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How To Apply Atmel Adcs And Dmux Devices For Best Results

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ADC and DMUX TS830500, TS8388B, TS83102G0B ADCs and TS81102G0 DMUX Application Note Applying e2v ADC and DMUX 1. Introduction This document aims at presenting relevant information needed to properly apply the e2v ADCs and DMUX. It describes the different configurations the product can be set at for best performance results. An important benefit is the full compatibility of the e2v ADCs and DMUX devices and their evaluation boards. In particular, this document offers some tips to help the users apply our products in a very user-friendly way. TSEV81102G0TPZR3 DMUX and TSEV83102G0BGL ADC Evaluation Boards Visit our website: www.e2v.com for the latest version of the datasheet e2v semiconductors SAS 2009 0993B–BDC–04/09 ADC and DMUX 2. ADC and DMUX Connection 2.1 ADC and DMUX Level Compatibility The TS8308500 8-bit 500 Msps ADC, TS8388B 8-bit 1 Gsps ADC and TS83102G0B 10-bit 2 Gsps ADC data outputs are ECL/LVDS compatible. As the DMUX can only accept ECL levels at its inputs, the ADCs have to be set in ECL output mode (VPLUSD to ground for the TS8308500 and TS8388B devices and at –0.8V for the TS83102G0B). In the particular case of the TS83102G0B device (10-bit 2 Gsps ADC), VPLUSD can be connected to ground and still make the output levels of the ADC compatible with the input level requirements from the DMUX. 2.2 DMUX Settings If connecting to one of the TS83xxx e2v ADCs, the DMUX has to be set in DR/2 clock mode (the Data Ready signal frequency out of the ADC is half the sampling frequency and thus half the data rate). The other settings on the DMUX depend on the required speed ratio and resolution: • NBBIT: set to 0 for 8 bits and 1 for 10 bits • RATIOSEL: set to 0 for 1:4 ratio and 1 for 1:8 ratio Note: 2.3 The DMUX output buffers are limited to 250 Msps. The choice of the speed ratio has to be made according to the required data rate out of the DMUX but also to this 250 Msps limitation. ADC and DMUX Interfacing Because the DMUX input buffers are already on-chip differentially 2 x 50Ω terminated, it is not necessary to add any termination resistor between the ADC and DMUX. Consequently, the ADC outputs can be directly sent to the DMUX (direct traces) as illustrated in Figure 2-1 and Figure 2-2. Figure 2-1. TS8388B 8-bit 1 Gsps ADC and DMUX Interfacing VPLUSD DMUX Input Buffer 75 Ω 75 Ω DATA IN 50 Ω Impedance Line - 50 Ω + 10 pF 50 Ω Impedance Line 50 Ω DATA INB 11 mA DVEE ADC Output Buffer ECL Differential DMUX Input Buffer 2 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX Figure 2-2. TS83102G0B 10-bit 2 Gsps ADC and DMUX Interfacing VPLUSD DMUX Input Buffer 50 Ω 50 Ω DATA IN 50 Ω Impedance Line 50 Ω + - 10 pF 50 Ω Impedance Line 50 Ω DATA INB 10.5 mA DVEE ECL Differential DMUX Input Buffer ADC Output Buffer Note: When connecting the ADC and DMUX evaluation boards, it is recommended to remove the extra 50 Ω termination resistors on the ADC board since the DMUX is already terminated. This does not apply for ADC boards with digital receivers, in which case the termination resistors are required for the digital receivers. 