 52. Supply Current vs. RF Frequency at 3.6 V 24 TA = –40°C TA = +25°C TA = +85°C 18 10 8 6 4 15 12 9 6 2 3 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 0 700 09912-053 0 700 RF FREQUENCY (MHz) 24 TA = –40°C TA = +25°C TA = +85°C 21 SSB NOISE FIGURE (dB) 30 20 15 10 5 TA = –40°C TA = +25°C TA = +85°C 18 15 12 9 6 3 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) 09912-054 INPUT IP3 (dBm) 25 0 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 Figure 56. Input P1dB vs. RF Frequency at 3.6 V Figure 53. Power Conversion Gain vs. RF Frequency at 3.6 V 35 TA = –40°C TA = +25°C TA = +85°C 21 INPUT P1dB (dBm) CONVERSION GAIN (dB) 12 Figure 55. Input IP2 vs. RF Frequency at 3.6 V 09912-056 14 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 0 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2700 RF FREQUENCY (MHz) Figure 57. SSB Noise Figure vs. RF Frequency at 3.6 V Figure 54. Input IP3 vs. RF Frequency at 3.6 V Rev. 0 | Page 16 of 28 09912-057 70 700 09912-055 INPUT IP2 (dBm) 130 09912-052 SUPPLY CURRENT (mA) 80 TA = –40°C TA = +25°C TA = +85°C ADL5811 SPURIOUS PERFORMANCE (N × fRF) − (M × fLO) spur measurements were made using the standard evaluation board. Mixer spurious products are measured in dBc from the IF output power level. Data was measured only for frequencies less than 6 GHz. Typical noise floor of the measurement system = −100 dBm. 5 V Performance VS = 5 V, TA = 25°C, RF power = −10 dBm, LO power = 0 dBm, R1 = 910 Ω, ZO = 50 Ω, optimum SPI settings, unless otherwise noted. Table 5. RF = 900 MHz, LO = 697 MHz 0 0 1 2 3 4 5 6 7 N 8 9 10 11 12 13 14 15 −37.8 −65.0 −94.0 <−100 <−100 <−100 1 −54.2 0.0 −54.4 −86.7 <−100 <−100 <−100 <−100 2 −31.4 −38.7 −69.6 <−100 <−100 <−100 <−100 <−100 <−100 3 −41.5 −19.6 −53.4 −91.0 <−100 <−100 <−100 <−100 <−100 4 −29.4 −51.6 −72.5 <−100 <−100 <−100 <−100 <−100 <−100 <−100 5 −58.5 −38.0 −82.3 −95.3 <−100 <−100 <−100 <−100 <−100 <−100 <−100 6 −49.3 −62.9 −93.5 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 7 −70.5 −52.4 −97.4 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 M 8 −52.9 −70.2 −93.0 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 5 6 7 M 8 9 −57.9 −98.8 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 10 11 12 13 14 15 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 10 11 12 13 14 15 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 Table 6. RF = 1900 MHz, LO = 1697 MHz 0 0 1 −33.2 2 −75.0 3 <−100 4 5 6 7 N 8 9 10 11 12 13 14 15 1 −34.9 0.0 −78.5 <−100 <−100 2 −30.7 −56.6 −71.5 <−100 <−100 3 −66.0 −51.3 −85.2 −89.5 <−100 <−100 4 −77.8 −80.3 −94.8 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 Rev. 0 | Page 17 of 28 9 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 ADL5811 Table 7. RF = 2500 MHz, LO = 2297 MHz 0 0 1 −32.5 2 −91.2 3 4 5 6 7 N 8 9 10 11 12 13 14 15 1 −28.6 0.0 −82.8 <−100 2 −45.7 −53.0 −60.5 <−100 <−100 3 −52.4 −80.8 −87.7 <−100 <−100 4 5 −97.3 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 6 7 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 M 8 <−100 <−100 <−100 <−100 <−100 9 <−100 <−100 <−100 <−100 <−100 10 <−100 <−100 <−100 <−100 <−100 11 <−100 <−100 <−100 <−100 <−100 12 <−100 <−100 <−100 <−100 <−100 13 <−100 <−100 <−100 <−100 <−100 14 15 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 3.6 V Performance VS = 3.6 V, TA = 25°C, RF power = −10 dBm, LO power = 0 dBm, R1 = 800 Ω, ZO = 50 Ω, optimum SPI settings, unless