Hx421c14fr2k4/32 Hx421c14fr2k4/32 Memory

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Memory Module Specifications HX421C14FR2K4/32 32GB (8GB 1G x 64-Bit x 4 pcs.) DDR4-2133 DDR4 2133 CL14 288 288-Pin Pin DIMM SPECIFICATIONS CL(IDD) 14 cycles Row Cycle Time (tRCmin) 46.5ns(min.) Refresh to Active/Refresh Command Time (tRFCmin) 350ns(min.) Row Active Time (tRASmin) 32.75ns(min.) Maximum Operating Power TBD W* UL Rating 94 V - 0 Operating Temperature 0o C to +85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX421C14FR2K4/32 is a kit of four 1G x 64-bit (8GB) • Power Supply: VDD = 1.2V Typical DDR4-2133 CL14 SDRAM (Synchronous DRAM) 1Rx8, memory • VDDQ = 1.2V Typical module, based on eight 1G x 8-bit FBGA components per module. • VPP - 2.5V Typical Each module kit supports Intel® Extreme Memory Profiles • VDDSPD = 2.2V to 3.6V (Intel® XMP) 2.0. Total kit capacity is 32GB. Each module has • Nominal and dynamic on-die termination (ODT) for been tested to run at DDR4-2133 at a low latency timing of 14-14-14 data, strobe, and mask signals at 1.2V. Additional timing parameters are shown in the • Low-power auto self refresh (LPASR) Plug-N-Play (PnP) Timing Parameters section below. The • Data bus inversion (DBI) for data bus JEDEC standard electrical and mechanical specifications are • On-die VREFDQ generation and calibration as follows: • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS. • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) JEDEC/XMP TIMING PARAMETERS • Fly-by topology • Terminated control command and address bus • • JEDEC/PnP: DDR4-2133 CL14-14-14 @1.2V XMP Profile #1: DDR4-2133 CL14-14-14 @1.2V • Height 1.340” (34.04mm), w/heatsink Continued >> hyperxgaming.com Document No. 4808071-001.A00 03/09/17 Page 1 continued MODULE WITH HEAT SPREADER 7.08 mm 34.04 mm 133.35 mm MODULE DIMENSIONS All measurements are in millimeters. (Tolerances on all dimensions are ±0.12 unless otherwise specified) 133.35 129.55 31.25 2.10± ±0.15 Pin 1 Detail A 3.35 Detail B Pin 35 Pin 47 Detail D Detail E 64.60 28.90 14.60 17.60 8.00 11.00 2.70±0.15 3.00 Detail C Pin 105 Pin 117 56.10 22.95 FOR MORE INFORMATION, GO TO HYPERXGAMING.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at published HyperX memory speeds and timing settings. Kingston does recommend that any user attempt their computers thethe published HyperX memory speeds and timing settings. Kingston does notnot recommend that any user attempt to to runrun their computers faster than published speed. Overclocking modifying your system timing may result damage computer components. faster than thethe published speed. Overclocking or or modifying your system timing may result in in damage to to computer components. HyperX is a division of Kingston. ©2017 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. Document No. 4808071-001.A00 Page 2 hyperxgaming.com