Transcript
iD9304 HIGH PSRR Dual LDO Regulator Features
General Description The iD9304 is a high accuracy dual-channel, low
Thermal Protection
noise, and low dropout regulator. It provides up to
Up to 200mA Output Current for each LDO
200mA current at each channel.
Dual EN/Shutdown Pins Control Each Output
The iD9304 uses a pass element which consumes low
Low Noise Output
supply current with both channels on independent of
Current Limiting Protection
load current and dropout conditions. The EN1 and
Short Circuit Protection
EN2 pins control each output and allow the output of
High PSRR Dual LDO in SOT-26 Package
each regulator to be turned off independently,
Low Shutdown Current.
resulting in a reduced power consumption. The chip is
High PSRR 70dB@100Hz
suitable
for
Auto Discharge
features
include
battery-powered a
current
applications. limiting
and
Other over
temperature protection.
Applications Mobile Phone Laptop, Notebook, and Palmtop Computers
Ordering Information
Battery-powered Equipment
iD9304 Channel 1 Channel 2
Hand-held Equipment Package
Wireless LAN
Taping R: Tape and Reel
A60:SOT-26 A61-SOT-26 B60:TSOT-26 FD6:TDFN-6 Output Voltage Voltage Code 1.2 G 1.3 I 1.5 F 1.8 H 2.5 L 2.8 O 3.0 K 3.3 T
Marking Information For
marking
representative
information, directly
or
contact through
our an
sales
iDESYN
distributor located in your area, otherwise visit our website for details.
For Example: Channel 1:2.8V ; Channel 2:3.3V iD9304-OTA60R *Preferred:CH1-Low Voltage; CH2-High Voltage
Other voltage outputs and combinations may be available. For further details, please contact an iDesyn sales or distributor.
Apr. 2014
1
Rev 1.1
iD9304 Typical Application Circuit EN1
Enable
VOUT1
V OUT1 C OUT1 =1µF
100K
iD9304
V IN
VIN
GND
C IN =1µF
Enable
EN2
C OUT2 =1µF
100K
Absolute Maximum Ratings Supply Voltage VIN
Recommended Operating Conditions 6V
Power Dissipation, PD @ TA=25°C SOT-26/ TSOT-26 TDFN-6
V OUT2
VOUT2
400mW 1250mW
Input Voltage VIN
2.5V to 6V
EN Input Voltage
0V to 5.5V
Junction Temperature Ambient Operating Temperature
-40°C to 125°C -40°C to 85°C
Thermal Resistance, ja SOT-26/ TSOT-26 TDFN-6
250°C/W 80°C/W
Output Current IOUT1 + IOUT2
400mA
Lead Temperature
260 °C
Storage Temperature
-65°C to 150°C
ESD Susceptibility HBM (Human Body Mode) MM (Machine Mode)
Apr. 2014
2kV 200V
2
Rev 1.1
iD9304 Electrical Characteristics (For each LDO unless otherwise specified, VIN=3.6V, CIN= COUT =1 F, EN1=EN2= VIN,TA=25°C)
Parameters
Symbol VOUT
Output Voltage Accuracy
Condition
Min
IOUT =1mA
-2.5
Typ
Max
Units
2.5
%
mA
Maximum Output Current
IMAX
Continuous
200
Supply Current Limit
ILIMIT
RLOAD = 1
300
IQ
IOUT = 0mA, EN1 ; EN2 pull high
160
VOUT = 1.2V
1000
1300
mV
VOUT = 1.8V
800
1000
mV
VOUT = 2.5V
320
500
mV
VOUT = 2.8V
200
300
mV
VOUT = 3.0V
180
260
mV
VOUT = 3.3V
150
200
mV
10
100
nA
0.2
%/V
40
mV
Quiescent Current
Dropout Voltage (Note 2)
EN input Bias Current
VDrop
IIBSD VLINE
Line regulation
IOUT = 200mA
VEN = GND or VIN VIN = (VOUT +VDROP) to 5.5V
600
-0.2
mA A
IOUT = 1mA Load Regulation
VLOAD
1mA < IOUT < 100mA
15
Fast Discharge N-MOSFET Turn On Resistance
RDISCHARGE
VIN = 4V, VEN = 0V
35
Output Noise Voltage
eNO
10Hz to 100KHz,
100
VRMS
165
°C
30
°C
IOUT = 1mA, COUT = 1 F Thermal Shutdown Temperature Thermal Shutdown Temperature Hysteresis Shutdown Current
TSD TSD ISHDN
VEN = GND, Shutdown
Logic-Low V
VIL
VIN = 2.5V to 6V,Shutdown
Logic-High V
VIH
VIN = 2.5V to 6V,Start-Up
f = 100Hz f = 10kHz
PSRR
COUT = 1 F, IOUT = 10mA
0.01
1
A
0.4
V
EN Threshold
Power Supply Rejection Rate
1.6
-70 -55
dB
Note 1: Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability.