otherwise noted. Table 8. RF = 900 MHz, LO = 697 MHz M 0 0 1 2 3 4 5 6 7 N 8 9 10 11 12 13 14 15 −41.0 −59.2 −90.0 <−100 <−100 <−100 1 −45.5 0.0 −54.7 −81.9 <−100 <−100 <−100 <−100 2 −35.1 −37.3 −78.2 <−100 <−100 <−100 <−100 <−100 <−100 3 −44.1 −18.9 −54.8 −73.9 <−100 <−100 <−100 <−100 <−100 4 −30.2 −54.8 −62.8 −89.6 <−100 <−100 <−100 <−100 <−100 <−100 5 −49.9 −40.4 −83.1 −79.4 <−100 <−100 <−100 <−100 <−100 <−100 <−100 6 −48.7 −62.4 −78.3 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 7 −66.6 −53.2 −96.1 −95.3 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 8 −66.5 −73.0 −79.5 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 Rev. 0 | Page 18 of 28 9 −66.8 −96.2 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 10 11 12 13 14 15 −96.2 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 ADL5811 Table 9. RF = 1900 MHz, LO = 1697 MHz M 0 0 1 −33.4 2 −68.9 3 <−100 4 5 6 7 N 8 9 10 11 12 13 14 15 1 −46.6 0.0 −77.2 <−100 <−100 2 −30.5 −57.0 −69.2 <−100 <−100 3 −78.5 −53.8 −72.8 −74.4 <−100 <−100 4 −79.5 −75.2 −94.0 <−100 <−100 <−100 5 <−100 <−100 <−100 <−100 <−100 <−100 6 <−100 <−100 <−100 <−100 <−100 <−100 7 8 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 9 <−100 <−100 <−100 <−100 <−100 <−100 <−100 10 11 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 10 11 12 <−100 <−100 <−100 <−100 <−100 <−100 13 <−100 <−100 <−100 <−100 <−100 <−100 14 15 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 14 15 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 Table 10. RF = 2500 MHz, LO = 2297 MHz M 0 0 1 −32.1 2 −89.0 3 4 5 6 7 N 8 9 10 11 12 13 14 15 1 −30.0 0.0 −78.0 <−100 2 −51.1 −53.6 −65.5 <−100 <−100 3 −51.7 −72.9 −73.5 <−100 <−100 4 5 −88.2 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 6 <−100 <−100 <−100 <−100 7 8 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 Rev. 0 | Page 19 of 28 9 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 12 <−100 <−100 <−100 <−100 <−100 13 <−100 <−100 <−100 <−100 <−100 ADL5811 CIRCUIT DESCRIPTION The ADL5811 consists of two primary components: the RF subsystem and the LO subsystem. The combination of design, process, and packaging technology allows the functions of these subsystems to be integrated into a single die, using mature packaging and interconnection technologies to provide a high performance device with excellent electrical, mechanical, and thermal properties. The wideband frequency response and flexible frequency programming simplifies the receiver design, saves on-board space, and minimizes the need for external components. The RF subsystem consists of an integrated, tunable, low loss RF balun; a double balanced, passive MOSFET mixer; a tunable sum termination network; and an IF amplifier. VPIF IFGM NC IFOP IFON NC IFGD COMM The LO subsystem consists of a multistage limiting LO amplifier. The purpose of the LO subsystem is to provide a large, fixed amplitude, balanced signal to drive the mixer independent of the level of the LO input. A block diagram of the device is shown in Figure 58. 