Hp Proliant Dl980 G7 Server Maintenance And Service Guide

Transcript

HP ProLiant DL980 G7 Server Maintenance and Service Guide Abstract This document describes service procedures for the HP ProLiant DL980 G7 Server. This document is intended for experienced service technicians. HP assumes that you are qualified in the servicing of computer equipment, are trained in recognizing hazards in products with hazardous energy levels, and are familiar with weight and stability precautions for rack installations. HP Part Number: AM426-9001H Published: May 2013 Edition: 8 © Copyright 2010, 2013 Hewlett-Packard Development Company, L.P. Notices The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Windows® and Windows Server® are U.S. registered trademarks of Microsoft Corporation. Intel® and Xeon® are trademarks of Intel Corporation in the United States and other countries. Contents 1 Illustrated parts catalog...............................................................................5 Mechanical Components...........................................................................................................5 System components...................................................................................................................9 2 Removal and replacement procedures.........................................................21 Required tools........................................................................................................................21 Safety considerations..............................................................................................................21 Preventing electrostatic discharge.........................................................................................21 Server warnings and cautions..............................................................................................21 Power off the server.................................................................................................................22 SAS hard drive blank..............................................................................................................22 SAS/SATA hard drive..............................................................................................................22 DVD-ROM drive......................................................................................................................23 Power supply blank.................................................................................................................23 Hot-plug power supply............................................................................................................24 Fans.....................................................................................................................................25 Upper fans........................................................................................................................25 Lower fan module..............................................................................................................25 Remove the upper or lower processor memory drawer or processor memory drawer blank...............26 Remove a processor memory drawer cover................................................................................27 Memory cartridge...................................................................................................................27 DIMMs..................................................................................................................................30 Memory options................................................................................................................32 DIMM support...................................................................................................................34 Single-, dual-, and quad-rank DIMMs...................................................................................34 DIMM identification...........................................................................................................35 DIMM installation guidelines...............................................................................................35 Memory cartridge population guidelines...............................................................................36 Memory subsystem architecture............................................................................................36 Hemisphere mode..............................................................................................................37 Memory performance optimization.......................................................................................38 Memory RAS.....................................................................................................................38 Advanced ECC memory population guidelines......................................................................39 Online Spare memory population guidelines.........................................................................39 Mirrored Memory population guidelines...............................................................................40 Heatsink................................................................................................................................42 Processor...............................................................................................................................44 Expansion slot cover...............................................................................................................49 Low profile I/O expander........................................................................................................50 Non-hot-plug expansion board.................................................................................................52 Battery-backed write cache procedures......................................................................................53 Removing the BBWC cache module......................................................................................53 Removing the BBWC battery pack........................................................................................54 BBWC low profile I/O expander location.............................................................................55 Recovering data from the battery-backed write cache..............................................................55 Remove the SPI board.............................................................................................................56 Systems Insight Display assembly..............................................................................................57 Front bezel.............................................................................................................................58 Solid state drive......................................................................................................................59 Battery..................................................................................................................................60 I/O expansion board..............................................................................................................61 Expansion board options....................................................................................................63 Contents 3 SAS backplane......................................................................................................................67 XNC module..........................................................................................................................67 System board.........................................................................................................................68 Re-entering the server serial number and product ID...............................................................70 Power backplane....................................................................................................................70 HP Trusted Platform Module.....................................................................................................72 3 Upgrading a 4s configuration to an 8s configuration....................................74 4 Flashing firmware.....................................................................................75 Flashing firmware requirements.................................................................................................75 Flashing firmware using Offline Update.....................................................................................76 Flashing firmware using Smart Components...............................................................................77 Procedure for Windows and Linux operating systems..............................................................77 Procedure for Solaris and VMware operating systems.............................................................82 5 Component identification...........................................................................83 Front panel components...........................................................................................................83 Front panel LEDs.....................................................................................................................84 System Insight Display LEDs......................................................................................................85 Processor and memory board configuration / logical (physical) location...................................87 Hard drive LEDs.....................................................................................................................87 Hard drive LED combinations...................................................................................................87 Rear panel components...........................................................................................................88 Rear panel LEDs.....................................................................................................................90 Power supply LED...................................................................................................................91 Fan location...........................................................................................................................92 System board components.......................................................................................................94 System maintenance switch.................................................................................................95 SPI board components.............................................................................................................96 Expansion board components..................................................................................................96 DIMM slot locations................................................................................................................98 Device numbers......................................................................................................................99 Battery pack LEDs...................................................................................................................99 6 Cabling................................................................................................102 XNC cabling.......................................................................................................................102 DVD-ROM drive cabling........................................................................................................103 7 Specifications.........................................................................................104 Environmental Specifications..................................................................................................104 Server Specifications.............................................................................................................105 8 Acronyms and abbreviations....................................................................107 9 Documentation feedback.........................................................................109 Index.......................................................................................................110 4 Contents 1 Illustrated parts catalog Mechanical Components NOTE: The list of part numbers is current and correct as of the publication of the document. Part numbers change often. Check the HP Partsurfer website (http://partsurfer.hp.com/search.aspx), to ensure you have the latest part numbers associated with this product. Item Description Spare part number Customer self repair 1 Access panel AM426-69016 Mandatory1 2 Processor memory drawer top AM426-69002 Mandatory1 — Bezel - Upper processor-memory drawer, frontal access AM426-69019 Mandatory1 3 Blank, hard drive 392613-001 Mandatory1 4 Bezel assembly, power, SID 591209-001 Mandatory1 5 Bezel - Frontal section of processor-memory drawer AM426-69021 Mandatory1 6 Processor memory drawer bottom AM426-69018 Mandatory1 Not shown Blank, lower processor memory drawer AM426-69008 Mandatory1 Mechanical Components 5 Item Description Spare part number Customer self repair — Bezel - Lower processor-memory drawer, frontal access AM426-69020 Mandatory1 7 Tool, T-15 Torx screwdriver 199630-001 Mandatory1 8 Blank, power supply 496058-001 Mandatory1 Not shown Plastics Kit AM426-69014 Mandatory1 Not shown Hardware kit - contains a 496058-001 heatsink blank, optical device blank, fan blank, full-length expansion slot cover, low-profile expansion slot cover, PCI retainer, PCI top retainer, PCI end retainer, and PCI removable retainer Mandatory1 Not shown Bezel kit - Miscellaneous parts included AM426-69022 Mandatory1 Not shown 3-8 U Slide rail kit AM426-2104A Mandatory1 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. — 1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'oeuvre du service vous seront facturés. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. — 1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. 