3. ADC and DMUX Mono-channel Application Figure 3-1. ADC and DMUX Mono-channel Application Clock enable D Q CP Fs Master clock 8 8 8 Clk Data Signal 8 8 8 DMUX ADC ASIC 8 DR Rst 8 delay 8 Rst Clk Asynchronous reset 3 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 3.1 Aim To constitute an acquisition channel with a high speed ADC, a DMUX and an ASIC. The high speed ADC may be one of e2v family: TS8308500, TS8388B, TS83102G0B. The DMUX is designed to slow down the output data frequency from the ADC, in order to allow the following ASIC to process calculations of this data at acceptable rates. The whole system consisting of the ADC and the DMUX can be controlled via the asynchronous reset of the DMUX. This asynchronous reset is needed to start the DMUX and consequently can be used as the trigger for an acquisition. Note: The Data Ready Reset DRRB of the ADC is not necessary for proper operation of the device. The DMUX input clock phase can be adjusted with an adjustable delay of ±250 ps to ensure an adequate phase between clock and data inside the DMUX due to the DMUXDelAdjCtrl function of the DMUX device. 4. ADC and DMUX Interleaving Applications For several applications (multi-channel, multiplication of sampling frequency, multiplication of speed ratio), it is necessary to interleave 2 (or more) ADC and DMUX couples. In these cases, it is essential to align with more than 1 ps accuracy the internal sampling instant of the ADCs for correct HF performances. In the case of the TS8388B ADC, a stand-alone delay adjustment (±250 ps) is available in the DMUX (ADC Delay Adjust). When the TS83102G0 ADC is used, the internal sampling instant can be fine-tuned by the Sampling Delay adjust function of the ADC. In this case, it is not necessary to use the ADC delay adjust function in the DMUX. 4 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 4.1 Multi-channel Application Figure 4-1. ADC and DMUX Multi-channel Application Clock enable D Low Skew Q CP Master clock Fs 8 8 delay Clk Data Signal 1 8 8 DMUX ADC 8 8 ASIC 8 DR 8 delay Rst 8 ARst Clk Async. Rst 8 8 delay Clk Data Signal 2 8 8 8 DMUX ADC 8 ASIC 8 DR Rst 8 delay 8 ARst Clk 4.2 Aim To constitute multiple acquisition channels composed of a high speed ADC, a DMUX and an ASIC. The state of each DMUX and each ADC is controlled with the asynchronous reset: the reset pulse is sent to all the devices. For each channel, the DMUX input clock phase can be adjusted with an adjustable delay of ±250 ps to ensure an adequate phase between clock and data inside the DMUX thanks to the DMUX Delay Adjust function. Note: It is recommended to use the synchronous reset of the DMUX to ensure good synchronization of both channels. How to align the internal sampling instant of the ADCs: 1. Connect all the ADCs inputs (Refer to Figure 4-1 on page 5, Signal 1 = Signal 2). 2. Generate a signal on the ADCs inputs. 3. Check the ADC or DMUX outputs with an acquisition system. 4. Tune the delay adjust until the codes on the outputs are exactly the same for all the channels. 5 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 4.3 Multiplication of Sampling Frequency Figure 4-2. Multiplication of Sampling Frequency Clock enable D Low Skew Q CP Master clock Fs 8 8 Offset control delay Clk Data 8 + 8 DMUX1 ADC1 8 8 ASIC 8 DR 8 delay Rst 8 Rst Clk Async. Rst 8 Analog signal 8 GND delay Clk Data + 8 8 8 DMUX2 ADC2 8 ASIC 8 DR Rst 8 delay 8 Rst Clk 4.4 Aim To multiply artificially the sampling frequency of 1 acquisition channel by using several ADC and DMUX couples. The state of each DMUX and each ADC is controlled with the asynchronous reset: the reset pulse is sent to all the devices. For each couple, the DMUX input clock phase can be adjusted with an adjustable delay of ±250 ps to ensure a good phase between clock and data inside the DMUX (DMUX Delay Adjust). In this application, it is very important to align the internal sampling of the ADCs for proper operation of the interleaving scheme. 