32 31 30 29 28 27 26 25 24 NC NC 1 RFCT 2 ADL5811 NC 3 23 NC 22 NC RFIN 4 21 LOIP NC 20 LOIN 5 NC 6 19 LE SERIAL PORT INTERFACE BIAS GEN NC 7 18 DATA NC 8 10 11 12 13 14 15 16 COMM VLO3 COMM VLO2 COMM VLO1 COMM 09912-162 9 VLO4 17 CLK Figure 58. Block Diagram RF SUBSYSTEM The single-ended, 50 Ω RF input is internally transformed to a balanced signal using a tunable, low loss, unbalanced-to-balanced (balun) transformer. This transformer is made possible by an extremely low loss metal stack, which provides both excellent balance and dc isolation for the RF port. Although the port can be dc connected, it is recommended that a blocking capacitor be used to avoid running excessive dc current through the part. The RF balun can easily support an RF input frequency range of 700 MHz to 2800 MHz. This balun is tuned over the frequency range by SPI controlled switched capacitor networks at the input and output of the RF balun. The resulting balanced RF signal is applied to a passive mixer that commutates the RF input in accordance with the output of the LO subsystem. The passive mixer is essentially a balanced, low loss switch that adds minimum noise to the frequency translation. The only noise contribution from the mixer is due to the resistive loss of the switches, which is in the order of a few ohms. Because the mixer is inherently broadband and bidirectional, it is necessary to properly terminate all idler (M × N product) frequencies generated by the mixing process. Terminating the mixer avoids the generation of unwanted intermodulation products and reduces the level of unwanted signals at the input of the IF amplifier, where high peak signal levels can compromise the compression and intermodulation performance of the system. This termination is accomplished by the addition of a programmable low-pass filter network between the IF amplifier and the mixer and in the feedback elements in the IF amplifier. The IF amplifier is a balanced feedback design that simultaneously provides the desired gain, noise figure, and input impedance that is required to achieve the overall performance. The balanced open-collector output of the IF amplifier, with an impedance modified by the feedback within the amplifier, permits the output to be connected directly to a high impedance filter, a differential amplifier, or an analog-to-digital converter (ADC) input while providing optimum second-order intermodulation suppression. The differential output impedance of the IF amplifier is approximately 200 Ω. If operation in a 50 Ω system is desired, the output can be transformed to 50 Ω by using a 4:1 transformer or an LC impedance matching network. The intermodulation performance of the design is generally limited by the IF amplifier. The IP3 performance can be optimized by adjusting the low-pass filter between the mixer and the IF amplifier. Further optimization can be made by adjusting the IF current with an external resistor. Figure 42 and Figure 43 illustrate how various IF resistors affect the performance with a 5 V supply. Additionally, dc current can be saved by increasing the IF resistor. It is permissible to reduce the IF amplifier’s dc supply voltage to as low as 3.3 V, further reducing the dissipated power of the part. (Note that no performance enhancement is obtained by reducing the value of these resistors, and excessive dc power dissipation may result.) Because the mixer is bidirectional, the tuning of the RF and IF ports is linked and it is possible for the user to optimize gain, noise figure, IP3, and impedance match via the SPI. This feature permits high performance operation and is achieved entirely using SPI control. Additionally, the performance of the mixer can be improved by setting the optimum gate voltage on the passive mixer, which is also controlled by the SPI to enable