6 Illustrated parts catalog 3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. — 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. — 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. — 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". — 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado. Mechanical Components 7 8 Illustrated parts catalog System components NOTE: The list of part numbers is current and correct as of the publication of the document. Part numbers change often. Check the HP Partsurfer website (http://partsurfer.hp.com/search.aspx), to ensure you have the latest part numbers associated with this product. Item Description Spare part number Customer self repair 1 PCI-X/PCI Express I/O expansion board 591204-001 Mandatory1 PCI Express I/O expansion board 591205-001 3 System board AM426-69015 Optional2 4 SPI board — — — HP ProLiant DL980 NC375i AM426-69017 SPI Board Mandatory1 — HP ProLiant DL980 331i SPI Board AM451-69002 Mandatory1 5 Memory module 591198-001 Optional2 6 Heatsink assembly 591207-001 Optional2 7 Memory — — 2 588139-B21 Mandatory1 588137-B21 System components 9 10 Item Description Spare part number Customer self repair — 2 GB (128 MBx8), 133 PC3-10600R, DDR3 DIMM memory module 501533-001 Mandatory1 — 4 GB (256MBx4), 133 501534-001 MHz, PC3-10600R, DDR3 DIMM memory module1Rx4 Mandatory1 — 4 GB, PC3-10600R, DDR3-1333, single-rank memory module 595424-001 Mandatory1 — 4 GB PC3L 10600R 606426-001 DDR3-1333 memory module Mandatory1 — 8 GB PC3-10600R-DDR3-133 MHz RDIMM 501536-001 Mandatory1 — 8GB PC3L 10600R 606427-001 DDR3-1333 memory module Mandatory1 — 16 GB DDR3-106, 501538-001 PC3-8500R memory module (512 MBx4) Mandatory1 — 16GB (1x16GB) memory DIMM - Dual rank x4, PC3L-10600, DDR3-1333, Registered CAS-9 LP 632204-001 Mandatory1 — 32GB memory DIMM 32GB 632205-001 4RX4 PC3L-8500R-9A Mandatory1 8 Processors — — Intel Xeon e7520 4 core 597821-001 processor, 1.86 GHz [1 GB Level-2 cache (256 KB per core), LGA 1567 socket, 95 W TDP] Mandatory1 — Intel Xeon E6540 6 core 594899-001 processor, 2.00 GHz [1.5 GB Level-2 cache (256 KB per core), LGA 1567 socket, 105 W TDP] Mandatory1 — Intel Xeon X6550 8 core 594896-001 processor, 2.00 GHz [2 GB Level-2 cache (256 KB per core), LGA 1567 socket, 130 W TDP] Mandatory1 — Intel Xeon X7500 8 core 594893-001 processor, 2.27 GHz [2 GB Level-2 cache (256 KB per core), LGA 1567 socket, 130W TDP] Mandatory1 — HP DL980 6 Core E7-4807 1.86 processor kit 653055-001 Mandatory1 — HP DL980 10 Core E7-2850 650016-001 2.0 processor kit Mandatory1 — Intel Xeon E7-2830 4-processor kit, 2.13GHz Mandatory1 Illustrated parts catalog — 650017-001 Item Description Spare part number Customer self repair (24MB Level-2 cache, 6.40GT/s) — HP DL980 10 Core E7-2860 650015-001 2.26 processor kit Mandatory1 — HP DL980 10 Core E7-4870 653050-001 2.4 processor kit Mandatory1 Not shown Thermal grease kit 395532-001 Optional2 9 Power backplane AM426-69001 No3 11 Memory cartridge — — — Memory cartridge for Intel Xeon 7500/6500 Series processor 591198-001 Optional2 — Memory cartridge for Intel Xeon E7 Family processor: HP DL980 647058-001 Optional2 13 SAS backplane 591203-001 Optional2 14 Systems Insight Display assembly AM426-69003 Optional2 15 SFF hot-plug drives (not shown) — — — a) 72-GB, 6G SAS, 15,000-rpm, 6.35-cm (2.5-in) 512743-001B21 Mandatory1 — b) 146-GB, 6G SAS, 15,000-rpm, 6.35-cm (2.5-in) 512744-001 Mandatory1 — c) 300 GB, 6G SAS, 10,000-rpm 6.35-cm: DL980 (2.5-in) 507284-001 Mandatory1 — d) 450 GB, 6G SAS, 10,000 rpm 6.35 cm (2.5 in) 581284-B21 Mandatory1 — e) 600 GB, 6G SAS, 10,000 rpm 6.35 cm (2.5 in) 581286-B21 Mandatory1 — f) 900 GB, 6G SAS, 10,000 619291-B21 rpm 6.35 cm (2.5 in) Mandatory1 — HP 300 GB SAS 10K SFF 507127-B21 (2.5 in.) dual port enterprise hard drive Mandatory1 — HP 72 GB SAS 15K SFF 512545-B21 (2.5 in.) dual port enterprise hard drive Mandatory1 — HP 146 GB SAS 15K SFF 512547-B21 (2.5 in.) dual port enterprise hard drive Mandatory1 Not shown Solid state drives — — System components 11 Item Description Spare part number Customer self repair — a) 60 GB 3G SATA, 6.35 cm (2.5 in), MDL SSD 572071-B21 Mandatory1 — b) 120 GB, 3G SATA, 6.35 572073-B21 cm (2.5 in) MDL SSD Mandatory1 — c) 200 GB, SAS, 6.35 cm (2.5 in) SSD SLC drive 632492-B21 Mandatory1 — e) 400 GB, SAS, 6.35 cm (2.5 in) SSD SLC drive 632494-B21 Mandatory1 Not shown Media drives — — — a) SATA DVD-ROM drive 481428-001 Mandatory1 481041-B21 — b) SATA DVD RW drive 481429-001 Mandatory1 481043-B21 12 16 Fan, lower module AM426-69013 Mandatory1 17 Small form factor PCI Express I/O expansion module AM426-69012 Mandatory1 18 XNC module AM426-69009 Mandatory1 19 Power supply PHB - 1200W, 579229-001 12V, 1U form factor, hot-pluggable, redundant, high-efficiency Mandatory1 Not shown HP 1200W CS Platinum Power Supply Kit 578322-B21 Mandatory1 Not shown I/O — — — SCSI U320e host bus adapter (HBA), dual channel, PCIe, with low voltage differential (LVD) 593120-001 Mandatory1 — Host channel adapter - IB 4x 593412-001 quad data rate (QDR) CX-2 PCIe dual port host channel adapter Mandatory1 — HP SC08Ge HBA 488765-B21 Mandatory1 — HP NC112T PCIe Gigabit Server Adapter 503746-B21 Mandatory1 — HP NC360T PCIe Dual Port 1Gb Server Adapter 412648-B21 Mandatory1 — HP NC365T 4-port Ethernet 593722-B21 Server Adapter Mandatory1 — HP NC373F PCIe Mfn 1GbE 394793-B21 Server Adapter Mandatory1 — HP NC373T PCIe Mfn 1GbE 394791-B21 Server Adapter Mandatory1 — HP NC375T PCIe 4Prt Gigabit Server Adapter Mandatory1 Illustrated parts catalog 538696-B21 Item Description Spare part number Customer self repair — HP NC382T PCIe Dual-Port Multifunction Gb Server Adapter 458492-B21 Mandatory1 — HP NC523SFP 10Gb 2P Adapter 593717-B21 Mandatory1 — HP NC524SFP Dual Port 10GbE Module 489892-B21 Mandatory1 — HP NC550SFP 2 -port PCIe 581201-B21 x8 Ethernet Adapter Mandatory1 — HP NC382T PCIe Dual Port 458491-001 Multifunction Gigabit Server Adapter Mandatory1 — SAS controller board, for use 462594-001 in the Smart Array P212 controller Mandatory1 — HP P212/256 Smart Array controller 462834-B21 Mandatory1 — HP P411/256 Smart Array controller 462830-B21 Mandatory1 — SAS controller board, for Smart Array P411 controller with 256 MB memory module 462918-001 Mandatory1 — HP Smart Array P411 controller w/1GB FBWC controller 572531-B21 Mandatory1 — HP Smart Array P411 controller w/512MB FBWC controller 578229-B21 Mandatory1 — HP Smart Array P812/1 controller Gb flash, 8-ports internal, 16-ports external, PCIe x8 487204-B21 Mandatory1 — HP SC08e 6 Gb SAS HBA 614988-B21 Mandatory1 — HP Smart Array P812 controller, 24 ports, 1 Gb, PCIe, SAS, supports up to 108 hard drives 587224-001 Mandatory1 — HP Smart Array E500/256 external controller 435129-B21 Mandatory1 — HP Smart Array P400/256 405132-B21 SAS controller, PCIe RAID controller with eight internal Serial Attached SCSI ports in a low-profile form factor, supports up to 512MB BBWC and RAID Level-6 (ADG) Mandatory1 — HP Smart Array P400/512 rmkt controller Mandatory1 411064-B21 System components 13 14 Item Description — HP Smart Array cache 383280-B21 battery kit - For Smart Array P400 controller only Mandatory1 — HP Smart Array P800 controller Mandatory1 — HP P410/Zero Memory FIO 462860-B21 Smart Array controller Mandatory1 — HP Smart Array P410/256 controller 462862-B21 Mandatory1 — HP Smart Array P400/512 rmkt controller 462864-B21 Mandatory1 — HP Smart Array P410/256 MB BBWC controller 491195-B21 Mandatory1 — HP Smart Array P410 with 1GB FBWC controller 572532-B21 Mandatory1 — HP P410 with 512MB FBWC controller 578230-B21 Mandatory1 — HP SAS Expander Card 468406-B21 Mandatory1 — HP StorageWorks 81Q PCI-e FC HBA AK344A Mandatory1 — HP StorageWorks FC 1242SR 4Gb PCIe dual channel HBA AE312A Mandatory1 — HP StorageWorks FC 2242SR 4Gb PCIe dual channel HBA A8003A Mandatory1 — HP StorageWorks FC 1142SR 4Gb PCIe HBA AE311A Mandatory1 — HP StorageWorks FC 2142SR 4Gb PCIe HBA A8002A Mandatory1 — HP StorageWorks 82E 8Gb AJ763A Dual-port PCIe FC HBA Mandatory1 — HP StorageWorks 82Q 8Gb AJ764A Dual Port PCI-e FC HBA Mandatory1 — HP StorageWorks 81E 8Gb SP PCI-e FC HBA AJ762A Mandatory1 — HP StorageWorks 8 Gb short wave FC SFF transceiver 468508-001 Mandatory1 — HP StorageWorks 42B PCIe AP768A 4Gb Dual Port Mandatory1 — HP StorageWorks 41B PCIe 4Gb Single Port AP767A Mandatory1 — HP StorageWorks 82B PCIe AP770A 8Gb Dual Port Mandatory1 — HP StorageWorks 81B PCIe 8Gb Single Port Mandatory1 Illustrated parts catalog Spare part number 381513-B21 AP769A Customer self repair Item Description Spare part number Customer self repair — PCIe one-port FC 81q HBA board 489190-001 Optional2 — HP StorageWorks CN1000E Dual Port Converged Network Adapter AW520A Mandatory1 — HP StorageWorks CN1000Q Dual Port Converged Network Adapter BS668A Mandatory1 — HP StorageWorks CN1100E Dual Port Converged Network Adapter BK835A Mandatory1 — HP SC11Xe HBA 412911-B21 Mandatory1 — HP StorageWorks PCIe U320e SCSI HBA AH627A Mandatory1 — HP IB 4X DDR CX-2 PCI-e G2 Dual Port HCA 592521-B21 Mandatory1 — HP IB 4X QDR CX-2 PCI-e G2 Dual Port HCA 592520-B21 Mandatory1 — HP IB 4X DDR Conn-X PCI-e 448397-B21 G2 Dual Port HCA Mandatory1 — HP IB 4X DDR PCI-e G2 Dual 409376-B21 Port HCA Mandatory1 — HP 160Gb SLC PCIe ioDrive 600278-B21 accelerator card Mandatory1 — HP 320Gb MLC PCIe ioDrive accelerator card 600279-B21 Mandatory1 — HP 320Gb SLC PCIe ioDrive 600281-B21 Duo accelerator card Mandatory1 — HP 640Gb MLC PCIe 600282-B21 ioDrive Duo accelerator card Mandatory1 — HP 1.28TB MLC PCIe ioDrive Duo 641027-B21 Mandatory1 Not shown USB/video assembly 591201-001 Optional2 Not shown 256 BBWC memory module 462974-001 - 40B wide - includes controller, does not include batteries Mandatory1 Not shown Smart Array cache module — — Not shown a) Smart Array cache module, 512 MB 405835-001 Optional2 Not shown b) Smart Array cache module, 256 MB 405836-001 Optional2 Not shown Smart Array BBWC battery pack 398648-001 Mandatory1 Not shown FBWC, cache module, 1-GB 505908-001 Mandatory1 System components 15 16 Item Description Spare part number Customer self repair Not shown HP 512 MB FBWC module 534915-B21 Mandatory1 Not shown HP 1 GB FBWC module 534562-B21 Mandatory1 Not shown FBWC module, 512 MB 578882-001 Mandatory1 Not shown FBWC capacitor pack 587324-001 Mandatory1 Not shown NC524SFP dual-port 10GBE 490712-001 module Optional2 Not shown Super capacitor module Optional2 — PCIe mezzanine NIC card - 436431-001 4-port, 1000base-T fiber connector (FC) Mandatory1 — 8-port external SAS HBA board 489103-001 Mandatory1 — PCIe dual-port FC 82q HBA 489191-001 board Mandatory1 — PC board - PCIe single -port 489192-001 FC 81e HBA board Mandatory1 — PC board - PCIe dual-port FC 489193-001 82e HBA board Mandatory1 — 4Gb PCIe to FC HBA StorageWorks FC142SR single-channel 397739-001 Mandatory1 — 4Gb PCIe to FC HBA StorageWorks FC2242SR dual-port 397740-001 Mandatory1 — 4 GB PCIe to FC HBA 407620-001 (QLogic) Features one 4Gbps FC port with SFF multimode optic with LC-style connector, automatic speed negotiation, and MPIO Mandatory1 — PCIe dual FC HBA (QLogic)- 407621-001 4GB, optical LC type connector, automatic speed negotiation, MPIO basic Mandatory1 — Intel NC360T PCIe 2-port Gb (1000 Base-T) server NIC adapter - includes a standard-height bracket attached 412651-001 Mandatory1 — HP NC522SFP Dual-Port 10GbE Gigabit Server Adapter 468332-B21 Mandatory1 — 4Gb PCIe-to-FC HBA StorageWorks FC2242SR dual-channel 397740-001 Mandatory1 — 4Gb PCIe-to-FC HBA StorageWorks FC2242SR dual-channel 397740-001 Mandatory1 — SCSI U320e (HBA) - dual channel, PCIe, with LVD 445009-001 Mandatory1 Illustrated parts catalog 587225-001 Item Description Spare part number — Dual-channel Ultra320 PCIE 445009-002 HBA Mandatory1 — PC board - HBA, 81Q, FC, PCIe 466515-001 Mandatory1 — SPS-BD,NC522SFP+ 10 gigabit,SE 468349-001 Mandatory1 — PCIe one-port FC 81q HBA board 489190-001 Mandatory1 — SPS-BD,NC112T,PCIe gigabit ADP 503827-001 Mandatory1 — SPS-BD NIC PXIE 4P 10/100/1000 539931-001 Mandatory1 — HP NC550SFP 10Gb 2-port 581201-B21 PCIe x8 Ethernet Adapter Mandatory1 — NC550SFP dual-port 10GbE 586444-001 server adapter Mandatory1 — SPS-BD mezzanine 4X DDR IB CX G2 dual-port 593413-001 Mandatory1 — Quad port NC365T adapter 593743-001 - 1 gigabit Ethernet (GbE) Mandatory1 — PC board - ioDrive 600474-001 accelerator card, 160 GB, logical Not And (NAND) flash, Single Level Cell (SLC), bandwidth (64kB) 750MBs writes, 770MBs reads, access latency (512 Byte) twenty-six microseconds, 123,000 Interface Operating Procedures (IOPS) 75/25 R/W Mandatory1 — PC board - ioDrive accelerator card, 320GB, logical NAND flash, MLC, bandwidth (64kB) 510MBs writes, 735M/s reads, access latency (512 Byte) twenty-nine microseconds, 67000 IOPS (75/25 R/W) 600475-001 Mandatory1 — PC board - ioDrive 600477-001 accelerator card, 320GB, logical NAND flash, SLC, bandwidth (64kB) 1.5GBs writes 1.5GBs reads, access latency (512 Byte) twenty-six microseconds, 238,000 IOPS 75/25 R/W mix Mandatory1 — PC board - ioDrive accelerator card, 640GB, logical NAND flash, MLC, bandwidth (64kB) 1.0GBs writes, 1.5GBs reads, access latency (512 byte) twenty-nine microseconds, Mandatory1 600478-001 Customer self repair System components 17 Item Description Spare part number Customer self repair 138, 000 IOPS 75/25 R/W mix Not shown SPS-PCA Mini-DIMM 512MB 581135-001 Mandatory1 Not shown Battery, 3V, Lithium 153099-001 Mandatory1 Not shown Cable kit for DL980G7 AM426-69011 Mandatory1 Not shown a) Cable assembly, USB, video — Mandatory1 Not shown b) Cable assembly, power, UID — Mandatory1 Not shown c) Cable assembly, SAS power — Mandatory1 Not shown d) Cable, SATA DVD — Mandatory1 Not shown e) Cable assembly, SSD — Mandatory1 Not shown f) Cable assembly, power, fan, backplane/SPI — Mandatory1 Not shown g) Cable assembly, thermal sensor — Mandatory1 Not shown g) Cable assembly, Mini — SAS (SPI to SAS backplane) Mandatory1 Not shown SATA DVD power cable 496071-001 Mandatory1 Not shown Cable assembly, 5A BBWC 409124-001 battery Mandatory1 Not shown Cable assembly, SATA power/data 501025-001 Optional2 Not shown Cable assembly, mini-SAS, 83.8 cm (33-in) 498426-001 Mandatory1 Not shown Cable - Serial ATA (SATA), power / data 531997-001 Mandatory1 Not shown Cable, XNC JLink, 35.56 cm AM426-69023 (14 in) Mandatory1 Not shown Trusted Platform Module (TPM) kit 488069-B21 No3 Not shown Trusted Platform Module (TPM) 505836-001 No3 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. — 18 Illustrated parts catalog 1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'oeuvre du service vous seront facturés. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. — 1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. 3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. — 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. — 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. — 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. System components 19 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". — 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado. 20 Illustrated parts catalog 2 Removal and replacement procedures Required tools You need the following items for some procedures: • Torx T-15 screwdriver (provided with the server) • Phillips screwdriver • Flathead screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly. Server warnings and cautions Before installing a server, be sure that you understand the following warnings and cautions. WARNING! To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server. WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. Required tools 21 Power off the server WARNING! To reduce the risk of personal injury, electric shock, or damage to the equipment, disconnect the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until the power cord is disconnected. NOTE: 1. 2. 3. 4. 5. 6. If installing a hot-plug device, it is not necessary to power down the server. Back up the server data. Shut down the operating system as directed by the operating system documentation. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on the front and rear panels of the server. Press the Power On/Standby button to place the server in standby mode. When the server activates standby power mode, the system power LED changes to amber. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button. Disconnect the power cords. The system is now without power. SAS hard drive blank CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. Remove the component as indicated. To replace the blank, slide the blank into the bay until it locks into place. SAS/SATA hard drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Determine the status of the drive from the hot-plug SAS hard drive LED combinations (“Hard drive LED combinations” (page 87)). 