6 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX Figure 4-3. Timing Diagram D4 D3 D5 D6 D2 D7 D2 D1 Analog input signal D8 ADC1 clock ADC2 clock ADC1 D1 D3 ADC2 Data available on DMUX1 and DMUX2 inputs Note: D5 D4 D2 D1 D2 D7 D3 D4 D6 D5 D6 D8 D7 D8 These timing diagrams do not take into account the different propagation delays in the ADCs (pipeline delays for example). In this application, the data available on the DMUX inputs are as if the sampling frequency was 2 x Fs instead of Fs. Practically, it is recommended to limit the number of channels for such an application to 4, so that the sampling frequency can be 4 x Fs. The shaded gray in Figure 4-3 is an example of bad alignment of the sampling of the ADCs. It is obvious that the data D2 will be different from the data expected in the case of sampling frequency of 2 x Fs. How to align the internal sampling instant of the ADCs: 1. Provide the Master Clock with a low frequency signal (typically 100 Msps). 2. Connect the ADCs positive input to a common analog sinewave signal of frequency twice the frequency of the Master Clock (typically 50 MHz). 3. Tune the sampling instant of one of the two ADCs until the codes at the two ADCs outputs are the same. 7 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 5. 1:16 Conversion Ratio This 1:16 conversion ratio is achieved using two DMUXs in parallel. 5.1 Multi-channel Application Figure 5-1. 1:16 Conversion Ratio 8 8 8 8 Data 8 ADC Clkln1 Signal 8 DR/2 Divide by N 8 8 8 delay 8 SyncRst DR1 Clk FS DMUX1 Delay Adjust SyncReset Clkln2 DR2 SyncRst 8 8 8 8 delay 8 8 DMUX2 8 8 8 5.2 Aim To reduce the data speed out of the ADC and DMUX couple from Fs/8 to Fs/16. To obtain 1:16 ratio, the ADC must provide a DR/2 clock, and each DMUX is configured to work in DR mode. The DR/2 is wired to the clock input of each DMUX (Clkln1 and Clkln2), so that they work in opposite phase. Thus, odd data is read by the first DMUX on the rising edge of Clkln1, and even data is read by the second DMUX on the rising edge of Clkln2. To ensure a good synchronization between the two DMUXes, it is advised to start both boards at the beginning by performing an asynchronous reset on both the DMUXes and then to send a common synchronous reset to the two boards simultaneously (if the synchronous reset is to be used as a singleended signal, it is recommended to leave the negative synchronous reset signal floating). 8 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX As implied by Figure 5-1 on page 8, there is no need to use the DRRB reset from the e2v ADC. As a matter of fact, the DRRB reset signal from the ADC is not mandatory when the e2v ADCs are used with the e2v DMUX, since the state of the ADC and DMUX system can be controlled thanks to the DMUX asynchronous reset. Figure 5-2. Timing Diagram FS ADC DR/2 ClkIn1 ClkIn2 ADC output data N N+1 N+2 DR1 N+3 N+4 N+5 N+6 N+7 N+8 N+9 Half-Clock period DR2 6. ADC and DMUX Power Up Sequence The power up sequence for the ADC and DMUX system is described hereafter: 1. Supply VEE = –5V 2. Supply VCC = +5V 3. Supply VPLUSD if needed 4. Supply VTT if needed 5. Apply the clock and the analog inputs on the ADC 6. Perform an Asynchronous reset on the DMUX The first four steps of this sequence are not critical but it is recommended not to have the +5V supply on while the –5V is off for too long a time. On the other hand, the last two steps are mandatory in the specified order (do not apply the clock and analog input signals to the ADC while the supplies are Off). The Asynchronous Reset of the DMUX is then required to start the DMUX device. 