Transcript
Infrared Imaging Components for Use in Automotive Safety Applications (ICU) Frank Niklaus, KTH-MST
Kick-off: 1 May 2008 Duration: 30 months Supported by the European Community, FP7 framework Information and Communication Technologies Programme
Low Cost Far Infrared Camera for Vision Enhancement and Injury Mitigation • Enhance driver awareness • Warn the driver for pedestrians in risk zone • Low IR system cost is a prerequisite Picture source: BMW AG
Research Focus in ICU Diffractive IR optics
IR detector chip, 320x240 array with 25x25 and 20x20 µm2 pixel pitch
Wafer-level vacuum package
MEMS-based camera integration/assembly concepts
Component evaluation
ICU Vision is a Wafer-Level Integrated IR Camera
ICU Consortium Infineon Technologies SensoNor AS, Norway
Autoliv, Sweden KTH - Royal Institute of Technology, Sweden Acreo AB, Sweden
Vrije Universiteit Brussel, Belgium Umicore NV, Belgium
Project Organization
WP8: Dissemination and Promotion
WP1: Project Management
WP2: Bolometer design and integration
WP3: Wafer-level vacuum package
KTH Acreo Autoliv SensoNor
SensoNor KTH Autoliv
WP4: Full size infrared bolometer focal plane array Acreo, KTH, SensoNor, Autoliv
WP5: MEMS based integration of infrared optics for 1 st level camera module
WP6: Infrared optics
SensoNor Umicore Autoliv KTH
Umicore VUB SensoNor Autoliv
WP7: InfraredInfrared camera module evaluation Autoliv
3D IC Integration of SiGe IR Bolometers KTH, Acreo, Infineon Polymer Adhesive SOI Wafer
SOI Wafer
Mono-Crystalline Si IC Contact Pads
IC Wafer
IC Wafer
IC Wafer
(a)
(b) Vias
Via Holes
IC Wafer
(d)
(c) IC-Integrated MEMS
IC Wafer
(e)
IC Wafer
(f)
• 3D IC integrated MEMS enables high-performance IR bolometer materials (Si/SiGe) on CMOS integrated circuits (ROICs). • Imaging chips can be manufactured in commercial MEMS foundries. • Improved bolometer performance allows for wafer-level vacuum packaging.
Quantum Well Si/SiGe Bolometers •
Large temperature coefficient of resistance & very low 1/f noise due to epitaxially grown single crystalline material.
Bolometer based on amorphous silicon
Quantum well based bolometer
Simulations of NETD
QW Si/SiGe IR Bolometers Si/SiGe QW layers R(T) Barrier QW
E
Contact Metal
Wafer-Level Vacuum Packaging of IR Bolometer Array Infineon, KTH, Autoliv
• Implementation of a low-cost CMOS compatible wafer-level vacuum packaging. • Cavity target pressure of 0.001 mbar. • Packaging technology compatible with standard CMOS processes and the 1st level camera integration approach.
Wafer-Level Vacuum Packaging with Getter Material
Wafer processing including getter and vacuum level sensors.
Fully implemented wafer bonding process in high-vacuum targeting 0.001 mbar.
IR Optics Umicore, VUB, Infineon, Autoliv
• Design of diffractive multilevel optics • “Flat” lens designs • Lens in package integration
MEMS Based Integration Concepts for 1st Level Camera Modules Infineon, Umicore, Autoliv, KTH • Development of 1st level camera design and mechanics that enables a MEMS manufacturing strategy for integrating bolometer and optics. • Adaptation of the lenses of WP6 to be suitable for integration into MEMS processes. Diffractive IR optics WL Vacuum package
System-Level FP7 Project Complementary to ICU FNIR - Fusing Far-Infrared and Near-Infrared Imaging for Pedestrian Injury Mitigation ICT-2007.6.1: ICT for intelligent vehicles and mobility services (start Jan 2008)
Objectives: Demonstrate the next generation Night Vision Enhancement system (NVE) with FIR and NIR sensor signal fusion to increase performance for automatic detection of pedestrians ( www.fnir.eu ).
Daimler (D), Autoliv (S), Infineon (N), Umicore (B) Acreo (S), KTH-MST (S), Linköping University (S)
Questions…?