2. Back up all server data on the hard drive. 3. Remove the hard drive. 22 Removal and replacement procedures To replace the component, reverse the removal procedure. DVD-ROM drive To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. Disconnect the cable from the rear of the DVD-ROM drive. 5. Remove the DVD-ROM drive. To replace the component, reverse the removal procedure. Power supply blank Remove the component as indicated. DVD-ROM drive 23 To replace the component, reverse the removal procedure. Hot-plug power supply The server supports up to eight hot-plug power supplies. Install all power supplies to provide full redundancy. HP recommends installing redundant hot-plug power supplies in pairs. To confirm the redundancy of your configuration, see the HP power advisor at the HP website (http://www.hp.com/go/hppoweradvisor). WARNING! To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server. To remove the component: 1. Disconnect the power cord from the failed power supply. 2. Remove the failed power supply. 24 Removal and replacement procedures To replace the component, reverse the removal procedure. Fans NOTE: If two fan fail or if a dual-rotor fan is removed and the "Shutdown" operating system pop-up alert appears, if the hot-plug fans are immediately replaced, the fan sensor state returns to "OK" (Green); however, the 60-second shutdown is not always aborted as it should be, and the system continues with its graceful shutdown. This issue occurs because HP Integrated Lights-Out 3 (iLO 3) Firmware Version 1.10 detects that when two fans are failed and repaired in quick succession, they may be flagged as "Failed" and then "OK" in a random order, so iLO 3 does not detect that the shutdown should be canceled when the fans are hot-swapped. A future version of iLO 3 firmware will prevent the graceful shutdown from continuing if the fans are immediately replaced. There is no workaround to prevent the possible shutdown; however, if the fans fail and need to be replaced, perform the following instead of hot-swapping the fans: 1. Shut down the server and remove the power cord. 2. Replace any dual rotor fans (or two individual fans). 3. Power the server back on. Upper fans To remove the component: 1. Extend the server from the rack. 2. Remove the access panel. 3. Remove the fan. To replace the component, reverse the removal procedure. Lower fan module To remove the component: 1. Extend the server from the rack. 2. Remove the fan module. Fans 25 To replace the component, reverse the removal procedure. Remove the upper or lower processor memory drawer or processor memory drawer blank 1. 2. 3. Power off the server (“Power off the server” (page 22)). Release the latches on the release lever. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch. 4. Firmly holding the processor memory drawer, press the release buttons and then remove the drawer from the server. The procedure is the same for the upper and lower processor memory drawers, and the processor memory drawer blank. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. 26 Removal and replacement procedures Remove a processor memory drawer cover 1. 2. 3. Power off the server (“Power off the server” (page 22)). Remove the processor memory drawer. (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)) Remove the processor memory drawer cover. The procedure is the same for the upper and lower processor memory drawers, and the processor memory drawer blank. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. Memory cartridge NOTE: Be sure you are using the correct spare part number when replacing the memory cartridge. The server ships with one of two different memory cartridges, which are not interchangeable. To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 3. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 4. Remove the failed memory cartridge. Remove a processor memory drawer cover 27 28 5. Open the memory cartridge cover. 6. Remove the DIMMs from the failed memory cartridge: a. Open the DIMM slot latches. b. Remove the DIMM. Removal and replacement procedures To replace the component: 1. Install the DIMMs in the replacement memory cartridge: a. Open the DIMM slot latches. b. Install the DIMM. 2. 3. Close the memory cartridge cover. Install the memory cartridge. Memory cartridge 29 4. 5. 6. Install the processor memory drawer cover. Install the processor memory drawer. Power up the server. DIMMs To remove the component: 1. Power down the server. 2. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 3. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 4. Remove the memory cartridge. 5. 30 Open the memory cartridge cover. Removal and replacement procedures 6. Remove the failed DIMM from the memory cartridge: a. Open the DIMM slot latches. b. Remove the DIMM. To replace the component: 1. Install the replacement DIMM in the memory cartridge: a. Open the DIMM slot latches. b. Install the DIMM. DIMMs 31 2. 3. Close the memory cartridge cover. Install the memory cartridge. 4. 5. 6. Install the processor memory drawer cover. Install the processor memory drawer. Power up the server. Memory options This server contains eight memory cartridge connectors in each processor memory drawer. Each memory cartridge can contain eight DIMMs, for a total of 128 DIMMs, for a maximum memory configuration of 4 TB. The server supports the following DIMM speeds: 32 • Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1066 MHz • Quad-rank PC3-8500 (DDR-1066) DIMMs operating at 1066 MHz Removal and replacement procedures Depending on the processor model, the memory clock speed might be reduced to 1066 or 800 MHz. WARNING! There is not enough available PCI memory to allocate to all devices installed in the system. Devices which were not allocated requested resources may not operate properly.This occurs during the I/O configuration phase of POST, after the System ROM has allocated most of the available memory for some PCI devices, leaving insufficient memory for PCI devices that have not yet been configured.The above message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows.This message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows.If some PCI devices are not allocated memory and the warning message appears during POST, perform one or more of the following potential workarounds to allow the remaining PCI devices to receive their requested memory allocations:If the server operating system documentation states that it requires 2GB (or more) of memory below the 4GB address boundary, do not perform Step 1 below because it may result in operating system boot failure.If the operating system documentation does not specify its memory requirements below the 4GB boundary, the Step 1 procedure below may be attempted. However, if performing Step 1 results in operating system boot failure, perform Step 1 again and change Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O , and then perform Step 2 below: 1. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU). a. Boot the server. b. Press the F9 key during POST (when the F9 prompt appears). c. Select Advanced Options. d. Select Advanced System ROM Options. e. Select Memory Mapped I/O Options. f. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of Memory Mapped I/O or Automatically configure Memory Mapped I/O. g. Reboot the server and verify that no warning messages appear during POST. If the operating system will not boot, perform Step 1 again and reset Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . 2. 3. If the warning message continues to appear, ensure that all slotted PCI devices are using updated firmware and drivers and reboot the server. If the warning message continues to appear, determine which adapter is least critical for the operating environment and remove or disable that adapter. Repeat this step until the server completes POST without displaying this error message. DIMMs 33 NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped I/O) memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O configurations, resulting in the following warning message: NOTE: When an HP ProLiant DL980 G7 server is configured with a DIMM that has an uninitialized SPD area, and the server is running any version of the System ROM detailed in the Scope section below, the Survey Utility in HP SmartStart will report the "Correctable Error Threshold Count" for the DIMM as "Feature Not Supported." However, this is incorrect. The DIMM does actually support "Correctable Error Threshold Count." This issue is only observed when using the Survey Tool in HP SmartStart. In addition, this issue does not affect the operation or functionality of the server or of ECC. It only affects the reporting of ECC capabilities in the DIMM SPD and does not impact any other system operation. Any ProLiant DL980 G7 server configured with a P66 System ROM dated 07/07/2010, 07/27/2010, or 01/27/2011 and using the Survey Tool in SmartStart (any version) may see this issue. This is only a reporting issue and can be safely ignored. It does not affect the operation or functionality of the server or of ECC. It only affects the reporting of ECC capabilities in the DIMM SPD and does not impact any other system operation. To prevent this issue from occurring, or to correct it after it has already occurred, update the System ROM to a version dated 03/24/2011 (or later). DIMM support The server supports the following DIMMs: • Single- and dual-rank PC3-10600 (DDR3-1333) DIMMs operating at 1066 MT/s While single-rank DIMMs are supported, HP recommends dual-rank and quad-rank DIMMs since they provide significant memory throughput and better memory protection (Online Spare memory mode) over single-rank DIMMs. • Quad-rank PC3-8500 (DDR3-1066) DIMMs operating at 1066 MT/s Single-, dual-, and quad-rank DIMMs To understand and configure memory protection modes properly, an understanding of single-, dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications. A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one rank accessible at a time. A quad-rank DIMM is effectively two dual-rank DIMMs on the same module. Only one rank is accessible at a time. The server memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM. Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4-GB and a quad-rank DIMM would be 8-GB. Although only one data rank is accessed at any given time for each DIMM, optimized command and address pipelining via various interleaving schemes enables the Intel® Xeon™ 7500-series processor architecture to benefit from dual-rank and quad-rank DIMMs. A dual-rank DIMM performs significantly better than its single-rank counterpart. A quad-rank DIMM provides further performance improvement even at the same DIMM capacity. 34 Removal and replacement procedures DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank2R = Dual-rank4R = Quad-rank 3 Data width x4 = 4-bitx8 = 8-bit 4 Memory speed 10600 = 1333-MHz8500 = 1066-MHz 5 DIMM type R = RDIMM (registered) For the latest supported memory information, see the QuickSpecs on the HP website (http:// www.hp.com). DIMM installation guidelines This server supports two memory cartridges per processor. Each memory cartridge can support up to eight DIMMs. Eight memory cartridges provide a total of 128 DIMMs per system. When installing DIMMs in the memory cartridge, observe the following minimum guidelines: • The minimum configuration is two DIMMs per cartridge. Running in Lockstep mode, such DIMM pairs offer larger memory protection to provide increased memory fault resiliency. • DIMMs must be installed in quads with identical characteristics. When possible, for configuration simplicity, HP recommends using DIMMs with identical part numbers throughout the system. • DIMM quads must be populated in sequence by letter designation. Install DIMM quad (1A, 8A in both cartridges) first, followed by DIMM quad (3B, 6B in both cartridges), DIMM quad (2C, 7C in both cartridges) and DIMM quad (4D, 5D in both cartridges). • To achieve maximum performance, balance DIMM quads by letter groupings across all memory cartridges so that the (1A, 8A) pair is installed in all memory cartridges first, followed by the B-pair, C-pair, and D-pair. • When installing mixed rank DIMMs in any cartridge, DIMMs with the highest number of ranks must be installed in the white DIMM connector locations. This guarantees proper electrical signaling on the DDR3 channel since DIMMs with higher rank counts present larger electrical loading on the DDR3 channel and must be populated at the end point of the channel. For more information, see the illustration below. CAUTION: Failure to follow these guidelines may result in the inability to recognize memory, memory errors, or reduced memory performance. NOTE: To utilize more than 128GB per processor socket, 44-bit addressing mode must be used (40-bit versus 44-bit addressing is configured in the RBSU). Not all supported operating systems support 44-bit addressing mode; refer to the desired operating system documentation to ensure 44-bit addressing is supported. In 40-bit mode, systems with 4 installed processors are limited to a maximum of 512GB, and systems with 8 installed processors are limited to a maximum of 1TB of addressable memory. DIMMs 35 • AMP modes Advanced ECC, Online Spare, and Mirrored Memory have further requirements beyond the ones listed here. For additional memory configuration requirements, see the corresponding AMP sections: ◦ Advanced ECC memory population guidelines (“Advanced ECC memory population guidelines” (page 39)) ◦ Online Spare memory population guidelines (“Online Spare memory population guidelines” (page 39)) ◦ Mirrored Memory population guidelines (“Mirrored Memory population guidelines” (page 40)) Memory cartridge population guidelines This server contains eight memory cartridge slots in each processor memory drawer. Observe the following guidelines: • Memory must be loaded in quads, with a pair of DIMMs in each memory cartridge for a corresponding processor. Upper processor memory board is shown on the left. Lower processor memory board is shown on the right. • Memory is only accessible to the system if the associated processor is installed. Do not install memory cartridges in cartridge slots without the corresponding processor installed. • Two DIMM populated memory cartridges are required per processor. • To maximize performance in multi-processor configurations, distribute the total memory capacity evenly across all processors. NOTE: Be sure you are using the correct spare part number when replacing the memory cartridge. The server ships with one of two different memory cartridges, which are not interchangeable. Memory subsystem architecture The Intel® Xeon™ 7500 processor memory architecture is designed to take advantage of multiple stages of memory interleaving to reduce latency and increase bandwidth. Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below. Each memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects to a memory buffer. The buffer converts SMI to DDR3 and expands the memory capacity of the 36 Removal and replacement procedures system. Each buffer has two DDR3 channels and can support up to four DIMMs for a total of eight DIMMs per cartridge. • Memory speed is not affected by number of DIMMs or ranks. All DIMMs run at the highest possible speed for a given processor. • DDR3 memory speed is a function of the QPI bus speed supported by the processor: • ◦ Processors with a QPI speed of 6.4 GT/s run memory at 1066 MT/s. ◦ Processors with a QPI speed of 5.6 GT/s run memory at 978 MT/s. ◦ Processors with a QPI speed of 4.8 GT/s run memory at 800 MT/s. Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of the two memory controllers in the processor such that adjacent cache lines reside on different memory controllers, SMIs, DIMMs, and DIMM ranks for better performance. To take advantage of this feature, DIMMs should be populated evenly between all SMI channels. If an SMI channel pair has more DIMMs than others, the extra memory on that SMI channel pair does not benefit from the interleaving mechanism across memory controllers. Hemisphere mode The Intel® Xeon™ 7500-series processor architecture incorporates Hemisphere mode, a high-performance interleaving technology. Hemisphere mode combines the tracking resources of both memory controllers within each processor for a more aggressive cache line pipelining. Hemisphere mode is the only supported configuration, and is enabled in RBSU when processors in the system have identical DIMM population behind both of their memory controllers. That is to say, all populated memory cartridges are populated the same way. • Hemisphere mode should produce the best overall performance for a variety of applications. • To enable each processor to enter Hemisphere mode, both memory cartridges must be installed and populated with equal memory capacities based on the DIMM installation guidelines (“DIMM installation guidelines” (page 35)). • Greater performance is obtained when all cartridges are populated with either four or eight dual- or quad-rank DIMMs. • The server supports Mirrored Memory mode while Hemisphere mode is enabled. DIMMs 37 Memory performance optimization The server supports 128 DIMMS across eight Multi-core processors (64 DIMMs across four multi-core processors, in each processor memory drawer). While there are many DIMM population configurations that can support any total memory size, optimal performance is achieved when populated DIMMs can take advantage of the Intel® Xeon™ 7500-series processor architecture. To achieve the best performance for a given memory processor configuration, observe the following guidelines: • The largest contributor to maximum memory bandwidth performance is to use both memory controllers inside the processor. To achieve maximum memory bandwidth performance, populate both memory cartridges for each installed processor. This configuration is required for this server. • The second largest contributor to performance is to populate each DDR3 channel in each memory cartridge. To achieve this, the minimum DIMM count per cartridge is four DIMMs installed in DIMM pair locations A and B. • The next largest contributor to performance is the number of ranks per DIMM. Dual-rank DIMMs perform significantly better than single-rank DIMMs. Quad-rank DIMMs offer a further performance boost. • The best performance is obtained when all installed processors are enabled for Hemisphere mode. Hemisphere mode is optimum when four or eight DIMMs are installed per cartridge. Hemisphere mode can be achieved with two or six DIMMs per cartridge (2 cartridges per processor), but this configuration is not optimal for Hemisphere mode. Hemisphere mode is required for this server. • Maximum throughput is achieved when all memory cartridges are fully populated with the maximum number of eight quad-rank DIMMs per cartridge. Plan the memory configurations using identical DIMMs to achieve the memory size target, taking into account that 64- and 128-DIMM count configurations result in the highest performance. Using a four-processor configuration as an example, do the following: • If the initial memory target is 64 GB, populate a four-processor system with eight cartridges of four 2-GB DIMMs each for a total of 32 DIMMs. • For 4-GB DIMMs, the initial memory target is 128-GB using 32 DIMMs. The maximum expansion target is 256 GB with 64 DIMMs. • For 8-GB DIMMs, the initial memory target is 256-GB using 32 DIMMs. The maximum expansion target is 512 GB with 64 DIMMs. • The maximum system memory capability is achieved with an initial memory target of 1024 GB with 32 x 32-GB DIMMs and 2 TB with 64 x 32-GB DIMMs. For an eight-processor configuration, the same example applies, but must be done for both processor memory drawers, resulting a doubling of the memory capacity, and a 4 TB maximum with 128 x 32 GB DIMMs. Memory RAS The server supports the following AMP modes: 38 • Advanced ECC memory mode provides the greatest memory capacity for a given DIMM size and provides x4 and x8 SDDC. This mode is the default option for this server. For more information, see "Advanced ECC memory population guidelines (“Advanced ECC memory population guidelines” (page 39))." • Online Spare memory mode provides protection against persistent DRAM failure. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory Removal and replacement procedures protection. For more information, see "Online Spare memory population guidelines (“Online Spare memory population guidelines” (page 39))." • Mirrored Memory mode provides the maximum protection against failed DIMMs. Uncorrectable errors in the DIMMs of one memory cartridge are corrected by the DIMMs in the mirrored cartridge. The two memory controllers of each processor form a mirrored pair using two memory cartridges. For more information, see "Mirrored Memory population guidelines (“Mirrored Memory population guidelines” (page 40))." AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility." For the latest memory configuration information, see the QuickSpecs on the HP website (http:// www.hp.com/go/ProLiant). Advanced ECC memory population guidelines Advanced ECC memory is the default memory protection mode for the server. Up to 2-TB of active memory using 16-GB DIMMs is supported in this AMP mode. Advanced ECC can correct single-bit and multi-bit memory errors on a single x8 or two adjacent x4 DRAM devices. The server provides notification when correctable error events have exceeded a pre-defined threshold rate. When uncorrectable errors are detected using Advanced ECC, the server notifies the user and shuts down the operating system. NOTE: When attempting to install or boot VMware ESX 4.1 on a ProLiant DL980 G7 server with Advanced Memory Protection (Memory Mirroring) enabled, the following error message will be displayed: The system has found a problem on your machine and cannot continue.The BIOS will report that NUMA node 1 has no memory. When implementing memory mirroring on the ProLiant DL980 G7 server, the sockets are paired so that the even socket of each pair is considered primary and the odd socket is the mirror. However, the system reports that the cores on the odd sockets do not have any local memory.If Memory Mirroring is enabled prior to VMware installation, then immediately after BIOS POST and when the VMware installation begins, press F2 and add the following line to the boot options:useNUMAInfo=falseAfter installation, the system will reboot. Perform the following: 1. At the boot menu, press "a" to modify the kernel argument and add "useNUMAInfo=false" to the end of the "grub append>" line. 2. Boot to VMware ESX 4.1. 3. Log into the newly installed VMWare Server with vSphere Client or vCenter Client. 4. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel 5. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA. If Memory Mirroring will be enabled after VMware is installed, perform the following: 6. 7. 8. Log into the installed VMWare Server using the vSphere Client or vCenter Client application. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA prior to enabling memory mirroring. Online Spare memory population guidelines Online spare memory provides protection against persistent DRAM failure. It monitors DIMMs for excessive correctable errors and copies the content of an unhealthy rank to an available spare rank in advance of multi-bit or persistent single-bit failures that may result in uncorrectable faults. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection. DIMMs 39 When Online Spare memory is enabled, the first ranks of DIMM pair, 1A/8A, are set aside as the sparing ranks. Therefore, the available memory is reduced by the size of the first ranks of DIMM pair 1A/8A. If a DIMM rank on either of the SMI buses exceeds its correctable ECC threshold, then the contents of the failing DIMM ranks are copied to the spare DIMM ranks. Once the copy is complete, all memory accesses to the previous failing DIMM ranks go to the spare DIMM ranks. No performance penalty occurs for rank-sparing, other than the time it takes to copy the data from the failing rank to the spare rank upon an error condition. The following population rules apply to each memory cartridge. Begin with the DIMM installation guidelines (“DIMM installation guidelines” (page 35)) with these additional constraints: • All installed processors must contain a valid sparing configuration. • If installing mixed rank DIMMs in a cartridge, follow the mixed rank installation rules of the DIMM installation guidelines (“DIMM installation guidelines” (page 35)). • Rank sparing requires that the spare ranks of the DIMM pair 1A/8A be at least as large as any other DIMM rank on the DDR3 channels of the cartridge. To determine the size of a single rank in a DIMM, divide the total DIMM size by the number of ranks. For example, the rank size of a dual-rank 2-GB DIMM is 1 GB and the rank size of a dual-rank 4-GB DIMM is 2 GB. Therefore, it is possible to support rank sparing with mixed DIMM pair sizes in the cartridge if the 1A/8A pair is populated with the 4-GB DIMMs and the other pairs are populated with either the identical 4-GB or 2-GB DIMMs (pairs C and D are not required to be populated). In this case, the 2-GB rank size of the 4-GB DIMMs in the 1A/8A pair is equal to or greater than the rank size of the other installed DIMMs. However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair locations. This is because it violates the rule requiring that the spare rank size of DIMM pair 1A/8A (1 GB) be equal to or larger than the single rank size of the other DIMM pair locations, since the rank size of a 4-GB DIMM in pairs B, C, or D would be larger (2 GB) than the spare rank size of the 2-GB DIMM pair in 1A/8A (1 GB). Mirrored Memory population guidelines Errors that are not corrected by ECC or SDDC cannot be corrected by Online Spare memory. By providing added redundancy in the memory sub-system, Mirrored Memory provides the greatest protection against memory failure beyond ECC, SDDC, and Online Spare memory. In Mirrored Memory mode, each Lockstep DIMM pair of a memory controller (of a memory cartridge connected to a processor) has a mirrored DIMM pair on the other memory cartridge of the sibling processor in the same QPI island. Upon detecting an uncorrectable memory error from a DIMM pair of a memory cartridge, the processor avoids a system crash by reading the mirrored DIMM pairs from the other memory cartridge. In this case, the system management routine disables the failed DIMM. Further memory reads and writes will only occur on the mirrored DIMM pairs. The exceptions to Mirrored Memory mode are the following: 40 • In Mirrored Memory mode, half of the memory is allocated to memory protection. • The available memory bandwidth is reduced by up to 50% in this mode. • Mirrored Memory mode, Online Spare mode, Hemisphere mode, and interleaving cannot be enabled simultaneously. Removal and replacement procedures To configure memory for Mirrored Memory mode, observe these additional constraints: • For the server to support Mirrored Memory, all processors must have a valid mirroring configuration. • The minimum allowable configuration is two memory cartridges per processor. • Both memory cartridges for each processor must be populated with the same DIMM configurations. • Both of the CPU sockets on the same QPI island must be loaded with identical memory. NOTE: When attempting to install or boot VMware ESX 4.1 on a ProLiant DL980 G7 server with Advanced Memory Protection (Memory Mirroring) enabled, the following error message will be displayed: The system has found a problem on your machine and cannot continue.The BIOS will report that NUMA node 1 has no memory. When implementing memory mirroring on the ProLiant DL980 G7 server, the sockets are paired so that the even socket of each pair is considered primary and the odd socket is the mirror. However, the system reports that the cores on the odd sockets do not have any local memory.If Memory Mirroring is enabled prior to VMware installation, then immediately after BIOS POST and when the VMware installation begins, press F2 and add the following line to the boot options:useNUMAInfo=falseAfter installation, the system will reboot. Perform the following: 1. At the boot menu, press "a" to modify the kernel argument and add "useNUMAInfo=false" to the end of the "grub append>" line. 2. Boot to VMware ESX 4.1. 3. Log into the newly installed VMWare Server with vSphere Client or vCenter Client. 4. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel 5. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA. If Memory Mirroring will be enabled after VMware is installed, perform the following: 6. 7. 8. Log into the installed VMWare Server using the vSphere Client or vCenter Client application. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA prior to enabling memory mirroring. NOTE: If all installed memory is configured for a single CPU on a ProLiant DL980 G7 server running Red Hat Enterprise Linux 5, an error message similar to the following may appear when the server is operating under a heavy workload, prior to the server becoming unresponsive: soft lockup - CPU#21 stuck for 10s!This occurs because configuring all server memory for a single CPU results in contention of all other CPUs for communication to the single node configured with memory. This contention is exacerbated when running processes with high memory resource requirements.This issue is not specific to the HP ProLiant DL980 G7 server. Any server using the Non-Uniform Memory Access (NUMA) multiprocessing architecture when all memory is configured for a single CPU may be affected. Although this has been observed under Red Hat Enterprise Linux 5, it may also occur under Red Hat Enterprise Linux 4 and SUSE Linux Enterprise Server 10.Recent Linux kernels (for example, kernels in Red Hat Enterprise Linux 6.x and SUSE Linux Enterprise Server 11) have improved methods for dealing with memory and should not experience this issue. To avoid this issue when running Red Hat Enterprise Linux 4, Red Hat Enterprise Linux 5, or SUSE Linux Enterprise Server 10, utilize the DIMM installation guidelines (“DIMM installation guidelines” (page 35)) for the ProLiant DL980 G7server: DIMMs 41 Heatsink To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 3. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 4. Open the processor retaining bracket. 5. 42 Remove the heatsink. Removal and replacement procedures To replace the component: 1. Clean the old thermal grease from the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the heatsink protective cover. 