9 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 7. PCB Ground Planes Concerning the ground planes on ADC and DMUX boards, we recommend the configuration used in our ADC and DMUX evaluation boards (TSEV8388, TSEV83102G0 and TSEV81102G0) as being the same ground plane for both analog and digital parts. You will find in the datasheets: • The board layers characteristics on Board Layers Thickness Profile for all the evaluation boards • The board metal layers schematics on Electrical Schematics of TSEV83102G0 • The board metal layers schematics on Electrical Schematics of TSEV8388 • The board metal layers schematics Evaluation Board Schematics of TSEV81102G0 7.1 ADC Boards The ADC boards are constituted of several ground planes, some of which are identical and were duplicated for board rigidity. We can consider that there is one main ground plane, being both an analog ground plane and digital ground plane. One common plane is used for both analog and digital grounds: • The ADC digital output buffers are differential buffers so there is no significant transient current in the power planes, even if several buffers switch at the same time. • The other parasitics which may perturb the ground plane are due to the poor adaptation of the digital output buffers. This may cause reflections and perturb the digital ground plane. But this situation can not ensure a correct transmission of the output signals. If the digital output signals are perturbed, the load acquisition will be ineffective. With a good adaptation of the output buffers, this can be avoided. Consequently, because of the use of well-adapted differential output buffers, the choice was made to merge the analog and digital ground planes. 7.2 DMUX Boards There is one reference plane (divided in V+D and GND planes) and there is one power supply plane. V+D and ground planes are separated because: • The DMUX digital output buffers are single ended buffers and consequently, when several output buffers switch simultaneously, large transients can be created in the V+D plane. As V+D and ground planes are separated, V+D plane does not corrupt significantly the ground plane. • V+D and ground planes are on the same layer and not stacked, that allows to avoid the corruption of the ground plane by V+D plane through the coupling capacitances. • As for the ADC board, there are also the issues of bad adaptations on the load which can corrupt the V+D plane. Moreover this involves a bad quality of the signals for the load acquisition. In the case of ECL output mode, V+D is connected to the ground by one wire, which allows the current to flow (see Figure 7-1 on page 11). Moreover this imposes on the perturbation to cover a big distance (several centimeters) before reaching the ground plane. As the planes have a very low impedance, the perturbation is quickly dissipated. Note: VPLUSD power supply has to be decoupled to VEE and not to ground. Finally, Figure 7-1 represents the ADC and DMUX boards, which can work at a frequency of up to 2 GHz (providing a good matching of the DMUX load). 10 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX Figure 7-1. ADC and DMUX Boards Schematic GROUND PLANE ADC BOARD ADC CHIP Connections between both boards Wire in case of ECL output mode Perturbation arriving on ground plane GROUND PLANE DMUX CHIP Perturbation created on V+D plane V+D PLANE DMUX BOARD 11 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 8. ADC and DMUX Board Layout Recommendations 8.1 Board’s Layer Profile It is recommended to use HTG dielectric layers because of their very good high frequency performances. The number of layers can be calculated as follows: (1 copper layer + 1 reference plane + 2 dielectric layers) x Number of signals to be separated (min = 3). 