Hx424c15fb/16 Hx424c15fb/16 Memory Module

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Memory Module Specifications HX424C15FB/16 16GB 2G x 64-Bit DDR4-2400 DDR4 2400 CL15 288 288-Pin Pi DIMM SPECIFICATIONS CL(IDD) 15 cycles Row Cycle Time (tRCmin) 46.75ns(min.) Refresh to Active/Refresh Command Time (tRFCmin) 350ns(min.) Row Active Time (tRASmin) 29.125ns(min.) Maximum Operating Power TBD W* UL Rating 94 V - 0 Operating Temperature 0o C to +85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX424C15FB/16 is a 2G x 64-bit (16GB) DDR4-2400 CL15 • Power Supply: VDD = 1.2V Typical SDRAM (Synchronous DRAM) 2Rx8, memory module, based on • VDDQ = 1.2V Typical sixteen 1G x 8-bit FBGA components per module. Each module kit • VPP - 2.5V Typical supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. • VDDSPD = 2.2V to 3.6V Each module has been tested to run at DDR4-2400 at a low latency • Nominal and dynamic on-die termination (ODT) for timing of 15-15-15 at 1.2V. Additional timing parameters are data, strobe, and mask signals shown in the Plug-N-Play (PnP) Timing Parameters section • Low-power auto self refresh (LPASR) below. The JEDEC standard electrical and mechanical • Data bus inversion (DBI) for data bus specifications are as follows: • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS. • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) JEDEC/XMP TIMING PARAMETERS • Fly-by topology • Terminated control command and address bus • JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V • Height 1.340” (34.04mm), w/o heatsink DDR4-2133 CL14-14-14 @1.2V •XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V Continued >> hyperxgaming.com kingston.com/hyperx Document No. 4807670-001.A00 4807667-001.A00 03/18/16 Page 1 continued MODULE WITH HEAT SPREADER 7.08 mm 34.04 mm 133.35 mm MODULE DIMENSIONS 133.35 129.55 31.25 2.10± ±0.15 Pin 1 Detail A 3.35 Detail B Pin 35 Pin 47 Detail D Detail E 64.60 28.90 14.60 17.60 8.00 11.00 2.70±0.15 3.00 Detail C Pin 105 Pin 117 56.10 22.95 FOR MORE INFORMATION, GO TO HYPERXGAMING.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. HyperX is a division of Kingston. ©2016 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. Document No. 4807670-001.A00 Page 2 hyperxgaming.com