Note 2: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100mV below the target value of VOUT.
Apr. 2014
3
Rev 1.1
iD9304 Pin Configurations
(Top View)
VOUT1
GND
VOUT2
VOUT1
VIN
EN1
6
5
4
6
5
4
1
2
3
1
2
3
EN1
VIN
EN2
GND
EN2
VOUT2
SOT-26 (A60) / TSOT-26
SOT-26 (A61)
TDFN-6
Pin Description Pin Name EN1 VIN EN2 VOUT2
Pin Function ON/OFF Control 1. Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating. Power Input ON/OFF Control 2. Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating. Output 2
GND
Ground
VOUT1
Output1
Function Block Diagram
EN1
EN2
Thermal Shutdown
VIN GND Current Limit1
VOUT1
Error Amp1
Voltage Reference
+
Error Amp2
Current Limit2
VOUT2
+ R21
R11
R12
Apr. 2014
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R22
4
Rev 1.1
iD9304 Typical Operating Characteristics Dropout Voltage vs. Output Current
PSRR 150
80 VIN =4.3VDC+0.5VP-P; CIN=COUT=1 F
Dropout Voltage (mV)
125
PSRR (dB)
70
60
50 VVout Load 10mA = 3.3V, Load 10mA OUT2.8,
100 75 VOUT = 3.3V
50 25
= 3.3V, Load 50mA VVout Load 50mA OUT2.8,
40
0
100
1000
10000
100000
0
25
Frequency (Hz)
50
3.34
3.34
Output Voltage (V)
Output Voltage (V)
3.37
3.32 3.30 3.28 3.26 3.23 75
100
125
150
175
3.28 3.26 3.23
200
3.5
4
250
Quiescent Current ( A)
Quiescent Current ( A)
125 120 115 110 105
VOUT1 = VOUT2 =3.3V EN1,EN2 pull high; No Load 5
5.5
5.5
6
200
150
100
50
VOUT1 = VOUT2 =3.3V EN1,EN2 pull high; No Load
0
6
-40
-20
0
20
40
60
80
100 120
140
Temperature ( )
Input Voltage (V) Apr. 2014
5
Quiescent Current vs. Temperature 300
4.5
4.5
Input Voltage (V)
Quiescent Current vs. Input Voltage
4
200
3.30
130
3.5
175
3.32
Output Current (mA)
100
150
VOUT = 3.3V No Load
VOUT = 3.3V
50
125
Line Regulation
Load Regulation
25
100
Output Current (mA)
3.37
0
75
5
Rev 1.1
iD9304 Output Voltage vs. Temperature 3.366
1.250
3.344
Output Voltage (V)
Output Voltage (V)
Output Voltage vs. Temperature 1.275
1.225
1.200
1.175
1.150
3.322
3.300
3.278
3.256
VOUT = 1.2V No Load
1.125
3.234 -40
-20
0
20
40
60
80
100 120 140
-40
Temperature ( )
-20
0
20
40
60
80
100 120 140
Temperature ( )
Line Transient Response
Line Transient Response
VIN (DC) 5V (1.00V/Div) 4V
VIN (DC) 5V (1.00V/Div) 4V
VOUT1 (AC) (50.0mV/Div)
VOUT1 (AC) (50.0mV/Div)
VOUT2 (AC) (50.0mV/Div)
VOUT2 (AC) (50.0mV/Div) VOUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 1mA, VIN = 4.0V to 5.0V
VOUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 10mA, VIN = 4.0V to 5.0V
Time (1.00ms/Div)
Time (1.00ms/Div)
Line Transient Response
Line Transient Response
VIN (DC) 5V (1.00V/Div) 4V
VIN (DC) 5V (1.00V/Div) 4V
VOUT1 (AC) (50.0mV/Div)
VOUT1 (AC) (100mV/Div)
VOUT2 (AC) (50.0mV/Div)
VOUT2 (AC) (100mV/Div)
VOUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 50mA, VIN = 4.0V to 5.0V Time (1.00ms/Div)
Apr. 2014
VOUT = 3.3V No Load
VOUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 100mA, VIN = 4.0V to 5.0V Time (1.00ms/Div)
6
Rev 1.1
iD9304
Load Transient Response
Load Transient Response
VOUT1 (AC) (10.0mV/Div)
VOUT1 (AC) (10.0mV/Div)
IOUT1 (DC) (50.0mA/Div)
IOUT1 (DC) (100mA/Div)
VOUT2 (AC) (10.0mV/Div)
VOUT2 (AC) (10.0mV/Div)
IOUT2 (DC) (50.0mA/Div)
IOUT2 (DC) (100mA/Div)
VIN = 5.0V ,V OUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 10mA to 50mA Time (1.00ms/Div)
Time (1.00ms/Div)
Start-Up
EN Pin Shutdown Response
VEN (DC) (5.00V/Div)
VEN (DC) (5.00V/Div)
VOUT1 (DC) (500mV/Div)
VOUT1 (DC) (500mV/Div)
VOUT2 (DC) (1.00V/Div)
VOUT2 (DC) (1.00V/Div)
VOUT1 = 1.2V, VOUT2 = 3.3V VIN = 5.0V, IOUT1 = IOUT2 = 50mA Time (20.0 s/Div)
Apr. 2014
VIN = 5.0V ,V OUT1 = 1.2V, VOUT2 = 3.3V IOUT1 = IOUT2 = 10mA to 100mA
VOUT1 = 1.2V, VOUT2 = 3.3V VIN = 5.0V, IOUT1 = IOUT2 = 50mA Time (100 s/Div)
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Rev 1.1
iD9304 Application Information
indefinite amount of time without damaging the part by
Capacitor Selection and Regulator
cooperation of current limit and thermal protection.