8.2 I/O Transmission Lines For proper matching and transmission of high frequency signals, 50 Ω microstrip lines should be used. Particular care should be taken with regards to the line length of similar signals: it should be the same with less than 2 mm accuracy for high-speed signals. 8.3 Power Supplies For proper operation of the device and good shielding versus noise, it is recommended to uncouple the power supplies of the ADC and DMUX at the 10 nF and 100 pF SMC capacitors in parallel (to be superimposed on one another). In the case of the DMUX, at least 30 x (10 nF + 100 pF) capacitors are necessary for all the power supplies. Note: 39 x (10 nF + 100 pF) capacitors are used on the evaluation board. When all 80 output data of the DMUX are to be used, it may be necessary to extra decouple the VTT power supply thanks to 4 additional 1 µF tantalum capacitors and 1 additional 15 µF capacitor. In the case of the TS8388B 8-bit 1 Gsps ADC, at least 11 x (10 nF + 100 pF) decoupling capacitors are necessary. Note: 24 x 10 nF + 16 x 100 pF capacitors are used on the evaluation board. 12 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 9. Appendix Appendix 1: TS81102G0 DMUX, TS8388B ADS and TS83102G0B ADC Block Diagrams TS81102G0 DMUX Block Diagram RatioSel FS/8 ADCDelAdjIn ADCDelAdjCtrl ClkIn ClkInType DEMUXDelAdjCtrl Clock Path NbBit I[0..7/9] BIST SwiAdj VplusDOut VCC GND VEE DIODE Data Path RatioSel Figure 9-1. SyncReset AsyncReset 9.1 delay delay NAP B2 mux BIST 8/10 mux Phase control 8/10 RstGen ClkPar odd master latch even slave latch odd slave latch Counter (8 stage shift register) 8 Counter Status Latch Sel Even/Odd [1..8/10] 8 even master latch Reset FS/8 Port Selection Clock 8 8 1 Even Ports Odd Ports DataReady generation DR/DR ADCDelAdjOut A[0..7/9] RefA C[0..7/9] RefC E[0..7/9] RefE G[0..7/9] RefG B[0..7/9] RefB D[0..7/9] RefD F[0..7/9] RefF H[0..7/9] RefH 3 8/10 Data Output Clock 13 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX Figure 9-2. TS8388B ADC Block Diagram Gain Master/Slave Track and Hold Amplifier VIN, VINB G=2 T/H G=1 T/H Analog Encoding Block Resistor Chain G=1 4 Interpolation Stages 5 4 Regeneration Latches 5 4 CLK, CLKB Error Correction and Decode Logic Clock Buffer 8 Output Latches and Buffers 8 GORB DRRB DR, DRB Figure 9-3. TS83102G0B ADC Block Diagram PGEB Sample and Hold VINB Master 50 50 2 B/BG OR ORB D9 D9B Slave 1 1 Analog Quantizer VIN DATA, DATAB OR, ORB Logic Block D0 DR0B DR DRB GA CLK CLKB 50 50 Clock Generation SDA DRRB 14 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 9.2 Appendix 2: Internal Timing Diagram 9.2.1 DMUX Timing Diagram This diagram corresponds to an established operation of the DMUX with Synchronous Reset. Figure 9-4. DMUX Timing Diagram 500 ps min Data In N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 N+9 N+10 N+11 N+12 N+13 N+14 N+15 N+16 N+17 N+18 N+19 N+20 N+21 N+22 N+23 N+24 N+25 N+26 N+27 N+28 N+29 N+30 N+31 DR In = Fs DR/2 In = Fs/2 = ClkPar Master Even Latch Master Odd Latch Slave Even Latch Slave Odd Latch N N+2 N+1 N+4 N+3 N N+5 N+2 N+1 N+6 N+7 N+4 N+3 N+8 N+9 N+6 N+5 N+10 N+11 N+8 N+7 N+12 N+13 N+10 N+9 N+14 N+15 N+12 N+11 N+16 N+17 N+14 N+13 N+18 N+19 N+16 N+15 N+20 N+21 N+18 N+17 N+22 N+23 N+20 N+19 N+24 N+25 N+22 N+21 N+26 N+27 N+24 N+23 N+28 N+31 N+29 N+26 N+25 N+30 