3. 4. Install the heatsink. Close and lock the processor retaining bracket. Heatsink 43 5. 6. 7. Install the processor memory drawer cover. Install the processor memory drawer. Power up the server. To replace the component, reverse the removal procedure. Processor WARNING! Use caution when installing the processor memory module or removing the processor memory module. The processor memory module is very heavy when fully populated. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. CAUTION: Use care when handling components to avoid damaging connector pins. CAUTION: To help avoid damage to the processor and system board, do not install the processor without using the processor installation tool. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). CAUTION: To prevent damage to the processor memory drawer cover, be sure the handle of the processor memory drawer is fully open before removing the cover. 3. 44 Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). Removal and replacement procedures 4. 5. Remove the heatsink (“Heatsink” (page 42)). Open the processor locking lever and the processor socket retaining bracket. 6. Using the processor tool, remove the processor from the system board: a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly. b. Press in on the plastic tabs, and then place the tool on the processor. c. Release the tabs, and then carefully lift the processor and tool straight up. 7. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool. Processor 45 CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To replace the component: 1. Carefully insert the processor into the processor installation tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area. 2. 46 Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. Removal and replacement procedures CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: 3. • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket. Press and hold the tabs on the processor installation tool to separate it from the processor, and then remove the tool. Processor 47 4. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 5. 6. 48 Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Removal and replacement procedures 7. 8. Install the heatsink. Close and lock the processor retaining bracket. 9. Install the processor memory drawer cover. 10. Install the processor memory drawer. 11. Power up the server. Expansion slot cover CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 1. 2. 3. Power down the server. Extend or remove the server from the rack. Remove the access panel. Expansion slot cover 49 4. Check for the shipping screw, and remove if present. 5. Open the latch, and remove the expansion slot cover. To replace the component, reverse the removal procedure. Low profile I/O expander 1. 2. 3. 50 Power off the server (“Power off the server” (page 22)). Press the release button, and open the lever. Slide the I/O expander out of the server. Place a hand under the component to support it as you remove it from the server. Removal and replacement procedures 4. Press the side buttons to remove the component cover. 5. To open the I/O card lock, push the blue tab, flip it back, then open the hinge forward. Low profile I/O expander 51 6. Remove expansion slot covers as necessary. To replace the component, reverse the removal procedure. Non-hot-plug expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. Open the expansion slot latch. 5. 52 Disconnect any cables attached to the expansion board. Removal and replacement procedures 6. 7. Remove the retaining screw, if installed. Remove the expansion board. To replace the component, reverse the removal procedure. Battery-backed write cache procedures Two types of procedures are provided for the BBWC option: • • Removal and replacement of failed components: ◦ Removing the cache module (“Removing the BBWC cache module” (page 53)) ◦ Removing the battery pack (“Removing the BBWC battery pack” (page 54)) Recovery of cached data from a failed server (“Recovering data from the battery-backed write cache” (page 55)) CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. Removing the BBWC cache module CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached. CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. Battery-backed write cache procedures 53 4. 5. 6. 7. 8. If the existing cache is connected to a battery, observe the BBWC Status LED (“Battery pack LEDs” (page 99)). • If the LED is flashing every 2 seconds, data is still trapped in the cache. Restore system power, and then repeat the previous steps. • If the LED is not illuminated, disconnect the battery cable from the cache. Disconnect the cable. Remove the SPI board (“Remove the SPI board” (page 56)). Open the cache slot latches. Remove the cache module. To replace the component, reverse the removal procedure. Removing the BBWC battery pack CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached. CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. If the existing cache is connected to a battery, observe the BBWC Status LED (“Battery pack LEDs” (page 99)). 5. 6. • If the LED is flashing every 2 seconds, data is still trapped in the cache. Restore system power, and then repeat the previous steps. • If the LED is not illuminated, disconnect the battery cable from the cache. Disconnect the cable. Remove the battery pack. The SPI board is removed for clarity. 54 Removal and replacement procedures To replace the component, reverse the removal procedure. BBWC low profile I/O expander location BBWC procedures are the same for a BBWC located in the low profile I/O expander. Recovering data from the battery-backed write cache If the server fails, you can recover any data temporarily trapped in the BBWC by using the following procedure. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 21)). Battery-backed write cache procedures 55 1. 2. Perform one of the following: • Set up a recovery server station using an identical server model. Do not install any internal drives or BBWC in this server. (This is the preferred option.) • Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration. Power down the failed server. If any data is trapped in the cache module, an amber LED on the module blinks every 15 seconds. CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. 3. 4. 5. 6. Transfer the hard drives from the failed server to the recovery server station. Remove the BBWC [cache module and battery pack (“Removing the BBWC battery pack” (page 54))] from the failed server. Perform one of the following: • Install the BBWC into an empty BBWC DIMM socket on the system board of the recovery server. • Install the BBWC into an empty BBWC DIMM socket on any Smart Array Controller in the recovery server. Power up the recovery server. A 1759 POST message is displayed, stating that valid data was flushed from the cache. This data is now stored on the drives in the recovery server. You can now transfer the drives (and controller, if one was used) to another server. Remove the SPI board To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Extend the server from the rack. 3. Remove the access panel. 4. Disconnect all cables from the SPI board. NOTE: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial number through RBSU (“Re-entering the server serial number and product ID” (page 70)). 5. 56 Raise the levers, and lift the SPI board from the server. Removal and replacement procedures 6. Remove all components from the failed SPI board. To replace the component, reverse the removal procedure. Systems Insight Display assembly CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped. To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Extend the server from the rack. 3. Remove the access panel. 4. Using a T-10 Torx screwdriver, release the two locking latches on the top of the SID bezel. 5. Pull the bezel up and away from the server. 6. Disconnect the cable from the rear of the Systems Insight Display assembly. 7. Remove the retaining screw. 8. Remove the Systems Insight Display assembly. Systems Insight Display assembly 57 To replace the component, reverse the removal procedure. Front bezel CAUTION: Removal of the bezel will most likely destroy the component. Have a replacement bezel on hand for immediate replacement before removing the bezel. 58 1. 2. 3. 4. 5. Power down the server. Extend the server from the rack. Remove the access panel. Remove the SID bezel (“Systems Insight Display assembly” (page 57)). Remove the seven screws from the right side of the chassis and eight screws from the left side of the chassis. 6. From the left and right insertion tabs, slide the upper part of the bezel forward. Removal and replacement procedures 7. Disengage the three bezel catches between the processor memory drawers, the three catches on the lower part of the bezel, and remove the bezel. To replace the component, reverse the removal procedure., inserting the left side tab as the bezel is placed into position. Solid state drive To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. Disconnect the cable from the solid state drive. 5. Remove the solid state drive. Solid state drive 59 To replace the component, reverse the removal procedure. Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING! The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery. • Do not expose the battery to temperatures higher than 60°C (140°F). • Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water. • Replace only with the spare designated for this product. To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. Remove the SPI board (“Remove the SPI board” (page 56)). 5. Remove the battery. 60 Removal and replacement procedures To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. I/O expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. NOTE: When either optional I/O expansion board in installed in a two-processor configuration, the second processor must be installed in socket 3. 1. 2. 3. 4. Power off the server (“Power off the server” (page 22)). Extend the server from the rack. Remove the access panel. Release the latches on the release lever. I/O expansion board 61 5. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch. 6. Remove any expansion boards from the failed I/O expansion board (“Non-hot-plug expansion board” (page 52)). Remove the I/O expansion board: 7. 62 • PCI-X/PCIe Express I/O expansion board • PCIe Express I/O expansion board Removal and replacement procedures To replace the component, reverse the removal procedure. Expansion board options In the main I/O tray the server supports up to 11 expansion slots. The server ships with 5 PCI Express expansion slots. I/O expansion board 63 To support the optional expansion slots, install one of the following options into the server: • PCI Express I/O Expansion Board—Adds six optional slots • PCI-X/PCI Express I/O Expansion Board—Adds five optional slots WARNING! There is not enough available PCI memory to allocate to all devices installed in the system. Devices which were not allocated requested resources may not operate properly.This occurs during the I/O configuration phase of POST, after the System ROM has allocated most of the available memory for some PCI devices, leaving insufficient memory for PCI devices that have not yet been configured.The above message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows.This message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows.If some PCI devices are not allocated memory and the warning message appears during POST, perform one or more of the following potential workarounds to allow the remaining PCI devices to receive their requested memory allocations:If the server operating system documentation states that it requires 2GB (or more) of memory below the 4GB address boundary, do not perform Step 1 below because it may result in operating system boot failure.If the operating system documentation does not specify its memory requirements below the 4GB boundary, the Step 1 procedure below may be attempted. However, if performing Step 1 results in operating system boot failure, perform Step 1 again and change Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O , and then perform Step 2 below: 1. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU). a. Boot the server. b. Press the F9 key during POST (when the F9 prompt appears). c. Select Advanced Options. d. Select Advanced System ROM Options. e. Select Memory Mapped I/O Options. f. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of Memory Mapped I/O or Automatically configure Memory Mapped I/O. g. Reboot the server and verify that no warning messages appear during POST. If the operating system will not boot, perform Step 1 again and reset Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . 2. 3. 64 If the warning message continues to appear, ensure that all slotted PCI devices are using updated firmware and drivers and reboot the server. If the warning message continues to appear, determine which adapter is least critical for the operating environment and remove or disable that adapter. Repeat this step until the server completes POST without displaying this error message. Removal and replacement procedures NOTE: For ProLiant DL980 G7 servers, when there is an HP NC550SFP 10Gb 2-port PCIe x8 Ethernet Adapter in I/O slot 9 and an HP CN1000E Converged Network Adapter in I/O slot 10, during a network stress test (netperf), the connection in the second port of the CN1000E may be dropped. This issue may also occur when there is an HP CN1000E Converged Network Adapter in slot 9 and a HP CN1000E Converged Network Adapter in slot 10. This 1. 2. 3. 