optimum performance of the part. See the Applications Information section for examples of this tuning. Rev. 0 | Page 20 of 28 ADL5811 LO SUBSYSTEM The LO amplifier is designed to provide a large signal level to the mixer to obtain optimum intermodulation and compression performance. The resulting LO amplifier provides very high performance over a wide range of LO input frequencies. The ideal waveshape for switching the passive mixer is a square wave at the LO frequency to cause the mixer to switch through its resistive region (from on to off and off to on) as rapidly as possible. While it has always been possible to generate such a square wave, the amount of dc current required to generate a large amplitude square wave at high frequencies has made it impractical to create such a mixer. Novel circuitry within the ADL5811 permits the generation of a near-square wave output at frequencies of up to 2800 MHz with dc current that compares favorably with that employed by narrow-band passive mixers. The input stages of the LO amplifier provide common-mode rejection, permitting the LO input to be driven either single ended or balanced. For a single-ended input, either LOIP or LOIN can be grounded. It is desirable to dc block the LO inputs to avoid damaging the part by the accidental application of a large dc voltage to the part. In addition, the LO inputs are internally dc blocked. Because the LO amplifier is inherently wideband, the ADL5811 can be driven with either high-side or low-side LO by simply setting the optimum RF balun and LPF inputs to the SPI. The LO amplifier converts a variable level, single or balanced input signal (−6 dBm to +10 dBm) to a hard voltage limited, balanced signal internally to drive the mixer. Excellent performance can be obtained with a 0 dBm input level; however, the circuit continues to function at considerably lower levels of LO input power. The performance of this amplifier is critical in achieving a high intercept passive mixer without degrading the noise floor of the system. This is a critical requirement in an interferer rich environment, such as cellular infrastructure, where blocking interferers can limit mixer performance. Blocking dynamic range can benefit from a higher level of LO drive, which pushes the LO amplifier stages harder into compression and causes them to switch harder and to limit the small signal gain of the chain. Both of these conditions are beneficial to low noise figure under blocking. NF under blocking can be improved several decibels for LO input power levels above 0 dBm. The LO amplifier topology inherently minimizes the dc current based on the LO operating voltage and the LO operating frequency. It is permissible to reduce the LO supply voltage down as low as 3.6 V, which drops the dc current rapidly. The mixer dynamic range varies accordingly with the LO supply voltage. No external biasing resistor is required for optimizing the LO amplifier. In addition, the ADL5811 has a power-down mode that can be used with any supply voltage applied to the part. All of the SPI inputs are designed to work with any logic family that provides a Logic 0 input level of less than 0.4 V and a Logic 1 input level that exceeds 1.4 V. All pins, including the RF pins, are ESD protected and have been tested up to a level of 2000 V HBM and 1250 V CDM. Rev. 0 | Page 21 of 28 ADL5811 APPLICATIONS INFORMATION BASIC CONNECTIONS BIAS RESISTOR