N+30 N+28 N+27 N+29 Synchronous reset = Fs/8 Internal reset pulse Port Select A Port Select B Port Select C Port Select D Port Select E Port Select F Port Select G Port Select H Latch Select A Latch Select B Latch Select C Latch Select D Latch Select E Latch Select F Latch Select G Latch Select H N N+8 N+1 N+16 N+9 N+2 N+17 N+10 N+3 N+27 N+20 N+13 N+6 N+26 N+19 N+12 N+5 N+25 N+18 N+11 N+4 N+24 N+21 N+14 N+22 N+7 N+15 N+23 N to N+7 N+8 to N+15 N+16 to N+23 A to H Port Out A to H LatchOut DROut 15 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 9.2.2 ADCs Timing Diagrams The timing diagrams for the TS8388B and TS83102G0 ADCs are similar. Care should only be taken regarding the values of the specified timings (refer to the corresponding device datasheet for more details). Figure 9-5. Timing Diagram: Data Ready Reset, Clock Held at LOW Level TA = 250 ps TBC X (VIN, VINB) X X N+1 N N-1 X N+2 X N+3 X N+5 X N+4 TC = 1000 ps TC1 TC2 (CLK, CLKB) DIGITAL OUTPUTS TOD = 1360 ps TPD: 4.0 Clock periods 1360 ps DATA N-5 1000 ps DATA N-4 DATA N-3 DATA N-2 DATA N-1 DATA N+1 TD1 = TC1 + TDR - TOD = TC1 - 40 ps = 460 ps TDR = 1320 ps TDR = 1320 ps DATA N Data Ready (DR, DRB) TD2 = TC2 + TOD - TDR = TC2 + 40 ps = 540 ps TRDR = 720 ps DRRB 1 ns (min) Figure 9-6. Timing Diagram: Data Ready Reset, Clock Held at HIGH Level TA = 250 ps TBC X (VIN, VINB) N XN-1 N+1 X X X X X N+5 N+4 N+2 TC = 1000 ps TC1 TC2 (CLK, CLKB) DIGITAL OUTPUTS TOD = 1360 ps TPD: 4.0 Clock periods 1360 ps DATA N-5 1000 ps DATA N-4 TDR = 1320 ps TDR = 1320 ps DATA N-3 DATA N-2 DATA N-1 DATA N DATA N+1 TD1 = TC1 + TDR - TOD = TC1 - 40 ps = 460 ps Data Ready (DR, DRB) TRDR = 720 ps TD2 = TC2 + TOD - TDR = TC2 + 40 ps = 540 ps DRRB 1 ns (min) 16 0993B–BDC–04/09 e2v semiconductors SAS 2009 ADC and DMUX 9.3 Appendix 3: ADC and DMUX Test Bench Figure 9-7. Example of ADC and DMUX Test Bench TSEV8388BG or TSEV83102G0 Evaluation Board Input Signal Generator ADC TSEV81102G0 Evaluation Board DMUX Filter Synchronization Acquisition System Clock Signal Generator Digital Acquisition LabView - Histogram - FFT - Reconstructed signal - ENOB, SFDR, INL, DNL, ... Scientific Computer 17 0993B–BDC–04/09 e2v semiconductors SAS 2009 How to reach us Home page: www.e2v.com Sales offices: Europe Regional sales office Americas e2v ltd e2v inc 106 Waterhouse Lane 520 White Plains Road Chelmsford Essex CM1 2QU Suite 450 Tarrytown, NY 10591 England USA Tel: +44 (0)1245 493493 Tel: +1 (914) 592 6050 or 1-800-342-5338, Fax: +44 (0)1245 492492 Fax: +1 (914) 592-5148 mailto: [email protected] mailto: [email protected] e2v sas Asia Pacific 16 Burospace e2v ltd F-91572 Bièvres Cedex 11/F., France Onfem Tower, Tel: +33 (0) 16019 5500 29 Wyndham Street, Fax: +33 (0) 16019 5529 Central, Hong Kong mailto: [email protected] Tel: +852 3679 364 8/9 Fax: +852 3583 1084 e2v gmbh mailto: [email protected] Industriestraße 29 82194 Gröbenzell Germany Tel: +49 (0) 8142 41057-0 Fax: +49 (0) 8142 284547 mailto: [email protected] Product Contact: e2v Avenue de Rochepleine BP 123 - 38521 Saint-Egrève Cedex France Tel: +33 (0)4 76 58 30 00 Hotline: mailto: [email protected] Whilst e2v has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for the consequences of any use thereof and also reserves the right to change the specification of goods without notice. e2v accepts no liability beyond that set out in its standard conditions of sale in respect of infringement of third party patents arising from the use of tubes or other devices in accordance with information contained herein. e2v semiconductors SAS 2009 0993B–BDC–04/09