4. issue occurs in the following scenario: Run a network stress test (netperf). Shut down the stress test and reboot the server. Run netperf again. The connections to the clients will be made at a slow rate and then finally the connection to slot 9 and 10 will be dropped. This occurs because the ServerEngines driver is not getting enough MSI messages at driver load time. On a ProLiant DL980 system, the driver is not getting enough MSI-X interrupts, so the system is reverting to legacy interrupt mode.For any ProLiant DL980 G7 server running Windows Server 2008 that has either an NC550SFP in slot 9 and an HP CN1000E Converged Network Adapter in slot 10 or an HP CN1000E Converged Network Adapter in slot 9 and an HP CN1000E Converged Network Adapter in slot 10, perform the following to allow netperf to run in this configuration without connections dropping: 1. Go to the Start menu, then "Run." 2. Type "cmd." 3. From the command prompt, type "bcdedit /set UsePhysicalDestination yes." NOTE: When multiple LAN-On-Motherboard (LOM) ports on an NC375i Network Adapter configured in a ProLiant DL980 G7 server are connected to a DHCP and a PXE server, booting from the PXE server may not succeed with the following error message: No filename or root path specified(There is no F12 key option available to boot from a PXE server.)This occurs due to the PXE implementation in the adapter firmware, which is not HP-specific.his issue only occurs when more than one LOM ports are connected AND Port 2 is used to boot from the PXE server. If only Port 2 is connected, the PXE boot will succeed. NOTE: If an HP ProLiant DL980 G7 with System ROM 2010.07.27 or a ProLiant DL580 G7 with System ROM 2010.08.28 is used with Integrated Lights-Out 3 (iLO 3) Firmware Version 1.15 (or later) and I/O cards are installed in SubIO (I/O expansion board) slots or LPIO (Low Profile PCI-e I/O expansion board) slots, then the server Power-On-Boot process may stop responding at the point where "Inlet Ambient Temperature" is displayed. The issue has been detected with a large range of I/O cards including the HP NC522SFP 10G NIC, Smart Array P212 Controller, and Smart Array P800 Controller. In addition, this may also potentially occur when any I/O card is installed in SubIO/LPIO slots with the BIOS/iLO 3 firmware combination described above.When this occurs, there are no Integrated Management Log (IML) events or other indications other than the boot sequence does not progress past "Inlet Ambient Temperature" as shown above.To prevent the server from ceasing to respond during the Power-On-Boot process, upgrade the System ROM to HP ProLiant DL980 G7 System ROM 2011.01.27 (or later). NOTE: cards: Any HP ProLiant DL980 server configured with any of the following HP IO Accelerator ◦ 160GB SLC PCIe ioDrive (part number 600278-B21) ◦ 320GB MLC PCIe ioDrive (part number 600279-B21) ◦ 320GB SLC PCIe ioDuo (part number 600281-B21) ◦ 640GB MLC PCIe ioDuo (part number 600282-B21) I/O expansion board 65 ◦ 1.28TB MCL PCIe ioDuo (part number 641027-B21) may experience thermal throttling when the server is running a System ROM dated July 27, 2010 (2010.07.27) or July 7, 2010 under both of the following conditions: ◦ An application has sustained high WRITE-bandwidth demands to the HP IO Accelerators. ◦ High ambient (data center) temperature (>25deg C). When the IO accelerator card begins thermal throttling, the system will display the following warnings: Thermal throttling activated ()When the IO accelerator card stops thermal throttling, the system will display the following warning: Thermal throttling deactivated ()The above warning messages will be logged as follows: ◦ For Linux operating systems in: /var/log/messages ◦ For Windows operating systems in: the Windows system event log. To avoid the temperature messages, perform either of the following: ◦ Accept "reduced write bandwidth" when prompted by the server. (With reduced cooling, the IO Accelerator cards will self manage the critical internal component temperature to stay within specifications. With no firmware change, the IO Accelerator cards will reduce WRITE bandwidth to remain within temperature specifications. The expected WRITE bandwidth reduction is relatively small.) ◦ Upgrade the System ROM to a version dated January 27, 2011 (1/27/2011) or later. NOTE: When the HP ProLiant DL980 G7 server is configured with the Low-profile PCI Express I/O expansion kit (Option Part Number AM434A) and no additional I/O backplane options are installed, I/O devices installed in the Low Profile I/O backplane may not function, causing the operating system to generate a machine check when attempting to access the devices. When this occurs, a message similar to the following will be displayed in the Integrate Management Log (IML):Uncorrectable Machine Check Exception (Board 0, Processor 5 or 6, APIC ID 0x000000A0, Bank 0x0000000B or 0x0000000C, Status 0xFA000000'00160F0F, Address 0x00000000'00000000, Misc 0x65000000'00000090)This is targeted to be resolved in a future version of the System ROM. As a workaround, perform either of the following: ◦ Remove the Low-profile PCI Express I/O expansion kit (Option Part Number AM434A) ◦ Order either of the following I/O backplane options and then add them to the server: – PCI Express I/O expansion kit option part number 588139-B21 – PCI-X / PCI Express I/O expansion kit option part number 588137-B21 NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped I/O) memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O configurations, resulting in the following warning message: NOTE: Five or more PCIe IO Accelerator Cards are now supported when running DL980 G7 System ROM version 2011.01.27 (or later) and PCIe IO Accelerator Card firmware driver version 2.2.3 (or later). The server supports up to 5 low profile PCI Express expansion slots in the optional low profile PCI Express expansion module. 66 Removal and replacement procedures NOTE: On an HP ProLiant DL980 G7 server with a 128 logical CPU configuration, if an HP NC382T PCI Express Dual Port Multifunction Gigabit Server Adapter is located in any Low Profile IO slot, the network connection may drop or the NIC may stop responding. This can occur while running Windows Server 2008 R2 and HP Network Configuration Utility for Windows Server 2008 R2 Version 10.10 or Version 10.20. To prevent network connections from dropping, upgrade to HP Network Configuration Utility for Windows Server 2008 R2 Version 10.30 (or later). SAS backplane To remove the component: 1. Power down the server. 2. Extend the server from the rack. 3. Remove the access panel. 4. Remove all hard drives (“SAS/SATA hard drive” (page 22)). 5. Disconnect all cables from the SAS backplane. 6. Release the locking latch. 7. Remove the SAS backplane. To replace the component, reverse the removal procedure. XNC module 1. 2. Power off the server (“Power off the server” (page 22)). Release the latches on the release lever. SAS backplane 67 3. Lower the handle, and then remove the component from the server. CAUTION: Do not replace either the SPI board, main I/O board, upper CPU board, lower CPU board or XNC boards with new components at the same time. CAUTION: If replacing this component with a new part, all component firmware must be updated (“Flashing firmware using Smart Components” (page 77)) before replacing any other component. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. To replace the component, reverse the removal procedure. System board WARNING! The server weighs approximately 72.6 kg–93 kg (160 lb–205 lb). To reduce the risk of injury due to the weight of the server, remove the following components before removing the server from the rack: • Processor memory module • Hard drives • Power supplies The server weighs 21.8 kg (48 lb) with these components removed and might require two people to remove the server from the rack. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 21)). CAUTION: Only authorized technicians trained by HP should attempt to remove the system board. If you believe the system board requires replacement, contact HP Technical Support before proceeding. 68 Removal and replacement procedures 1. 2. 3. 4. 5. 6. 7. 8. 9. Power off the server (“Power off the server” (page 22)). Remove the server from the rack. Remove the access panel. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). Disconnect all cables from all installed expansion boards. Remove all expansion boards (“Non-hot-plug expansion board” (page 52)). Remove the SPI board (“Remove the SPI board” (page 56)). Remove the I/O expansion board, if installed. Remove the system board. To replace a system board: 1. Install the spare system board. 2. 3. Replace all components removed from the failed system board. Install the access panel. System board 69 4. 5. Slide the server back into the rack. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Service Options. 4. Select Serial Number. The following warnings appear: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis. Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. 6. 7. Press the Enter key to clear the warning. Enter the serial number and press the Enter key. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Product ID on the chassis. 8. 9. 10. 11. Enter the product ID and press the Enter key. Press the Esc key to close the menu. Press the Esc key to exit RBSU. Press the F10 key to confirm exiting RBSU. The server automatically reboots. Re-entering the server serial number and product ID After you replace the SPI board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Serial Number. The following warning is displayed: Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis. 4. 5. 6. Press the Enter key to clear the warning. Enter the serial number. Select Product ID. The following warning is displayed: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. 7. 8. 9. 10. Enter the product ID, and press the Enter key. Press the Esc key to close the menu. Press the Esc key to exit RBSU. Press the F10 key to confirm exiting RBSU. The server automatically reboots. Power backplane To remove the component: 1. Power off the server (“Power off the server” (page 22)). 2. Extend the server from the rack. 3. Remove the access panel. 4. Remove all power supplies (“Hot-plug power supply” (page 24)). 5. Remove the XNC module (“XNC module” (page 67)). 70 Removal and replacement procedures 6. 7. 8. 9. Remove the SPI board (“SPI board components” (page 96)). Remove the processor memory drawers (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). Remove the system board (“System board” (page 68)). Disconnect the upper cables from the power supply backplane: a. Disconnect the upper fan power cable. b. Remove the screws and disconnect the power cable. c. Remove the lower fan power cable from the cable management slot. 10. Disconnect the lower cables from the power supply backplane: a. Disconnect the lower fan power cable from the power backplane. b. Lift the release latch. c. Disconnect the lower power cable from the power supply backplane. Power backplane 71 11. Remove the two screws (if present), slide the plastic retainer to the rear of the server, and then remove the backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data. 72 Removal and replacement procedures If you suspect a TPM board failure, leave the TPM installed and remove the system board (“System board” (page 68)). Contact an HP authorized service provider for a replacement system board and TPM board. HP Trusted Platform Module 73 3 Upgrading a 4s configuration to an 8s configuration To upgrade your DL980 G7 server from a 4s configuration to an 8s configuration: 1. Verify that the current system firmware is the latest available and if necessary upgrade the system firmware (“Flashing firmware” (page 75)). 2. Power off the server and disconnect the power cords (“Power off the server” (page 22)). 3. Remove the lower processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 4. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 5. Install processors 5 through 8 in the lower processor memory drawer. For instructions on installing a processor, see the HP ProLiant DL980 G7 Server User Guide. 6. Install DIMMs in the lower processor memory drawer (“DIMMs” (page 30)). CAUTION: Ensure that you follow DIMM installation guidelines (“DIMM installation guidelines” (page 35)) and memory cartridge population guidelines (“Memory cartridge population guidelines” (page 36)). Failure to follow these guidelines may result in the inability to recognize memory, memory errors, or reduced memory performance. 7. Connect XNC cabling (“XNC cabling” (page 102)). CAUTION: XNC cabling is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. 8. 9. 74 Install any additional components, such as the power profile I/O assembly. Connect the power cords and power on the server. Verify server operation by monitoring POST messages and checking the iLO IML log. Upgrading a 4s configuration to an 8s configuration 4 Flashing firmware Flashing firmware requirements A firmware update is required when upgrading to Intel® Xeon® E7 Family processors or when replacing a SPI board, main I/O board, upper CPU board, lower CPU board, or XNC assembly with a new part. • The system firmware must be upgraded to a minimum level of HWM5.1. • If upgrading the CPUs.The CPUs and heatsinks must be replaced with the new CPUs and heatsinks. • The server must only contain supported I/O cards. The following cards are no longer supported on the DL980 G7 Server with Intel Xeon E7 Family® processors. I/O Card Part number HP NC364T PCIE 4 Port 1GbE 435508-B21 HP NC522SFP Dual Port 10GbE Server Adapter 468332-B21 SC08Ge 488765-B21 To upgrade system firmware, use one of the following methods: • Flashing firmware using Offline Update Method. This is the preferred method for all operating system. • Flashing firmware using Smart Components. This method may be used for Windows and Linux operating systems. Before contacting HP, always attempt to resolve problems by completing the procedures in this guide. NOTE: Collect the appropriate server information and operating system information before contacting HP for support. For United States and worldwide contact information, see the Contact HP website (http:// www.hp.com/go/assistance). In the United States: • To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be recorded or monitored. If you have purchased a Care Pack (service upgrade), see the Support & Drivers website (http:// www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website, call Flashing firmware requirements 75 1-800-633-3600. For more information about Care Packs, see the HP website (http:// pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html). • In other locations, see the Contact HP worldwide (in English) (http://welcome.hp.com/country/ us/en/contact_us.html) webpage. CAUTION: If replacing a SPI board, main I/O board, upper CPU board, lower CPU board, or XNC assembly with a new part, all component firmware must be updated before replacing any other component. Do no replace either the SPI board, main I/O board, upper CPU board, lower CPU board, or XNC assembly with new components at the same time. CAUTION: Physical access to the server is required for updating these components. This procedure cannot be performed remotely or with automated deployment. NOTE: Read through the entire firmware update process before beginning. Flashing firmware using Offline Update This procedure can be used for Windows, Linux, Solaris and VMware operating systems. CAUTION: Physical access to the server is required for updating these components. This procedure cannot be performed remotely or with automated deployment. Do not use vMedia Functionality. CAUTION: While upgrading the firmware, do not power off the server or attempt any operations. CAUTION: All steps of this procedure must be performed in the exact order given in this procedure. Once the upgrade is started, complete the entire update. Do not stop at any point during the update. 76 NOTE: Read through the entire firmware update process before beginning. NOTE: This procedure will take approximately 2 - 4 hours to complete. 1. Obtain the Flash System Programmable Logic Offline Update ISO Image and the latest BIOS (System ROM): a. Go to the Contact HP United States (http://welcome.hp.com/country/us/en/ contact_us.html) webpage. b. Select Support and Driver downloads. c. Select Drivers and Software. d. Enter a product name/number (for example: DL980), and click Search. e. Click HP ProLiant DL980 G7 Server. f. To retrieve an index of all available drivers, system management applications, BIOS, firmware, software, and utilities, click your operating system. 2. 3. 4. 