Stability
Capacitor Selection and Regulator Stability
The iD9304 combines two low noise, low dropout, and
Like any low-dropout regulator, the external capacitors
low quiescent current linear regulators designed
used with the iD9304 must be carefully selected for
primarily for battery-powered applications. Output
regulator stability and performance. Use a capacitor
voltages are optional ranging from 1.5V to 3.3V, and
whose value is > 1 F on the iD9304 input.
each channel can supply current up to 200mA.
amount of capacitance can be increased without limit.
Shutdown
The input capacitor must be located in a distance of no
The iD9304 is shutdown by pulling the EN input low,
more than 0.5 inches from the input pin of the IC and
and can be turned on by driving the input high. If this
returned to a clean analog ground. Any high quality
feature is not to be used, the EN input should be tied to
ceramic can be used for this capacitor. Capacitor with
VIN to keep the regulator on all the time. Note that the
larger value and lower ESR (Equivalent Series
EN input must not be floating.
Resistance) provides better PSRR performance and
Internal P-Channel Pass Transistor
better line-transient response.
The iD9304 integrates two typical P-channel MOSFET
The output capacitor must meet both requirements for
pass transistors. It provides battery with longer life by
minimum amount of capacitance and ESR in all LDO
using P-Channel MOSFET, which requires no base
applications. The iD9304 is designed specifically to
drive. The quiescent current is considerably reduced.
work with low ESR ceramic output capacitor in space-
The iD9304 consumes only 160 A quiescent current
saving and performance consideration.
whether
ceramic capacitor whose value is at least 1 F with
in
dropout,
light-load,
or
heavy-load
The
Using a
applications.
ESR is > 5m
Current Limit and Thermal Protection
Having the wide stable range of ESR tolerance, the
The iD9304 has two independent current limiting
iD9304 works well with output capacitor of other types.
structures which control each pass transistor's gate
Output capacitor with a larger capacitance can reduce
voltages limiting the guaranteed maximum output
noise and improve load-transient response, stability,
current to 200mA. Thermal-overload protection limits
and PSRR. The output capacitor should be located no
total power dissipation in the iD9304. When the
more than 0.5 inches from the VOUT pin of the iD9304
junction temperature exceeds TJ = 165 C, the thermal
and returned to a clean analog ground.
sensor signals the shutdown logic turning off the pass
Note that some ceramic dielectrics exhibit large
transistor and allowing the IC to cool.
The thermal
capacitance and ESR variation with temperature. It
sensor will turn on the pass transistor again after the
may be necessary to use 1 F or more to ensure
IC's junction temperature is lowered by 30 C. Thermal
stability at temperatures below -10 C in this case.
protection is designed to protect the iD9304 in the
Load-Transient Considerations
event of continuous thermal-overload conditions. Do
The iD9304 load-transient response graphs show two
not
junction
components of the output response: a DC shift from
temperature rating of TJ = 125 C for continuous
the output impedance due to the load current change
operation. The output can be shorted to ground for an
and the transient response. The DC shift is quite small
exceed
Apr. 2014
the
absolute
maximum
8
on the iD9304 output ensures stability.
Rev 1.1
iD9304 due to the excellent load regulation of the IC. Typical
where TJ - TA is the temperature difference between the
output voltage transient spike for a step change in the
iD9304 die junction and the surrounding environment,
load current from 0mA to 200mA is only tens mV,
JA
is the thermal resistance from the junction to the
depending on the ESR of the output capacitor.
surrounding environment. The GND pin of the iD9304
Increasing the output capacitor's value and decreasing
performs the dual function of providing an electrical
the ESR attenuates the overshoot.
connection to ground and channeling heat away.