SELECTION The ADL5811 mixer is designed to downconvert radio frequencies (RF) primarily between 700 MHz and 2800 MHz to lower intermediate frequencies (IF) between 30 MHz and 450 MHz. Figure 59 depicts the basic connections of the mixer. It is recommended to ac couple RF and LO input ports to prevent nonzero dc voltages from damaging the RF balun or LO input circuit. A RFIN capacitor value of 22 pF is recommended. An external resistor, R1, is used to adjust the bias current of the integrated amplifier at the IF terminal. It is necessary to have a sufficient amount of current to bias both the internal IF amplifier to optimize dc current vs. optimum input IP3 performance. Figure 42 and Figure 43 provide the reference for the bias resistor selection when lower power consumption is considered at the expense of conversion gain and input IP3 performance. IF PORT VGS PROGRAMMING The mixer differential IF interface requires pull-up choke inductors to bias the open-collector outputs and to set the output match. The shunting impedance of the choke inductors used to couple dc current into the IF amplifier should be selected to provide the desired output return loss. The ADL5811 allows programmability for internal gate-to-source voltages for optimizing mixer performance over the desired frequency bands. The ADL5811 defaults the VGS setting to 0. Power conversion gain, input IP3, NF, and input P1dB can be optimized, as shown in Figure 39 and Figure 40. The real part of the output impedance is approximately 200 Ω, as seen in Figure 31, which matches many commonly used SAW filters without the need for a transformer. This results in a voltage conversion gain that is approximately 6 dB higher than the power conversion gain. When a 50 Ω output impedance is needed, use a 4:1 impedance transformer, as shown in Figure 59. C3 T1 120pF TC4-1W+ L1 470nH VCC L2 470nH C1 0.1µF IFOP R20 OPEN C5 120pF C4 120pF C2 0.1µF IFON R21 0Ω R1 910Ω C7 100pF 1 2 3 4 5 6 7 8 RFIN NC RFCT NC RFIN NC NC NC NC NC NC NC LOIP LOIN LE DATA CLK ADL5811 24 23 22 21 20 19 18 17 C17 22pF LOIP LE DATA CLK VCC 9 10 11 12 13 14 15 16 VLO4 COMM VLO3 COMM VLO2 COMM VOL1 COMM C6 22pF PAD VPIF IFGM NC IFOP IFON NC IFGD COMM PAD 32 31 30 29 28 27 26 25 C8 0.1µF C23 10pF VCC VCC VCC BLK C20 10pF VPOS C18 10pF 09912-163 AGND C19 10pF RED VCC Figure 59. Basic Connections Rev. 0 | Page 22 of 28 ADL5811 LOW-PASS FILTER PROGRAMMING RF BALUN PROGRAMMING The ADL5811 allows programmability for the low-pass filter terminating the mixer output. This filter helps to block sum term mixing products at the expense of some noise figure and gain and can significantly increase input IP3. The ADL5811 defaults the LPF setting to 0. Power conversion gain, input IP3, NF, and input P1dB can be optimized, as shown in Figure 48 to Figure 51. The ADL5811 allows programmability for the RF balun by allowing capacitance to be switched into both the input and the output, which allows the balun to be tuned to cover the entire frequency band (700 MHz to 2800 MHz). Under most circumstances, the input and output can be tuned together though sometimes it may be advantageous for matching reasons to tune them separately. The ADL5811 defaults the RFB setting to 0. Power conversion gain, input IP3, NF, and input P1dB can be optimized, as shown in Figure 44 to Figure 47. Rev. 0 | Page 23 of 28 ADL5811 REGISTER STRUCTURE The LPF bits control the low-pass filter