5. Flash BIOS (System ROM) by following the component installation instructions. Power down to Stand-By (dc power off). Using the web interface, flash iLO. Using the Offline Update ISO Image by following the installation instructions in the README.txt file included in the zip file with the ISO image, flash System Programmable Logic. a. Insert the update media (CD or USB key) into the DL980 G7 server, and power up or reset the system. b. Allow the system to boot normally; it will auto-boot into the update media. c. After several minutes you will be presented with a splash screen. Proceed with the update, accepting each of the three updates as they occur. Flashing firmware 6. Disconnect all power cables from the server, and wait at least 30 seconds. CAUTION: After flashing the System Programmable Logic Devices, the power must cycle for the changes to take effect. All power cables must be unplugged for at least 30 seconds to allow the components to lose their residual charge. Pressing the power button is not sufficient. 7. 8. 9. 10. If installing new processors (“Processor” (page 44)), install them now. Connect the power cables to the server. Power up the server. HP recommends verifying post by watching POST codes through iLO IRC (bottom banner). Flashing firmware using Smart Components CAUTION: Physical access to the server is required for updating these components. This procedure cannot be performed remotely or with automated deployment. NOTE: Read through the entire firmware update process before beginning. Procedure for Windows and Linux operating systems CAUTION: All steps of this procedure must be performed in the exact order given in this procedure. Once the upgrade is started, complete the entire update. Do not stop at any point during the update. NOTE: While upgrading the firmware, do not power off the server or attempt any operations. NOTE: This procedure will take approximately 2 - 4 hours to complete. This procedure uses Smart Components. Smart Components are self-extracting executables, with a filename based on the component number. 1. Obtain the latest BIOS (System ROM) and device drivers: a. Go to the Contact HP United States (http://welcome.hp.com/country/us/en/ contact_us.html) webpage. b. Select Support and Driver downloads. c. Select Drivers and Software. d. Enter a product name/number (for example: DL980), and click Search. e. Click HP ProLiant DL980 G7 Server. f. To retrieve an index of all available drivers, system management applications, BIOS, firmware, software, and utilities, click your operating system. 2. The appropriate device driver must be installed and running before using this flash component. CAUTION: If the appropriate device driver is not installed and running before using this flash component, you will receive the following error message if the driver is not running. "The software is not supported for installation on this system. You must install the iLO Channel Interface driver to use this component." 3. 4. • On the Windows operating system, install the HP ProLiant iLO 3 Management Controller Driver Package. • On the Linux operating system, install the HP ProLiant Channel Interface Device Driver for iLO. Follow the component installation instructions to flash BIOS (System ROM). Power down to Stand-By. Flashing firmware using Smart Components 77 5. 6. 7. 8. Use the web interface to flash iLO. Power on the system. Boot the system to the OS. If running, disable SNMP agents service. • For a. b. c. d. • For Linux operating systems, enter Windows operating systems: Run Services. Select SNMP Service. Click Stop to stop the service. Click yes to stop the services indicated. service hp-snmp-agents stop . 9. Flash the FPGA using the FPGA Smart Component. NOTE: When updating the individual components, the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. For components other than is CPLD, you can select "Close" and continue with the rest of the firmware update process. For the CPLD, you must select "install" and update the CPLD. TIP: 78 Flashing firmware The estimated time for this update is 10 - 15 minutes. a. b. c. d. e. f. Download the Smart Component to a directory on the hard drive and change to that directory. • Download the FPGA firmware for the Windows operating system (ftp://ftp.hp.com/ pub/softlib2/software1/sc-windows-fw/p2013128495/v68025). • Download the FPGA firmware for the Linux operating system (ftp://ftp.hp.com/pub/ softlib2/software1/sc-linux-fw/p1486976799/v68026). From that drive and directory, execute the downloaded file. Linux users can execute "sh CPxxxxxx.scexe" where CPxxxxxx.scexe represents the filename of the component. Click "Install" when prompted. If the first update pass fails, retry flashing the FPGA. If the second update pass fails, browse to the iLO web information Diagnostics tab, and use the Reset button to reset iLO. Retry flashing the FPGA. Upon successful update, the following dialog boxes will appear. Do not restart the server at this time. CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated. g. Click Restart Later. 10. Flash the CPLD using the CPLD Smart Component. Flashing firmware using Smart Components 79 NOTE: When updating the individual components, the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. For components other than is CPLD, you can select "Close" and continue with the rest of the firmware update process. For the CPLD, you must select "install" and update the CPLD. TIP: a. b. c. d. e. f. The estimated time for this update is approximately one hour. Download the Smart Component to a directory on the hard drive and change to that directory. • Download the CPLD firmware for the Windows operating system (ftp://ftp.hp.com/ pub/softlib2/software1/sc-windows-fw/p350928355/v68911). • Download the CPLD firmware for the Linux operating system (ftp://ftp.hp.com/pub/ softlib2/software1/sc-linux-fw/p290132142/v68931). From that drive and directory, execute the downloaded file. Linux users can execute "sh CPxxxxxx.scexe" where CPxxxxxx.scexe represents the filename of the component. Click "Install" when prompted. If the first update pass fails, retry flashing the CPLD. If the second update pass fails, browse to the iLO web information Diagnostics tab and use the Reset button to reset iLO. Retry flashing the CPLD. Upon successful update, the following dialog box will appear. Do not restart the server at this time. CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated. 11. Flash the FMP using the FMP Smart Component. NOTE: When updating the individual components, the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. For components other than is CPLD, you can select "Close" and continue with the rest of the firmware update process. For the CPLD, you must select "install" and update the CPLD. 80 Flashing firmware TIP: a. b. c. d. e. f. The estimated time for this update is approximately one hour. Download the Smart Component to a directory on the hard drive and change to that directory. • Download the FMP firmware for the Windows operating system (ftp://ftp.hp.com/ pub/softlib2/software1/sc-windows-fw/p2062200202/v68009). • Download the FMP firmware for the Linux operating system (ftp://ftp.hp.com/pub/ softlib2/software1/sc-linux-fw/p1438027470/v68004). From that drive and directory, execute the downloaded file. Linux users can execute "sh CPxxxxxx.scexe" where CPxxxxxx.scexe represents the filename of the component. Click "Install" when prompted. If the first update pass fails, retry flashing the FMP. If the second update pass fails, browse to the iLO web information Diagnostics tab and use the Reset button to reset iLO. Retry flashing the FMP. Upon successful update, the following dialog box will appear. CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated. 12. Shutdown the OS. 13. Unplug all power cables from the server, and wait at least 30 seconds. CAUTION: After flashing the System Programmable Logic Devices, the power must cycle for the changes to take effect. All power cables must be unplugged for at least 30 seconds to allow the components to lose their residual charge. Pressing the power button is not sufficient. 14. 15. 16. 17. If installing new processors (“Processor” (page 44)), install them now. Connect the power cables to the server. Power up the server (dc on). Verify post by watching post codes through iLO IRC (bottom banner). This step is optional, but recommended. Flashing firmware using Smart Components 81 Procedure for Solaris and VMware operating systems For Solaris and VMware operating systems use the Flashing firmware using Offline Update Method. 82 Flashing firmware 5 Component identification Front panel components Item Description 1 Hard drive bay 1 2 Hard drive bay 2 3 Hard drive bay 3 4 Hard drive bay 4 5 Hard drive bay 5 6 Hard drive bay 6 7 Hard drive bay 7 8 Hard drive bay 8 9 Optical drive bay 10 UID button and LED 11 Health LED 12 NIC 1 LED 13 NIC 2 LED 14 NIC 3 LED 15 NIC 4 LED 16 Power on/Standby button and LED 17 SID 18 USB connectors 19 Video connector Front panel components 83 Item Description 20 Processor memory tray (upper) 21 Processor memory tray (lower) Front panel LEDs Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server being managed remotely Off—Deactivated 2 Health LED Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) 3 NIC 1 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 4 NIC 2 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 5 NIC 3 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 6 84 Component identification NIC 4 LED Green—Linked to network Item Description Status Green (flashing)—Linked with activity on the network Off—No network connection 7 Power on/Standby button and LED Amber—System has AC power and is in standby mode. Green—System has AC power and is powered on. Off—System has no AC power. System Insight Display LEDs LED Component POWER System power Description Green—Normal (system on) Off—Normal (system off) BOOT PROGRESS Boot progress Green—Normal (system on) Green (flashing)—Normal (system on reset) Amber (flashing)—No POST code within first timeout period Red (flashing)—No POST code within a subsequent second timeout period Off—Normal (system off) System Insight Display LEDs 85 LED Component EXT HEALTH External component health Description Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) POWER CAP Powering capping Green—System on or requesting power on Flashing amber—Power on denied Off—Standby OVER TEMP Over temperature Off—Normal Amber—Failed or missing component AMP Advanced memory protection Off—No protection Green—Protection enabled Amber—Memory failure occurred Amber (flashing)—Memory configuration error PS X Power supply Off—Normal Amber—Failed or missing component FAN X Fan Off—Normal Amber—Failed or missing component SPI ILK SPI board not properly seated Off—Normal Amber—Failed or missing component XNC XNC board not properly seated Off—Normal Amber—Failed or missing component CABLE LOWER CPU INK UPPER CPU ILK PROC X XNC J-Link cables or management cable Amber—Failed or missing component Off—Normal Lower processor memory drawer not fully seated Amber—Failed or missing component Upper processor memory drawer not fully seated Amber—Failed or missing component Processor Off—Normal Off—Normal Off—Normal Amber—Failed or missing component UPPER CPU LOWER CPU MEMORY BOARD X DIMM 1A-8D Indicates upper CPU tray with associated CPUs, memory risers and DIMMs Indicates lower CPU tray with associated CPUs, memory risers and DIMMs DIMM slot Off—Normal Amber—Failed or missing component Off—Normal Amber—Failed or missing component Off—Normal Amber—Failed or missing component 86 Component identification Processor and memory board configuration / logical (physical) location Upper processor memory board is shown on the left. Lower processor memory board is shown on the right. Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application. On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application. On Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible. On Off The drive is online, but it is not active currently. Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete. Hard drive LEDs 87 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Off Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is rebuilding, or it is part of an array that is undergoing capacity expansion or stripe migration. Flashing irregularly Amber, flashing regularly (1 Hz) The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible. Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible. Off Off The drive is offline, a spare, or not configured as part of an array. Rear panel components 88 Item Description 1 Torx T-15 Tool 2 iLO 3 connector 3 Mouse connector Component identification Item Description 4 Serial connector 5 NIC connector 2 6 NIC connector 4 7 UID 8 NIC connector 3 9 NIC connector 1 10 Video connector 11 Keyboard connector 12 USB connectors 13 I/O expansion slots 14 Small form factor I/O expansion slots (optional) 15 XNC connectors 16 XNC management connector 17 Power supply 8 18 Power supply 7 19 Power supply 6 20 Power supply 5 21 Power supply 4 22 Power supply 3 23 Power supply 2 24 Power supply 1 Rear panel components 89 Rear panel LEDs Item Description LED color Status 1 iLO3 NIC Activity LED Green On or flashing—Network activity Off—No network activity 2 iLO3 NIC Link LED Green On—Linked to network Off—Not linked to network 3 NIC 2 Activity LED Green On or flashing—Network activity Off—No network activity 4 NIC 2 Link LED Green On—Linked to network Off—Not linked to network 5 NIC 4 Activity LED Green On or flashing—Network activity Off—No network activity 6 NIC 4 Link LED Green On—Linked to network Off—Not linked to network 90 Component identification Item Description LED color Status 7 UID LED Blue On—UID active Off—UID inactive 8 NIC 3 Link LED Green On—Linked to network Off—Not linked to network 9 NIC 3 Activity LED Green On or flashing—Network activity Off—No network activity 10 NIC 1 Link LED Green On—Linked to network Off—Not linked to network 11 NIC 1 Activity LED Green On or flashing—Network activity Off—No network activity Power supply LED Power LED Status Off No AC power to power supply units Green AC is present. Standby output is on, output is disabled. Green AC is present. Standby output is on, power supply DC output is on and OK. Off Power supply failure (includes overvoltage and overtemperature) Power supply LED 91 Fan location 92 Component identification Item Description 1 Fan 4 2 Fan 3 3 Fan 2 4 Fan 1 5 Fan module 6 6 Fan module 5 Fan location 93 System board components Item Description 1 Optional I/O expansion board connectors: • PCI-X/PCI Express I/O expansion board • PCI Express I/O expansion board 94 2 Slot 7 PCIe2 x8 (4, 2, 1) 3 Slot 8 PCIe2 x8 (4, 2, 1) 4 Slot 9 PCIe2 x16 (8, 4, 2, 1) 5 Slot 10 PCIe2 x8 (4, 2, 1) 6 Slot 11 PCIe2 x8 (8, 4, 2, 1) 7 SPI board connector 8 Internal USB connectors (2) 9 NMI jumper 10 System maintenance switch 11 Optical drive connector 12 Video/USB connector 13 Solid state drive connector 14 Power button/UID connector Component identification System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off. Position Description Function S1 iLO3 security Off = iLO3 security is enabled. On = iLO3 security is disabled. S2 Configuration lock Off = System configuration can be changed. On = System configuration is locked. S3 Reserved Reserved S4 Reserved Reserved S5 Password protection override Off = No function On = Clears power-on password and administrator password S6 Invalidate configuration Off = Normal On = Clears NVRAM S7 Reserved Reserved S8 Reserved Reserved System board components 95 SPI board components Item Description 1 Mini SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data connector 5 RMII connector 6 SD card slot 7 Battery 8 10Gb NIC connector 9 NIC cache connector 10 NIC 3 connector 11 NIC 1 connector 12 Video connector 13 Keyboard connector 14 USB connectors (2) 15 iLO 3 connector 16 Mouse connector 17 Serial connector 18 NIC 2 connector 19 NIC 4 connector Expansion board components • 96 PCI-X/PCI Express I/O expansion board Component identification Item Description 1 Slot 6 PCIe2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe2 x8 (4, 2, 1) 3 Slot 3 PCIe2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI-X 5 Slot 1 PCI-X 1 • 1 Slot 4 is physically a x8 slot but operates electrically as a x4 slot. PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (8, 4, 2, 1) 2 Slot 5 PCIe2 x16 (8, 4, 2, 1) 3 Slot 4 PCIe2 x8 (4, 2, 1) 4 Slot 3 PCIe2 x16 (8, 4, 2, 1) 5 Slot 2 PCIe2 x16 (8, 4, 2, 1) 1 2 3 4 Expansion board components 97 Item Description 5 6 • Slot 1 PCIe1 x8 (4, 2, 1) 6 1 Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. 