Dropout Voltage
Connect the GND pin to ground using a large pad or
A regulator's dropout voltage determines the lowest
ground plane.
Maximum Power Dissipation
stably usable supply voltage. In battery-powered systems, this determines the useful end-of-life battery
0.6
Maximum Power Dissipation (W)
voltage. The dropout voltage is a function of drain-tosource resistance multiplied by the load current. Reverse Current Path The power transistor used in the iD9304 has an inherent diode connected between each regulator input and output. If the output is forced above the input by more than a diode-drop, this diode will become forward biased and current will flow from the VOUT terminal to VIN. This diode will also be turned on by abruptly stepping the input voltage to a value below the output voltage. To prevent regulator mis-operation, a Schottky
0.5
SOT-26/TSOT-26
0.4 0.3 0.2 0.1 0
0
25
50
75
100
125
Ambient Temperature (°C)
diode may be used in applications where input/output voltage conditions can cause the internal diode to be turned on. As shown, the Schottky diode is connected in parallel with the internal parasitic diode and prevents it from being turned on by limiting the voltage drop across it to about 0.3V < 100mA to prevent damage to the part.
Operating Region and Power Dissipation The maximum power dissipation of iD9304 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the device is P = IOUT (VIN - VOUT ). The maximum power dissipation is: P(MAX) = (TJ - TA) / Apr. 2014
JA
9
Rev 1.1
iD9304
Packaging SOT-26
SYMBOLS A A1 A2 b C D E e H L 1 e1
Apr. 2014
DIMENSIONS IN MILLIMETERS MIN 1.00 0.00 0.70 0.35 0.10 2.70 1.40 --2.60 0.37 1° ---
NOM 1.10 --0.80 0.40 0.15 2.90 1.60 1.9(TYP) 2.80 --5° 0.95(TYP)
MAX 1.30 0.10 0.90 0.50 0.25 3.10 1.80 --3.00 --9° ---
10
DIMENSIONS IN INCH MIN 0.039 0.000 0.027 0.013 0.004 0.106 0.055 --0.102 0.015 1° ---
NOM 0.043 --0.031 0.016 0.006 0.114 0.063 0.075 0.110 --5° 0.037
MAX 0.051 0.004 0.035 0.020 0.010 0.122 0.071 --0.118 --9° ---
Rev 1.1
iD9304
TSOT-26
SYMBOLS A A1 A2 b c D E E1 e e1 L L1 L2 y R
Apr. 2014
DIMENSIONS IN MILLIMETERS MIN 0.75 0.00 0.70 0.35 0.10 2.80 2.60 1.50
0.37
--0.10 0°
NOM ----0.75 ----2.90 2.80 1.60 0.95 BSC 1.90 BSC --0.60 REF 0.25 BSC ------7° NOM 8° NOM
DIMENSIONS IN INCH
MAX 0.90 0.10 0.80 0.51 0.25 3.00 3.00 1.70
MIN 0.030 0.000 0.028 0.014 0.004 0.110 0.102 0.059
---
0.015
0.10 --8°
0.004 0°
11
NOM ----0.030 ----0.114 0.110 0.063 0.0374 BSC 0.0748 BSC --0.0236 REF 0.0098 BSC ------7° NOM 8° NOM
MAX 0.035 0.004 0.031 0.020 0.010 0.118 0.118 0.067
---
0.004 --8°
Rev 1.1
iD9304
TDFN-6
SYMBOLS A A1 A3 D E E1 D1 k b e L
Apr. 2014
DIMENSIONS IN MILLIMETERS MIN NOM MAX 0.700 0.75 0.800 0.000 0.050 0.152 1.550 1.650 1.550 1.650 0.500 0.700 0.9 1.100 0.200MIN 0.180 0.280 0.500BSC 0.164 0.316
12
DIMENSIONS IN INCH MIN NOM MAX 0.028 0.030 0.032 0.000 0.002 0.006REF. 0.061 0.065 0.061 0.065 0.020 0.028 0.035 0.043 0.008REF. 0.007 0.011 0.020BSC. 0.006 0.012
Rev 1.1
iD9304
Footprints SOT-26 / TSOT-26
Package
Number of PIN
(T)SOT-26
6
Footprint Dimension (mm) P1
P2
A
B
C
D
M
0.95
-
3.60
1.60
1.00
0.70
2.60
Tolerance ±0.10
TDFN-6 (1.6mm x 1.6mm) Pitch=0.5
Package
Number of PIN
TDFN-6 1.6x1.6
6
Apr. 2014
Footprint Dimension (mm) P
A
B
C
D
Sx
Sy
M
0.5
1.8
1.00
0.40
0.35
1.00
0.60
1.35
13
Tolerance ±0.050
Rev 1.1