settings at the IF output. The ability to tune the low-pass filter allows some trade-off between gain, noise figure, and input IP3 with higher settings, 7, providing higher input IP3 at the cost of some gain and noise figure, and lower settings, 0, providing higher gain and lower NF at the cost of lower input IP3. The VGS bits control the VGS settings of the mixer core and allow further tuning of the device. Figure 60 illustrates the register map of the ADL5811. The ADL5811 only uses Register 5. Because of this, set all of the control bits to 5. When set to 0, the ENBL bit, DB7, enables the part. By setting this bit to 1, the mixer is powered down. The RFB IN CAP DAC and RFB OUT CAP DAC bits are used to tune the RF balun. In most cases, they are tuned together with the higher settings, 7, tuning for the low frequencies, and with the lower settings, 0, tuning for the high frequencies. There are times where it becomes advantageous to tune the input and output of the RF balun separately and that ability is provided. RESERVED VGS LPF RFB OUT CAP DAC Table 11 lists the optimum settings characterized for each frequency band. All register bits default to 0. RFB IN CAP DAC DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 0 0 VGS2 VGS1 VGS0 LPF1 LPF0 0 CDO2 DCDO1 CDO0 0 CDI2 CDI1 CDI0 VGS2 VGS1 VGS0 0 0 0 ' ' ' 1 1 1 ENBL DB8 0 RESERVED DB7 EN DB6 0 DB5 0 DB4 0 MEN 0 1 MAIN ENABLE DEVICE ENABLED DEVICE DISABLED CONTROL BITS DB3 0 DB2 DB1 DB0 C3(1) C2(0) C1(1) VGS SETTING 0 ' 7 LPF1 LPF0 LOW PASS FILTER SETTING 0 0 0 ' ' ' 1 1 3 CDI2 CDI1 CDI0 RF BALUN INTPUT TUNING 0 0 0 0 ' ' ' ' 1 1 1 7 09912-160 CDO2 CDO1 CDO0 RF BALUN OUTPUT TUNING 0 0 0 0 ' ' ' ' 1 1 1 7 Figure 60. ADL5811 Register Maps Table 11. Optimum Settings RF Frequency (MHz) 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 LO Frequency (MHz) 497 597 697 797 897 997 1097 1197 1297 1397 1497 1597 1697 1797 1897 1997 2097 2197 2297 2397 2497 2597 VGS 3 1 2 1 3 3 3 3 3 3 3 3 3 3 3 2 3 2 3 3 1 3 LPF 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 2 2 3 2 2 2 Rev. 0 | Page 24 of 28 RFB OUT CAP DAC 7 6 6 4 7 5 5 4 4 3 3 3 2 2 1 2 2 2 1 2 2 1 RFB IN CAP DAC 7 6 6 4 7 5 5 4 4 3 3 3 2 2 1 2 2 2 1 2 2 1 ADL5811 EVALUATION BOARD The evaluation board is fabricated using Rogers® 3003 material. Table 12 details the configuration for the mixer characterization. The evaluation board software is available on www.analog.com. An evaluation board is available for the ADL5811. The standard evaluation board schematic is presented in Figure 61. The USB interface circuitry schematic is presented in Figure 64. The evaluation board layout is shown in Figure 62 and Figure 63. VCC C1 0.1µF L1 470nH C3 T1 120pF TC4-1W+ L2 470nH 3 4 2 1 6 R20 OPEN C5 120pF C4 120pF C2 0.1µF IFOP IFON R21 0Ω R1 910Ω C7 100pF 1 2 3 4 5 6 7 8 RFIN NC RFCT NC RFIN NC NC NC NC NC NC NC LOIP LOIN LE DATA CLK ADL5811 24 23 22 21 20 19 18 17 C17 22pF LOIP LE DATA CLK VCC 9 10 11 12 13 14 15 16 VLO4 COMM VLO3 COMM VLO2 COMM VOL1 COMM C6 22pF PAD VPIF IFGM NC IFOP IFON NC IFGD COMM PAD 32 31 30 29 28 27 26 25 C8 0.1µF C23 10pF VCC VCC VCC C20 10pF VPOS BLK C19 10pF 09912-060 AGND C18 10pF RED VCC Figure 61. Evaluation Board Schematic Table 12. Evaluation Board Configuration Components C1, C2, C8, C18, C19, C20, C23 C6, C7, RFIN C3, C4, C5, L1, L2, R20, R21, T1, IFOP, IFON C17, LOIP R1 Description Power supply decoupling. Nominal supply decoupling consists of a 