2 Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. 3 Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots. 4 Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. 5 Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. 6 Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots. Low profile I/O expansion board Item Description 1 Slot 12 Low profile PCIe2 x8 (4, 2, 1) 2 Slot 13 Low profile PCIe2 x8 (4, 2, 1) 3 Slot 14 Low profile PCIe2 x4 (2, 1) 4 Slot 15 Low profile PCIe x8 (4, 2, 1) 5 Slot 16 Low profile PCIe x8 (4, 2, 1) DIMM slot locations Each memory module contains 8 DIMM slots. The paired banks are identified by the letters A through D. 98 Component identification Device numbers Battery pack LEDs Item Color Description 1 Green System Power LED. This LED is on when the system is powered up and 12 V system power is available. This power supply is used to maintain the battery charge and provide supplementary power to the cache microcontroller. 2 Green Auxiliary Power LED. This LED is on when 3.3V auxiliary voltage is detected. The auxiliary voltage is used to preserve BBWC data and is available any time that the system power cords are connected to a power supply. Device numbers 99 Item Color Description 3 Amber Battery Health LED. To interpret the illumination patterns of this LED, see the following table. 4 Green BBWC Status LED. To interpret the illumination patterns of this LED, see the following table. LED3 pattern LED4 pattern Interpretation Off Flashing (2 Hz) The system is powered down, and the cache contains data that has not yet been written to the drives. Restore system power as soon as possible to prevent data loss. Data preservation time is extended any time that 3.3 V auxiliary power is available, as indicated by LED 2. In the absence of auxiliary power, battery power alone preserves the data. A fully-charged battery can normally preserve data for at least 2 days. The battery lifetime also depends on the cache module size. For more information, see the controller QuickSpecs on the HP website (http:// www.hp.com). Off Double flash, then pause The cache microcontroller is waiting for the host controller to communicate. Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are unavailable temporarily until charging is complete. The recharge process takes between 15 minutes and 2 hours, depending on the initial capacity of the battery. Off On The battery pack is fully charged, and posted write data is stored in the cache. Off Off The battery pack is fully charged, and no posted write data exists in the cache. Flashing (1 Hz) Flashing (1 Hz) An alternating green and amber flashing pattern indicates that the cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller. On — A short circuit exists across the battery terminals or within the battery pack. BBWC features are disabled until the battery pack is replaced. The life expectancy of a battery pack is typically more than 3 years. Flashing (1 Hz) — An open circuit exists across the battery terminals or within the battery pack. BBWC features are disabled until the 100 Component identification LED3 pattern LED4 pattern Interpretation battery pack is replaced. The life expectancy of a battery pack is typically more than 3 years. Battery pack LEDs 101 6 Cabling XNC cabling CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. For best cable management, follow the recommend connection order. 102 Cabling 1. 2. Make connections labeled 1 through 8 in the illustration. Refer to cabling illustrations and table to make connections 9 though 16. For example, to make the ninth connection, to upper board 1, use the cable connected to lower board 4. Connection sequence Board Number Connects to Connection sequence Board Number Seventh Lower 4 Connects Ninth Upper 1 Third Lower 3 Connects Tenth Upper 2 Eighth Lower 2 Connects Eleventh Upper 3 Fourth Lower 1 Connects Twelfth Upper 4 Fifth Lower 8 Connects Thirteenth Upper 5 First Lower 7 Connects Fourteenth Upper 6 Sixth Lower 6 Connects Fifteenth Upper 7 Second Lower 5 Connects Sixteenth Upper 8 DVD-ROM drive cabling DVD-ROM drive cabling 103 7 Specifications Environmental Specifications Specification Value System inlet temperature — Operating 10° to 35°C (50° to 95°F) at sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10°C/hr (18°F/hr). The upper limit may be limited by the type and number of options installed. System performance may be reduced if operating with a fan fault or above 30°C (86°F). Non-operating -30° to 60°C (-22° to 140°F). Maximum rate of change is 20°C/hr (36°F/hr). Relative humidity (non-condensing) — Operating 10 to 90% relative humidity (Rh), 28°C (82.4°F) maximum wet bulb temperature, non-condensing. Non-operating 5 to 95% relative humidity (Rh), 38.7°C (101.7°F) maximum wet bulb temperature, non-condensing. Altitude — Operating 3050 m (10,000 ft). This value may be limited by the type and number of options installed. Maximum allowable altitude change rate is 457 m/min (1500 ft/min). Non-operating 9144 m (30,000 ft). Maximum allowable altitude change rate is 457 m/min (1500 ft/min). Acoustic noise Listed are the declared A-Weighted sound power levels (LWAd) and declared average bystander position A-Weighted sound pressure levels (LpAm) when the product is operating in a 23°C ambient environment. Noise emissions were measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Idle L WAd 7.5 Bels L pAm 59.7 dB Operating L WAd 7.5 Bels L pAm 89.7 dB Emissions Classification (EMC) — FCC rating Class A Normative Standards CISPR 22; EN55022; EN55024; FCC CFR 47, Pt 15; ICES-003; CNS13438; GB9254; K22;K24; EN 61000-3-2; EN 61000-3-3; EN 60950-1; IEC 60950-1 104 Specifications Server Specifications Specification Value Dimension — Height 35.36 cm (13.92 in) Depth 87.63 cm (34.5 in) Width 48.26 cm (19.0 in) Weight (maximum) 93 kg (205 lb) Weight (one hard drive, power supply and processor installed) 75 kg (165 lb) Input requirement1 — Rated line voltage 100-240 VAC Rates input current 9.3A @ 100 VAC 9.5A @ 108-120 VAC 6.6A @ 200-240 VAC Rated input frequency 50–60 Hz +/- 3hz Input power (maximum) 4600 W BTUs rating (maximum) 14,444 BTU/hr (worst case configuration and utilization) Power supply output (per power supply) — Rated steady-state power 800 W @ 100 VAC 900 W @ 110-120 VAC 1200 W @ 200-240 VAC Rated input power 950W @ 100 VAC 1075W @ 108–120 VAC 1375W @ 200-240 VAC Maximum peak power 960 W @ 100 VAC 1080 W @ 110-120 VAC 1440 W @ 200-240 VAC 1 To ensure the server has sufficient power during normal operation, a server configured with eight populated CPU sockets or a detected high power GPU requires high line (200 - 240 V) ac server configuration. As a precaution, if these configurations are detected on a low line (100 - 127 V) ac configured server the server will halt at Power-On Self-Test with a "Low line (100-120 VAC) power delivery is not sufficient for this configuration. High line (200-240 VAC) delivery is required to operate the system in its current configuration" message and only boot to RBSU. At POST, the server automatically detects whether the power supplies are connected to high-line power or low-line power. If the server is configured with eight populated CPU sockets or a detected high power GPU, the system will halt if it detects that the server is plugged into low-line power. This occurs by design because systems configured eight processors, and/ or high power graphics cards, with a large amount of memory, hard drives, or other options might require more power than can be provided by low-line power. POST halts this low-line configuration as a precaution against the server having insufficient power during operation. If a you wish to operate a server in this configuration when utilizing low-line power, the power supply solution should be verified as sufficient using the HP Power Advisor (http://www.hp.com/ go/hppoweradvisor). If the power solution is not deemed sufficient, the server may not have Server Specifications 105 sufficient power to operate normally. If the solution is deemed sufficient, a ROM-Based Setup Utility option, outlined below, can be used to allow the system to operate in this configuration. If the HP Power Advisor has determined that the server can be reliably powered at low-line power in this configuration, perform the following steps to override the Power Supply Requirements setting in ROM-Based Setup Utility (RBSU): 1. When the server halts, access RBSU. 2. Select "Advanced Options". 3. Scroll down to "Power Requirements Override" and choose to enable it. 4. Exit RBSU,which will reboot the server and should bypass the message on the subsequent boot. 106 Specifications 8 Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache FBWC flash-backed write cache GPU graphics processing unit IEC International Electrotechnical Commission iLO 3 Integrated Lights-Out 3 IML Integrated Management Log NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test RBSU ROM-Based Setup Utility 107 SAS serial attached SCSI SD Secure Digital SFF small form factor SIM Systems Insight Manager SPI system peripheral interface SSD support software diskette TPM Trusted Platform Module UID unit identification USB universal serial bus 108 Acronyms and abbreviations 9 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback. Include the document title and part number, version number, or the URL when submitting your feedback. 109 Index Symbols 4s to 8s upgrade, 74 B battery Battery, 60 SPI board components, 96 battery pack LEDs, 99 battery-backed write cache (BBWC) Battery pack LEDs, 99 Battery-backed write cache procedures, 53 BBWC low profile I/O expander location, 55 Recovering data from the battery-backed write cache, 55 Removing the BBWC battery pack, 54 SPI board components, 96 battery-backed write cache battery pack Battery-backed write cache procedures, 53 Removing the BBWC battery pack, 54 BBWC (battery-backed write cache) Battery pack LEDs, 99 Battery-backed write cache procedures, 53 Recovering data from the battery-backed write cache, 55 Removing the BBWC battery pack, 54 Removing the BBWC cache module, 53 blank, power supply, 23 board, SPI (System Peripheral Interface) Re-entering the server serial number and product ID, 70 Remove the SPI board, 56 SPI board components, 96 System board components, 94 C cables, 102 cabling, DVD-ROM drive, 103 cabling, XNC, 102 components, front panel Front panel components, 83 Front panel LEDs, 84 components, identification Component identification, 83 Illustrated parts catalog, 5 components, rear Rear panel components, 88 Rear panel LEDs, 90 components, SPI board, 96 components, system board System board components, 94 System maintenance switch, 95 connector, iLO3, 96 connector, keyboard, 96 connector, mouse, 96 connector, NIC, 96 connector, USB, 96 110 Index connector, video, 96 D device numbers, 99 DIMM installation guidelines DIMM installation guidelines, 35 Hemisphere mode, 37 DIMM slot locations, 98 DIMMs DIMM identification, 35 Single-, dual-, and quad-rank DIMMs, 34 drives, 22 DVD drive, 103 DVD-ROM drive DVD-ROM drive, 23 DVD-ROM drive cabling, 103 DVD-ROM drive, removing, 23 E electrostatic discharge, 21 expansion board, 52 expansion boards Expansion board options, 63 Low profile I/O expander, 50 Non-hot-plug expansion board, 52 expansion slots, 94 F fans Fans, 25 Hot-plug power supply, 24 Upper fans, 25 fans, removing Fans, 25 Upper fans, 25 fans, replacing Fans, 25 Upper fans, 25 features, 83 firmware, 75 firmware requirements, 75 firmware update, 75 firmware, updating, 75 front bezel, 58 H hard drive backplane, 67 hard drive LEDs Hard drive LED combinations, 87 Hard drive LEDs, 87 I I/O expansion boards, removing, 61 iLO 3 connector, 96 K Removal and replacement procedures, 21 Required tools, 21 keyboard connector, 96 L S LED, health, 84 LED, iLO 3 link Rear panel components, 88 Rear panel LEDs, 90 LED, UID Front panel LEDs, 84 Rear panel LEDs, 90 LEDs, 91 LEDs, battery pack, 99 LEDs, front panel, 84 LEDs, hard drive Hard drive LED combinations, 87 Hard drive LEDs, 87 LEDs, power supply, 91 LEDs, rear panel, 90 LEDs, Systems Insight Display, 85 LEDs, unit identification (UID), 84 safety considerations, 21 safety information, 21 SAS backplane, 67 SAS hard drive LEDs Hard drive LED combinations, 87 Hard drive LEDs, 87 serial connector, 96 serial number, 70 server asset text, 70 server specifications Server Specifications, 105 Specifications, 104 server warnings and cautions, 21 SID, 57 Solaris environments, 82 solid state drive, removing, 59 specifications, environmental Environmental Specifications, 104 Specifications, 104 specifications, server Environmental Specifications, 104 Specifications, 104 SPI (System Peripheral Interface) board Re-entering the server serial number and product ID, 70 Remove the SPI board, 56 SPI board components, 96 System board components, 94 static electricity, 21 status lights, battery pack, 99 switch, system maintenance, 94 system battery, 96 system board components System board components, 94 System maintenance switch, 95 system board replacement, 68 system board switches, 95 system components Component identification, 83 System components, 9 system maintenance switch System board components, 94 System maintenance switch, 95 System Peripheral Interface (SPI) board, 96 system power LED, 99 M mechanical components Illustrated parts catalog, 5 Mechanical Components, 5 memory, 34 memory cartridge, 27 memory module population guidelines Advanced ECC memory population guidelines, 39 Mirrored Memory population guidelines, 40 memory options, 32 memory performance optimization, 38 memory requirements, 38 mirrored memory, 40 mouse connector, 96 N NIC connectors, 96 non-hot-plug expansion boards, removing, 52 NVRAM, clearing, 95 P power LEDs, system, 99 power supplies, removing, 24 power supply bays, 91 power supply blank, 23 power supply LEDs, 91 power supply, installing, 24 processor, 44 processor memory module Processor and memory board configuration / logical (physical) location, 87 Remove a processor memory drawer cover, 27 Remove the upper or lower processor memory drawer or processor memory drawer blank, 26 R required tools T three slot option card connectors, 94 tools, 21 TPM (Trusted Platform Module), 72 Trusted Platform Module (TPM), 72 U upgrade 4s to 8s configuration, 74 USB connectors, 96 111 V video connector, 96 VMware ESX Server, configuring, 82 X XNC Module, 67 112 Index