0.1 μF capacitor to ground in parallel with a 10 pF capacitor to ground positioned as close to the device as possible. RF input interface. The input channel is ac-coupled through C6. C7 provides bypassing for the center tap of the RF input balun. IF output interface. The open-collector IF output interfaces are biased through pull-up choke inductors, L1 and L2. T1 is a 4:1 impedance transformer used to provide a single-ended IF output interface, with C5 providing center-tap bypassing. Remove R21 for balanced output operation. LO interface. C17 provides ac coupling for the LOIP local oscillator input. Bias control. R1 sets the bias point for the internal IF amplifier. Rev. 0 | Page 25 of 28 Default Conditions C1, C2 = 0.1 μF (size 0402), C8, C18, C19, C20, C23 = 10 pF (size 0402) C6 = 22 pF (size 0402), C7 = 100 pF (size 0402) C3, C4, C5 = 120 pF (size 0402), L1, L2 = 470 nH (size 0603), R20 = open, R21 = 0 Ω (size 0402), T1 = TC4-1W+ (Mini-Circuits®) C17 = 22 pF (size 0402) R1 = 910 Ω (size 0402) Figure 62. Evaluation Board Top Layer 09912-063 09912-062 ADL5811 Figure 63. Evaluation Board Bottom Layer Rev. 0 | Page 26 of 28 ADL5811 Y2 24.000000MHZ 3 1 C40 22PF 5V_USB C41 22PF CASE 2 4 DGND DGND DGND J6 C34 1 10PF C35 2 3 4 5 3V3_USB 10PF C37 DGND 4 AVCC 100K SDA R10 100K C38 0.1UF SCL 5 42 C39 0.1UF 44 14 DGND 1 2 DGND XTALIN RESET_N 33 34 35 36 37 38 39 40 PB0_FD0 PB1_FD1 PB2_FD2 PB3_FD3 PB4_FD4 PB5_FD5 PB6_FD6 PB7_FD7 PD0_FD8 PD1_FD9 PD2_FD10 PD3_FD11 PD4_FD12 PD5_FD13 PD6_FD14 PD7_FD15 18 19 20 21 22 23 24 25 45 46 47 48 49 50 51 52 WAKEUP RESERVED RDY0_SLRD RDY1_SLWR 28 26 6 GND 12 AGND 10 55 PA0_INT0_N PA1_INT1_N PA2_SLOE PA3_WU2 PA4_FIFOADR0 PA5_FIFOADR1 PA6_PKTEND PA7_FLAGD_SLCS_N 41 R9 3V3_USB P1 4 XTALOUT DPLUS 8 DMINUS 9 13 IFCLK 54 CLKOUT 29 CTL0_FLAGA CTL1_FLAGB 30 CTL2_FLAGC 31 DGND 15 16 897-43-005-00-100001 DGND U6 GND PINS VCC 1 2 3 SAMTECTSW10608GS3PIN R11 R17 0 0 R12 R18 0 0 R19 R13 0 LE DATA CLK 0 R14 1K DNI DGND C49 TBD0402 330PF DNI DGND R15 1K DNI DGND C50 TBD0402 330PF DNI DGND R16 1K DNI DGND C51 TBD0402 330PF DNI DGND DGND PAD 56 WC_N GND 24LC64-I-SN 43 0.1UF PAD 5 17 SDA 11 SCL G1 G2 G3 G4 3V3_USB 32 VCC A0 A1 A2 27 2 3 6 7 53 1 R8 2K 3 R7 2K 3V3_USB C36 DGND 0.1UF 7 U7 8 CY7C68013A-56LTXC DGND 3V3_USB 5V_USB 1 3P3V ORG 3V3_USB DNI C SML-210MTT86 D1 DGND U5 7 8 6 IN1 OUT1 IN2 OUT2 SD_N PAD PAD FB GND DECOUPLING FOR U6 C33 1.0UF R6 140K DGND C42 0.1UF 5 R5 78.7K DGND ADP3334ACPZ C32 1000PF 1 2 3 DGND 1 C43 0.1UF DGND BLK DNI DGND Figure 64. USB Interface Circuitry on the Evaluation Board Rev. 0 | Page 27 of 28 DGND C44 0.1UF C45 0.1UF C46 0.1UF C47 0.1UF C48 0.1UF 09912-161 DGND DGND A AGND C31 1.0UF R4 2K R3 0 ADL5811 OUTLINE DIMENSIONS 5.10 5.00 SQ 4.90 1 0.50 BSC 3.45 3.30 SQ 3.15 EXPOSED PAD 17 TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 8 16 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE PIN 1 INDICATOR 32 25 24 9 BOTTOM VIEW 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 033009-A PIN 1 INDICATOR 0.30 0.25 0.18 Figure 65. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad (CP-32-13) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5811ACPZ-R7 ADL5811-EVALZ 1 Temperature Range −40°C to +85°C Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Evaluation Board Z = RoHS Compliant Part. ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09912-0-7/11(0) Rev. 0 | Page 28 of 28 Package Option CP-32-13 Quantity 1500